JP2531434B2 - Wire bonding apparatus and method - Google Patents

Wire bonding apparatus and method

Info

Publication number
JP2531434B2
JP2531434B2 JP5110842A JP11084293A JP2531434B2 JP 2531434 B2 JP2531434 B2 JP 2531434B2 JP 5110842 A JP5110842 A JP 5110842A JP 11084293 A JP11084293 A JP 11084293A JP 2531434 B2 JP2531434 B2 JP 2531434B2
Authority
JP
Japan
Prior art keywords
bonding
wire
tool
bonding tool
clamper
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP5110842A
Other languages
Japanese (ja)
Other versions
JPH06326164A (en
Inventor
善宏 小野
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
Nippon Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nippon Electric Co Ltd filed Critical Nippon Electric Co Ltd
Priority to JP5110842A priority Critical patent/JP2531434B2/en
Publication of JPH06326164A publication Critical patent/JPH06326164A/en
Application granted granted Critical
Publication of JP2531434B2 publication Critical patent/JP2531434B2/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
    • H01L24/78—Apparatus for connecting with wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
    • H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
    • H01L2224/45001—Core members of the connector
    • H01L2224/45099—Material
    • H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
    • H01L2224/45138—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C
    • H01L2224/45144—Gold (Au) as principal constituent
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/484—Connecting portions
    • H01L2224/48463—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond
    • H01L2224/48465—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond the other connecting portion not on the bonding area being a wedge bond, i.e. ball-to-wedge, regular stitch
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73201—Location after the connecting process on the same surface
    • H01L2224/73215—Layer and wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78—Apparatus for connecting with wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78—Apparatus for connecting with wire connectors
    • H01L2224/7825—Means for applying energy, e.g. heating means
    • H01L2224/78268—Discharge electrode
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78—Apparatus for connecting with wire connectors
    • H01L2224/7825—Means for applying energy, e.g. heating means
    • H01L2224/783—Means for applying energy, e.g. heating means by means of pressure
    • H01L2224/78301—Capillary
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
    • H01L2224/85009—Pre-treatment of the connector or the bonding area
    • H01L2224/8503—Reshaping, e.g. forming the ball or the wedge of the wire connector
    • H01L2224/85035—Reshaping, e.g. forming the ball or the wedge of the wire connector by heating means, e.g. "free-air-ball"
    • H01L2224/85045—Reshaping, e.g. forming the ball or the wedge of the wire connector by heating means, e.g. "free-air-ball" using a corona discharge, e.g. electronic flame off [EFO]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
    • H01L2224/8512—Aligning
    • H01L2224/85148—Aligning involving movement of a part of the bonding apparatus
    • H01L2224/85169—Aligning involving movement of a part of the bonding apparatus being the upper part of the bonding apparatus, i.e. bonding head, e.g. capillary or wedge
    • H01L2224/8518—Translational movements
    • H01L2224/85181—Translational movements connecting first on the semiconductor or solid-state body, i.e. on-chip, regular stitch

Description

【発明の詳細な説明】Detailed Description of the Invention

【０００１】[0001]

【産業上の利用分野】本発明はワイヤボンディング装置
および方法に関し、特に被覆ワイヤを用いたワイヤボン
ディングに対応するワイヤボンディング装置および方法
に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a wire bonding apparatus and method, and more particularly to a wire bonding apparatus and method corresponding to wire bonding using a covered wire.

【０００２】半導体素子の高密度化に伴い、従来のワイ
ヤボンディングに使用させてきた金ワイヤに代わり、金
ワイヤに絶縁被覆を施した被覆ワイヤが開発させてい
る。被覆ワイヤを用いたボンディングは、隣接するワイ
ヤ間のショート不良が避けられるので、長ワイヤ，オー
バーリード，低ループ等の適用ができ、高密度実装に有
利である。With the increase in the density of semiconductor elements, a coated wire in which an insulating coating is applied to the gold wire has been developed in place of the gold wire used in the conventional wire bonding. Bonding using a covered wire can avoid short-circuit defects between adjacent wires, and thus can be applied to long wires, overleads, low loops, etc., and is advantageous for high-density mounting.

【０００３】[0003]

【従来の技術】図３は、従来のワイヤボンディング装置
の一例を示す側面図である。図３に示すワイヤボンディ
ング装置は、ボンディングツール４と、ホーン５とホー
ン５を移動運動させるための揺動機構６とワイヤカット
クランパ７とトーチロッド９から成るボンディングヘッ
ド部と、ボンディングヘッド部を平面運動させる為のＸ
Ｙステージ１０を備えている。2. Description of the Related Art FIG. 3 is a side view showing an example of a conventional wire bonding apparatus. The wire bonding apparatus shown in FIG. 3 includes a bonding tool 4, a horn 5, a swinging mechanism 6 for moving the horn 5, a bonding head portion including a wire cut clamper 7 and a torch rod 9, and a bonding head portion in a flat plane. X to exercise
The Y stage 10 is provided.

【０００４】図４（１）〜図４（６）は、図３に示すワ
イヤボンディング装置による金ワイヤを用いたワイヤボ
ンディングの動作を説明するためのワイヤボンディング
工程図である。4 (1) to 4 (6) are wire bonding process diagrams for explaining the operation of wire bonding using a gold wire by the wire bonding apparatus shown in FIG.

【０００５】まず、図４（１）に示すようにボンディン
グツール４の先端に送り出せれた金ワイヤ１の先端にト
ーチロッド９より電気火花を飛ばしてボールを形成を行
う。次に図４（２）に示すようにワイヤカットクランパ
７を開いた後、ボンディングツール４をホーン揺動機構
６により下降させ、金ワイヤ１の先端に形成したボール
をワ−ク３に接合する。これを１ｓｔボンディングと言
う。First, as shown in FIG. 4A, electric sparks are blown from the torch rod 9 to the tip of the gold wire 1 sent to the tip of the bonding tool 4 to form a ball. Next, as shown in FIG. 4 (2), after opening the wire cut clamper 7, the bonding tool 4 is lowered by the horn swinging mechanism 6 to bond the ball formed at the tip of the gold wire 1 to the work 3. . This is called 1st bonding.

【０００６】次に、図４（３）に示すようにボンディン
グツール４をホーン揺動機構６に上昇させ、更にＸＹス
テージ１０により次の接合点まで移動させる。次に、図
４（４）に示すようにボンディングツール４をホーン揺
動機構６により下降させ、ワーク３に金ワイヤ１を接合
する。これを２ｎｄボンディングと言う。次に、図４
（５）に示すようにボンディングツール４をホーン揺動
機構６によりワイヤ送り出し量まで上昇させたところで
ワイヤカットクランパ７を閉じる。最後に、図４（６）
に示すように更にボンディングツール４をホーン揺動機
構６により上昇させて金ワイヤ１を接合部分から切断
し、金ワイヤ１をボンディングツール４先端に送り出
す。Next, as shown in FIG. 4C, the bonding tool 4 is moved up to the horn swinging mechanism 6 and further moved to the next bonding point by the XY stage 10. Next, as shown in FIG. 4 (4), the bonding tool 4 is lowered by the horn swinging mechanism 6 to bond the gold wire 1 to the work 3. This is called 2nd bonding. Next, FIG.
As shown in (5), the wire cutting clamper 7 is closed when the bonding tool 4 is moved up to the wire feeding amount by the horn swinging mechanism 6. Finally, Fig. 4 (6)
As shown in FIG. 5, the bonding tool 4 is further raised by the horn swinging mechanism 6 to cut the gold wire 1 from the bonded portion, and the gold wire 1 is sent to the tip of the bonding tool 4.

【０００７】以上の動作を繰り返すことによりワイヤボ
ンディングを行う。Wire bonding is performed by repeating the above operation.

【０００８】[0008]

【発明が解決しようとする課題】しかし、上述した従来
のワイヤボンディング装置により、被覆ワイヤを用いて
ワイヤボンディングを行う場合、２ｎｄボンディングに
おいて被覆がワイヤとワークの接合面に挟まるため、電
気的および機械的接合強度が損なわれるという問題があ
った。However, in the case of performing wire bonding using a coated wire by the above-described conventional wire bonding apparatus, the coating is sandwiched between the bonding surface of the wire and the work in the second bonding, so that electrical and mechanical There is a problem that the dynamic bonding strength is impaired.

【０００９】また、接合強度を確保するため過度のボン
ディング負荷を与えると、接合部分のワイヤ強度が損な
われてワイヤ切断が不的確となり、これによりワイヤ送
り出し量の不安定によるボール形成不良に起因したボン
ディング不良を引き起こすという問題点もあった。Further, if an excessive bonding load is applied to secure the bonding strength, the wire strength at the bonding portion is impaired and the wire cutting becomes inaccurate, which results in ball formation failure due to unstable wire feeding amount. There is also a problem that it causes defective bonding.

【００１０】[0010]

【課題を解決するための手段】上記問題点を解決するた
めに、本発明のワイヤボンディング装置は、ボンディン
グワイヤを挿通させる貫通孔を設けたボンディングツー
ルと、このボンディングツールを取り付けて振動させる
振動手段と、前記ボンディングツールの先端に突出した
前記ボンディングワイヤの先端にボールを形成させる手
段と、前記ボンディングツールの上側で前記ボンディン
グワイヤを把持および解放するクランパと、前記振動手
段と共に前記ボンディングツールを上下に移動させる第
１の揺動機構と、前記クランパを前記ボンディングツー
ルとは独立して上下に移動させる第２の揺動機構とを備
え、前記第２のよう動機構は、前記ボンディングワイヤ
を前記ボンディングツールによりワークに仮接合を行っ
た後、前記クランパを上方に移動させて前記ボンディン
グワイヤを切断し、前記ボンディングツールは、前記ボ
ンディングワイヤが切断された後、前記ワークに残って
いる前記ボンディングワイヤを接合するものである。 In order to solve the above-mentioned problems, the wire bonding apparatus of the present invention has a bonding tool provided with a through hole through which a bonding wire is inserted, and the bonding tool is attached and vibrated.
A vibrating means and a hand for forming a ball at the tip of the bonding wire protruding at the tip of the bonding tool.
A step , a clamper for gripping and releasing the bonding wire above the bonding tool, and the vibrating hand.
The moving said bonding tool up and down with the stages
The swinging mechanism of No. 1 and the clamper are connected to the bonding tool.
Le and Bei a second swinging mechanism for moving up and down independently
The second moving mechanism is the bonding wire.
Temporarily join the work with the bonding tool
After that, the clamper is moved upward to move the bonder
Cutting the wire and the bonding tool
Left on the work after the bonding wire is cut
The bonding wires are joined together.

【００１１】本発明のワイヤボンディング方法は、ボン
ディングツールの下端に突出したボンディングワイヤの
先端に形成したボールをワーク上の一点に接合した後に
前記ボンディングツールを前記ワークの他の点に移動さ
せて前記ボンディングワイヤを前記ボンディングツール
により低負荷で仮接合し、次に前記ボンディングワイヤ
を前記ボンディングツールの上側で上向きに引張って前
記ワークの他の点の接合部分から切断した後に前記ワー
クの他の点に残った前記ボンディングワイヤを前記ボン
ンディングツールにより高負荷で接合することを特徴と
する。In the wire bonding method of the present invention, the ball formed at the tip of the bonding wire protruding from the lower end of the bonding tool is bonded to one point on the work, and then the bonding tool is moved to another point on the work. Temporarily bonding the bonding wire with the bonding tool at a low load, then pulling the bonding wire upward on the upper side of the bonding tool to cut it from the bonding part of the other point of the work, and then to the other point of the work. It is characterized in that the remaining bonding wire is bonded with a high load by the bonding tool.

【００１２】[0012]

【実施例】次に本発明の実施例について図面を参照して
詳細に説明する。Embodiments of the present invention will now be described in detail with reference to the drawings.

【００１３】図１は、本発明の一実施例のワイヤボンデ
ィング装置を示す側面図である。FIG. 1 is a side view showing a wire bonding apparatus according to an embodiment of the present invention.

【００１４】図１に示すワイヤボンディング装置は、ボ
ンディングツール４とホーン５と，ホーン５を移動させ
るた為のホーン揺動機構６とワイヤカットクランパ７
と，ワイヤカットクランパ７を揺動運動させるためのク
ランパ揺動機構８と，トーチロッド９から成るボンディ
ングヘッド部と、ボンディングヘッド部を平面運動させ
るためのＸＹステージ１０を備えている。なお、クラン
パ揺動機構８はホーン５と共にホーン揺動機構６によっ
て動かされ、ホーン揺動機構６によりホーン５を上下動
させるとワイヤカットクランパ７も同量だけ上下動す
る。The wire bonding apparatus shown in FIG. 1 includes a bonding tool 4, a horn 5, a horn swinging mechanism 6 for moving the horn 5, and a wire cut clamper 7.
A clamper swinging mechanism 8 for swinging the wire cut clamper 7, a bonding head portion including a torch rod 9, and an XY stage 10 for moving the bonding head portion in a plane. The clamper swinging mechanism 8 is moved together with the horn 5 by the horn swinging mechanism 6, and when the horn 5 is moved up and down by the horn swinging mechanism 6, the wire cut clamper 7 also moves up and down by the same amount.

【００１５】図２（１）〜（８）は、図１に示すワイヤ
ボンディング装置による被覆ワイヤを用いたワイヤボン
ディングの動作を説明するための工程図である。FIGS. 2 (1) to 2 (8) are process diagrams for explaining the operation of wire bonding using the covered wire by the wire bonding apparatus shown in FIG.

【００１６】まず、図２（１）に示すようにボンディン
グツール４の先端に送り出された被覆ワイヤ２の先端に
トーチロッド９により電気火花を飛ばしてボール形成を
行う。次に、図２（２）に示すようにワイヤカットクラ
ンパ７を開いた後、ボンディングツール４をホーン揺動
機構６により下降させ、形成ボールをワーク３に接合す
る。次に、図２（３）に示すようにボンディングツール
４をホーン揺動機構６により上昇させ、更にＸＹステー
ジ１０により次の接合点まで移動させる。First, as shown in FIG. 2A, electric sparks are blown by the torch rod 9 to the tip of the covered wire 2 delivered to the tip of the bonding tool 4 to form a ball. Next, as shown in FIG. 2B, after opening the wire cut clamper 7, the bonding tool 4 is lowered by the horn swinging mechanism 6 to bond the formed ball to the work 3. Next, as shown in FIG. 2C, the bonding tool 4 is raised by the horn swinging mechanism 6 and further moved by the XY stage 10 to the next bonding point.

【００１７】次に、図２（４）に示すようにボンディン
グツール４をホーン揺動機構６により下降させ、被覆ワ
イヤ２をワーク３に低負荷で仮接合する。次に、図２
（５）に示すようにワイヤカットクランパ７をワイヤ送
り出し量（ボール形成時にボンディングツール４の先端
より突出させる被覆ワイヤ２の長さ、図２（８）に示す
ボンディングツール４の先端より突出した被覆ワイヤ２
の長さ）だけクランパ揺動機構８により上昇させたとこ
ろでワイヤカットクランパ７を閉じる。図２（６）に示
すように更にワイヤカットクランパ７を揺動機構８によ
り上昇させて被覆ワイヤ２を接合部分から切断する。Next, as shown in FIG. 2 (4), the bonding tool 4 is lowered by the horn swinging mechanism 6 to temporarily bond the covered wire 2 to the work 3 with a low load. Next, FIG.
As shown in (5), the wire feed amount of the wire cut clamper 7 (the length of the coating wire 2 which is projected from the tip of the bonding tool 4 at the time of ball formation, the coating which is projected from the tip of the bonding tool 4 shown in FIG. Wire 2
The wire-cut clamper 7 is closed when it is lifted by the clamper swinging mechanism 8 by the length (. As shown in FIG. 2 (6), the wire cut clamper 7 is further raised by the swinging mechanism 8 to cut the covered wire 2 from the joined portion.

【００１８】次に、図２（７）に示すようにボンディン
グツール４により被覆ワイヤ２をワーク３に高負荷で本
接合する。最後に、図２（８）に示すようにボンディン
グツール４をワイヤカットクランパ７まで（機構上可能
な範囲でワイヤカットクランパ７に接近）移動させるべ
くホーン揺動機構６によりボンディングツール４を上昇
させるとともにワイヤカットクランパ７の絶対的な位置
が変わらないようにクランパ揺動機構８によりワイヤカ
ットクランパ７をボンディングツール４に対して担対的
に下げ被覆ワイヤ２をボンディングツール４先端から突
出させる。Next, as shown in FIG. 2 (7), the covered wire 2 is permanently bonded to the work 3 with a high load by the bonding tool 4. Finally, as shown in FIG. 2 (8), the bonding tool 4 is raised by the horn swinging mechanism 6 to move the bonding tool 4 to the wire cut clamper 7 (close to the wire cut clamper 7 within a mechanically possible range). At the same time, so that the absolute position of the wire cut clamper 7 does not change, the wire cut clamper 7 is supported by the clamp tool swinging mechanism 8 to lower the wire cut clamper 7 relative to the bonding tool 4 so that the covered wire 2 projects from the tip of the bonding tool 4.

【００１９】以上の動作を繰り返すことにより被覆ワイ
ヤを用いたワイヤボンディングを行う。By repeating the above operation, wire bonding using a covered wire is performed.

【００２０】[0020]

【発明の効果】以上説明したように本発明のワイヤボン
ディング装置および方法は、被覆ワイヤを用いたワイヤ
ボンディングを行う場合、２ｎｄボンディングを仮接合
と本接合との２段階分け、仮接合時においてワイヤ切断
を行うことによりワイヤ送り量が安定化してボール形成
不良いに起因したボンディング不良を防ぐことができる
と共に、本接合時において高いボンディング負荷でボン
ディングワイヤをワークに接合するため十分な電気的お
よび機械的接合信頼性を確保することができるという効
果を有する。As described above, in the wire bonding apparatus and method of the present invention, when performing wire bonding using a covered wire, 2nd bonding is divided into two steps, temporary bonding and main bonding. By cutting, it is possible to stabilize the wire feed amount and prevent defective bonding due to poor ball formation, and at the time of main bonding, sufficient electrical and mechanical power is required to bond the bonding wire to the workpiece with a high bonding load. This has the effect of ensuring the reliability of dynamic joining.

【図面の簡単な説明】[Brief description of drawings]

【図１】本発明の一実施例を示す側面図である。FIG. 1 is a side view showing an embodiment of the present invention.

【図２】図１に示す実施例の動作を示す説明図である。FIG. 2 is an explanatory diagram showing the operation of the embodiment shown in FIG.

【図３】従来のワイヤボンディング装置を示す側面図で
ある。FIG. 3 is a side view showing a conventional wire bonding apparatus.

【図４】図３に示すワイヤボンディング装置の動作を示
す説明図である。FIG. 4 is an explanatory view showing the operation of the wire bonding apparatus shown in FIG.

【符号の説明】[Explanation of symbols]

１ 金ワイヤ ２ 被覆ワイヤ ３ ワーク ４ ボンディングツール ５ ホーン ６ ホーン揺動機構 ７ ワイヤカットクランパ ８ クランパ揺動機構 ９ トーチロッド １０ ＸＹステージ 1 Gold Wire 2 Coated Wire 3 Work 4 Bonding Tool 5 Horn 6 Horn Swing Mechanism 7 Wire Cut Clamper 8 Clamper Swing Mechanism 9 Torch Rod 10 XY Stage

Claims (2)

(57)【特許請求の範囲】(57) [Claims] 【請求項１】 ボンディングワイヤを挿通させる貫通孔
を設けたボンディングツールと、 このボンディングツールを取り付けて振動させる振動手
段と、 前記ボンディングツールの先端に突出した前記ボンディ
ングワイヤの先端にボールを形成させる手段と、 前記ボンディングツールの上側で前記ボンディングワイ
ヤを把持および解放するクランパと、 前記振動手段と共に前記ボンディングツールを上下に移
動させる第１の揺動機構と、 前記クランパを前記ボンディングツールとは独立して上
下に移動させる第２の揺動機構とを備え、 前記第２のよう動機構は、前記ボンディングワイヤを前
記ボンディングツールによりワークに仮接合を行った
後、前記クランパを上方に移動させて前記ボンディング
ワイヤを切断し、 前記ボンディングツールは、前記ボンディングワイヤが
切断された後、前記ワークに残っている前記ボンディン
グワイヤを接合する ことを特徴とするワイヤボンディン
グ装置。1. A bonding tool having a through hole through which a bonding wire is inserted, and a vibrating hand to which the bonding tool is attached to vibrate.
A step , a means for forming a ball on the tip of the bonding wire protruding to the tip of the bonding tool, a clamper for gripping and releasing the bonding wire on the upper side of the bonding tool, and a vertical movement of the bonding tool together with the vibrating means. a first swinging mechanism for moving the, and a second rocking mechanism for moving up or down <br/> the clamper independently of the said bonding tool, the second as dynamic mechanisms, In front of the bonding wire
Temporary joining was performed on the workpiece with the bonding tool.
After that, the clamper is moved upward to perform the bonding.
Cut the wire and the bonding tool
The bondins remaining on the workpiece after being cut
Wire bonding apparatus characterized by joining Guwaiya. 【請求項２】 ボンディングツールの下端に突出したボ
ンディングワイヤの先端に形成したボールをワーク上の
一点に接合した後に前記ボンディングツールを前記ワー
クの他の点に移動させて前記ボンディングワイヤを前記
ボンディングツールにより低負荷で仮接合し、次に前記
ボンディングワイヤを前記ボンディングツールの上側で
上向きに引張って前記ワークの他の点の接合部分から切
断するとともに、切断されたボンディングワイヤの先端
を前記ボンディングツール内部に引き込み、その後に前
記ワークの他の点に残った前記ボンディングワイヤを前
記ボンンディングツールにより高負荷で接合することを
特徴とするワイヤボンディング方法。2. A ball formed at the tip of a bonding wire protruding from the lower end of the bonding tool is bonded to one point on the work, and then the bonding tool is moved to another point on the work to move the bonding wire to the bonding tool. Temporary bonding with a low load by, and then pulling the bonding wire upward on the upper side of the bonding tool to cut from the bonding portion at another point of the work, and the tip of the cut bonding wire.
The bonding tool retraction inside, a wire bonding method characterized by joining the bonding wire remaining in other points of the workpiece after the at a high load by the Bonn down loading tool.
JP5110842A 1993-05-13 1993-05-13 Wire bonding apparatus and method Expired - Lifetime JP2531434B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP5110842A JP2531434B2 (en) 1993-05-13 1993-05-13 Wire bonding apparatus and method

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP5110842A JP2531434B2 (en) 1993-05-13 1993-05-13 Wire bonding apparatus and method

Publications (2)

Publication Number Publication Date
JPH06326164A JPH06326164A (en) 1994-11-25
JP2531434B2 true JP2531434B2 (en) 1996-09-04

Family

ID=14546051

Family Applications (1)

Application Number Title Priority Date Filing Date
JP5110842A Expired - Lifetime JP2531434B2 (en) 1993-05-13 1993-05-13 Wire bonding apparatus and method

Country Status (1)

Country Link
JP (1) JP2531434B2 (en)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4744238B2 (en) * 2005-08-29 2011-08-10 田中電子工業株式会社 Wire cutting method
JP6455037B2 (en) * 2014-09-12 2019-01-23 富士電機株式会社 Manufacturing method of semiconductor device

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6265341A (en) * 1985-09-17 1987-03-24 Mitsubishi Electric Corp Bonding method
JPH05251491A (en) * 1992-03-06 1993-09-28 Fujitsu Ltd Wire bonding method and semiconductor device

Also Published As

Publication number Publication date
JPH06326164A (en) 1994-11-25

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