JPH08115938A - Wire bonder - Google Patents

Wire bonder

Info

Publication number
JPH08115938A
JPH08115938A JP6251893A JP25189394A JPH08115938A JP H08115938 A JPH08115938 A JP H08115938A JP 6251893 A JP6251893 A JP 6251893A JP 25189394 A JP25189394 A JP 25189394A JP H08115938 A JPH08115938 A JP H08115938A
Authority
JP
Japan
Prior art keywords
wire
torch electrode
spark
bonding apparatus
capillary tool
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP6251893A
Other languages
Japanese (ja)
Inventor
Hiroshi Haji
宏 土師
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Holdings Corp
Original Assignee
Matsushita Electric Industrial Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electric Industrial Co Ltd filed Critical Matsushita Electric Industrial Co Ltd
Priority to JP6251893A priority Critical patent/JPH08115938A/en
Publication of JPH08115938A publication Critical patent/JPH08115938A/en
Pending legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/74Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
    • H01L24/78Apparatus for connecting with wire connectors
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42Wire connectors; Manufacturing methods related thereto
    • H01L2224/47Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805Shape
    • H01L2224/4809Loop shape
    • H01L2224/48091Arched
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42Wire connectors; Manufacturing methods related thereto
    • H01L2224/47Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/484Connecting portions
    • H01L2224/48463Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond
    • H01L2224/48465Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond the other connecting portion not on the bonding area being a wedge bond, i.e. ball-to-wedge, regular stitch
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78Apparatus for connecting with wire connectors
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78Apparatus for connecting with wire connectors
    • H01L2224/7825Means for applying energy, e.g. heating means
    • H01L2224/78268Discharge electrode
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78Apparatus for connecting with wire connectors
    • H01L2224/7825Means for applying energy, e.g. heating means
    • H01L2224/783Means for applying energy, e.g. heating means by means of pressure
    • H01L2224/78301Capillary
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78Apparatus for connecting with wire connectors
    • H01L2224/788Means for moving parts
    • H01L2224/78801Lower part of the bonding apparatus, e.g. XY table
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/85Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/85Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
    • H01L2224/85009Pre-treatment of the connector or the bonding area
    • H01L2224/8503Reshaping, e.g. forming the ball or the wedge of the wire connector
    • H01L2224/85035Reshaping, e.g. forming the ball or the wedge of the wire connector by heating means, e.g. "free-air-ball"
    • H01L2224/85045Reshaping, e.g. forming the ball or the wedge of the wire connector by heating means, e.g. "free-air-ball" using a corona discharge, e.g. electronic flame off [EFO]
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/013Alloys
    • H01L2924/014Solder alloys

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Wire Bonding (AREA)

Abstract

PURPOSE: To provide a wire bonder in which the spark of a torch electrode can be stabilized. CONSTITUTION: The wire bonder comprises a capillary tool 12 inserted with a wire 11, an arm for moving the capillary tool 12 up and down, and a torch electrode 14 having a potential difference with respect to the wire 11 and approaches the lower end of the wire 11 to generate a spark G thus forming a ball. A magnet 16 for converging the spark G, generated between the torch electrode 14 and the wire 11, toward the lower end part 11a of the wire 11 is disposed between the torch electrode 14 and the lower end part 11a of the wire 11.

Description

【発明の詳細な説明】Detailed Description of the Invention

【0001】[0001]

【産業上の利用分野】本発明は、ボールの形状を安定さ
せ得るようにしたワイヤボンディング装置に関するもの
である。
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a wire bonding device capable of stabilizing the shape of a ball.

【0002】[0002]

【従来の技術】基板の電極とこの基板に搭載されたチッ
プの電極をワイヤで接続するワイヤボンディングにおい
て、ワイヤの下端部にボールを形成するため、トーチ電
極とワイヤに電位差を持たせ、両者間にスパークを発生
させる工程が行われる。
2. Description of the Related Art In wire bonding for connecting an electrode of a substrate and an electrode of a chip mounted on this substrate with a wire, a ball is formed at the lower end of the wire, so that there is a potential difference between the torch electrode and the wire, The process of generating a spark is performed.

【0003】図3、図4は、従来のワイヤボンディング
装置におけるスパーク発生工程を示す拡大図である。図
3中、Aはリードフレームなどの基板、Bは基板Aに搭
載されたチップ、CはワイヤDが挿通されたキャピラリ
ツール、Eはその先端部E1とワイヤDの下端部D1と
の間で、スパークGを発生させるトーチ電極である。こ
こで、トーチ電極Eには+の電位が、ワイヤDには−の
電位が与えられる。
3 and 4 are enlarged views showing a spark generation process in a conventional wire bonding apparatus. In FIG. 3, A is a substrate such as a lead frame, B is a chip mounted on the substrate A, C is a capillary tool into which a wire D is inserted, and E is between a tip portion E1 thereof and a lower end portion D1 of the wire D. , A torch electrode for generating a spark G. Here, a positive potential is applied to the torch electrode E, and a negative potential is applied to the wire D.

【0004】さて、図3、図4に示すように、この工程
ではワイヤDの下端部D1とトーチ電極Eを近接させ、
本来トーチ電極Eの先端部E1とワイヤDの下端部D1
とを直線的に結ぶ経路により、スパークさせるように意
図されている。
Now, as shown in FIGS. 3 and 4, in this step, the lower end portion D1 of the wire D and the torch electrode E are brought close to each other,
Originally, the tip E1 of the torch electrode E and the lower end D1 of the wire D
It is intended to cause a spark by a path that connects directly with.

【0005】[0005]

【発明が解決しようとする課題】しかしながら、従来の
ワイヤボンディング装置では、本来、ワイヤDの下端部
D1に放電が生じ、この下端部D1が溶融してボールと
なるべきであるのに、スパークGの発生箇所が一定せ
ず、図3に示すように、キャピラリツールCから露呈す
るワイヤDのどの位置にも放電が起こる可能性があっ
た。また、ワイヤDにおける放電箇所により、形成され
るボールの形状が相違する。したがって、従来のワイヤ
ボンディング装置では、ボールの形状が安定せず、ボン
ディング品質が低下しやすいという問題点がある。
However, in the conventional wire bonding apparatus, the lower end portion D1 of the wire D should be originally discharged, and the lower end portion D1 should be melted to form a ball. The locations where the occurrences of V were not constant, and as shown in FIG. 3, discharge could occur at any position of the wire D exposed from the capillary tool C. Further, the shape of the formed ball differs depending on the discharge location on the wire D. Therefore, the conventional wire bonding apparatus has a problem that the shape of the ball is not stable and the bonding quality is likely to deteriorate.

【0006】さらに、通常ワイヤボンディング装置で
は、一つのチップBに対し、数十から数百のワイヤをボ
ンディングするものであり、図4に示すように、トーチ
電極Eの近傍にボンディング済みのワイヤFが存在する
こともある。このような場合、本来放電がされるべき目
的のワイヤDの下端部D1ではなく、ボンディング済み
のワイヤFに誤って放電してしまうことがある。このよ
うな事故があれば、ボンディング済みのワイヤFが断線
するなど、ボンディング不良となってしまう。
Further, in the normal wire bonding apparatus, several tens to several hundreds of wires are bonded to one chip B, and as shown in FIG. 4, the bonded wires F are formed near the torch electrode E. May exist. In such a case, the wire F that has already been bonded may be erroneously discharged, instead of the lower end D1 of the wire D that is originally intended to be discharged. If such an accident occurs, a bonding failure will occur, such as a break in the bonded wire F.

【0007】以上説明したように、従来のワイヤボンデ
ィング装置では、スパークが不安定であって、ボンディ
ング品質が低下しやすいという問題点があった。
As described above, the conventional wire bonding apparatus has a problem that the spark is unstable and the bonding quality is apt to deteriorate.

【0008】そこで本発明は、トーチ電極のスパークを
安定させる得るワイヤボンディング装置を提供すること
を目的とする。
Therefore, an object of the present invention is to provide a wire bonding apparatus which can stabilize the spark of the torch electrode.

【0009】[0009]

【課題を解決するための手段】本発明のワイヤボンディ
ング装置は、ワイヤが挿通されたキャピラリツールと、
キャピラリツールを昇降させるアームと、ワイヤに対し
て電位差を有し、ワイヤの下端部に接近してスパークを
発生し、ボールを形成するトーチ電極とを備え、トーチ
電極とワイヤの下端部との間に、トーチ電極とワイヤの
間に発生するスパークをワイヤの下端部に向けて収斂さ
せる磁石を設けている。
A wire bonding apparatus according to the present invention comprises a capillary tool having a wire inserted therethrough,
An arm for raising and lowering the capillary tool and a torch electrode having a potential difference with respect to the wire and forming a ball by approaching the lower end of the wire to generate a spark are provided, and the space between the torch electrode and the lower end of the wire is provided. Further, a magnet for converging the spark generated between the torch electrode and the wire toward the lower end of the wire is provided.

【0010】[0010]

【作用】上記構成により、ワイヤの下端部とトーチ電極
の間にスパークを発生させる工程において、トーチ電極
の先端部から放電されたスパークは、磁石によりその進
路をコントロールされ、ワイヤの下端部に収斂する。よ
って、スパークは常にワイヤの下端部に集中し、ワイヤ
の一定位置に放電が起こることになる。その結果、ワイ
ヤに形成されるボールの形状が一定となり、良好なボン
ディング品質を得ることができる。
With the above construction, in the step of generating a spark between the lower end of the wire and the torch electrode, the spark discharged from the tip of the torch electrode is controlled in its course by the magnet and converges at the lower end of the wire. To do. Therefore, the sparks are always concentrated on the lower end of the wire, and the electric discharge occurs at a fixed position on the wire. As a result, the shape of the ball formed on the wire becomes constant, and good bonding quality can be obtained.

【0011】[0011]

【実施例】次に図面を参照しながら本発明の実施例を説
明する。図1は本発明の一実施例におけるワイヤボンデ
ィング装置の斜視図、図2は本発明の一実施例における
トーチ電極付近の拡大図である。
Embodiments of the present invention will now be described with reference to the drawings. FIG. 1 is a perspective view of a wire bonding apparatus in one embodiment of the present invention, and FIG. 2 is an enlarged view of the vicinity of a torch electrode in one embodiment of the present invention.

【0012】図1において、1はリードフレーム又は厚
膜セラミックス基板などの基板2をX方向に搬送あるい
は位置決めする搬送レール、3は基板2上において基板
2に搭載されたチップ4を囲むように形成された電極で
ある。5は搬送レール1上の基板2を上方から押さえる
押え部材であり、押え部材5には、チップ4や電極3を
露呈させるための開口部5aが開けられている。
In FIG. 1, reference numeral 1 is a transport rail for transporting or positioning a substrate 2 such as a lead frame or a thick film ceramic substrate in the X direction, and 3 is formed on the substrate 2 so as to surround a chip 4 mounted on the substrate 2. It is the formed electrode. Reference numeral 5 denotes a pressing member that presses the substrate 2 on the transport rail 1 from above, and the pressing member 5 has an opening 5a for exposing the chip 4 and the electrode 3.

【0013】7は搬送レール1と対面するように配設さ
れ、かつXテーブル9、Yテーブル8上に載置されたユ
ニットボックスであり、ユニットボックス7内には公知
(例えば特開平4−291735号公報)に記載の駆動
機構が収納され、この駆動機構により、キャピラリツー
ル12を先端部に保持するアーム10を揺動させること
により、キャピラリツール12を昇降させる。13はキ
ャピラリツール12の側方に位置するようユニットボッ
クス7に固定されたトーチ電極部であり、キャピラリツ
ール12に挿通されたワイヤ11の下端部にスパークを
飛ばしてボールを形成する。
A unit box 7 is disposed so as to face the transport rail 1 and is placed on the X table 9 and the Y table 8. The unit box 7 is known in the unit box 7 (for example, Japanese Patent Laid-Open No. 4-291735). The drive mechanism described in Japanese Patent Laid-Open Publication No. 2003-242242 is housed, and the drive mechanism causes the arm 10 that holds the capillary tool 12 at the tip end to swing, whereby the capillary tool 12 is moved up and down. Reference numeral 13 is a torch electrode portion fixed to the unit box 7 so as to be positioned on the side of the capillary tool 12, and a spark is blown to the lower end portion of the wire 11 inserted into the capillary tool 12 to form a ball.

【0014】次にトーチ電極部13の構成について、図
2を参照しながら説明する。14はトーチ電極部13の
中核をなすトーチ電極であり、その先端部14aからス
パークGが発生する。またトーチ電極14の基部の周囲
には不要なスパークを防止するべく、絶縁コートが表面
に被覆されている。なお先端部14aは、純タングステ
ンを母材とする円錐状に形成され、放電を許容するため
当然絶縁コートは施されていない。
Next, the structure of the torch electrode portion 13 will be described with reference to FIG. Reference numeral 14 is a torch electrode forming the core of the torch electrode portion 13, and a spark G is generated from the tip portion 14a thereof. The surface of the torch electrode 14 is covered with an insulating coat in order to prevent unnecessary sparks. Note that the tip portion 14a is formed in a conical shape using pure tungsten as a base material, and is naturally not provided with an insulating coat in order to permit discharge.

【0015】15はトーチ電極14を包囲する筒状の絶
縁チューブ、16は絶縁チューブ15の先端部に外嵌さ
れた円環状の永久磁石である。勿論、永久磁石16にか
えて電磁コイルを用いて、これを励磁してもよい。永久
磁石16は、そのS極がワイヤ11の下端部11aを向
き、N極がトーチ電極14の先端部14aを向くように
配置してある。
Reference numeral 15 is a cylindrical insulating tube that surrounds the torch electrode 14, and 16 is a ring-shaped permanent magnet fitted onto the tip of the insulating tube 15. Of course, an electromagnetic coil may be used instead of the permanent magnet 16 to excite it. The permanent magnet 16 is arranged such that its S pole faces the lower end 11 a of the wire 11 and its N pole faces the tip 14 a of the torch electrode 14.

【0016】従って、トーチ電極14の先端部14aと
ワイヤ11の下端部11aの間の空間において、図2に
示しているような磁場が形成される。
Therefore, a magnetic field as shown in FIG. 2 is formed in the space between the tip portion 14a of the torch electrode 14 and the lower end portion 11a of the wire 11.

【0017】ここで、トーチ電極14の先端部14aと
ワイヤ11の下端部11aとの間で発生するスパークG
は、電子の移動に他ならないが、永久磁石16により形
成される磁場により、このスパークGをコントロールす
るのである。すなわち、永久磁石16は、電子の軌跡を
ワイヤ11の下端部11aに集中させる電磁レンズとし
ての作用を奏する。
Here, a spark G generated between the tip portion 14a of the torch electrode 14 and the lower end portion 11a of the wire 11.
Is the movement of electrons, but controls the spark G by the magnetic field formed by the permanent magnet 16. That is, the permanent magnet 16 acts as an electromagnetic lens that concentrates the trajectory of electrons on the lower end 11 a of the wire 11.

【0018】また、スパークGのエネルギは、従来のワ
イヤボンディング装置における放電のように、拡散した
状態によりワイヤ11にあたるのではなく、ワイヤ11
の下端部11aに集中的に照射されるので、そのエネル
ギのほとんどが、ワイヤ11の下端部11aを溶融する
ことに費やされる。
Further, the energy of the spark G does not hit the wire 11 due to a diffused state like the discharge in the conventional wire bonding apparatus, but the wire 11 does not.
Since the lower end 11a of the wire 11 is intensively irradiated, most of its energy is spent on melting the lower end 11a of the wire 11.

【0019】即ち、放電するエネルギあたりの有効なエ
ネルギの比率が高く、トーチ電極14に与えるエネルギ
を小さくしても十分なボール形成を実現できる。このこ
とにより、エネルギの節約を行えるだけでなく、トーチ
電極14の消耗を押さえて、トーチ電極部13の寿命を
延ばすこともできる。
That is, the ratio of effective energy per discharged energy is high, and sufficient ball formation can be realized even if the energy applied to the torch electrode 14 is reduced. This not only saves energy, but also suppresses wear of the torch electrode 14 and extends the life of the torch electrode portion 13.

【0020】[0020]

【発明の効果】本発明のワイヤボンディング装置は、ワ
イヤが挿通されたキャピラリツールと、キャピラリツー
ルを昇降させるアームと、ワイヤに対して電位差を有
し、ワイヤの下端部に接近してスパークを発生し、ボー
ルを形成するトーチ電極とを備え、トーチ電極とワイヤ
の下端部との間に、トーチ電極とワイヤの間に発生する
スパークをワイヤの下端部に向けて収斂させる磁石を設
けているので、スパークをワイヤの下端部に集中させる
ことができ、ワイヤに形成されるボールの形状を一定に
して、ボンディング品質を向上することができる。
The wire bonding apparatus of the present invention has a capillary tool through which a wire is inserted, an arm for moving the capillary tool up and down, and a potential difference with respect to the wire, which causes a spark to approach the lower end of the wire. And a torch electrode forming a ball, and a magnet provided between the torch electrode and the lower end of the wire for converging the spark generated between the torch electrode and the wire toward the lower end of the wire. The sparks can be concentrated on the lower end portion of the wire, the shape of the ball formed on the wire can be made constant, and the bonding quality can be improved.

【図面の簡単な説明】[Brief description of drawings]

【図1】本発明の一実施例におけるワイヤボンディング
装置の斜視図
FIG. 1 is a perspective view of a wire bonding apparatus according to an embodiment of the present invention.

【図2】本発明の一実施例におけるトーチ電極付近の拡
大図
FIG. 2 is an enlarged view of the vicinity of a torch electrode according to an embodiment of the present invention.

【図3】従来のワイヤボンディング装置におけるスパー
ク発生工程を示す拡大図
FIG. 3 is an enlarged view showing a spark generation process in a conventional wire bonding apparatus.

【図4】従来のワイヤボンディング装置におけるスパー
ク発生工程を示す拡大図
FIG. 4 is an enlarged view showing a spark generation process in a conventional wire bonding apparatus.

【符号の説明】[Explanation of symbols]

10 アーム 11 ワイヤ 11a 下端部 12 キャピラリツール 13 トーチ電極部 14 トーチ電極 14a 先端部 16 永久磁石 DESCRIPTION OF SYMBOLS 10 Arm 11 Wire 11a Lower end 12 Capillary tool 13 Torch electrode part 14 Torch electrode 14a Tip part 16 Permanent magnet

Claims (3)

【特許請求の範囲】[Claims] 【請求項1】ワイヤが挿通されたキャピラリツールと、
前記キャピラリツールを昇降させるアームと、前記ワイ
ヤに対して電位差を有し、かつ前記ワイヤの下端部に接
近してスパークを発生し、ボールを形成するトーチ電極
とを備えたワイヤボンディング装置であって、 前記トーチ電極と前記ワイヤの下端部との間に、前記ト
ーチ電極と前記ワイヤの間に発生するスパークを前記ワ
イヤの下端部に向けて収斂させる磁石を設けたことを特
徴とするワイヤボンディング装置。
1. A capillary tool having a wire inserted therethrough,
A wire bonding apparatus comprising: an arm for raising and lowering the capillary tool; and a torch electrode having a potential difference with respect to the wire and forming a ball by approaching a lower end portion of the wire to generate a spark. A wire bonding device is provided between the torch electrode and a lower end of the wire, and a magnet is provided to converge a spark generated between the torch electrode and the wire toward a lower end of the wire. .
【請求項2】前記磁石は、永久磁石であることを特徴と
する請求項1記載のワイヤボンディング装置。
2. The wire bonding apparatus according to claim 1, wherein the magnet is a permanent magnet.
【請求項3】前記磁石は、電磁コイルであることを特徴
とする請求項1記載のワイヤボンディング装置。
3. The wire bonding apparatus according to claim 1, wherein the magnet is an electromagnetic coil.
JP6251893A 1994-10-18 1994-10-18 Wire bonder Pending JPH08115938A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP6251893A JPH08115938A (en) 1994-10-18 1994-10-18 Wire bonder

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP6251893A JPH08115938A (en) 1994-10-18 1994-10-18 Wire bonder

Publications (1)

Publication Number Publication Date
JPH08115938A true JPH08115938A (en) 1996-05-07

Family

ID=17229522

Family Applications (1)

Application Number Title Priority Date Filing Date
JP6251893A Pending JPH08115938A (en) 1994-10-18 1994-10-18 Wire bonder

Country Status (1)

Country Link
JP (1) JPH08115938A (en)

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