JP3289609B2 - Wire bonding method - Google Patents
Wire bonding methodInfo
- Publication number
- JP3289609B2 JP3289609B2 JP21701796A JP21701796A JP3289609B2 JP 3289609 B2 JP3289609 B2 JP 3289609B2 JP 21701796 A JP21701796 A JP 21701796A JP 21701796 A JP21701796 A JP 21701796A JP 3289609 B2 JP3289609 B2 JP 3289609B2
- Authority
- JP
- Japan
- Prior art keywords
- wire
- capillary tool
- substrate
- ball
- wire bonding
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
- H01L24/78—Apparatus for connecting with wire connectors
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
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- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
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- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
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- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/484—Connecting portions
- H01L2224/48463—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond
- H01L2224/48465—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond the other connecting portion not on the bonding area being a wedge bond, i.e. ball-to-wedge, regular stitch
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- H01L2224/78—Apparatus for connecting with wire connectors
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- H01L2224/78—Apparatus for connecting with wire connectors
- H01L2224/7825—Means for applying energy, e.g. heating means
- H01L2224/783—Means for applying energy, e.g. heating means by means of pressure
- H01L2224/78301—Capillary
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- H01L2224/78—Apparatus for connecting with wire connectors
- H01L2224/7865—Means for transporting the components to be connected
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- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
- H01L2224/85009—Pre-treatment of the connector or the bonding area
- H01L2224/8503—Reshaping, e.g. forming the ball or the wedge of the wire connector
- H01L2224/85035—Reshaping, e.g. forming the ball or the wedge of the wire connector by heating means, e.g. "free-air-ball"
- H01L2224/85045—Reshaping, e.g. forming the ball or the wedge of the wire connector by heating means, e.g. "free-air-ball" using a corona discharge, e.g. electronic flame off [EFO]
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- H01L2224/851—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector the connector being supplied to the parts to be connected in the bonding apparatus
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- H01L2224/8512—Aligning
- H01L2224/85148—Aligning involving movement of a part of the bonding apparatus
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- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
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- H01L2924/01082—Lead [Pb]
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Wire Bonding (AREA)
Description
【０００１】[0001]
【発明の属する技術分野】本発明は、キャピラリツール
を用いてチップと基板をワイヤで接続するワイヤボンデ
ィング方法に関するものである。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a wire bonding method for connecting a chip and a substrate with wires using a capillary tool.
【０００２】[0002]
【従来の技術】チップと、このチップが搭載されたリー
ドフレームなどの基板をワイヤで接続するワイヤボンデ
ィングは、キャピラリツールの下端部から下方へ導出さ
れたワイヤの下端部とトーチの間で電気的スパークを発
生させてワイヤの下端部にボールを形成した後、キャピ
ラリツールを下降させてボールを基板に搭載されたチッ
プの上面にボンディングし、次いでキャピラリツールを
基板の上方へ移動させてワイヤを基板にボンディングし
た後、基板へのボンディング点でワイヤをカットしてキ
ャピラリツールを上昇させるようになっている。2. Description of the Related Art Wire bonding for connecting a chip and a substrate such as a lead frame on which the chip is mounted with wires is performed by electrically connecting a lower end of a wire led downward from a lower end of a capillary tool to a torch. After a spark is generated to form a ball at the lower end of the wire, the capillary tool is lowered to bond the ball to the upper surface of the chip mounted on the substrate, and then the capillary tool is moved above the substrate to move the wire to the substrate. After bonding, the wire is cut at the bonding point to the substrate to raise the capillary tool.
【０００３】そして上昇位置に退去したキャピラリツー
ルの下端部から導出するワイヤの下端部に電気的スパー
クによりボールを形成し、このボールを形成した状態で
次の基板がキャピラリツールの下方に搬送されてくるま
で待機し、次の基板がキャピラリツールの下方に搬送さ
れてきたならば、上記したワイヤボンディングを再開す
るようになっていた。[0003] A ball is formed by electric spark at the lower end of a wire led out from the lower end of the capillary tool that has retreated to the ascending position, and the next substrate is conveyed under the capillary tool with the ball formed. When the next substrate is transported below the capillary tool, the above-described wire bonding is restarted.
【０００４】しかしながらこのような従来方法では、ワ
イヤの下端部にボールを形成した状態で次の基板がキャ
ピラリツールの下方に搬送されてくるまで待機していた
ため、その間にボールが冷えてしまい、ボールのチップ
に対するボンディングが不良になりやすいという不具合
があった。However, in such a conventional method, since the ball is formed at the lower end of the wire and the substrate is on standby until the next substrate is conveyed below the capillary tool, the ball cools during that time, and the ball is cooled. There is a problem that bonding to the chip tends to be defective.
【０００５】そこで従来、このような不具合を解決する
ために、次のような方法が採られていた。まず第１の従
来方法は、基板がキャピラリツールの下方に搬送されて
きたならば、ワイヤの下端部に形成済のボールを捨て打
ちステージに捨て打ちした後、再度電気的スパークによ
りボールを形成し直す方法である。また第２の従来方法
は、ワイヤの下端部に形成済のボールとトーチの間に再
度電気的スパークを発生させてボールを再加熱する方法
である。Therefore, conventionally, the following method has been adopted to solve such a problem. First, in the first conventional method, when the substrate is conveyed below the capillary tool, the ball formed at the lower end of the wire is thrown away on the throwing stage, and the ball is formed again by electric spark. It is a way to fix it. The second conventional method is a method in which an electric spark is generated again between the torch and the ball formed at the lower end of the wire to reheat the ball.
【０００６】[0006]
【発明が解決しようとする課題】しかしながら上記第１
の従来方法では、キャピラリツールの移動範囲内のどこ
かに捨て打ちステージを格別に設けねばならず、またキ
ャピラリツールを捨て打ちステージの上方へ移動させて
捨て打ち動作を行わせねばならないため運転管理が面倒
であって、且つ捨て打ち動作のための時間を要するため
生産性が低下することとなり、さらには捨て打ちステー
ジに捨て打ちされたボールの除去作業などの捨て打ちス
テージの管理を行わねばならないなどの多くの問題点が
あった。However, the first problem is to be solved.
According to the conventional method, a dumping stage must be specially provided somewhere within the moving range of the capillary tool, and the capillary tool must be moved above the dumping stage to perform the dumping operation. Is cumbersome and requires time for the dumping operation, which results in a decrease in productivity, and furthermore, it is necessary to manage the dumping stage such as the work of removing the ball dumped and dumped on the dumping stage. There were many problems such as.
【０００７】また上記第２の従来方法では、電気的スパ
ークを２回発生させることになるので、ボール径が大き
くなってしまい、その結果、ボールはボンディングされ
るチップの上面のパッドのピッチが小さい場合には、相
隣るボール同士が接触してショートを生じやすいという
問題点があった。In the second conventional method, the electric spark is generated twice, so that the diameter of the ball becomes large. As a result, the pitch of the ball on the upper surface of the chip to be bonded is small. In such a case, there is a problem that adjacent balls are likely to come into contact with each other to cause a short circuit.
【０００８】したがって本発明は、上記課題を解決し、
ワイヤの下端部のボールをチップに確実にボンディング
できるワイヤボンディング方法を提供することを目的と
する。Therefore, the present invention solves the above-mentioned problems,
An object of the present invention is to provide a wire bonding method capable of reliably bonding a ball at a lower end portion of a wire to a chip.
【０００９】[0009]
【課題を解決するための手段】本発明は、キャピラリツ
ールの上方のクランパでワイヤをクランプしてワイヤの
下端部をキャピラリツールの下端部から所定長導出させ
た状態を維持したままで、次の基板がキャピラリツール
の下方へ搬送されてきてワイヤボンディングを実行可能
な状態になるのを待ってから、電気的スパークを発生さ
せてワイヤの下端部にボールを形成するようにしたもの
である。SUMMARY OF THE INVENTION According to the present invention, a wire is clamped by a clamper above a capillary tool so that the lower end of the wire is drawn out from the lower end of the capillary tool by a predetermined length, and the following process is performed. An electrical spark is generated after a substrate is conveyed below the capillary tool to be in a state where wire bonding can be performed, and a ball is formed at the lower end of the wire.
【００１０】[0010]
【発明の実施の形態】上記構成の本発明は、次の基板が
キャピラリツールの下方へ搬送されてきてワイヤボンデ
ィングを実行可能な状態になるのを待ってから、電気的
スパークを発生させてワイヤの下端部にボールを形成す
るので、ボールが冷えてしまうことはなく、ボールをチ
ップに確実にボンディングすることができる。DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS The present invention having the above-described structure, according to the present invention, waits until the next substrate is conveyed below the capillary tool to be in a state where wire bonding can be performed, and then generates an electric spark to generate a wire. Since the ball is formed at the lower end of the chip, the ball does not cool down and the ball can be securely bonded to the chip.
【００１１】次に、本発明の一実施の形態を図面を参照
しながら説明する。図１は本発明の一実施の形態のワイ
ヤボンディング装置の斜視図、図２および図３は同ワイ
ヤボンディング作業の工程図であって、一連の動作を工
程順に示している。まず図１を参照してワイヤボンディ
ングの装置の全体構造を説明する。基台１の上面には基
板２が載置されている。基板２の中央にはチップ３が搭
載されており、チップ３の周囲には電極４が多数形成さ
れている。５は押え板であって、シリンダ６のロッド７
に結合されている。ロッド７が引き込むと、基板２は押
え板５で押え付けられて固定される。８は基板２を基台
１上を右方へ搬送するための搬送爪である。Next, an embodiment of the present invention will be described with reference to the drawings. FIG. 1 is a perspective view of a wire bonding apparatus according to an embodiment of the present invention, and FIGS. 2 and 3 are process diagrams of the wire bonding operation, showing a series of operations in the order of processes. First, the overall structure of the wire bonding apparatus will be described with reference to FIG. The substrate 2 is mounted on the upper surface of the base 1. A chip 3 is mounted at the center of the substrate 2, and a number of electrodes 4 are formed around the chip 3. Reference numeral 5 denotes a holding plate, and the rod 7 of the cylinder 6
Is joined to. When the rod 7 is pulled in, the substrate 2 is pressed and fixed by the pressing plate 5. Reference numeral 8 denotes a transport claw for transporting the substrate 2 on the base 1 to the right.
【００１２】基台１の側方には可動テーブル１０が設置
されている。可動テーブル１０上には駆動ボックス１１
が設けられている。駆動ボックス１１からはホーン１２
が前方へ延出している。ホーン１２の先端部にはキャピ
ラリツール１３が保持されている。キャピラリツール１
３にはスプール１４から繰り出されたワイヤ１５が挿通
されている。１６はキャピラリツール１３の上方に配置
されたクランパであって、開閉動作を行うことによりワ
イヤ１５をクランプして固定する。Ｘ方向モータ１７と
Ｙ方向モータ１８が駆動して可動テーブル１０が作動す
ると、可動テーブル１０上の駆動ボックス１１、ホーン
１２、キャピラリツール１３などはＸ方向やＹ方向へ水
平移動する。A movable table 10 is provided beside the base 1. A drive box 11 is provided on the movable table 10.
Is provided. Horn 12 from drive box 11
Extends forward. The tip of the horn 12 holds a capillary tool 13. Capillary tool 1
A wire 15 fed from a spool 14 is inserted through 3. Reference numeral 16 denotes a clamper disposed above the capillary tool 13, which clamps and fixes the wire 15 by performing an opening and closing operation. When the movable table 10 is operated by driving the X-direction motor 17 and the Y-direction motor 18, the drive box 11, the horn 12, and the capillary tool 13 on the movable table 10 move horizontally in the X direction and the Y direction.
【００１３】次に図２および図３を参照して、ワイヤボ
ンディング動作を説明する。図２（ａ）は初期状態であ
って、この状態でキャピラリツール１３の下端部からワ
イヤ１５を下方へ導出し、キャピラリツール１３の上方
のクランパ１６でワイヤ１５をクランプしてワイヤ１５
を固定している。１５’は、前回のワイヤボンディング
動作でチップ３と基板２を接続したワイヤである。Next, the wire bonding operation will be described with reference to FIGS. FIG. 2A shows an initial state. In this state, the wire 15 is led out from the lower end of the capillary tool 13, and the wire 15 is clamped by the clamper 16 above the capillary tool 13.
Is fixed. Reference numeral 15 'denotes a wire connecting the chip 3 and the substrate 2 in the previous wire bonding operation.
【００１４】次に図２（ｂ）に示すようにワイヤ１５の
下端部に接近したトーチ１９に高電圧を印加することに
より、ワイヤ１５の下端部とトーチ１９の先端部の間に
電気的スパークを発生させ、ワイヤ１５の下端部にボー
ル２０を形成する。なお図１ではトーチ１９は省略して
いる。Next, as shown in FIG. 2 (b), a high voltage is applied to the torch 19 approaching the lower end of the wire 15, so that an electric spark is applied between the lower end of the wire 15 and the tip of the torch 19. And a ball 20 is formed at the lower end of the wire 15. In FIG. 1, the torch 19 is omitted.
【００１５】次に図２（ｃ）に示すようにクランパ１６
を開いてワイヤ１５のクランプ状態を解除するととも
に、キャピラリツール１３を下降させてボール２０をチ
ップ３の上面のパッドに押し付けてボンディングする。
次いで鎖線で示すようにキャピラリツール１３を基板２
の電極４の上方へ移動させてワイヤ１５を基板２の電極
４にボンディングする。Next, as shown in FIG.
Is opened to release the clamped state of the wire 15, and the capillary tool 13 is lowered to press the ball 20 against the pad on the upper surface of the chip 3 for bonding.
Then, as shown by the dashed line, the capillary tool 13 is
The wire 15 is bonded to the electrode 4 of the substrate 2 by moving the wire 15 above the electrode 4.
【００１６】次に図３（ａ）に示すようにキャピラリツ
ール１３を上昇させ、かつクランパ１６でワイヤ１５を
再度クランプしてワイヤ１５を引き上げれば、ワイヤ１
５はボンディング点ａでカットされる。Next, as shown in FIG. 3A, the capillary tool 13 is raised, the wire 15 is clamped again by the clamper 16, and the wire 15 is pulled up.
5 is cut at the bonding point a.
【００１７】以上によりワイヤボンディングが終了した
ならば、基板２は次の工程へ送り出され、図３（ｂ）に
示すようにキャピラリツール１３は次の基板２がその下
方に搬送されてくるまで待機する。この待機状態で、ク
ランパ１６はワイヤ１５をクランプして、ワイヤ１５が
不要に上昇してワイヤ１５の下端部がキャピラリツール
１３の内部に入り込まないようにし、ワイヤ１５の下端
部が所定長Ｌだけキャピラリツール１３の下端部から導
出した状態を維持している。When the wire bonding is completed as described above, the substrate 2 is sent out to the next step, and the capillary tool 13 waits until the next substrate 2 is conveyed below the substrate 2 as shown in FIG. I do. In this standby state, the clamper 16 clamps the wire 15 so that the wire 15 does not rise unnecessarily and the lower end of the wire 15 does not enter the inside of the capillary tool 13, and the lower end of the wire 15 has a predetermined length L. The state of being drawn out from the lower end of the capillary tool 13 is maintained.
【００１８】次に図３（ｃ）に示すように次の基板２が
キャピラリツール１３の下方に搬送されてきたならば、
そこでトーチ１９とワイヤ１５の下端部の間に電気的ス
パークを発生させてボール２０を形成し、上述したワイ
ヤボンディング動作を再開する。Next, as shown in FIG. 3C, if the next substrate 2 is conveyed below the capillary tool 13,
Therefore, an electric spark is generated between the torch 19 and the lower end of the wire 15 to form the ball 20, and the above-described wire bonding operation is restarted.
【００１９】[0019]
【発明の効果】本発明は、次の基板がキャピラリツール
の下方へ搬送されてきてワイヤボンディングを実行可能
な状態になるのを待ってから、電気的スパークを発生さ
せてワイヤの下端部にボールを形成するようにしている
ので、従来方法のようにボールが冷えてしまうことはな
く、ボールをチップに確実にボンディングすることがで
きる。As described above, according to the present invention, after the next substrate is conveyed below the capillary tool to be in a state where wire bonding can be performed, an electric spark is generated and a ball is attached to the lower end of the wire. Is formed, so that the ball does not cool down unlike the conventional method, and the ball can be securely bonded to the chip.
【図１】本発明の一実施の形態のワイヤボンディング装
置の斜視図FIG. 1 is a perspective view of a wire bonding apparatus according to an embodiment of the present invention.
【図２】本発明の一実施の形態のワイヤボンディング作
業の工程図FIG. 2 is a process diagram of a wire bonding operation according to an embodiment of the present invention.
【図３】本発明の一実施の形態のワイヤボンディング作
業の工程図FIG. 3 is a process diagram of a wire bonding operation according to an embodiment of the present invention.
２ 基板 ３ チップ １３ キャピラリツール １５ ワイヤ １６ クランパ １９ トーチ ２０ ボール 2 substrate 3 chip 13 capillary tool 15 wire 16 clamper 19 torch 20 ball
───────────────────────────────────────────────────── フロントページの続き (56)参考文献 特開 平８−162506（ＪＰ，Ａ) 特開 昭62−11242（ＪＰ，Ａ) 特開 昭62−126643（ＪＰ，Ａ) 特開 平４−320350（ＪＰ，Ａ) (58)調査した分野(Int.Cl.7，ＤＢ名) H01L 21/60 ──────────────────────────────────────────────────続 き Continuation of the front page (56) References JP-A-8-162506 (JP, A) JP-A-62-12422 (JP, A) JP-A-62-126643 (JP, A) JP-A-4-162 320350 (JP, A) (58) Field surveyed (Int. Cl. 7 , DB name) H01L 21/60
Claims (1)
されたワイヤの下端部とトーチの間で電気的スパークを
発生させてワイヤの下端部にボールを形成した後、キャ
ピラリツールを下降させてボールを基板に搭載されたチ
ップの上面にボンディングし、次いでキャピラリツール
を基板の上方へ移動させてワイヤを基板にボンディング
した後、基板へのボンディング点でワイヤをカットして
キャピラリツールを上昇させるようにしたワイヤボンデ
ィング方法であって、キャピラリツールの上方のクラン
パでワイヤをクランプしてワイヤの下端部をキャピラリ
ツールの下端部から所定長導出させた状態を維持したま
まで、次の基板がキャピラリツールの下方へ搬送されて
きてワイヤボンディングを実行可能な状態になるのを待
ってから、前記電気的スパークを発生させてワイヤの下
端部にボールを形成することを特徴とするワイヤボンデ
ィング方法。An electric spark is generated between a lower end of a wire led out from a lower end of a capillary tool and a torch to form a ball at a lower end of the wire, and then the ball is lowered by lowering the capillary tool. Is bonded to the upper surface of the chip mounted on the substrate, then the capillary tool is moved above the substrate to bond the wire to the substrate, and then the wire is cut at the bonding point to the substrate to raise the capillary tool. In the wire bonding method, the next substrate is clamped with a clamper above the capillary tool, and the lower end of the wire is maintained at a predetermined length from the lower end of the capillary tool. Wait until it is conveyed downward to be in a state where wire bonding can be performed, Wire bonding method, which comprises forming a ball at the lower end portion of the wire by generating sparks.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP21701796A JP3289609B2 (en) | 1996-08-19 | 1996-08-19 | Wire bonding method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP21701796A JP3289609B2 (en) | 1996-08-19 | 1996-08-19 | Wire bonding method |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH1064943A JPH1064943A (en) | 1998-03-06 |
| JP3289609B2 true JP3289609B2 (en) | 2002-06-10 |
Family
ID=16697529
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP21701796A Expired - Fee Related JP3289609B2 (en) | 1996-08-19 | 1996-08-19 | Wire bonding method |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP3289609B2 (en) |
-
1996
- 1996-08-19 JP JP21701796A patent/JP3289609B2/en not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| JPH1064943A (en) | 1998-03-06 |
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