JP3050812B2 - Multilayer printed wiring board - Google Patents

Multilayer printed wiring board

Info

Publication number
JP3050812B2
JP3050812B2 JP8206170A JP20617096A JP3050812B2 JP 3050812 B2 JP3050812 B2 JP 3050812B2 JP 8206170 A JP8206170 A JP 8206170A JP 20617096 A JP20617096 A JP 20617096A JP 3050812 B2 JP3050812 B2 JP 3050812B2
Authority
JP
Japan
Prior art keywords
solder
pad
pads
layer
wiring board
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP8206170A
Other languages
Japanese (ja)
Other versions
JPH1051146A (en
Inventor
元雄 浅井
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Ibiden Co Ltd
Original Assignee
Ibiden Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ibiden Co Ltd filed Critical Ibiden Co Ltd
Priority to JP8206170A priority Critical patent/JP3050812B2/en
Priority to US08/897,702 priority patent/US6525275B1/en
Priority to EP97112872A priority patent/EP0823833B1/en
Priority to DE69739005T priority patent/DE69739005D1/en
Priority to MYPI97003418A priority patent/MY118245A/en
Priority to KR1019970036339A priority patent/KR100276802B1/en
Priority to SG1997002759A priority patent/SG71716A1/en
Priority to CN97115322A priority patent/CN1082783C/en
Publication of JPH1051146A publication Critical patent/JPH1051146A/en
Application granted granted Critical
Publication of JP3050812B2 publication Critical patent/JP3050812B2/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H05K1/111—Pads for surface mounting, e.g. lay-out
    • H05K1/112—Pads for surface mounting, e.g. lay-out directly combined with via connections
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
    • H01L23/49811—Additional leads joined to the metallisation on the insulating substrate, e.g. pins, bumps, wires, flat leads
    • H01L23/49816—Spherical bumps on the substrate for external connection, e.g. ball grid arrays [BGA]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
    • H01L23/49827—Via connections through the substrates, e.g. pins going through the substrate, coaxial cables
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
    • H01L23/49838—Geometry or layout
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3457—Solder materials or compositions; Methods of application thereof
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/42—Plated through-holes or plated via connections
    • H05K3/429—Plated through-holes specially for multilayer circuits, e.g. having connections to inner circuit layers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01019—Potassium [K]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/0102—Calcium [Ca]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01025—Manganese [Mn]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01046—Palladium [Pd]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01078—Platinum [Pt]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01079—Gold [Au]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/151—Die mounting substrate
    • H01L2924/1517—Multilayer substrate
    • H01L2924/15172—Fan-out arrangement of the internal vias
    • H01L2924/15174—Fan-out arrangement of the internal vias in different layers of the multilayer substrate
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/151—Die mounting substrate
    • H01L2924/153—Connection portion
    • H01L2924/1531—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface
    • H01L2924/15311—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface being a ball array, e.g. BGA
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09372—Pads and lands
    • H05K2201/09472—Recessed pad for surface mounting; Recessed electrode of component
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/095—Conductive through-holes or vias
    • H05K2201/09509—Blind vias, i.e. vias having one side closed
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09818—Shape or layout details not covered by a single group of H05K2201/09009 - H05K2201/09809
    • H05K2201/0989—Coating free areas, e.g. areas other than pads or lands free of solder resist
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09818—Shape or layout details not covered by a single group of H05K2201/09009 - H05K2201/09809
    • H05K2201/099—Coating over pads, e.g. solder resist partly over pads
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10621—Components characterised by their electrical contacts
    • H05K2201/10734—Ball grid array [BGA]; Bump grid array
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/03—Metal processing
    • H05K2203/0338—Transferring metal or conductive material other than a circuit pattern, e.g. bump, solder, printed component
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3452—Solder masks
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4602—Manufacturing multilayer circuits characterized by a special circuit board as base or central core whereon additional circuit layers are built or additional circuit boards are laminated
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits

Description

【発明の詳細な説明】DETAILED DESCRIPTION OF THE INVENTION

【０００１】[0001]

【発明の属する技術分野】本発明は多層プリント配線板
に関し、特に、配線基板表面の高密度実装特性を維持し
つつ、配線層数の低減化を図ることができるフリップチ
ップ実装用多層プリント配線板の構造についての提案で
ある。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a multilayer printed wiring board, and more particularly to a multilayer printed wiring board for flip-chip mounting capable of reducing the number of wiring layers while maintaining high-density mounting characteristics on the surface of the wiring board. Here is a proposal for the structure of

【０００２】[0002]

【従来の技術】フリップチップ実装用の多層プリント配
線板（例えば、パッケージ）は、その実装表面に、はん
だバンプが設けられたパッドを多数配列してなるはんだ
パッド群が形成されている。2. Description of the Related Art A multilayer printed wiring board (for example, a package) for flip-chip mounting has a solder pad group formed by arranging a large number of pads provided with solder bumps on the mounting surface.

【０００３】このはんだパッド群は、一般に、配線基板
の所定の導体パターンと電気的に接続した実装用パッド
（あるいはランド）と呼ばれる平坦な円板状の導体表面
に、表面張力によって球状になったはんだが設けられた
構造のはんだパッドで構成され、例えばパッケージをマ
ザーボード等に実装するための外部端子に、前記実装用
パッドから引き出された所定の配線によって電気的に接
続されている。This solder pad group is generally formed into a spherical shape by a surface tension on a flat disk-shaped conductor surface called a mounting pad (or land) electrically connected to a predetermined conductor pattern of a wiring board. It is composed of solder pads having a structure provided with solder, and is electrically connected to, for example, an external terminal for mounting the package on a motherboard or the like by a predetermined wiring drawn from the mounting pad.

【０００４】しかしながら、このようなはんだパッド群
の構成では、はんだパッド群のうちの内側部に位置する
はんだパッドは、実装用パッドに接続した導体パターン
を、該パッドよりも外側部に位置するパッドを迂回しな
がら引き出された配線を通して、外部端子と電気的に接
続する必要がある。そのため、配線基板の外周付近に位
置するパッドの間隔は、前記配線の幅に相当する領域を
確保することが必要となり、電子部品（チップ）の高集
積化が難しくなるといった問題が生じた。However, in such a configuration of the solder pad group, the solder pad located on the inner side of the solder pad group is formed by replacing the conductive pattern connected to the mounting pad with the pad located on the outer side of the pad. It is necessary to electrically connect to an external terminal through a wiring drawn while bypassing the terminal. For this reason, it is necessary to secure a region corresponding to the width of the wiring in the interval between the pads located near the outer periphery of the wiring board, and there has been a problem that it is difficult to highly integrate electronic components (chips).

【０００５】また、上記はんだパッド群の構成では、電
子部品（チップ）の高集積化を図ろうとすると、配線パ
ターンを細くすることになるので不良箇所の発生頻度が
高くなる。このため、一層づつ配線層を形成するビルド
アップ配線板においては、不良を製造過程で確認するこ
とが難しいために、各層の一箇所でも不良が発生する
と、最終製品である配線板全体が不良品となり、良好な
積層材までも処分しなければならず、製造効率や製造歩
留りの悪化を招きやすいという問題があった。[0005] In the structure of the above-mentioned solder pad group, in order to achieve high integration of electronic components (chips), the wiring pattern becomes thinner, so that the frequency of occurrence of defective portions increases. For this reason, in a build-up wiring board in which wiring layers are formed one by one, it is difficult to confirm a defect in a manufacturing process. Therefore, it is necessary to dispose even a good laminated material, and there is a problem that the production efficiency and the production yield are easily deteriorated.

【０００６】このように、特にビルドアップ法で製造す
るフリップチップ実装用の多層プリント配線板は、製造
効率や製造歩留りを悪化させることなく量産化に対応さ
せるためには、電子部品の高集積化と同時に配線層数の
低減化を図る必要があった。As described above, a multilayer printed wiring board for flip-chip mounting, particularly manufactured by a build-up method, requires high integration of electronic components in order to cope with mass production without deteriorating manufacturing efficiency and manufacturing yield. At the same time, it was necessary to reduce the number of wiring layers.

【０００７】[0007]

【発明が解決しようとする課題】そこで本発明は、はん
だパッドの高集積化（高密度化）を実現するとともに、
配線基板表面の高密度実装特性を維持しつつ配線層数の
低減化を図ることができる、フリップチップ実装用多層
プリント配線板を提供することにある。Accordingly, the present invention realizes high integration (high density) of solder pads,
An object of the present invention is to provide a multilayer printed wiring board for flip-chip mounting, which can reduce the number of wiring layers while maintaining high-density mounting characteristics on a wiring board surface.

【０００８】[0008]

【課題を解決するための手段】発明者は、上記目的の実
現に向け鋭意研究を行った結果、以下の内容を要旨構成
とする発明を完成するに至った。すなわち、本発明は、
コア基板上に、層間絶縁材層と導体回路が交互に積層さ
れた多層配線層が形成され、この多層配線層の表面に、
はんだバンプが設けられたパッドを２次元的に配列して
なるはんだパッド群を形成してなる多層プリント配線板
において、前記はんだパッド群の形状を、中心部を除く
周辺部のみに配置した額縁状にすると共に、その額縁状
はんだパッド群のうちの外側部に位置するはんだパッド
は、その表面の導体パターンにそれぞれ接続した平坦パ
ッドとこのパッド表面に形成したはんだバンプとで構成
し、一方、内側部に位置するはんだパッドは、内層に位
置する平坦な内層パッド群にそれぞれ接続したバイアホ
ールとこのバイアホールの凹部に形成したはんだバンプ
とで構成したことを特徴とする多層プリント配線板であ
る。この多層プリント配線板の典型的な構造を図１に示
す。Means for Solving the Problems The inventor of the present invention has intensively studied for realizing the above-mentioned object, and as a result, has completed the invention having the following contents. That is, the present invention
On the core substrate, a multilayer wiring layer in which interlayer insulating material layers and conductor circuits are alternately laminated is formed, and on the surface of this multilayer wiring layer,
In a multilayer printed wiring board in which a solder pad group formed by two-dimensionally arranging pads provided with solder bumps is formed, a frame shape in which the shape of the solder pad group is arranged only in a peripheral portion excluding a central portion is provided. At the same time, the solder pads located on the outer side of the frame-shaped solder pad group are composed of flat pads connected to the conductor patterns on the surface thereof and solder bumps formed on the surface of the pad, while The solder pad located in the portion is a multilayer printed wiring board comprising a via hole connected to a flat inner layer pad group located in an inner layer, and a solder bump formed in a concave portion of the via hole. FIG. 1 shows a typical structure of this multilayer printed wiring board.

【０００９】なお、上記本発明にかかる多層プリント配
線板において、前記はんだパッド群のうちの外側部に位
置するはんだパッドは、最外周から１列目乃至５列目ま
でに位置するはんだパッドであることが望ましく、ま
た、前記層間絶縁材層は、その表面に表面粗さが５〜15
μｍの粗化面が形成されてなることが望ましい。さら
に、上記本発明にかかる多層プリント配線板は、前記多
層配線層の表面に、ソルダーレジスト層が形成されてな
り、このソルダーレジストの開口径を、前記はんだパッ
ドを構成する平坦パッドとバイアホールの直径よりも大
きくすることにより、ソルダーレジストが当該パッドあ
るいは当該バイアホールと重ならないようにすることが
望ましい。In the multilayer printed wiring board according to the present invention, the solder pads located on the outer side of the solder pad group are the solder pads located in the first to fifth rows from the outermost periphery. Preferably, the interlayer insulating material layer has a surface roughness of 5 to 15
It is desirable that a roughened surface of μm be formed. Further, the multilayer printed wiring board according to the present invention is such that a solder resist layer is formed on the surface of the multilayer wiring layer, and the opening diameter of the solder resist is set to a value between a flat pad and a via hole constituting the solder pad. By making the diameter larger than the diameter, it is desirable that the solder resist does not overlap with the pad or the via hole.

【００１０】このように本発明は、コア基板上に、層間
絶縁材層と導体回路が交互に積層された多層配線層が形
成され、この多層配線層の表面に、はんだバンプが設け
られたパッドを２次元的に配列してなるはんだパッド群
を形成してなる、フリップチップ実装用の多層プリント
配線板における、前記はんだパッド群の新たな構成を提
案するものである。As described above, according to the present invention, there is provided a pad in which a multilayer wiring layer in which interlayer insulating layers and conductive circuits are alternately laminated is formed on a core substrate, and a solder bump is provided on the surface of the multilayer wiring layer. Are proposed in a multilayer printed wiring board for flip-chip mounting, in which a solder pad group formed by two-dimensionally arranging the solder pads is formed.

【００１１】ここで、「２次元的に配列して」というの
は、図２(a) に示すように、パッドをＸ−Ｙ軸方向に枡
目状に配列する方法だけでなく、図２(b) に示すよう
に、Ｘ−Ｙ軸方向に一つおきに千鳥状に配列する形態も
含むものである。特に、千鳥状に配列する形態は、内側
のパッドから外部端子に向けて配線を引き出しやすい点
で有利である。Here, "arranged two-dimensionally" means not only a method of arranging the pads in a grid pattern in the X-Y axis direction as shown in FIG. As shown in (b), the arrangement includes a staggered arrangement every other in the XY axis direction. In particular, the staggered arrangement is advantageous in that wiring can be easily drawn from the inner pads to the external terminals.

【００１２】本発明では、図１(b) に示すように、はん
だパッド群の配列を千鳥状とし、このはんだパッド群の
最外周列から３列目までを多層配線層表面の導体パター
ンと接続する構造が、最適の構造である。この構造にお
いて、配線をはんだパッド群の外側へ引き出すために
は、図１(b) に示すように、最外周列（１列目）のはん
だパッド間では、３等分するように２列目および３列目
のはんだパッドと接続する導体パターンを配置し、さら
に、１列目のはんだパッドの一方と２列目のはんだパッ
ドの間では、２等分するように３列目のパッドと接続す
る導体パターンを配置するように設計する方法が、最適
である。In the present invention, as shown in FIG. 1B, the arrangement of the solder pad groups is staggered, and the third to third rows of the solder pad groups are connected to the conductor patterns on the surface of the multilayer wiring layer. Is the optimal structure. In this structure, in order to lead the wiring out of the solder pad group, as shown in FIG. 1B, between the solder pads in the outermost row (first row), the second row is divided into three equal parts. And a conductor pattern connected to the third row of solder pads, and further connected to the third row of pads between one of the first row of solder pads and the second row of solder pads so as to be equally divided into two. The most suitable method is to design a conductor pattern to be arranged.

【００１３】[0013]

【発明の実施の形態】本発明にかかる多層プリント配線
板の特徴は、多層配線層の表面に形成するはんだパッド
群の形状を、中心部を除く周辺部のみに配置した額縁状
（環状）にすると共に、その額縁状はんだパッド群のう
ちの外側部に位置するはんだパッド、望ましくは最外周
から１列目乃至５列目までに位置するはんだパッドを、
その表面の導体パターンにそれぞれ接続した平坦パッド
とこのパッド表面に形成したはんだバンプとで構成し、
一方、これらのはんだパッドを除く内側部に位置するは
んだパッドを、内層に位置する平坦な内層パッド群にそ
れぞれ接続したバイアホールとこのバイアホールの凹部
に形成したはんだバンプとで構成した点にある。DESCRIPTION OF THE PREFERRED EMBODIMENTS A multilayer printed wiring board according to the present invention is characterized in that the shape of a solder pad group formed on the surface of a multilayer wiring layer is in a frame shape (annular shape) arranged only in a peripheral portion except a central portion. And solder pads located on the outer side of the frame-shaped solder pad group, desirably solder pads located in the first to fifth rows from the outermost periphery,
It consists of a flat pad connected to the conductor pattern on the surface and a solder bump formed on the surface of this pad,
On the other hand, the solder pads located on the inner side excluding these solder pads are constituted by via holes respectively connected to a flat inner layer pad group located on the inner layer and solder bumps formed in recesses of the via holes. .

【００１４】このような構成としたことにより、はんだ
パッド群のうちの最外周から１列目乃至５列目までに位
置するはんだパッドの平坦パッド（例えば、図１の第
１，２，３列目のパッド）は、表面の導体パターンと接
続され、該パッドから引き出された配線によってパッド
群の外側にある外部端子と電気的に接続される。同時に
最外周から１列目乃至５列目までに位置するはんだパッ
ド以外のはんだパッドのパッド（例えば、図１の第４，
５，６列目のパッド）は、内層に位置する平坦な内層パ
ッド群にバイアホールを介して接続され、該内層パッド
から引き出された配線によってパッド群の外側にある外
部端子と電気的に接続される。すなわち、はんだパッド
群のうちの最外周から１列目乃至５列目までに位置する
前記パッドと接続する導体パターンは、それぞれ該パッ
ドから前記１列目乃至４列目のパッドを迂回して引き出
された配線によって外部端子と接続され、それ以外のパ
ッドは、バイアホールで構成されて内層パッドに接続さ
れ、この内層パッドから引き出された配線によって外部
端子と接続される。With such a configuration, the flat pads of the solder pads located in the first to fifth rows from the outermost periphery of the solder pad group (for example, the first, second, third rows in FIG. 1) The eye pad) is connected to the conductor pattern on the surface, and is electrically connected to an external terminal outside the pad group by a wiring drawn from the pad. At the same time, pads of solder pads other than the solder pads located in the first to fifth rows from the outermost periphery (for example, fourth and fourth pads in FIG. 1)
The fifth and sixth rows of pads) are connected via via holes to a flat inner layer pad group located in the inner layer, and are electrically connected to external terminals outside the pad group by wiring drawn out from the inner layer pad. Is done. That is, the conductor patterns connected to the pads located in the first to fifth rows from the outermost periphery of the solder pad group are drawn out of the pads by bypassing the pads in the first to fourth rows, respectively. The remaining wiring is connected to an external terminal, and the other pads are formed of via holes and connected to the inner layer pad, and are connected to the external terminal by wiring drawn out from the inner layer pad.

【００１５】したがって、本発明によれば、外部端子と
接続するための配線の全てを表面のはんだパッド群から
引き出した従来の構成に代えて、はんだパッド群のうち
の内側部に位置するはんだパッドに接続された前記配線
を内層パッドから分割して引き出す構成としたので、表
層のはんだパッド間の間隔を小さくすることができる。
その結果、はんだパッドの高密度化（高集積化）が可能
となる。Therefore, according to the present invention, in place of the conventional configuration in which all the wires for connecting to the external terminals are drawn out from the solder pad group on the surface, the solder pads located inside the solder pad group are replaced. Since the wiring connected to the inner layer is divided and drawn out from the inner layer pad, the interval between the solder pads on the surface layer can be reduced.
As a result, the density (integration) of the solder pads can be increased.

【００１６】また、本発明によれば、多層配線層の表面
に形成するはんだパッド群の形状を、中心部を除く周辺
部のみに配置した額縁状（環状）にしたことにより、配
線基板表面の高密度実装特性を維持しつつ配線層数の低
減化を図ることができる。以下に、この理由について説
明する。Further, according to the present invention, the shape of the solder pad group formed on the surface of the multilayer wiring layer is formed in a frame shape (annular shape) which is disposed only in the peripheral portion except for the central portion, so that the surface of the wiring substrate can be formed. The number of wiring layers can be reduced while maintaining high-density mounting characteristics. The reason will be described below.

【００１７】図３に示すように、はんだパッド群の形状
をフルグリッドのマトリックス状に配置すると、配線基
板表面の高密度実装特性を維持するためには、はんだパ
ッドは、中央部よりに位置するに従い、順次、バイアホ
ールを介して下層の各内層パッド群に分割して接続し、
最終的にコア基板上の内層パッド群と接続することが必
要である。このため、かかる形状では、各内層パッド群
に分割するための配線層が必要となるので、配線基板表
面の高密度実装特性を維持しつつ配線層数の低減化を図
ることはできない。 この点、図４に示すように、はん
だパッド群の形状を、中心部を除く周辺部のみに配置し
た額縁状にすると、中央部にはんだパッドが存在しない
ので、各内層パッド群に分割するための配線層の数をそ
のはんだパッドが存在しない中央部の列数に相当する分
だけ少なくすることができる。この場合、はんだパッド
の数（はんだパッドの実装密度）を維持するためには、
中央部に位置するはんだパッドの不足分を、はんだパッ
ド群の外側に列数を増やすことにより補償する必要があ
る。しかるに、このはんだパッド群の外側への列数増加
は、中央部の不足分の列数よりも少なくなる。その結
果、本発明にかかるはんだパッド群の形状によれば、配
線基板表面の高密度実装特性を維持しつつ配線層数の低
減化を図ることができるのである。As shown in FIG. 3, when the shape of the solder pads is arranged in a full grid matrix, the solder pads are located closer to the center in order to maintain the high-density mounting characteristics on the surface of the wiring board. According to the following, sequentially divided and connected to each inner layer pad group of the lower layer via via holes,
Finally, it is necessary to connect to the inner layer pad group on the core substrate. For this reason, in such a shape, a wiring layer for dividing into each inner layer pad group is required, and it is not possible to reduce the number of wiring layers while maintaining high-density mounting characteristics on the surface of the wiring board. In this regard, as shown in FIG. 4, when the shape of the solder pad group is formed into a frame shape arranged only in the peripheral portion excluding the center portion, since there is no solder pad in the center portion, the solder pad group is divided into each inner layer pad group. Can be reduced by an amount corresponding to the number of rows at the center where no solder pad exists. In this case, in order to maintain the number of solder pads (the mounting density of solder pads),
It is necessary to compensate for the shortage of the solder pad located at the center by increasing the number of rows outside the solder pad group. However, the increase in the number of rows outside the solder pad group is smaller than the number of short rows at the center. As a result, according to the shape of the solder pad group according to the present invention, the number of wiring layers can be reduced while maintaining high-density mounting characteristics on the surface of the wiring board.

【００１８】例えば、図３に示すような、一辺が18個の
はんだパッドからなる正方形のフルグリッドのマトリッ
クス状に配置して形成したはんだパッド群の場合、はん
だパッドの総数は18×18＝324 個である。これに対応す
る本発明例として、図４に示すように、一辺が20個の正
方形状のはんだパッド群から中心部に位置する一辺が８
個の正方形状のはんだパッド群を取り除いてなる、額縁
状に配置して形成したはんだパッド群が例示でき、その
はんだパッドの総数は、20×20−８×８＝336個であ
る。つまり、本発明によれば、中心部の除かれた８列に
比べてわずか一辺２列の外周列の増加で、十分なはんだ
パッド数を確保しつつ、配線層数を低減化を図ることが
できる。しかも、わずか２列の列数増加であるため、外
部端子等に接続するために引き出す導体パターンの配置
に関し困難性はなく、はんだパッドの密度を低下させる
こともない。なお、上記例示では、額縁状に配置された
はんだパッド群の形状が正方形である例を挙げたが、そ
の形状が長方形や円、あるいは図９に示すような八角形
等の多角形であってもよい。特に、はんだパッド群の形
状を多角形にすると、長方形や正方形の場合に比べて、
角部のはんだパッドを外部端子等に接続するために引き
出す導体パターンは、迂回させることが少なくなる。ま
た、はんだバンプの存在しない中心部には、はんだパッ
ドの数を調整するために複数個のバイアホールからなる
パッドを設けることができる。For example, as shown in FIG. 3, in the case of a solder pad group formed by arranging in a square full grid matrix consisting of 18 solder pads on one side, the total number of solder pads is 18 × 18 = 324. Individual. As an example of the present invention corresponding to this, as shown in FIG. 4, one side located in the center from a square-shaped solder pad group having 20 sides has 8 sides.
A solder pad group formed by arranging in a frame shape by removing the square solder pad groups can be exemplified, and the total number of the solder pads is 20 × 20−8 × 8 = 336. That is, according to the present invention, it is possible to reduce the number of wiring layers while securing a sufficient number of solder pads by increasing the number of outer rows of only two rows per side as compared with the eight rows excluding the center part. it can. In addition, since the number of rows is increased by only two rows, there is no difficulty in arranging the conductor patterns to be drawn for connection to the external terminals and the like, and the density of the solder pads does not decrease. In the above example, the shape of the solder pad group arranged in a frame shape is a square, but the shape is a rectangle, a circle, or a polygon such as an octagon as shown in FIG. Is also good. In particular, when the shape of the solder pad group is polygonal, compared to the case of rectangular or square,
The conductor pattern drawn out to connect the corner solder pad to an external terminal or the like is less likely to be bypassed. In addition, a pad including a plurality of via holes can be provided in the center where no solder bump exists, in order to adjust the number of solder pads.

【００１９】本発明の多層プリント配線板において、額
縁状はんだパッド群のうちの内側部に位置するはんだパ
ッド、望ましくは最外周から１列目乃至５列目までに位
置するはんだパッドを除くはんだパッドは、内層に位置
する平坦な内層パッド群にそれぞれ接続したバイアホー
ルとこのバイアホールの凹部に形成したはんだバンプと
で構成されている。このため、バイアホールの凹部には
んだを充填する本発明の上記はんだパッドの構成によれ
ば、はんだ量を多くすることができ、表面張力に起因す
るセルフアライメント効果により、正確な実装が可能と
なる。In the multilayer printed wiring board according to the present invention, the solder pads except for the solder pads located in the inner part of the frame-shaped solder pad group, preferably in the first to fifth rows from the outermost periphery. Are composed of via holes respectively connected to a flat inner layer pad group located in an inner layer, and solder bumps formed in recesses of the via holes. For this reason, according to the configuration of the solder pad of the present invention in which the concave portion of the via hole is filled with solder, the amount of solder can be increased, and accurate mounting can be performed due to a self-alignment effect caused by surface tension. .

【００２０】ここで、本発明における上記バイアホール
は、内層パッドが露出するように層間絶縁材層に設けた
開口部に前記内層パッドと層間絶縁材層表面の導体回路
を電気的に接続するための金属膜が被成された構造を有
する。このバイアホールの凹部にはんだを充填すること
により、本発明の上記一の構成にかかるはんだパッドが
形成される。従って、本発明は、例えば特開Ｈ４−3376
95号に開示されたような、はんだによって内層パッドと
層間絶縁材層表面の導体回路を電気的に接続する技術で
はない。特開Ｈ４−337695号のように、はんだを直接樹
脂絶縁材層に接触させると、鉛の拡散により樹脂の劣化
を招く。また、樹脂とはんだは馴染みが悪いので、はん
だで構成されたバイアホールが脱落しやすいという欠点
がある。この点、本発明では、バイアホールを金属膜で
構成し、このバイアホールの凹部にはんだが充填されて
いるので、樹脂の劣化やバイアホールの脱落もない。The via hole in the present invention is used to electrically connect the inner layer pad and a conductor circuit on the surface of the interlayer insulating material layer to an opening provided in the interlayer insulating material layer so that the inner layer pad is exposed. Has a structure in which a metal film is formed. By filling the recesses of the via holes with solder, the solder pads according to the first aspect of the present invention are formed. Therefore, the present invention relates to, for example, JP-A-H4-3376.
It is not a technique for electrically connecting an inner layer pad and a conductor circuit on the surface of an interlayer insulating material layer by soldering as disclosed in Japanese Patent No. 95. When the solder is brought into direct contact with the resin insulating material layer as in Japanese Patent Application Laid-Open No. H4-337695, the deterioration of the resin is caused by the diffusion of lead. In addition, since resin and solder are not well-adapted, there is a disadvantage that via holes made of solder are easily dropped. In this regard, in the present invention, since the via hole is formed of a metal film and the recess of the via hole is filled with solder, there is no deterioration of the resin and no dropout of the via hole.

【００２１】なお、上記パッド群に接続された多層配線
層の導体パターンは、コア基板に設けたスルーホールを
介して、コア基板の裏面に設けられた外部端子、例え
ば、はんだバンプや導体ピンなどと接続される。特に、
コア基板の裏面には、このスルーホールと電気的に接続
する導体層と樹脂絶縁層を交互に積層した多層配線層を
設け、この表面にはんだバンプを形成する構成がよい
（図１参照）。The conductor pattern of the multilayer wiring layer connected to the pad group is connected to an external terminal, such as a solder bump or a conductor pin, provided on the back surface of the core substrate through a through hole provided in the core substrate. Connected to In particular,
It is preferable to provide a multilayer wiring layer in which conductor layers and resin insulating layers electrically connected to the through holes are alternately laminated on the back surface of the core substrate, and solder bumps are formed on this surface (see FIG. 1).

【００２２】本発明の多層プリント配線板において、は
んだパッド群を構成するバイアホールは、内層パッドと
のみ接続されているので剥離しやすい。そのため、かか
るバイアホールの剥離を防止する目的で、層間絶縁材層
の表面は、表面粗さ５〜15μｍの粗化面が形成されてい
ることが望ましい。表面粗さが５μｍ未満では、バイア
ホールとの密着強度が不充分であり、一方、表面粗さが
15μｍを超えると微細な導体パターンを得ることが困難
になるからである。In the multilayer printed wiring board of the present invention, the via holes constituting the solder pad group are easily connected to the inner layer pads, and thus are easily separated. Therefore, in order to prevent the peeling of the via hole, it is preferable that the surface of the interlayer insulating material layer has a roughened surface with a surface roughness of 5 to 15 μm. If the surface roughness is less than 5 μm, the adhesion strength to the via hole is insufficient, while the surface roughness is
If the thickness exceeds 15 μm, it becomes difficult to obtain a fine conductor pattern.

【００２３】本発明においては、多層配線層の表面に、
ソルダーレジスト層が形成されてなり、このソルダーレ
ジストの開口径を、前記はんだパッドを構成する平坦な
パッドとバイアホールの直径よりも大きくすることによ
り、ソルダーレジストが当該パッドあるいは当該バイア
ホールと重ならないようにし、パッドおよびバイアホー
ルをソルダーレジストの開口から完全に露出させること
が有利である。本発明のように、高集積化したはんだパ
ッドの構成では、ソルダーレジストの開口径をパッドの
直径よりも小さくすると、感光性樹脂であるソルダーレ
ジストを露光現像（いわゆるフォトリソグラフィー）に
より開口する際に、フォトマスクの温度膨張や収縮によ
って開口部の位置ずれを起こし、パッドの露出面積が実
質的に小さくなってしまう。その結果、ここにはんだを
形成すると、はんだの流出やはんだブリッジ等の不良を
引き起こしやすく部品の実装信頼性が悪くなる。従っ
て、本発明におけるソルダーレジストの開口径は、パッ
ドやバイアホールの直径よりも大きくすることが望まし
い。In the present invention, on the surface of the multilayer wiring layer,
A solder resist layer is formed, and the opening diameter of the solder resist is made larger than the diameter of the flat pad and the via hole constituting the solder pad, so that the solder resist does not overlap with the pad or the via hole. Thus, it is advantageous that the pad and the via hole are completely exposed from the opening of the solder resist. In the configuration of a highly integrated solder pad as in the present invention, if the opening diameter of the solder resist is smaller than the diameter of the pad, the solder resist, which is a photosensitive resin, is exposed and developed by exposure and development (so-called photolithography). In addition, the position of the opening is shifted due to the thermal expansion and contraction of the photomask, and the exposed area of the pad is substantially reduced. As a result, if the solder is formed here, it is likely to cause outflow of the solder or a defect such as a solder bridge, and the mounting reliability of the component is deteriorated. Therefore, it is desirable that the opening diameter of the solder resist in the present invention be larger than the diameter of the pad or the via hole.

【００２４】一方で、多層配線層の表面に位置する全て
のはんだパッドを平坦なパッドで構成した従来技術にお
いて、前記平坦なパッドは全て、そのパッドが存在する
同一層にて導体パターンと配線接続される。このため、
パッドの直径よりもソルダーレジストの開口径を大きく
すると、導体パターンの配線の一部が露出した状態とな
りやすい（図５(a) 参照）。その結果、ここにはんだを
形成すると、露出した導体パターンの配線上にもはんだ
が載って、はんだバンプが低くなり、またそのはんだバ
ンプの位置ずれを生じる（図５(b) 参照）。On the other hand, in the prior art in which all the solder pads located on the surface of the multilayer wiring layer are formed of flat pads, all of the flat pads are connected to the conductor pattern and the wiring in the same layer where the pads exist. Is done. For this reason,
When the opening diameter of the solder resist is larger than the pad diameter, a part of the wiring of the conductor pattern is likely to be exposed (see FIG. 5A). As a result, if the solder is formed here, the solder is also placed on the exposed wiring of the conductor pattern, so that the solder bump is lowered and the solder bump is displaced (see FIG. 5B).

【００２５】この点、本発明では、額縁状はんだパッド
群のうちの外側部に位置するはんだパッドを除くはんだ
パッド群は、バイアホールの凹部にはんだバンプを形成
したもので構成したので、同一層に位置する導体パター
ンに配線接続されることはない。しかも、本発明では、
はんだバンプを形成するためのパッドを、バイアホール
から新たに配線していないので、ソルダーレジストの開
口径をバイアホールの直径よりも大きくしても、ソルダ
ーレジストの開口部から導体パターンの配線が露出する
ようなこともない（図６(a) 参照）。それ故に、本発明
にかかるバイアホールの凹部にはんだバンプを形成する
構成によれば、はんだバンプが低くなることもなく、ま
たはんだバンプの位置ずれも生じない（図６(b) 参
照）。In this respect, in the present invention, the solder pad group except for the solder pad located on the outer side of the frame-shaped solder pad group is formed by forming the solder bumps in the recesses of the via holes. No wiring connection is made to the conductor pattern located at. Moreover, in the present invention,
Since the pads for forming the solder bumps are not newly wired from the via holes, even if the opening diameter of the solder resist is larger than the diameter of the via holes, the wiring of the conductor pattern is exposed from the opening of the solder resist. (See FIG. 6 (a)). Therefore, according to the configuration in which the solder bumps are formed in the recesses of the via holes according to the present invention, the solder bumps do not become low or the solder bumps are not displaced (see FIG. 6B).

【００２６】また、ソルダーレジストの開口径をパッド
径よりも大きくする上記構成は、はんだ転写法によりは
んだバンプを形成する場合には、特に有利である。はん
だ転写法とは、フィルム上に貼着したはんだ箔をエッチ
ングして、パッド位置に相当する箇所にはんだ箔のパタ
ーンを形成しておき、これをはんだ箔がパッドに接触す
るように載置し、加熱リフローすることにより、はんだ
はフィルムとの馴染みが悪く金属と馴染むために、はん
だがパッドに転写されるものである。このようなはんだ
転写法では、フィルム上に形成されるはんだ箔のパター
ンの面積は、一般にパッドよりも大きくなる。このた
め、ソルダーレジストの開口径をパッド径よりも大きく
すると、丁度、ソルダーレジストの開口部とはんだパタ
ーンが嵌合して、位置合わせしやすいからである（図７
参照）。The above configuration in which the opening diameter of the solder resist is larger than the pad diameter is particularly advantageous when a solder bump is formed by a solder transfer method. With the solder transfer method, the solder foil attached to the film is etched to form a solder foil pattern at the location corresponding to the pad position, and this is placed so that the solder foil contacts the pad When the solder is reflowed by heating, the solder is poorly adapted to the film and is adapted to the metal, so that the solder is transferred to the pad. In such a solder transfer method, the area of the solder foil pattern formed on the film is generally larger than that of the pad. For this reason, if the opening diameter of the solder resist is larger than the pad diameter, the opening of the solder resist and the solder pattern just fit, and the alignment is easy (FIG. 7).
reference).

【００２７】さらに、本発明の多層プリント配線板にお
いて、最表層に位置する配線層は、めっきレジストを介
して、そのめっきレジスト間に平坦なパッドとバイアホ
ールが形成されてなり、さらにその表面には、前記の平
坦なパッドとバイアホールが露出する開口部を設けたソ
ルダーレジスト層が形成されてなり、このソルダーレジ
スト層は、その開口径を前記パッドおよびバイアホール
の直径よりも大きくして、その開口部からパッド、バイ
アホールおよびめっきレジストの一部を露出させること
が有利である。このような構成にすると、パッドやバイ
アホールの周囲側面がめっきレジストにより隠蔽される
（図８参照）。このため、前記の周囲側面にはんだが付
着しない。その結果、はんだバンプが低くならず、接続
信頼性に優れる。Further, in the multilayer printed wiring board of the present invention, the wiring layer positioned at the outermost layer is formed by forming flat pads and via holes between the plating resists with the plating resist interposed therebetween. Is formed with a solder resist layer provided with an opening for exposing the flat pad and the via hole, the solder resist layer having an opening diameter larger than the diameter of the pad and the via hole, It is advantageous to expose a portion of the pad, via hole and plating resist from the opening. With such a configuration, the peripheral side surfaces of the pads and via holes are concealed by the plating resist (see FIG. 8). Therefore, the solder does not adhere to the peripheral side surface. As a result, the solder bumps are not reduced and the connection reliability is excellent.

【００２８】以下に、本発明にかかる多層プリント配線
板の製造方法について説明する。 (1)まず、基板（コア材）１の表面に、内層銅パターン
２および内層パッドを形成する。この基板１への銅パタ
ーン２の形成は、銅張積層板をエッチングして行うか、
あるいは、ガラスエポキシ基板やポリイミド基板、セラ
ミック基板、金属基板などの基板に無電解めっき用接着
剤層を形成し、この接着剤層表面を粗化して粗化面と
し、ここに無電解めっきを施して行う方法がある。特
に、銅張積層板をエッチングして銅パターン２とした場
合は、無溶剤の絶縁樹脂（エポキシ樹脂やポリイミド樹
脂）を塗布して、これを硬化した後、研磨し、銅パター
ン２を露出させて、基板表面を平滑化しておくことが望
ましい。基板表面を平滑化しておくと、その上に感光性
の樹脂絶縁層を形成する際に、その厚さが均一になるた
め、露光、現像がしやすいからである。なお、図１に示
すコア基板１では、スルーホール４が形成されてなり、
このスルーホール４を介して表面と裏面の配線層を電気
的に接続している。Hereinafter, a method for manufacturing a multilayer printed wiring board according to the present invention will be described. (1) First, an inner layer copper pattern 2 and an inner layer pad are formed on the surface of a substrate (core material) 1. The copper pattern 2 is formed on the substrate 1 by etching a copper-clad laminate,
Alternatively, an adhesive layer for electroless plating is formed on a substrate such as a glass epoxy substrate, a polyimide substrate, a ceramic substrate, or a metal substrate, and the surface of the adhesive layer is roughened to a roughened surface. There is a way to do it. In particular, when the copper-clad laminate is etched to form a copper pattern 2, a solvent-free insulating resin (epoxy resin or polyimide resin) is applied, cured, and polished to expose the copper pattern 2. It is desirable to smooth the substrate surface. This is because, when the surface of the substrate is smoothed, the photosensitive resin insulating layer has a uniform thickness when the photosensitive resin insulating layer is formed thereon, so that exposure and development are easy. In the core substrate 1 shown in FIG. 1, through holes 4 are formed.
The wiring layers on the front and back surfaces are electrically connected via the through holes 4.

【００２９】(2)次に、前記 (1)で形成した内層銅パタ
ーン２および内層パッドの上に、層間絶縁材層５を形成
する。この層間絶縁材層５は、エポキシ樹脂やポリイミ
ド樹脂、ビスマレイミドトリアジン樹脂、フェノール樹
脂などの熱硬化性樹脂、これらを感光化した感光性樹
脂、ポリエーテルスルフォンなどの熱可塑性樹脂、熱可
塑性樹脂と熱硬化性樹脂の複合体、あるいは熱可塑性樹
脂と感光性樹脂の複合体で構成されることが望ましい。
これらの樹脂層の表面は、酸化剤や酸、アルカリなどで
粗化処理することができる。粗化することにより、この
表面に形成される導体回路との密着性を改善することが
できるからである。(2) Next, an interlayer insulating material layer 5 is formed on the inner copper pattern 2 and the inner pad formed in the above (1). The interlayer insulating material layer 5 is made of a thermosetting resin such as an epoxy resin, a polyimide resin, a bismaleimide triazine resin, or a phenol resin, a photosensitive resin obtained by sensitizing the resin, a thermoplastic resin such as polyether sulfone, or a thermoplastic resin. It is desirable to be composed of a composite of a thermosetting resin or a composite of a thermoplastic resin and a photosensitive resin.
The surface of these resin layers can be roughened with an oxidizing agent, acid, alkali, or the like. This is because the roughening can improve the adhesion to the conductor circuit formed on the surface.

【００３０】このような層間絶縁材としては、とくに無
電解めっき用接着剤を用いることが望ましい。この無電
解めっき用接着剤は、酸あるいは酸化剤に難溶性の耐熱
性樹脂中に酸あるいは酸化剤に可溶性の耐熱性樹脂粒子
が分散されてなるものが最適である。これは、酸あるい
は酸化剤に可溶性の耐熱性樹脂粒子を粗化して除去する
ことにより、表面に蛸壺状のアンカーを形成でき、導体
回路との密着性を顕著に改善することができるからであ
る。As such an interlayer insulating material, it is particularly desirable to use an adhesive for electroless plating. As the adhesive for electroless plating, an adhesive obtained by dispersing heat-resistant resin particles that are soluble in an acid or an oxidizing agent in a heat-resistant resin that is hardly soluble in an acid or an oxidizing agent is optimal. This is because by roughening and removing the heat-resistant resin particles soluble in an acid or an oxidizing agent, an octopus-shaped anchor can be formed on the surface, and the adhesion to the conductor circuit can be significantly improved. is there.

【００３１】上記接着剤において、酸あるいは酸化剤に
難溶性の耐熱性樹脂としては、感光化した熱硬化性樹
脂、感光化した熱硬化性樹脂と熱可塑性樹脂の複合体が
望ましい。感光化することにより、露光、現像により、
バイアホールを容易に形成できるからである。また、熱
可塑性樹脂と複合化することにより靱性を向上させるこ
とができ、導体回路のピール強度の向上、ヒートサイク
ルによるバイアホール部分のクラック発生を防止できる
からである。具体的には、エポキシ樹脂をアクリル酸や
メタクリル酸などと反応させたエポキシアクリレートや
エポキシアクリレートとポリエーテルスルホンとの複合
体がよい。エポキシアクリレートは、全エポキシ基の20
〜80％がアクリル酸やメタクリル酸などと反応したもの
が望ましい。In the above-mentioned adhesive, as the heat-resistant resin hardly soluble in an acid or an oxidizing agent, a photosensitive thermosetting resin or a composite of a photosensitive thermosetting resin and a thermoplastic resin is preferable. By photosensitizing, by exposure and development,
This is because via holes can be easily formed. Further, by forming a composite with a thermoplastic resin, the toughness can be improved, the peel strength of the conductor circuit can be improved, and the occurrence of cracks in the via hole due to the heat cycle can be prevented. Specifically, epoxy acrylate obtained by reacting an epoxy resin with acrylic acid, methacrylic acid, or the like, or a composite of epoxy acrylate and polyether sulfone is preferable. Epoxy acrylate has 20 of all epoxy groups
It is desirable that about 80% react with acrylic acid or methacrylic acid.

【００３２】上記接着剤において、前記耐熱性樹脂粒子
としては、平均粒径が10μｍ以下の耐熱性樹脂粉末、
平均粒径が２μｍ以下の耐熱性樹脂粉末を凝集させて
平均粒径２〜10μｍの大きさとした凝集粒子、平均粒
径が２〜10μｍの耐熱性粉末樹脂粉末と平均粒径２μｍ
以下の耐熱性樹脂粉末との混合物、平均粒径２〜10μ
ｍの耐熱性樹脂粉末の表面に平均粒径２μｍ以下の耐熱
性樹脂粉末もしくは平均粒径２μｍ以下の無機粉末のい
ずれか少なくとも１種を付着させてなる疑似粒子から選
ばれることが望ましい。これらは、複雑なアンカーを形
成できるからである。耐熱性樹脂粒子としては、エポキ
シ樹脂、アミノ樹脂（メラミン樹脂、尿素樹脂、グアナ
ミン樹脂）などがよい。特に、エポキシ樹脂は、そのオ
リゴマーの種類、硬化剤の種類、架橋密度を変えること
により任意に酸や酸化剤に対する溶解度を変えることが
できる。例えば、ビスフェノールＡ型エポキシ樹脂オリ
ゴマーをアミン系硬化剤で硬化処理したものは、酸化剤
に溶解しやすい。しかし、ノボラックエポキシ樹脂オリ
ゴマーをイミダゾール系硬化剤で硬化させたものは、酸
化剤に溶解しにくい。In the above adhesive, the heat-resistant resin particles include a heat-resistant resin powder having an average particle diameter of 10 μm or less;
Aggregated particles having an average particle diameter of 2 to 10 μm by aggregating heat-resistant resin powder having an average particle diameter of 2 μm or less, heat-resistant powder resin powder having an average particle diameter of 2 to 10 μm, and an average particle diameter of 2 μm
Mixture with the following heat resistant resin powder, average particle size 2-10μ
It is desirable to select from pseudo particles obtained by adhering at least one of a heat-resistant resin powder having an average particle diameter of 2 μm or less and an inorganic powder having an average particle diameter of 2 μm or less to the surface of the m heat-resistant resin powder. These are because they can form complex anchors. As the heat-resistant resin particles, epoxy resin, amino resin (melamine resin, urea resin, guanamine resin) and the like are preferable. Particularly, the solubility of an epoxy resin in an acid or an oxidizing agent can be arbitrarily changed by changing the type of the oligomer, the type of the curing agent, and the crosslinking density. For example, a bisphenol A-type epoxy resin oligomer cured with an amine-based curing agent is easily dissolved in an oxidizing agent. However, the novolak epoxy resin oligomer cured with an imidazole-based curing agent is hardly dissolved in the oxidizing agent.

【００３３】本発明で使用できる酸としては、リン酸、
塩酸、硫酸、あるいは蟻酸や酢酸などの有機酸がある
が、特に有機酸が望ましい。粗化処理した場合に、バイ
アホールから露出する金属導体層を腐食させにくいから
である。酸化剤としては、クロム酸、過マンガン酸塩
（過マンガン酸カリウムなど）が望ましい。特に、アミ
ノ樹脂を溶解除去する場合は、酸と酸化剤で交互に粗化
処理することが望ましい。The acid which can be used in the present invention includes phosphoric acid,
There are hydrochloric acid, sulfuric acid, and organic acids such as formic acid and acetic acid, and organic acids are particularly desirable. This is because when the roughening treatment is performed, the metal conductor layer exposed from the via hole is hardly corroded. As the oxidizing agent, chromic acid and permanganate (such as potassium permanganate) are desirable. In particular, in the case of dissolving and removing the amino resin, it is preferable to perform a roughening treatment alternately with an acid and an oxidizing agent.

【００３４】本発明の多層プリント配線板において、層
間絶縁材層５は、複数層でもよい。例えば、複数層にす
る場合は次の形態がある。 ．上層導体回路と下層導体回路の間に設けられてなる
層間絶縁材層において、上層導体回路に近い側を、酸あ
るいは酸化剤に難溶性の耐熱性樹脂中に酸あるいは酸化
剤に可溶性の耐熱性樹脂粒子が分散されてなる無電解め
っき用接着剤とし、下層導体回路に近い側を酸あるいは
酸化剤に難溶性の耐熱性樹脂とした２層構造の層間絶縁
材層。この構成では、無電解めっき用接着剤層を粗化処
理しても粗化しすぎて、層間を短絡させてしまうことが
ない。 ．上層導体回路と下層導体回路の間に設けられてなる
層間絶縁剤層において、下層導体回路間に充填樹脂材を
埋め込み、下層導体回路とこの充填樹脂材の表面を同一
平面になるようにし、この上に、酸あるいは酸化剤に難
溶性の耐熱性樹脂層を形成、さらにその上に酸あるいは
酸化剤に難溶性の耐熱性樹脂中に酸あるいは酸化剤に可
溶性の耐熱性樹脂粒子が分散されてなる無電解めっき用
接着剤を形成した３層構造の層間絶縁材層。この構成で
は、下層導体回路間に充填樹脂材を充填しているので、
基板表面が平滑になり、厚さのバラツキにより生じる現
像不良がない。また、充填樹脂材にシリカなどの無機粒
子を含有させることにより、硬化収縮を低減して基板の
反りを防止できる。なお、充填樹脂材としては、無溶剤
樹脂が望ましく、特に無溶剤エポキシ樹脂が最適であ
る。溶剤を使用すると、加熱した場合に残留溶剤が気化
して層間剥離の原因になるからである。In the multilayer printed wiring board of the present invention, the interlayer insulating material layer 5 may have a plurality of layers. For example, in the case of using a plurality of layers, there are the following modes. . In the interlayer insulating material layer provided between the upper conductor circuit and the lower conductor circuit, the side close to the upper conductor circuit is made of a heat-resistant resin soluble in an acid or an oxidizing agent in a heat-resistant resin that is hardly soluble in an acid or an oxidizing agent. An interlayer insulating material layer having a two-layer structure in which an adhesive for electroless plating in which resin particles are dispersed is used, and a heat-resistant resin that is hardly soluble in an acid or an oxidizing agent on the side close to the lower conductive circuit. With this configuration, even if the adhesive layer for electroless plating is roughened, the layer is not excessively roughened and short-circuits between the layers. . In the interlayer insulating agent layer provided between the upper conductor circuit and the lower conductor circuit, a filling resin material is embedded between the lower conductor circuits so that the surface of the lower conductor circuit and the surface of the filling resin material are flush with each other. A heat-resistant resin layer hardly soluble in an acid or an oxidizing agent is formed thereon, and heat-resistant resin particles soluble in the acid or the oxidizing agent are further dispersed in a heat-resistant resin layer hardly soluble in an acid or an oxidizing agent. An interlayer insulating material layer having a three-layer structure on which an adhesive for electroless plating is formed. In this configuration, the filling resin material is filled between the lower conductor circuits,
The surface of the substrate becomes smooth, and there is no defective development caused by thickness variations. In addition, by including inorganic particles such as silica in the filler resin material, curing shrinkage can be reduced and the substrate warpage can be prevented. As the filling resin material, a solventless resin is desirable, and particularly, a solventless epoxy resin is optimal. If a solvent is used, the residual solvent will evaporate when heated, causing delamination.

【００３５】(3)上記(2) で形成した層間絶縁材層５を
乾燥した後、感光性樹脂の場合は、露光、現像すること
により、また、熱硬化性樹脂の場合は、熱硬化したのち
レーザー加工することにより、バイアホール用の開口部
を設ける。(3) After drying the interlayer insulating material layer 5 formed in the above (2), the photosensitive resin is exposed and developed, and the thermosetting resin is thermally cured. After that, an opening for a via hole is provided by laser processing.

【００３６】(4)上記(3) でバイアホール用の開口部を
設けた層間絶縁材層５の表面を粗化した後、触媒核を付
与する。この触媒核は、貴金属イオンやコロイドなどが
望ましく、一般的には、塩化パラジウムやパラジウムコ
ロイドを使用する。なお、触媒核を固定するために加熱
処理を行うことが望ましい。(4) After roughening the surface of the interlayer insulating material layer 5 provided with the opening for the via hole in the above (3), a catalyst nucleus is provided. The catalyst nucleus is preferably a noble metal ion or a colloid. Generally, palladium chloride or a palladium colloid is used. Note that it is desirable to perform a heat treatment to fix the catalyst core.

【００３７】(5)上記(4) で触媒核を付与した後、めっ
きレジスト６を形成する。このめっきレジスト６として
は、市販品を使用してもよく、エポキシ樹脂をアクリル
酸やメタクリル酸などと反応させたエポキシアクリレー
トとイミダゾール硬化剤からなる組成物、あるいはエポ
キシアクリレート、ポリエーテルスルホンおよびイミダ
ゾール硬化剤からなる組成物でもよい。ここで、エポキ
シアクリレートとポリエーテルスルホンの比率は、50／
50〜80／20程度が望ましい。エポキシアクリレートが多
過ぎると可撓性が低下し、少な過ぎると感光性、耐塩基
性、耐酸性、耐酸化剤特性が低下するからである。エポ
キシアクリレートは、全エポキシ基の20〜80％がアクリ
ル酸やメタクリル酸などと反応したものが望ましい。ア
クリル化率が高過ぎるとＯＨ基による親水性が高くなり
吸湿性が上がり、アクリル化率が低過ぎると解像度が低
下するからである。基本骨格樹脂であるエポキシ樹脂と
しては、ノボラック型エポキシ樹脂が望ましい。架橋密
度が高く、硬化物の吸水率が 0.1％以下に調整でき、耐
塩基性に優れるからである。ノボラック型エポキシ樹脂
としては、クレゾールノボラック型、フェノールノボラ
ック型がある。(5) After providing the catalyst nucleus in (4), a plating resist 6 is formed. As the plating resist 6, a commercially available product may be used, and a composition comprising an epoxy acrylate and an imidazole curing agent obtained by reacting an epoxy resin with acrylic acid or methacrylic acid, or epoxy acrylate, polyether sulfone and imidazole curing. It may be a composition comprising an agent. Here, the ratio of epoxy acrylate to polyether sulfone is 50 /
About 50-80 / 20 is desirable. This is because if the amount of epoxy acrylate is too large, the flexibility is reduced, and if the amount is too small, the photosensitivity, base resistance, acid resistance and antioxidant properties are reduced. The epoxy acrylate is preferably one in which 20 to 80% of all epoxy groups have reacted with acrylic acid or methacrylic acid. If the acrylate ratio is too high, the hydrophilicity due to the OH group is increased and the hygroscopicity is increased, and if the acrylate ratio is too low, the resolution is reduced. As the epoxy resin as the basic skeleton resin, a novolak type epoxy resin is desirable. This is because the crosslinking density is high, the water absorption of the cured product can be adjusted to 0.1% or less, and the base resistance is excellent. Novolak type epoxy resins include cresol novolak type and phenol novolak type.

【００３８】(6)上記(5) の処理でめっきレジスト６が
形成されなかった部分に一次めっきを施す。このとき、
銅パターンだけでなく、額縁状に配置した平坦パッド８
およびバイアホール９を形成する。この一次めっきとし
ては、銅、ニッケル、コバルトおよびリンから選ばれる
少なくとも２種以上の金属イオンを使用した合金めっき
であることが望ましい。この理由は、これらの合金は強
度が高く、ピール強度を向上させることができるからで
ある。上記一次めっきの無電解めっき液において、銅、
ニッケル、コバルトイオンと塩基性条件下で安定した錯
体を形成する錯化剤としては、ヒドロキシカルボン酸を
用いることが望ましい。上記一次めっきの無電解めっき
液において、金属イオンを還元して金属元素にするため
の還元剤は、アルデヒド、次亜リン酸塩（ホスフィン酸
塩と呼ばれる）、水素化ホウ素塩、ヒドラジンから選ば
れる少なくとも１種であることが望ましい。これらの還
元剤は、水溶性であり、還元力に優れるからである。特
に、ニッケルを析出させる点では次亜リン酸塩が望まし
い。上記一次めっきの無電解めっき液において、塩基性
条件下に調整するためのｐＨ調整剤としては、水酸化ナ
トリウム、水酸化カリウム、水酸化カルシウムから選ば
れる少なくとも１種の塩基性化合物を用いることが望ま
しい。塩基性条件下において、ヒドロキシカルボン酸は
ニッケルイオンなどと錯体を形成するからである。この
ヒドロキシカルボン酸としては、クエン酸、リンゴ酸、
酒石酸などが望ましい。これらは、ニッケル、コバル
ト、銅と錯体を形成しやすいからである。前記ヒドロキ
シカルボンの濃度は 0.1〜0.8 Ｍであることが望まし
い。 0.1Ｍより少ないと十分な錯体が形成できず、異常
析出や液の分解が生じる。一方、 0.8Ｍを超えると析出
速度が遅くなったり、水素の発生が多くなったりするな
どの不具合が発生するからである。上記一次めっきの無
電解めっき液は、ビピリジルを含有してなることが望ま
しい。この理由は、ビピリジルはめっき浴中の金属酸化
物の発生を抑制してノジュールの発生を抑制できるから
である。なお、銅イオン、ニッケルイオン、コバルトイ
オンは、硫酸銅、硫酸ニッケル、硫酸コバルト、塩化
銅、塩化ニッケル、塩化コバルトなどの銅、ニッケル、
コバルト化合物を溶解させることにより供給する。(6) A primary plating is applied to a portion where the plating resist 6 is not formed in the process (5). At this time,
Flat pads 8 arranged not only in a copper pattern but also in a frame shape
And a via hole 9 is formed. The primary plating is desirably an alloy plating using at least two or more metal ions selected from copper, nickel, cobalt and phosphorus. This is because these alloys have high strength and can improve the peel strength. In the electroless plating solution of the primary plating, copper,
As a complexing agent that forms a stable complex with nickel and cobalt ions under basic conditions, it is desirable to use hydroxycarboxylic acid. In the electroless plating solution for the primary plating, a reducing agent for reducing metal ions to a metal element is selected from aldehyde, hypophosphite (referred to as phosphinate), borohydride, and hydrazine. Desirably, at least one kind is used. This is because these reducing agents are water-soluble and have excellent reducing power. In particular, hypophosphite is desirable in terms of depositing nickel. In the electroless plating solution for the primary plating, at least one basic compound selected from sodium hydroxide, potassium hydroxide, and calcium hydroxide may be used as a pH adjuster for adjusting under basic conditions. desirable. This is because under basic conditions, hydroxycarboxylic acid forms a complex with nickel ions and the like. As the hydroxycarboxylic acid, citric acid, malic acid,
Tartaric acid and the like are desirable. This is because these easily form a complex with nickel, cobalt, and copper. The concentration of the hydroxycarboxylic acid is preferably 0.1 to 0.8M. If the amount is less than 0.1 M, a sufficient complex cannot be formed, resulting in abnormal precipitation or decomposition of the liquid. On the other hand, if it exceeds 0.8M, problems such as a low deposition rate and a large amount of hydrogen are generated. The electroless plating solution for the primary plating desirably contains bipyridyl. The reason for this is that bipyridyl can suppress the generation of metal oxides in the plating bath and the generation of nodules. In addition, copper ion, nickel ion, and cobalt ion are copper, nickel, such as copper sulfate, nickel sulfate, cobalt sulfate, copper chloride, nickel chloride, and cobalt chloride.
Supplied by dissolving the cobalt compound.

【００３９】このような無電解めっき液により形成され
た一次めっき膜は、無電解めっき用接着剤層の粗化面に
対する追従性に優れ、粗化面の形態をそのままトレース
する。そのため、一次めっき膜は、粗化面と同様にアン
カーを持つ。従って、この一次めっき膜上に形成される
二次めっき膜は、このアンカーにより、密着性が確保さ
れるのである。従って、一次めっき膜は、ピール強度を
支配するために、上述したような無電解めっき液によっ
て析出する強度が高いめっき膜が望ましく、一方、二次
めっき膜は、電気導電性が高く、析出速度が早いことが
望ましいので、複合めっきよりも単純な銅めっき液によ
って析出するめっき膜が望ましい。The primary plating film formed by such an electroless plating solution has excellent followability to the roughened surface of the adhesive layer for electroless plating, and traces the form of the roughened surface as it is. Therefore, the primary plating film has an anchor like the roughened surface. Therefore, the adhesion of the secondary plating film formed on the primary plating film is secured by the anchor. Therefore, in order to control the peel strength, the primary plating film is desirably a plating film having a high strength to be deposited by the electroless plating solution as described above, while the secondary plating film has a high electric conductivity and a high deposition rate. Therefore, a plating film deposited with a simple copper plating solution is more desirable than composite plating.

【００４０】(7)上記(6) で形成した一次めっき膜の上
に二次めっきを施して、平坦パッド８およびバイアホー
ル９を含む導体回路を形成する。この二次めっきによる
めっき膜は、銅めっき膜であることが望ましい。上記二
次めっきの無電解めっき液は、銅イオン、トリアルカノ
ールアミン、還元剤、ｐＨ調整剤からなる無電解銅めっ
き液において、銅イオンの濃度が 0.005〜0.015mol／
ｌ、ｐＨ調整剤の濃度が0.25〜0.35 mol／ｌであり、還
元剤の濃度が0.01〜0.04 mol／ｌである無電解めっき液
を用いることが望ましい。このめっき液は、浴が安定で
あり、ノジュールなどの発生が少ないからである。上記
二次めっきの無電解めっき液において、トリアルカノー
ルアミンの濃度は0.1〜0.8 Ｍであることが望ましい。
この範囲でめっき析出反応が最も進行しやすいからであ
る。このトリアルカノールアミンは、トリエタノールア
ミン、トリイソパノールアミン、トリメタノールアミ
ン、トリプロパノールアミンから選ばれる少なくとも１
種であることが望ましい。水溶性だからである。上記二
次めっきの無電解めっき液において、還元剤は、アルデ
ヒド、次亜リン酸塩、水素化ホウ素塩、ヒドラジンから
選ばれる少なくとも１種であることが望ましい。水溶性
であり、塩基性条件下で還元力を持つからである。ｐＨ
調整剤は、水酸化ナトリウム、水酸化カリウム、水酸化
カルシウムから選ばれる少なくとも１種であることが望
ましい。(7) Secondary plating is performed on the primary plating film formed in (6) to form a conductor circuit including the flat pad 8 and the via hole 9. The plating film formed by the secondary plating is preferably a copper plating film. The electroless plating solution for the secondary plating is an electroless copper plating solution comprising copper ions, trialkanolamine, a reducing agent, and a pH adjuster, and has a copper ion concentration of 0.005 to 0.015 mol /
It is desirable to use an electroless plating solution in which the concentration of the pH adjuster is 0.25 to 0.35 mol / l and the concentration of the reducing agent is 0.01 to 0.04 mol / l. This is because the plating solution has a stable bath and generates little nodules and the like. In the above electroless plating solution for secondary plating, the concentration of trialkanolamine is desirably 0.1 to 0.8M.
This is because the plating precipitation reaction most easily proceeds in this range. The trialkanolamine is at least one selected from triethanolamine, triisopanolamine, trimethanolamine, and tripropanolamine.
Desirably a seed. Because it is water-soluble. In the above electroless plating solution for secondary plating, the reducing agent is desirably at least one selected from aldehyde, hypophosphite, borohydride, and hydrazine. This is because it is water-soluble and has a reducing power under basic conditions. pH
The adjusting agent is desirably at least one selected from sodium hydroxide, potassium hydroxide, and calcium hydroxide.

【００４１】このようにして、一次めっき膜と二次めっ
き膜からなる、導体パターン、額縁状に配置した平坦パ
ッド８および上層導体と内層パッドを電気的に接続する
バイアホール９を形成する。ここで、上記バイアホール
は、図１では14×14−８×８＝132 個であり、コア基材
の導体パターンと電気的に接続された 132個の額縁状に
配置された平坦な内層パッド群の上面に形成される。ま
た、上記平坦パッドは、配線基板の表層に上記バイアホ
ールの外側部に額縁状に配置して 204個形成される。な
お、配線基板の表層に形成したはんだパッド群は、図１
(b) に示すように、千鳥配置にして導体パターンと接続
することが望ましい。即ち、図１(b) に示すように、最
外周のパッド間では、３等分するように第２列，第３列
のパッドから引き出された導体パターンを配置し、さら
に、第１列のパッドの一方と第２列のパッドの間では、
２等分するように第３列のパッドから引き出された導体
パターンを配置する。In this way, the conductor pattern, the flat pad 8 arranged in a frame shape, and the via hole 9 for electrically connecting the upper conductor and the inner layer pad, which are composed of the primary plating film and the secondary plating film, are formed. Here, the number of via holes is 14 × 14−8 × 8 = 132 in FIG. 1, and 132 flat inner layer pads arranged in a frame shape electrically connected to the conductor pattern of the core substrate. It is formed on the upper surface of the group. Further, 204 flat pads are formed in a frame shape on the outer layer of the via hole on the surface layer of the wiring board. The solder pads formed on the surface layer of the wiring board are shown in FIG.
As shown in (b), it is desirable to connect the conductor patterns in a staggered arrangement. That is, as shown in FIG. 1 (b), between the outermost pads, conductor patterns drawn from the pads in the second and third rows are arranged so as to be equally divided into three, and further, the pads in the first row are further divided. Between one of the pads and the second row of pads,
The conductor pattern drawn from the third row of pads is arranged so as to divide into two.

【００４２】(8)次に、感光性のソルダーレジスト10を
塗布し、露光、現像して、平坦パッド８とバイアホール
９の位置にそれらの径よりも大きな径の開口を有するソ
ルダーレジスト10の層を形成する。なお、具体的な設計
値としては、平坦パッド８の径を100 μｍ、バイアホー
ル９の径を 175μｍ、平坦パッド８部のソルダーレジス
ト10の開口径を 125μｍ、バイアホール９部のソルダー
レジスト10の開口径を 200μｍとする。(8) Next, a photosensitive solder resist 10 is applied, exposed, and developed to form a solder resist 10 having openings larger in diameter than the flat pad 8 and the via hole 9 at the positions of the flat pad 8 and the via hole 9. Form a layer. As specific design values, the diameter of the flat pad 8 is 100 μm, the diameter of the via hole 9 is 175 μm, the opening diameter of the solder resist 10 at the flat pad 8 is 125 μm, and the solder resist 10 at the via hole 9 is The opening diameter is 200 μm.

【００４３】(9)さらに、前記 (7)で形成したソルダー
レジスト10の開口から露出する平坦パッド８およびバイ
アホール９の表面にＮｉめっき、Ａｕめっきを順に施
す。(9) Further, Ni plating and Au plating are sequentially applied to the surface of the flat pad 8 and the via hole 9 exposed from the opening of the solder resist 10 formed in (7).

【００４４】(10) そして、ポリエチレンテレフタレー
トフィルム上にはんだ箔をラミネートし、バイアホール
およびパッドの位置に相当する場所をはんだパターンと
して残してエッチング処理する。次いで、このフィルム
を、はんだパターンとパッドおよびバイアホールが接触
するように積層し、加熱リフローしてはんだをパッドお
よびバイアホールに転写し、はんだバンプ11を形成す
る。なお、パッド部のはんだ量とバイアホール部のはん
だ量の比率は、例えば 190：210 とする。(10) Then, a solder foil is laminated on the polyethylene terephthalate film, and etching is performed while leaving a place corresponding to the position of the via hole and the pad as a solder pattern. Next, this film is laminated so that the solder pattern is in contact with the pad and the via hole, and is heated and reflowed to transfer the solder to the pad and the via hole, thereby forming the solder bump 11. The ratio of the amount of solder in the pad portion to the amount of solder in the via hole portion is, for example, 190: 210.

【００４５】このようにして得られた多層プリント配線
板の断面模式図を図１に示す。この図に示す多層プリン
ト配線板は、裏面側にも多層配線層を有するものである
が、製造方法は、基本的には同じである。FIG. 1 shows a schematic cross-sectional view of the multilayer printed wiring board thus obtained. The multilayer printed wiring board shown in this figure has a multilayer wiring layer also on the back surface side, but the manufacturing method is basically the same.

【００４６】[0046]

【発明の効果】以上説明したように本発明によれば、は
んだパッドの高集積化（高密度化）を実現するととも
に、配線基板表面の高密度実装特性を維持しつつ配線層
数の低減化を図ることができる、フリップチップ実装用
多層プリント配線板を安定して提供することができる。
これにより、多層プリント配線板の収率改善および製造
コストの低減が可能となる。As described above, according to the present invention, high integration (high density) of solder pads is realized, and the number of wiring layers is reduced while maintaining high-density mounting characteristics on the surface of a wiring board. And a multilayer printed wiring board for flip chip mounting can be stably provided.
This makes it possible to improve the yield of the multilayer printed wiring board and reduce the manufacturing cost.

【図面の簡単な説明】[Brief description of the drawings]

【図１】(a)本発明にかかる多層プリント配線板の一例
を示す断面模式図と、(b)配線層表面のはんだパッドか
らの配線状態を示す図である。FIG. 1A is a schematic cross-sectional view showing an example of a multilayer printed wiring board according to the present invention, and FIG. 1B is a diagram showing a wiring state from a solder pad on the surface of a wiring layer.

【図２】(a) 枡目状、(b) 千鳥状に配列されたはんだバ
ンプを示す模式図である。FIGS. 2A and 2B are schematic views showing solder bumps arranged in (a) grid pattern and (b) staggered pattern.

【図３】多層配線層表面にフルグリッドのマトリックス
状に配置してはんだパッド群を形成してなる多層プリン
ト配線板における、(a) 内層配線の接続状態、(b) はん
だバンプの一配列状態を示す図である。FIG. 3 shows (a) the connection state of the inner layer wiring, and (b) the arrangement state of the solder bumps in the multilayer printed wiring board in which the solder pad group is formed by being arranged in a full grid matrix on the surface of the multilayer wiring layer. FIG.

【図４】本発明の多層プリント配線板における、(a) 内
層配線の接続状態、(b) はんだバンプの一配列状態を示
す図である。FIG. 4 is a diagram showing (a) a connection state of an inner layer wiring and (b) an arrangement state of solder bumps in the multilayer printed wiring board of the present invention.

【図５】(a) 平坦パッドにおけるソルダーレジストの開
口状態、(b) 平坦パッドでははんだバンプの位置ずれが
生じること、を説明する図である。FIGS. 5A and 5B are diagrams illustrating (a) an opening state of a solder resist in a flat pad, and (b) displacement of a solder bump in the flat pad.

【図６】(a) バイアホールにおけるソルダーレジストの
開口状態、(b) バイアホールでははんだバンプの位置ず
れがないこと、を説明する図である。FIGS. 6A and 6B are diagrams illustrating (a) an opening state of a solder resist in a via hole, and (b) no displacement of a solder bump in the via hole.

【図７】はんだ転写法を行った場合に、はんだパターン
とソルダーレジストの開口が嵌合することを説明する図
である。FIG. 7 is a diagram illustrating that a solder pattern and an opening of a solder resist are fitted when a solder transfer method is performed.

【図８】(a) めっきレジストがない場合と、(b) めっき
レジストがある場合の、はんだバンプの形成状態の差を
示す図である。FIG. 8 is a diagram showing a difference between the formation state of a solder bump when (a) there is no plating resist and (b) when there is a plating resist.

【図９】額縁状に配置されたはんだパッド群の形状が八
角形であるときのはんだバンプの配列を示す模式図であ
る。FIG. 9 is a schematic view showing an arrangement of solder bumps when the shape of a group of solder pads arranged in a frame is octagonal.

【符号の説明】[Explanation of symbols]

１ 基板（コア材） ２ 銅パターン（導体パターン） ４ スルーホール ５ 層間絶縁材層 ６ めっきレジスト ８ 平坦パッド ９ バイアホール 10 ソルダーレジスト 11 はんだバンプ DESCRIPTION OF SYMBOLS 1 Substrate (core material) 2 Copper pattern (conductor pattern) 4 Through hole 5 Interlayer insulating material layer 6 Plating resist 8 Flat pad 9 Via hole 10 Solder resist 11 Solder bump

フロントページの続き (58)調査した分野(Int.Cl.7，ＤＢ名) H05K 3/46 H05K 3/28 H01L 23/12 Continuation of the front page (58) Field surveyed (Int.Cl. 7 , DB name) H05K 3/46 H05K 3/28 H01L 23/12

Claims (4)

(57)【特許請求の範囲】(57) [Claims] 【請求項１】 コア基板上に、層間絶縁材層と導体回路
が交互に積層された多層配線層が形成され、この多層配
線層の表面に、はんだバンプが設けられたパッドを２次
元的に配列してなるはんだパッド群を形成してなる多層
プリント配線板において、 前記はんだパッド群の形状を、中心部を除く周辺部のみ
に配置した額縁状にすると共に、その額縁状はんだパッ
ド群のうちの外側部に位置するはんだパッドは、その表
面の導体パターンにそれぞれ接続した平坦パッドとこの
パッド表面に形成したはんだバンプとで構成し、一方、
内側部に位置するはんだパッドは、内層に位置する平坦
な内層パッド群にそれぞれ接続したバイアホールとこの
バイアホールの凹部に形成したはんだバンプとで構成し
たことを特徴とする多層プリント配線板。1. A multilayer wiring layer in which interlayer insulating material layers and conductive circuits are alternately laminated on a core substrate, and pads provided with solder bumps are two-dimensionally formed on the surface of the multilayer wiring layer. In a multilayer printed wiring board formed with an array of solder pads, the shape of the solder pads is formed into a frame shape arranged only in a peripheral portion excluding a center portion, and among the frame-shaped solder pads, The solder pad located on the outer side of is composed of a flat pad connected to the conductor pattern on the surface thereof and a solder bump formed on the surface of the pad.
A multilayer printed wiring board, wherein the solder pads located on the inner side are composed of via holes connected to flat inner layer pad groups located on the inner layer, respectively, and solder bumps formed in recesses of the via holes. 【請求項２】 前記はんだパッド群のうちの外側部に位
置するはんだパッドは、最外周から１列目乃至５列目ま
でに位置するはんだパッドである請求項１に記載の多層
プリント配線板。2. The multilayer printed wiring board according to claim 1, wherein the solder pads located on the outer side of the solder pad group are solder pads located in the first to fifth rows from the outermost periphery. 【請求項３】 前記層間絶縁材層は、その表面に表面粗
さが５〜15μｍの粗化面が形成されてなる請求項１に記
載の多層プリント配線板。3. The multilayer printed wiring board according to claim 1, wherein the interlayer insulating material layer has a roughened surface with a surface roughness of 5 to 15 μm formed on a surface thereof. 【請求項４】 前記多層配線層の表面に、ソルダーレジ
スト層が形成されてなり、このソルダーレジストの開口
径を、前記はんだパッドを構成する平坦パッドとバイア
ホールの直径よりも大きくすることにより、ソルダーレ
ジストが当該パッドあるいは当該バイアホールと重なら
ないようにしたことを特徴とする請求項１に記載の多層
プリント配線板。4. A solder resist layer is formed on the surface of the multilayer wiring layer, and an opening diameter of the solder resist is made larger than diameters of a flat pad and a via hole constituting the solder pad. 2. The multilayer printed wiring board according to claim 1, wherein the solder resist does not overlap with the pad or the via hole.
JP8206170A 1996-08-05 1996-08-05 Multilayer printed wiring board Expired - Fee Related JP3050812B2 (en)

Priority Applications (8)

Application Number Priority Date Filing Date Title
JP8206170A JP3050812B2 (en) 1996-08-05 1996-08-05 Multilayer printed wiring board
US08/897,702 US6525275B1 (en) 1996-08-05 1997-07-21 Multilayer printed circuit boards
DE69739005T DE69739005D1 (en) 1996-08-05 1997-07-25 Solder pad arrangement and connection structure for multilayer printed circuit boards
EP97112872A EP0823833B1 (en) 1996-08-05 1997-07-25 Solder pad arrangement and interconnect structure for multilayer printed circuit boards
MYPI97003418A MY118245A (en) 1996-08-05 1997-07-26 Multilayer printed circuit boards
KR1019970036339A KR100276802B1 (en) 1996-08-05 1997-07-31 Multilayer printed circuit boards
SG1997002759A SG71716A1 (en) 1996-08-05 1997-08-01 Multilayer printed circuit boards
CN97115322A CN1082783C (en) 1996-08-05 1997-08-04 Multilayer printed circuit boards

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP8206170A JP3050812B2 (en) 1996-08-05 1996-08-05 Multilayer printed wiring board

Publications (2)

Publication Number Publication Date
JPH1051146A JPH1051146A (en) 1998-02-20
JP3050812B2 true JP3050812B2 (en) 2000-06-12

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JP8206170A Expired - Fee Related JP3050812B2 (en) 1996-08-05 1996-08-05 Multilayer printed wiring board

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US (1) US6525275B1 (en)
EP (1) EP0823833B1 (en)
JP (1) JP3050812B2 (en)
KR (1) KR100276802B1 (en)
CN (1) CN1082783C (en)
DE (1) DE69739005D1 (en)
MY (1) MY118245A (en)
SG (1) SG71716A1 (en)

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Also Published As

Publication number Publication date
EP0823833A3 (en) 1999-04-14
KR100276802B1 (en) 2001-02-01
KR19980018258A (en) 1998-06-05
CN1082783C (en) 2002-04-10
DE69739005D1 (en) 2008-11-06
SG71716A1 (en) 2000-04-18
US6525275B1 (en) 2003-02-25
EP0823833B1 (en) 2008-09-24
EP0823833A2 (en) 1998-02-11
CN1173108A (en) 1998-02-11
MY118245A (en) 2004-09-30
JPH1051146A (en) 1998-02-20

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