JP3314652B2 - Wire bonding method - Google Patents

Wire bonding method

Info

Publication number
JP3314652B2
JP3314652B2 JP05455097A JP5455097A JP3314652B2 JP 3314652 B2 JP3314652 B2 JP 3314652B2 JP 05455097 A JP05455097 A JP 05455097A JP 5455097 A JP5455097 A JP 5455097A JP 3314652 B2 JP3314652 B2 JP 3314652B2
Authority
JP
Japan
Prior art keywords
capillary tool
wire
driving
loop
speed pattern
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP05455097A
Other languages
Japanese (ja)
Other versions
JPH10256292A (en
Inventor
幸一 高橋
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Corp
Panasonic Holdings Corp
Original Assignee
Panasonic Corp
Matsushita Electric Industrial Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Panasonic Corp, Matsushita Electric Industrial Co Ltd filed Critical Panasonic Corp
Priority to JP05455097A priority Critical patent/JP3314652B2/en
Publication of JPH10256292A publication Critical patent/JPH10256292A/en
Application granted granted Critical
Publication of JP3314652B2 publication Critical patent/JP3314652B2/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
    • H01L24/78—Apparatus for connecting with wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/484—Connecting portions
    • H01L2224/48463—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78—Apparatus for connecting with wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78—Apparatus for connecting with wire connectors
    • H01L2224/7825—Means for applying energy, e.g. heating means
    • H01L2224/783—Means for applying energy, e.g. heating means by means of pressure
    • H01L2224/78301—Capillary
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78—Apparatus for connecting with wire connectors
    • H01L2224/7865—Means for transporting the components to be connected
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
    • H01L2224/85009—Pre-treatment of the connector or the bonding area
    • H01L2224/8503—Reshaping, e.g. forming the ball or the wedge of the wire connector
    • H01L2224/85035—Reshaping, e.g. forming the ball or the wedge of the wire connector by heating means, e.g. "free-air-ball"
    • H01L2224/85045—Reshaping, e.g. forming the ball or the wedge of the wire connector by heating means, e.g. "free-air-ball" using a corona discharge, e.g. electronic flame off [EFO]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
    • H01L2224/851—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector the connector being supplied to the parts to be connected in the bonding apparatus
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
    • H01L2224/8512—Aligning
    • H01L2224/85148—Aligning involving movement of a part of the bonding apparatus
    • H01L2224/85169—Aligning involving movement of a part of the bonding apparatus being the upper part of the bonding apparatus, i.e. bonding head, e.g. capillary or wedge
    • H01L2224/8518—Translational movements
    • H01L2224/85181—Translational movements connecting first on the semiconductor or solid-state body, i.e. on-chip, regular stitch
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01004—Beryllium [Be]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01005—Boron [B]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01006—Carbon [C]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01033—Arsenic [As]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01039—Yttrium [Y]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01073—Tantalum [Ta]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01082—Lead [Pb]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/1015—Shape
    • H01L2924/1016—Shape being a cuboid
    • H01L2924/10162—Shape being a cuboid with a square active surface

Description

【発明の詳細な説明】DETAILED DESCRIPTION OF THE INVENTION

【０００１】[0001]

【発明の属する技術分野】本発明は、キャピラリツール
を用いてチップと基板をワイヤで接続するワイヤボンデ
ィング方法に関するものである。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a wire bonding method for connecting a chip and a substrate with wires using a capillary tool.

【０００２】[0002]

【従来の技術】チップと、このチップが搭載されたリー
ドフレームやプリント基板などの基板をワイヤで接続す
るワイヤボンディングは、キャピラリツールの下端部か
ら下方へ導出されたワイヤの下端部とトーチとの間で電
気的にスパークを発生させ、ワイヤの下端部にボールを
形成した後、キャピラリツールを下降させてボールを基
板に搭載されたチップの上面にボンディングする。次い
で、キャピラリツールを一旦基板の上方に移動させた後
に、キャピラリツールの下端部を所定の軌跡を描かせな
がら下降させワイヤのループを形成させてワイヤを基板
にボンディングする。この場合の軌跡として、略円弧状
の軌跡が一般的であり、この円弧状の軌跡上でのキャピ
ラリツールの動作制御では、各軸のモータは所定の速度
パターンに従った制御がなされる。2. Description of the Related Art Wire bonding for connecting a chip to a substrate, such as a lead frame or a printed circuit board, on which the chip is mounted by wires is performed by connecting a lower end of a wire led downward from a lower end of a capillary tool to a torch. After a spark is generated electrically between the wires and a ball is formed at the lower end of the wire, the capillary tool is lowered to bond the ball to the upper surface of the chip mounted on the substrate. Next, after once moving the capillary tool above the substrate, the lower end of the capillary tool is lowered while drawing a predetermined trajectory to form a wire loop and bond the wire to the substrate. The trajectory in this case is generally a substantially circular trajectory, and in the operation control of the capillary tool on this circular trajectory, the motors of the respective axes are controlled according to a predetermined speed pattern.

【０００３】以下、従来の方法による速度パターンにつ
いて図面を参照して説明する。図７はワイヤボンディン
グ方法のループ形成時の円弧状の軌跡を表す極座標図、
図８は従来のワイヤボンディング方法のループ形成時の
速度パターンを示すグラフである。Hereinafter, a speed pattern according to a conventional method will be described with reference to the drawings. FIG. 7 is a polar coordinate diagram showing an arc-shaped locus at the time of forming a loop in the wire bonding method;
FIG. 8 is a graph showing a speed pattern when a loop is formed in a conventional wire bonding method.

【０００４】図７において、１はキャピラリツールであ
り、太実線Ｑはキャピラリツールの下端点Ｐの軌跡を表
している。Ａ点にボールをボンディングした後、キャピ
ラリツールはＢ点まで上昇し、その後略円弧状の軌跡を
描いてＣ点にワイヤをボンディングする。キャピラリツ
ールの下端点Ｐの動きは、図７の極座標においては原点
Ｏから半径Ｌの円弧上で、原点Ｏと下端点Ｐとを結ぶ直
線ＯＰがＺ軸となす角度θのみの式（数１）で表すこと
ができるが、実際のワイヤボンディング装置を構成する
各軸のモータの動作として表すためには、（数２）〜
（数４）に示すように、ＸＹＺ各駆動軸方向の速度成分
Ｖｘ、Ｖｙ、Ｖｚを求めなければならない。In FIG. 7, reference numeral 1 denotes a capillary tool, and a bold solid line Q represents a locus of a lower end point P of the capillary tool. After bonding the ball to point A, the capillary tool moves up to point B, and then draws a substantially arc-shaped trajectory to bond the wire to point C. The movement of the lower end point P of the capillary tool is expressed by an equation (Equation 1) in which only the angle θ between the straight line OP connecting the origin O and the lower end point P to the Z axis on an arc having a radius L from the origin O in the polar coordinates of FIG. ), But in order to express it as the operation of the motor of each axis constituting the actual wire bonding apparatus,
As shown in (Equation 4), speed components Vx, Vy, and Vz in the XYZ drive axis directions must be obtained.

【０００５】[0005]

【数１】 (Equation 1)

【０００６】[0006]

【数２】 (Equation 2)

【０００７】[0007]

【数３】 (Equation 3)

【０００８】[0008]

【数４】 (Equation 4)

【０００９】図８の上段のグラフに示すように、従来は
円弧状軌跡上でのキャピラリツールの下端点Ｐの角速度
は、等角加速度曲線を描くように制御されていた。した
がって、角速度のグラフは図８の中段に示すように３角
形状のグラフとなり、このときのＸＹＺ各駆動軸方向の
速度成分Ｖｘ、Ｖｙ、Ｖｚは図８の下段のグラフで表さ
れる。As shown in the upper graph of FIG. 8, conventionally, the angular velocity of the lower end point P of the capillary tool on an arc-shaped locus has been controlled so as to draw a constant angular acceleration curve. Therefore, the graph of the angular velocity is a triangular graph as shown in the middle part of FIG. 8, and the velocity components Vx, Vy, Vz in the XYZ drive axis directions at this time are represented by the lower part of FIG.

【００１０】[0010]

【発明が解決しようとする課題】図８の下段のグラフか
らわかるように、従来の等角加速度制御では水平方向の
速度成分Ｖｘ、Ｖｙの立ち上がり時ｔａに急激な加速度
が表れており、また垂直速度成分Ｖｚにおいては着地時
ｔｂに急激な減速（負加速度）が表れている。このよう
な急激な加速度変化は、ワイヤボンディング装置の機構
にとって振動発生源として作用し、特にキャピラリツー
ルは片持ち支持されたホーンに保持されているため振動
を誘起しやすい。このため、キャピラリツールの下端部
が振動することによりワイヤ横振れや、ワイヤ圧着不良
などのボンディング不良が発生するという問題点があっ
た。As can be seen from the graph at the bottom of FIG. 8, in the conventional equiangular acceleration control, a sharp acceleration appears at the rising time ta of the horizontal velocity components Vx and Vy, and the vertical acceleration is vertical. In the velocity component Vz, a sharp deceleration (negative acceleration) appears at the time of landing tb. Such a rapid change in acceleration acts as a vibration source for the mechanism of the wire bonding apparatus. In particular, the capillary tool tends to induce vibration because it is held by the cantilevered horn. For this reason, there has been a problem in that the lower end of the capillary tool vibrates to cause wire lateral deflection or bonding failure such as wire crimping failure.

【００１１】そこで本発明は、ワイヤのループ形成時に
急激な加速度変化が発生せず、機構の振動によるボンデ
ィング不良を防止することができるワイヤボンディング
方法を提供することを目的とする。SUMMARY OF THE INVENTION It is an object of the present invention to provide a wire bonding method capable of preventing a bonding failure due to vibration of a mechanism without causing a sudden change in acceleration when a wire loop is formed.

【００１２】[0012]

【課題を解決するための手段】本発明のワイヤボンディ
ング方法は、ワイヤを挿通するキャピラリツールと、キ
ャピラリツールを保持するホーンと、ホーンをＸ、Ｙお
よびＺの３方向に駆動する３軸からなる駆動手段と、駆
動手段を制御する制御部とを備えたワイヤボンディング
装置によるワイヤボンディング方法であって、キャピラ
リツールの下端部から導出するワイヤの下端部に形成さ
れたボールをキャピラリツールにより第１のボンディン
グ点に圧着する工程と、前記駆動手段を駆動してキャピ
ラリツールを所定高さまで上昇させる行程と、前記駆動
手段を駆動してキャピラリツールの下端部を第２のボン
ディング点まで移動させてワイヤのループを形成する工
程と、形成されたループの端部をキャピラリツールによ
り第２のボンディング点に圧着する工程とを含み、かつ
前記ループを形成する工程におけるキャピラリツールの
下端部の軌跡が略円弧状ないしは略楕円状をなしてお
り、前記軌跡上でのキャピラリツールの下端部の移動を
極座標で表したときの角加速度が時間について連続であ
って、この角加速度を時間について積分して得られる速
度パターンを求め、更にこの速度パターンを直交座標系
のＸＹＺ各軸成分に座標変換することにより求められた
速度パターンに基づいて前記駆動手段のＸＹＺ各軸の速
度を制御するようにした。A wire bonding method according to the present invention comprises a capillary tool for inserting a wire, a horn for holding the capillary tool, and three axes for driving the horn in three directions of X, Y and Z. A wire bonding method using a wire bonding apparatus including a driving unit and a control unit that controls the driving unit, wherein a ball formed at a lower end of a wire derived from a lower end of a capillary tool is firstly moved by a capillary tool. Pressing the bonding tool to the bonding point, driving the driving means to raise the capillary tool to a predetermined height, and driving the driving means to move the lower end of the capillary tool to a second bonding point so that Forming a loop, and connecting the end of the formed loop to a second bonder using a capillary tool. And the locus of the lower end of the capillary tool in the step of forming the loop is substantially arc-shaped or substantially elliptical, and the lower end of the capillary tool is moved on the locus. Is expressed in polar coordinates, the angular acceleration is continuous over time, and the speed obtained by integrating this angular acceleration over time
A degree pattern is obtained, and the speed of each of the XYZ axes of the driving means is controlled based on the speed pattern obtained by performing coordinate conversion of the speed pattern into XYZ axes of a rectangular coordinate system.

【００１３】[0013]

【発明の実施の形態】上記構成の本発明は、ループ形成
時の略円弧状軌跡を描くキャピラリツールの動作を、極
座標でのこの軌跡上の角加速度が時間について連続とな
るようＸＹＺ各軸の速度パターンを制御することにより
行う。このため、ＸＹＺ各軸の速度パターンには急激な
加速度変化は表れず、したがってボンディング装置の機
構の振動が防止できるため、ボンディング不良のない安
定したループ形成が行える。DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS The present invention having the above-mentioned structure is arranged so that the operation of a capillary tool which draws a substantially circular locus when a loop is formed is controlled so that the angular acceleration on this locus in polar coordinates is continuous with respect to time. This is performed by controlling the speed pattern. For this reason, a rapid acceleration change does not appear in the speed pattern of each of the XYZ axes, so that the vibration of the mechanism of the bonding apparatus can be prevented, so that a stable loop without bonding failure can be formed.

【００１４】以下、本発明の実施の形態を図面を参照し
て説明する。図１は本発明の一実施の形態のワイヤボン
ディング装置の全体構造を示す斜視図、図２は同ワイヤ
ボンディング装置の制御系の構成を示すブロック図、図
３及び図４は同ワイヤボンディング工程の説明図、図５
は同ワイヤボンディング方法のループを形成する工程の
モータの速度パターンを示すグラフ、図６は同ワイヤボ
ンディング方法のループを形成する工程のモータ制御の
フローチャートである。Hereinafter, embodiments of the present invention will be described with reference to the drawings. FIG. 1 is a perspective view showing the overall structure of a wire bonding apparatus according to an embodiment of the present invention, FIG. 2 is a block diagram showing the configuration of a control system of the wire bonding apparatus, and FIGS. Explanation diagram, FIG.
Is a graph showing a motor speed pattern in a step of forming a loop in the wire bonding method, and FIG. 6 is a flowchart of motor control in a step of forming a loop in the wire bonding method.

【００１５】まず、図１を参照してワイヤボンディング
装置の全体構造を説明する。基台１の上面には、基板２
が載置されている。基板２の中央にはチップ３が搭載さ
れており、チップ３の周辺には、電極４が多数形成され
ている。５は押さえ板であって、シリンダ６のロッド７
に連結されている。ロッド７が引き込むと、基板２は押
さえ板５で押さえつけられて固定される。基台１の側方
には可動テーブル１０が設置されている。可動テーブル
１０上には、駆動ボックス１１が設けられている。駆動
ボックス１１からはホーン１２が前方へ延出している。
ホーン１２の先端部にはキャピラリツール１３が保持さ
れている。First, the overall structure of the wire bonding apparatus will be described with reference to FIG. On the upper surface of the base 1, a substrate 2
Is placed. A chip 3 is mounted at the center of the substrate 2, and a number of electrodes 4 are formed around the chip 3. Reference numeral 5 denotes a holding plate, and the rod 7 of the cylinder 6
It is connected to. When the rod 7 is retracted, the substrate 2 is pressed and fixed by the pressing plate 5. A movable table 10 is provided on the side of the base 1. A drive box 11 is provided on the movable table 10. A horn 12 extends forward from the drive box 11.
The tip of the horn 12 holds a capillary tool 13.

【００１６】キャピラリツール１３には、スプール１４
から繰り出されたワイヤ１５が挿通されている。１６は
キャピラリツール１３の上方に配置されたクランパであ
って、開閉動作を行うことによりワイヤ１５をクランプ
して固定する。Ｘ方向モータ１７とＹ方向モータ１８が
駆動して可動テーブル１０が作動すると、可動テーブル
１０上の駆動ボックス１１、ホーン１２、キャピラリツ
ール１３などはＸ方向やＹ方向へ水平移動する。また、
キャピラリツール１３は駆動ボックス１１内に収納され
図示しないＺ方向モータに駆動され上下動を行う。The capillary tool 13 has a spool 14
The wire 15 drawn out from is inserted. Reference numeral 16 denotes a clamper disposed above the capillary tool 13, which clamps and fixes the wire 15 by performing an opening and closing operation. When the movable table 10 is operated by driving the X-direction motor 17 and the Y-direction motor 18, the drive box 11, the horn 12, and the capillary tool 13 on the movable table 10 move horizontally in the X direction and the Y direction. Also,
The capillary tool 13 is housed in the drive box 11 and driven by a Z-direction motor (not shown) to move up and down.

【００１７】次に、図２を参照してワイヤボンディング
装置の制御系の構成を説明する。図２において、２０は
制御部であり、速度パターン演算部２１に各要素動作の
動作距離を指示し、また各軸のパルス生成部２７、２
８、２９にパルス出力開始信号を伝達する。ループ形状
データ記憶部２２は、所定のループ形状を実現するため
の制御データを記憶する。ボンディング座標記憶部２３
は、各種ワークのボンディング位置の座標データを記憶
する。速度パターン演算部２１は、制御部２０、ループ
形状データ記憶部２２及びボンディング座標記億部２３
からのデータを受け取り、ＸＹＺ各軸の駆動のための速
度パターンを演算する。Next, the configuration of a control system of the wire bonding apparatus will be described with reference to FIG. In FIG. 2, reference numeral 20 denotes a control unit, which instructs the speed pattern calculation unit 21 on the operation distance of each element operation, and also outputs a pulse generation unit 27, 2
The pulse output start signal is transmitted to 8 and 29. The loop shape data storage unit 22 stores control data for realizing a predetermined loop shape. Bonding coordinate storage unit 23
Stores coordinate data of bonding positions of various works. The speed pattern calculation unit 21 includes a control unit 20, a loop shape data storage unit 22, and a bonding coordinate storage unit 23.
, And calculates a speed pattern for driving each of the XYZ axes.

【００１８】Ｘ軸速度パターン記憶部２４、Ｙ軸速度パ
ターン記憶部２５、Ｚ軸速度パターン記憶部２６は、演
算された各軸の速度パターンを記憶する。Ｘ軸パルス生
成部２７、Ｙ軸パルス生成部２８、Ｚ軸パルス生成部２
９はそれぞれの軸の速度パターン記憶部からの速度パタ
ーンデータと制御部２０からのパルス出力開始信号を受
けて、モータ制御パルス列を出力する。Ｘ軸ドライバ３
０、Ｙ軸ドライバ３１、Ｚ軸ドライバ３２はそれぞれの
軸のパルス生成部からモータ制御パルス列を受け、それ
ぞれＸ軸モータ３３、Ｙ軸モータ３４、Ｚ軸モータ３５
の駆動電流を制御する。The X-axis speed pattern storage unit 24, the Y-axis speed pattern storage unit 25, and the Z-axis speed pattern storage unit 26 store the calculated speed patterns of the respective axes. X-axis pulse generator 27, Y-axis pulse generator 28, Z-axis pulse generator 2
9 receives the speed pattern data from the speed pattern storage unit of each axis and the pulse output start signal from the control unit 20, and outputs a motor control pulse train. X-axis driver 3
0, the Y-axis driver 31, and the Z-axis driver 32 receive motor control pulse trains from the pulse generation units of the respective axes, and respectively receive an X-axis motor 33, a Y-axis motor 34, and a Z-axis motor 35
To control the driving current.

【００１９】このワイヤボンディング装置は上記の構成
より成り、以下その動作について図３及び図４を参照し
て説明する。なお、図３（ａ）〜（ｃ）および図４
（ａ）〜（ｃ）は、一連の動作を動作順に示している。
図３（ａ）は初期状態であって、この状態でキャピラリ
ツール１３の下端部からワイヤ１５を下方へ導出し、キ
ャピラリツール１３の上方のクランパ１６でワイヤ１５
をクランプしてワイヤ１５を固定している。１５’は、
前回のワイヤボンディング動作でチップ３と基板２を接
続したワイヤである。This wire bonding apparatus has the above configuration, and its operation will be described below with reference to FIGS. 3A to 3C and FIG.
(A) to (c) show a series of operations in the order of operations.
FIG. 3A shows an initial state. In this state, the wire 15 is led out from the lower end of the capillary tool 13 and is clamped by the clamper 16 above the capillary tool 13.
Are clamped to fix the wire 15. 15 '
These wires connect the chip 3 and the substrate 2 in the previous wire bonding operation.

【００２０】次に図３（ｂ）に示すように、ワイヤ１５
の下端部に接近したトーチ１９に高電圧を印加すること
により、ワイヤ１５の下端部とトーチ１９の先端部との
間に電気的スパークを発生させ、ワイヤ１５の下端部に
ボール２０を形成する。なお、図１ではトーチ１９は省
略している。Next, as shown in FIG.
By applying a high voltage to the torch 19 approaching the lower end of the wire 15, an electric spark is generated between the lower end of the wire 15 and the tip of the torch 19, and the ball 20 is formed at the lower end of the wire 15. . In FIG. 1, the torch 19 is omitted.

【００２１】次に図３（ｃ）で示すように、クランパ１
６を開いてワイヤ１５のクランプ状態を解除するととも
に、キャピラリツール１３を下降させてボール２０をチ
ップ３上面のパッドに押しつけてボンディングする。次
いで、鎖線で示すようにキャピラリツール１３を基板２
の電極４の上方に移動させ、キャピラリツール１３の下
端部を所定の軌跡を描かせながら下降させワイヤ１５の
ループを形成させてワイヤ１５を基板２の電極４にボン
ディングする（この場合のキャピラリツール１３の下端
部が描く所定の軌跡については図７を参照）。なお、こ
のループを形成する行程でのモータの制御方法について
は後述する。Next, as shown in FIG.
6, the wire 15 is released from the clamped state, and the capillary tool 13 is lowered to press the ball 20 against the pad on the upper surface of the chip 3 for bonding. Next, as shown by a chain line, the capillary tool 13 is
Of the capillary tool 13 is moved down while drawing a predetermined trajectory to form a loop of the wire 15 and bond the wire 15 to the electrode 4 of the substrate 2 (the capillary tool in this case). (Refer to FIG. 7 for the predetermined trajectory drawn by the lower end of 13). The method of controlling the motor in the process of forming this loop will be described later.

【００２２】次に図４（ａ）に示すようにキャピラリツ
ール１３を上昇させ、かつクランパ１６でワイヤ１５を
再度クランプしてワイヤ１５を引き上げれば、ワイヤ１
５はボンディング点ａでカットされる。以上によりワイ
ヤボンディングが終了したならば、基板２は次の工程へ
送り出され、図４（ｂ）に示すようにキャピラリツール
１３は次の基板２が送られてくるまで待機する。この待
機状態で、クランパ１６はワイヤ１５をクランプして、
ワイヤ１５が不要に上昇してワイヤ１５の下端部がキャ
ピラリツール１３の内部に入り込まないようにし、ワイ
ヤ１５の下端部が所定長Ｌだけキャピラリツール１３の
下端部から導出した状態を維持している。Next, as shown in FIG. 4A, the capillary tool 13 is raised, the wire 15 is clamped again by the clamper 16 and the wire 15 is pulled up.
5 is cut at the bonding point a. When the wire bonding is completed as described above, the substrate 2 is sent out to the next step, and the capillary tool 13 waits until the next substrate 2 is sent as shown in FIG. In this standby state, the clamper 16 clamps the wire 15 and
The wire 15 is unnecessarily raised so that the lower end of the wire 15 does not enter the inside of the capillary tool 13, and the state in which the lower end of the wire 15 is led out from the lower end of the capillary tool 13 by a predetermined length L is maintained. .

【００２３】次に、図４（ｃ）に示すように、次の基板
２がキャピラリツール１３の下方に搬送されて来たなら
ば、そこでトーチ１９とワイヤ１５の下端部との間で電
気的スパークを発生させてボール２０を形成し、上述し
たワイヤボンディング動作を再開する。Next, as shown in FIG. 4C, when the next substrate 2 is transported below the capillary tool 13, the electrical connection between the torch 19 and the lower end of the wire 15 is made. A ball is formed by generating a spark, and the above-described wire bonding operation is restarted.

【００２４】次に、図５を参照してワイヤボンディング
方法のループを形成する行程のモータの速度パターンに
ついて説明する。本実施の形態では、図５の中段のグラ
フで示すように角速度のパターンとして略サイクロイド
パターンを採用し、角加速度が時間について連続である
速度パターンを実現している（図５の上段のグラフを参
照）。そしてＸＹＺ各駆動軸方向の速度成分Ｖｘ、Ｖ
ｙ、Ｖｚは図５の下段のグラフで表され、水平方向の速
度成分Ｖｘ、Ｖｙのみならず、垂直方向の速度成分Ｖｚ
も立ち上がり時ｔａ及び着地時ｔｂの双方とも非常に滑
らかに変化しており、機械的振動の原因となる急激な加
速度変化は表れていない。Next, with reference to FIG. 5, a description will be given of a motor speed pattern in a process of forming a loop of the wire bonding method. In the present embodiment, a substantially cycloid pattern is adopted as the angular velocity pattern as shown in the middle graph of FIG. 5, and a velocity pattern in which the angular acceleration is continuous with respect to time is realized (the upper graph of FIG. reference). Then, velocity components Vx, V in the XYZ drive axis directions
y and Vz are represented by the lower graph in FIG. 5 and include not only the horizontal speed components Vx and Vy but also the vertical speed component Vz.
In both cases, both the rising time ta and the landing time tb change very smoothly, and no rapid change in acceleration causing mechanical vibration appears.

【００２５】次に、図２及び図６を参照してワイヤボン
ディング方法のループを形成する工程でのモータ制御の
フローについて説明する。まず、図６に示すように、ボ
ンディング座標とループ形状データより円弧の開始点と
終点の位置を算出する（ＳＴ１）。次に、図５に示され
る速度パターンに基づき、（数２）〜（数４）に示す座
標変換式を用いてＸＹＺ各軸の速度パターンを作成する
（ＳＴ２）。Next, the flow of motor control in the step of forming a loop of the wire bonding method will be described with reference to FIGS. First, as shown in FIG. 6, the starting point and the ending point of the arc are calculated from the bonding coordinates and the loop shape data (ST1). Next, based on the speed pattern shown in FIG. 5, a speed pattern for each of the XYZ axes is created using the coordinate conversion formulas shown in (Formula 2) to (Formula 4) (ST2).

【００２６】次いで、この各軸の速度パターンがそれぞ
れの速度パターン記憶部２４、２５、２６に記憶される
（ＳＴ３）。次いで制御部２０からのパルス出力信号が
ＯＮであるか否かが判断され（ＳＴ４）、ＯＮであれば
ＳＴ５にて各軸のパルス生成部２７、２８、２９より各
軸のモータ駆動用のドライバ３０、３１、３２に対して
制御パルス列が出力される。この制御パルスに従って各
軸のモータ３３、３４、３５が駆動することにより、キ
ャピラリツール１３は所定の軌跡を描いてワイヤのルー
プを形成する。Next, the speed patterns of the respective axes are stored in the respective speed pattern storage units 24, 25 and 26 (ST3). Next, it is determined whether or not the pulse output signal from the control unit 20 is ON (ST4). If the pulse output signal is ON, the pulse generators 27, 28, and 29 for each axis drive the motor driving drivers for each axis in ST5. Control pulse trains are output to 30, 31, and 32. By driving the motors 33, 34, and 35 of each axis according to the control pulse, the capillary tool 13 draws a predetermined trajectory to form a wire loop.

【００２７】本発明は、上記実施の形態に限定されない
のであって、例えばループを形成する行程での軌跡は上
記実施の形態では略円弧状となっているが、略楕円状で
あってもよく、また角速度のパターンとして略サイクロ
イドパターンを採用しているが、角加速度が時間的に連
続であるものならばこれ以外のパターンであっても良
い。The present invention is not limited to the above embodiment. For example, the trajectory in the process of forming a loop is substantially arc-shaped in the above embodiment, but may be substantially elliptical. Although the substantially cycloid pattern is employed as the angular velocity pattern, any other pattern may be used as long as the angular acceleration is temporally continuous.

【００２８】[0028]

【発明の効果】本発明は、ループ形成時の略円弧状軌跡
を描くキャピラリツールの動作を、極座標でのこの軌跡
上の角加速度が時間について連続となるようＸＹＺ各軸
の速度パターンを制御することにより行うようにしてい
るので、ＸＹＺ各軸の速度パターンには急激な加速度変
化は表れず、したがってボンディング装置の機構の振動
が防止できるため、ボンディング不良のない安定したル
ープ形成が行える。According to the present invention, the operation of the capillary tool for drawing a substantially circular locus during loop formation is controlled by controlling the speed patterns of the XYZ axes so that the angular acceleration on the locus in polar coordinates is continuous with respect to time. As a result, a rapid change in acceleration does not appear in the speed pattern of each of the XYZ axes, and therefore the vibration of the mechanism of the bonding apparatus can be prevented, so that a stable loop can be formed without bonding failure.

【図面の簡単な説明】[Brief description of the drawings]

【図１】本発明の一実施の形態のワイヤボンディング装
置の全体構造を示す斜視図FIG. 1 is a perspective view showing the overall structure of a wire bonding apparatus according to an embodiment of the present invention.

【図２】本発明の一実施の形態のワイヤボンディング装
置の制御系の構成を示すブロック図FIG. 2 is a block diagram illustrating a configuration of a control system of the wire bonding apparatus according to the embodiment of the present invention;

【図３】本発明の一実施の形態のワイヤボンディング工
程の説明図FIG. 3 is an explanatory diagram of a wire bonding step according to one embodiment of the present invention.

【図４】本発明の一実施の形態のワイヤボンディング工
程の説明図FIG. 4 is an explanatory diagram of a wire bonding step according to one embodiment of the present invention.

【図５】本発明の一実施の形態のワイヤボンディング方
法のループを形成する工程のモータの速度パターンを示
すグラフFIG. 5 is a graph showing a motor speed pattern in a step of forming a loop in the wire bonding method according to one embodiment of the present invention;

【図６】本発明の一実施の形態のワイヤボンディング方
法のループを形成する工程のモータ制御のフローチャー
トFIG. 6 is a flowchart of motor control in a step of forming a loop of the wire bonding method according to one embodiment of the present invention;

【図７】ワイヤボンディング方法のループ形成時の円弧
状の軌跡を表す極座標図FIG. 7 is a polar coordinate diagram showing an arc-shaped trajectory when a loop is formed in the wire bonding method.

【図８】従来のワイヤボンディング方法のループ形成時
の速度パターンを示すグラフFIG. 8 is a graph showing a speed pattern when a loop is formed in a conventional wire bonding method.

【符号の説明】[Explanation of symbols]

１ 基台 ２ 基板 ３ チップ ４ 電極 ５ 基板押さえ １０ 可動テーブル １２ ボンディングアーム １３ キャピラリツール １４ スプール １５ ワイヤ １６ クランパ ２０ 制御部 ２１ 速度パターン演算部 ２２ ループ形状データ記憶部 Reference Signs List 1 base 2 substrate 3 chip 4 electrode 5 substrate holder 10 movable table 12 bonding arm 13 capillary tool 14 spool 15 wire 16 clamper 20 control unit 21 speed pattern calculation unit 22 loop shape data storage unit

Claims (1)

(57)【特許請求の範囲】(57) [Claims] 【請求項１】ワイヤを挿通するキャピラリツールと、キ
ャピラリツールを保持するホーンと、ホーンをＸ、Ｙお
よびＺの３方向に駆動する３軸からなる駆動手段と、駆
動手段を制御する制御部とを備えたワイヤボンディング
装置によるワイヤボンディング方法であって、キャピラ
リツールの下端部から導出するワイヤの下端部に形成さ
れたボールをキャピラリツールにより第１のボンディン
グ点に圧着する工程と、前記駆動手段を駆動してキャピ
ラリツールを所定高さまで上昇させる行程と、前記駆動
手段を駆動してキャピラリツールの下端部を第２のボン
ディング点まで移動させてワイヤのループを形成する工
程と、形成されたループの端部をキャピラリツールによ
り第２のボンディング点に圧着する工程とを含み、かつ
前記ループを形成する工程におけるキャピラリツールの
下端部の軌跡が略円弧状ないしは略楕円状をなしてお
り、前記軌跡上でのキャピラリツールの下端部の移動を
極座標で表したときの角加速度が時間について連続であ
って、この角加速度を時間について積分して得られる速
度パターンを求め、更にこの速度パターンを直交座標系
のＸＹＺ各軸成分に座標変換することにより求められた
速度パターンに基づいて前記駆動手段のＸＹＺ各軸の速
度を制御することを特徴とするワイヤボンディング方
法。1. A capillary tool for inserting a wire, a horn for holding the capillary tool, a driving unit including three axes for driving the horn in three directions of X, Y and Z, and a control unit for controlling the driving unit. A step of pressing a ball formed at a lower end of a wire derived from a lower end of a capillary tool to a first bonding point by a capillary tool, and the driving means. A step of driving to raise the capillary tool to a predetermined height; a step of driving the driving means to move a lower end portion of the capillary tool to a second bonding point to form a wire loop; and Crimping the end to a second bonding point with a capillary tool, and forming the loop The locus of the lower end of the capillary tool in the step is substantially arc-shaped or substantially elliptical, and the angular acceleration when the movement of the lower end of the capillary tool on the locus is expressed in polar coordinates is continuous with respect to time. Speed obtained by integrating this angular acceleration with respect to time.
A speed pattern for each of the XYZ axes of the driving means based on a speed pattern obtained by obtaining a degree pattern, and further converting the speed pattern into XYZ axes of a rectangular coordinate system. Bonding method.
JP05455097A 1997-03-10 1997-03-10 Wire bonding method Expired - Fee Related JP3314652B2 (en)

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JP3314652B2 true JP3314652B2 (en) 2002-08-12

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JP4631138B2 (en) * 2000-08-07 2011-02-16 日本電気株式会社 Wire bonding equipment

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