JP3049976B2 - Wire bonding apparatus and wire bonding method - Google Patents

Wire bonding apparatus and wire bonding method

Info

Publication number
JP3049976B2
JP3049976B2 JP4318187A JP31818792A JP3049976B2 JP 3049976 B2 JP3049976 B2 JP 3049976B2 JP 4318187 A JP4318187 A JP 4318187A JP 31818792 A JP31818792 A JP 31818792A JP 3049976 B2 JP3049976 B2 JP 3049976B2
Authority
JP
Japan
Prior art keywords
wire
torch
wire bonding
tip
capillary tool
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP4318187A
Other languages
Japanese (ja)
Other versions
JPH06163624A (en
Inventor
潔 有田
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Corp
Panasonic Holdings Corp
Original Assignee
Panasonic Corp
Matsushita Electric Industrial Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Panasonic Corp, Matsushita Electric Industrial Co Ltd filed Critical Panasonic Corp
Priority to JP4318187A priority Critical patent/JP3049976B2/en
Publication of JPH06163624A publication Critical patent/JPH06163624A/en
Application granted granted Critical
Publication of JP3049976B2 publication Critical patent/JP3049976B2/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
    • H01L24/78—Apparatus for connecting with wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78—Apparatus for connecting with wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78—Apparatus for connecting with wire connectors
    • H01L2224/7825—Means for applying energy, e.g. heating means
    • H01L2224/78268—Discharge electrode
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78—Apparatus for connecting with wire connectors
    • H01L2224/7825—Means for applying energy, e.g. heating means
    • H01L2224/783—Means for applying energy, e.g. heating means by means of pressure
    • H01L2224/78301—Capillary
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78—Apparatus for connecting with wire connectors
    • H01L2224/787—Means for aligning
    • H01L2224/78703—Mechanical holding means
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
    • H01L2224/85009—Pre-treatment of the connector or the bonding area
    • H01L2224/8503—Reshaping, e.g. forming the ball or the wedge of the wire connector
    • H01L2224/85035—Reshaping, e.g. forming the ball or the wedge of the wire connector by heating means, e.g. "free-air-ball"
    • H01L2224/85045—Reshaping, e.g. forming the ball or the wedge of the wire connector by heating means, e.g. "free-air-ball" using a corona discharge, e.g. electronic flame off [EFO]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01004—Beryllium [Be]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01005—Boron [B]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01006—Carbon [C]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01033—Arsenic [As]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01039—Yttrium [Y]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01082—Lead [Pb]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/1015—Shape
    • H01L2924/1016—Shape being a cuboid
    • H01L2924/10162—Shape being a cuboid with a square active surface

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Wire Bonding (AREA)

Description

【発明の詳細な説明】DETAILED DESCRIPTION OF THE INVENTION

【０００１】[0001]

【産業上の利用分野】本発明はワイヤボンディング装置
に係り、詳しくは、キャピラリツールに挿通されたワイ
ヤの下端部とトーチの間に放電を発生させてこの下端部
にボールを生じさせるワイヤボンディング装置およびワ
イヤボンディング方法に関するものである。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a wire bonding apparatus, and more particularly, to a wire bonding apparatus that generates a discharge between a lower end of a wire inserted into a capillary tool and a torch to generate a ball at the lower end. And wa
The present invention relates to an ear bonding method .

【０００２】[0002]

【従来の技術】図４は、リードフレームなどの基板１の
電極と、この基板１に搭載されたチップ２の電極をワイ
ヤ３で接続するワイヤボンディング装置を示している。
このものは、ホーン４の先端部に保持されたキャピラリ
ツール５にワイヤ３を挿通し、このキャピラリツール５
の下部から導出するワイヤ３の下端部にトーチ６を近接
させてこのトーチ６に高電圧を印加し、ワイヤ３の下端
部とトーチ６の間に放電（矢印Ａ参照）を発生させてこ
の下端部にボール７を生じさせ、このボール７をチップ
２の電極にボンディングするようになっている。１８は
基板１を押え付ける押えマスクである。2. Description of the Related Art FIG. 4 shows a wire bonding apparatus for connecting electrodes of a substrate 1 such as a lead frame and electrodes of a chip 2 mounted on the substrate 1 with wires 3.
This wire is inserted through a capillary tool 5 held at the tip of a horn 4, and the capillary tool 5
A high voltage is applied to the torch 6 by bringing the torch 6 close to the lower end of the wire 3 led out from the lower part of the wire 3 and a discharge (see arrow A) is generated between the lower end of the wire 3 and the torch 6 to generate a discharge. A ball 7 is generated in the portion, and the ball 7 is bonded to an electrode of the chip 2. Reference numeral 18 denotes a pressing mask for pressing the substrate 1.

【０００３】[0003]

【発明が解決しようとする課題】ところがトーチ６に高
電圧を印加した場合、矢印Ａで示すように必ずしもワイ
ヤ３の下端部との間に放電が発生せず、矢印Ｂに示すよ
うにマスク１８などの他の金属部分との間に誤って放電
が発生し、その結果ワイヤ３の下端部にボール７が生じ
ない場合が発生するという問題点があった。殊にワイヤ
３は鎖線にて示すようにたわみやすいものであり、この
ようなたわみが生じると、ワイヤ３との間に放電が発生
しにくくなり、上記のような問題が生じやすいものであ
った。更にはワイヤ３とトーチ６の間で放電する場合で
も、矢印Ａａで示すように放電する場所が変化しやす
く、矢印Ａの場合と矢印Ａａの場合では放電路長に差が
あるのでボール７の径がばらついてしまうという問題点
があった。However, when a high voltage is applied to the torch 6, discharge does not always occur between the lower end of the wire 3 as shown by the arrow A and the mask 18 as shown by the arrow B. However, there is a problem that a discharge may be erroneously generated between the wire 3 and another metal part, and as a result, the ball 7 may not be formed at the lower end of the wire 3. In particular, the wire 3 is easy to bend as indicated by a chain line, and if such a warp occurs, it is difficult to generate a discharge between the wire 3 and the above-described problem. . Further, even in the case of discharging between the wire 3 and the torch 6, the location of the discharging tends to change as indicated by the arrow Aa, and there is a difference in the discharge path length between the arrow A and the arrow Aa. There is a problem that the diameter varies.

【０００４】したがって本発明は、ワイヤの下端部とト
ーチの間に確実に放電を発生させてワイヤの下端部にボ
ールを形成することができるワイヤボンディング装置お
よびワイヤボンディング方法を提供することを目的とす
る。Accordingly, the present invention provides a wire bonding apparatus and a wire bonding apparatus which can reliably generate a discharge between the lower end of a wire and a torch to form a ball at the lower end of the wire .
And a wire bonding method .

【０００５】[0005]

【課題を解決するための手段】このために本発明は、ホ
ーンと、前記ホーンの先端部に保持されてワイヤが挿通
されるキャピラリツールと、前記キャピラリツールの下
部から導出したワイヤの下端部に近接して前記下端部と
の間に放電を発生させて前記下端部にボールを生じさせ
る針状の先端部を有するトーチとを備えたワイヤボンデ
ィング装置において、前記ワイヤの下端部と前記トーチ
の間の放電路に沿うように前記針状の先端部へ向ってレ
ーザ光を照射するレーザ光照射手段を設けたことを特徴
とするワイヤボンディング装置である。Means for Solving the Problems] The present invention To this end, ho
And the wire is inserted through the horn
Capillary tool to be used and below the capillary tool
The lower end in close proximity to the lower end of the wire derived from the part
A discharge is generated during the time to produce a ball at the lower end.
Wire bonder with a torch having a needle-like tip
A lower end of the wire and the torch.
Toward the needle-like tip along the discharge path between
Laser light irradiation means for irradiating laser light
Is a wire bonding apparatus .

【０００６】[0006]

【作用】上記構成において、トーチの針状の先端部へ向
ってレーザ光を照射すると、このレーザ光の光路のガス
はプラズマ状態となり、放電が生じやすい状態となる。
したがって放電はワイヤ下端部とトーチの先端部の間に
発生し、ワイヤの下端部に確実にボールを生じさせるこ
とができる。In the above structure, the torch is directed toward the needle-like tip.
When the laser light is irradiated, the gas in the optical path of the laser light is in a plasma state, and the discharge is likely to occur.
Therefore, discharge occurs between the lower end of the wire and the tip of the torch , and the ball can be reliably generated at the lower end of the wire.

【０００７】[0007]

【実施例】次に、図面を参照しながら本発明の実施例を
説明する。Next, an embodiment of the present invention will be described with reference to the drawings.

【０００８】図１はワイヤボンディング装置の斜視図で
ある。移動テーブル１１上に駆動ボックス１２が設置さ
れており、この駆動ボックス１２からホーン４が前方に
延出している。ホーン４の先端部にはキャピラリツール
５が保持されており、キャピラリツール５にはワイヤ３
が挿通されている。移動テーブル１１はキャピラリツー
ル５をＸ方向やＹ方向に移動させる。駆動ボックス１２
の内部にはホーン４を上下方向に揺動させる駆動手段が
内蔵されている。この駆動手段は周知手段であり、その
説明は省略する。またリードフレームには、図４に示す
従来例と同様にマスクが被蓋されているが、図面が繁雑
になるのでこのマスクは省略している。FIG. 1 is a perspective view of a wire bonding apparatus. A drive box 12 is provided on the moving table 11, and the horn 4 extends forward from the drive box 12. A capillary tool 5 is held at the tip of the horn 4, and a wire 3 is attached to the capillary tool 5.
Is inserted. The moving table 11 moves the capillary tool 5 in the X direction or the Y direction. Drive box 12
A driving means for swinging the horn 4 in the up-down direction is built in the inside. This driving means is a well-known means, and a description thereof will be omitted. Although the lead frame is covered with a mask in the same manner as the conventional example shown in FIG. 4, this mask is omitted because the drawing becomes complicated.

【０００９】ホーン４と平行にトーチ６が延出してい
る。図２に示すようにトーチ６の先端部６ａは針状であ
り、駆動ボックス１２の内部に内蔵された電気回路から
高電圧が印加されることにより、キャピラリツール５の
下端部から導出するワイヤ３の下端部との間に矢印Ａで
示す放電路に放電が生じ、ワイヤ３の下端部にボール７
が生じる。ホーン４が上下方向に揺動することにより、
このボール７はチップ２の上面の電極８にボンディング
される。９はリードフレーム１の電極であり、ワイヤ３
の他端部側はこの電極９にボンディングされる。１０は
リードフレーム１の搬送用コンベアである。A torch 6 extends parallel to the horn 4. As shown in FIG. 2, the tip 6 a of the torch 6 is needle-shaped, and a high voltage is applied from an electric circuit built in the drive box 12, so that the wire 3 led out from the lower end of the capillary tool 5. A discharge occurs in the discharge path indicated by arrow A between the lower end of the wire 3 and the ball 7 at the lower end of the wire 3.
Occurs. By the horn 4 swinging up and down,
This ball 7 is bonded to the electrode 8 on the upper surface of the chip 2. Reference numeral 9 denotes an electrode of the lead frame 1 and a wire 3
Is bonded to this electrode 9. Reference numeral 10 denotes a conveyor for transporting the lead frame 1.

【００１０】図１において、駆動ボックス１２の前面に
は支持フレーム１３が設けられており、この支持フレー
ム１３の先端部にはレーザ照射器１４が設けられてい
る。したがってレーザ照射器１４はキャピラリツール５
と一体的にＸ方向やＹ方向に移動する。図２及び図３に
示すように、レーザ照射器１４の発光部１４ａはトーチ
６の先端部６ａに対向しており、この先端部６ａへ向か
ってレーザ光を照射する。図３に示すようにこのレーザ
光の光路Ｃは、ワイヤ３下端部とトーチ先端部６ａとの
間の最良の放電路に沿うようにこれに合致若しくは近接
させてある。なおワイヤボンディングは空気中で行うも
のや、チッソガス雰囲気中で行うものがあるが、本装置
は何れの方式にも適用できる。このワイヤボンディング
装置は上記のような構成より成り、次に動作の説明を行
う。In FIG. 1, a support frame 13 is provided on the front surface of the drive box 12, and a laser irradiator 14 is provided at the tip of the support frame 13. Therefore, the laser irradiator 14 is used for the capillary tool 5
And move in the X and Y directions integrally. As shown in FIGS. 2 and 3, the light emitting portion 14a of the laser irradiator 14 is opposed to the tip 6a of the torch 6, and irradiates the tip 6a with laser light. As shown in FIG. 3, the optical path C of the laser beam is aligned with or close to the best discharge path between the lower end of the wire 3 and the torch tip 6a. Note that wire bonding may be performed in air or in a nitrogen gas atmosphere, but the present apparatus can be applied to any method. This wire bonding apparatus is configured as described above, and the operation will be described next.

【００１１】図２に示すように、キャピラリツール５の
下部から導出したワイヤ３の下端部にトーチ６の先端部
６ａは近接しており、トーチ６に高電圧を印加するとと
もに、発光部１４ａからトーチ６の先端部６ａへ向かっ
て矢印Ｃに示すようにレーザ光を照射する。するとレー
ザ光の光路付近のガスはプラズマ状態となり、放電がき
わめて発生しやすくなる。したがってトーチ６に高電圧
を印加すると、この光路Ｃに沿うように放電が発生し、
ワイヤ３の下端部にボール７が生じる。そこで次にホー
ン４を下方へ揺動させることにより、このボール７をチ
ップ２の電極８にボンディングする。このように本手段
はワイヤ３の下端部とトーチ６の先端部６ａの間の放電
路Ａに沿うようにレーザ光を照射することにより、ワイ
ヤ３がたわんでいる場合でもこの放電路Ａで確実に放電
を発生させてワイヤ３の下端部にボール７を生じさせる
ことができるものであり、またレーザ光Ｃの命中箇所を
一定にしておけば放電路は安定し、図４において矢印Ａ
ａで示したような放電路のばらつきによるボール７の径
のばらつきを解消できる。As shown in FIG. 2, the tip 6a of the torch 6 is close to the lower end of the wire 3 led out from the lower part of the capillary tool 5, so that a high voltage is applied to the torch 6 and the light emitting unit 14a A laser beam is emitted toward the tip 6a of the torch 6 as shown by an arrow C. Then, the gas in the vicinity of the optical path of the laser beam becomes a plasma state, and discharge is extremely likely to occur. Therefore, when a high voltage is applied to the torch 6, a discharge occurs along the optical path C,
A ball 7 is formed at the lower end of the wire 3. Then, the ball 7 is bonded to the electrode 8 of the chip 2 by swinging the horn 4 downward. In this way, the present means irradiates the laser beam along the discharge path A between the lower end of the wire 3 and the tip 6a of the torch 6, so that even when the wire 3 is bent, the discharge path A can be used. 4 can generate a ball 7 at the lower end of the wire 3. If the hit position of the laser beam C is fixed, the discharge path becomes stable, and the arrow A in FIG.
The variation in the diameter of the ball 7 due to the variation in the discharge path as shown in FIG.

【００１２】[0012]

【００１３】[0013]

【発明の効果】以上説明したように本発明は、ワイヤの
下端部とトーチの間の放電路に沿うように、トーチの針
状の先端部へ向ってレーザ光を照射するようにしている
ので、ワイヤの下端部とトーチとの間に確実に放電を発
生させてワイヤの下端部にボールを生じさせることがで
きる。As described above, according to the present invention, the wire
Align the torch needle with the discharge path between the lower end and the torch.
Since the laser beam is emitted toward the tip of the wire, a discharge can be reliably generated between the lower end of the wire and the torch, and a ball can be generated at the lower end of the wire.

【図面の簡単な説明】[Brief description of the drawings]

【図１】本発明の一実施例のワイヤボンディング装置の
斜視図FIG. 1 is a perspective view of a wire bonding apparatus according to an embodiment of the present invention.

【図２】本発明の一実施例のワイヤボンディング装置の
要部斜視図FIG. 2 is a perspective view of a main part of a wire bonding apparatus according to an embodiment of the present invention.

【図３】本発明の一実施例のワイヤボンディング装置の
要部平面図FIG. 3 is a plan view of a main part of a wire bonding apparatus according to an embodiment of the present invention.

【図４】従来のワイヤボンディング装置の要部側面図FIG. 4 is a side view of a main part of a conventional wire bonding apparatus.

【符号の説明】[Explanation of symbols]

３ ワイヤ ４ ホーン ５ キャピラリツール ６ トーチ ７ ボール １４ レーザ照射手段 Reference Signs List 3 wire 4 horn 5 capillary tool 6 torch 7 ball 14 laser irradiation means

Claims (2)

(57)【特許請求の範囲】(57) [Claims] 【請求項１】ホーンと、前記ホーンの先端部に保持され
てワイヤが挿通されるキャピラリツールと、前記キャピ
ラリツールの下部から導出したワイヤの下端部に近接し
て前記下端部との間に放電を発生させて前記下端部にボ
ールを生じさせる針状の先端部を有するトーチとを備え
たワイヤボンディング装置において、 前記ワイヤの下端部と前記トーチの間の放電路に沿うよ
うに前記針状の先端部へ向ってレーザ光を照射するレー
ザ光照射手段を設けたことを特徴とするワイヤボンディ
ング装置。An electric discharge is generated between a horn, a capillary tool held at a tip of the horn, through which a wire is inserted, and a lower end of the wire protruding from a lower portion of the capillary tool, the lower end being close to a lower end of the wire. And a torch having a needle-like tip portion that generates a ball at the lower end portion of the wire bonding device, wherein a wire along a discharge path between the lower end portion of the wire and the torch is provided .
A wire bonding apparatus provided with laser light irradiation means for irradiating laser light toward the needle-like tip as described above . 【請求項２】ホーンに保持されたキャピラリツールに挿2. Insertion into a capillary tool held by a horn
通されてこのキャピラリツールの下部から導出したワイThrough the lower part of this capillary tool
ヤの下端部にトーチの針状の先端部を近接させ、且つ前With the needle-shaped tip of the torch close to the lower end of the
記ワイヤの下端部と前記トーチの間の放電路に沿うようAlong the discharge path between the lower end of the wire and the torch
に前記針状の先端部へ向ってレーザ光照射手段からレーThe laser beam irradiation means
ザ光を照射することにより、前記ワイヤの下端部にボーBy irradiating the light, a baud is
ルを形成することを特徴とするワイヤボンディング方Wire bonding method characterized by forming a wire
法。Law.
JP4318187A 1992-11-27 1992-11-27 Wire bonding apparatus and wire bonding method Expired - Fee Related JP3049976B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP4318187A JP3049976B2 (en) 1992-11-27 1992-11-27 Wire bonding apparatus and wire bonding method

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP4318187A JP3049976B2 (en) 1992-11-27 1992-11-27 Wire bonding apparatus and wire bonding method

Publications (2)

Publication Number Publication Date
JPH06163624A JPH06163624A (en) 1994-06-10
JP3049976B2 true JP3049976B2 (en) 2000-06-05

Family

ID=18096428

Family Applications (1)

Application Number Title Priority Date Filing Date
JP4318187A Expired - Fee Related JP3049976B2 (en) 1992-11-27 1992-11-27 Wire bonding apparatus and wire bonding method

Country Status (1)

Country Link
JP (1) JP3049976B2 (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPWO2014054305A1 (en) * 2012-10-05 2016-08-25 株式会社新川 Antioxidant gas blowing unit

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4852521B2 (en) * 2007-12-07 2012-01-11 株式会社新川 Bonding apparatus and bonding method

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPWO2014054305A1 (en) * 2012-10-05 2016-08-25 株式会社新川 Antioxidant gas blowing unit

Also Published As

Publication number Publication date
JPH06163624A (en) 1994-06-10

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