JP3039188B2 - Electronic component manufacturing method - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for manufacturing an electronic component obtained by sealing a chip mounted on a substrate with a resin.

[0002]

2. Description of the Related Art After a chip is mounted on a substrate, a mold press device is used to form a molded body for protecting the chip to obtain an electronic component. Next, a method of forming a mold body will be described with reference to FIG. Chip 1
Is sealed between the upper mold 3 and the lower mold 4, and the molten resin 6 heated in the resin housing hole 5 and melted in the resin housing hole 5 is pushed up by the plunger 7 while passing through the gate groove 8. Then, it is pressure-fed to the side 2 and filled into the cavity 9 surrounding the chip 1 by press-fitting. Next, after the molten resin is solidified, the upper mold 3 and the lower mold 4 are opened, and the resin (that is, a molded body) solidified in the cavity 9 is pushed up from below by the ejector pins 10 to take out the substrate 2. 11 is a pressure-sensitive element for measuring the internal pressure of the cavity 9;
2 is a push-up plate and 13 is a push-up rod.

FIG. 8 shows a residue of resin adhering to the substrate 2 taken out from between the upper die 3 and the lower die 4 (resin solidified in the gate groove 8 and called a cull, a cold slag, or the like).
6A illustrates a state in which 6a is separated from the substrate 2 and separated.
As shown, a chip 1 is mounted at the center of the substrate 2. A circuit pattern 14 is formed around the chip 1, and a resist film 15 covering the circuit pattern 14 is applied. Reference numeral 16 denotes a wire connecting the chip 1 and the circuit pattern 14. When the chip is a flip chip or a chip manufactured by a tab (TAB) method, the wire 16 is unnecessary. 6b is the cavity 9
Molded body formed by solidification of resin inside
And the wire 16 is covered and protected.

As shown in the figure, the cull 6a is separated from the substrate 2 by rotating the cull 6a clockwise. However, since the cull 6a is firmly adhered to the resist film 15 and solidified, there is a problem that the resist film 15 and the circuit pattern 14 are easily peeled off integrally with the cull 6a.

As a method for solving such a problem,
The means disclosed in Japanese Patent Application Laid-Open No. 4-184944 has been proposed. This is especially shown in FIGS. 1 (a) and 1 (b).
As described in (1), a sealing piece is provided at a gate which is a passage of the molten resin. Then, the molten resin is pressed into the cavity by bypassing the upper surface of the sealing piece, and after the molten resin is cured, the sealing piece is raised, so that the resin remaining on the upper surface of the sealing piece is separated from the resin substrate. I have to.

[0006]

However, in the above-mentioned structure, it is necessary to provide a sealing piece and a drive mechanism for moving the sealing piece up and down, and to collect the resin remaining on the upper surface of the sealing piece. Since a means must be provided separately,
There were problems that the structure and the operation of the apparatus became complicated, and that the production efficiency was lowered due to the time required to move the sealing piece up and down.

Accordingly, an object of the present invention is to provide a method of manufacturing an electronic component that can easily separate a cull from a substrate without damaging a circuit pattern of the substrate.

[0008]

According to the present invention, a substrate on which a chip is mounted is set between an upper die and a lower die of a mold press device, and molten resin is pressed into a cavity from a gate groove. After forming a mold body for protecting the lever, the upper mold and the lower mold are separated, the substrate is taken out from between the upper mold and the lower mold, and then the resin cured inside the gate groove is formed.
The edge of the substrate is punched together with the substrate by a cutting device, so that the peripheral portion of the substrate is hardened inside the gate groove.
They are removed together with the resin to obtain electronic components.

[0009]

According to the above construction, an electronic component can be obtained by cutting a rib and a substrate together after forming a molded body for protecting a chip. In this case, the rib is cut together with the substrate. Cull is separated from the substrate,
It does not damage the circuit pattern of the substrate.

[0010]

Embodiments of the present invention will be described below with reference to the drawings.

FIG. 1 is a perspective view of an electronic component manufactured by the method for manufacturing an electronic component according to the present invention. This electronic component 21
Is formed by sealing a chip 23 mounted on the upper surface of the substrate 22 with a mold body 24 with resin. The mold body 24 has tapered ribs 25, 26, 27,
28 are integrally provided. Reference numeral 29 denotes a wire connecting the electrode of the chip 23 and the electrode of the substrate 22. Next, a mold press device for manufacturing the electronic component 21 will be described.

FIG. 2 is a perspective view of the upper die 31 and the lower die 32 of the mold press device. A rectangular cavity 33, a circular hole 34, and a gate groove 35 for communicating the cavity 33 with the circular hole 34 are formed on the lower surface of the upper die 31. Small grooves 36, 37, 38, 39 are provided at the four corners of the cavity 33.
Are formed so as to extend outward, and one of the small grooves 36 is a sub-gate groove connected to the gate groove 35. The resin cured in the cavity 33 becomes the mold body 24, and the resin cured in the small grooves 36 to 39 becomes the ribs 25 to 28.

A rectangular hole 41 is formed on the upper surface of the lower mold 32 at a position corresponding to the cavity 33, and a resin storage hole for storing resin is formed at a position corresponding to the circular hole 34. 42 is formed in a circular hole shape. When performing the mold press, the substrate 22 on which the chip 23 is mounted is mounted.
Is set between the upper mold 31 and the lower mold 32.

FIG. 3 is a cross-sectional view of the upper mold 31 and the lower mold 32 during a mold press. An ejector pin 43 is disposed below the hole 41 of the lower die 32, and the ejector pin 43 is driven by a vertical moving means (not shown) to perform a vertical operation. A resin 44 is stored in the resin storage section 42. This resin 44 is heated and melted by a heater (not shown). A plunger 45 is housed inside the resin housing 42. 46 is a support pin of the plunger 45. The substrate 22 of this embodiment is a printed circuit board, and a bump 30 is provided on the lower surface thereof, and the bump 30 and the wire 29 are electrically connected. As shown, the connection between the gate groove 35 and the sub-gate groove 36 has a tapered neck detail 40.

Next, the operation of the mold press will be described. As shown in FIG. 3, the substrate 22 is placed on the upper surface of the lower die 32, and the upper die 31 is lowered to be grounded on the upper surface of the lower die 32. In this state, the chip 23 is located in the cavity 33, and the bump 30 is located in the hole 41.

Next, the resin 44 is heated and melted by the heater, and the plunger 45 is raised. Then, the melted resin 44 passes through the gate groove 35 and the sub-gate groove 36 and is pressed into the cavity 33.

Next, after the molten resin 44 is cured, the upper die 31 is lifted and separated from the lower die 32, and the lower surface of the substrate 22 is pushed up by the ejector pins 43 and taken out from the lower die 32.

FIG. 4 shows a semi-finished product 47 of the electronic component thus taken out of the mold press.
In the drawing, reference numeral 44a denotes a resin cured in the resin storage portion 42;
b is a band-shaped resin cured in the gate groove 35, and 44c is a constricted portion cured in the neck detail 40. As described above, these resins 44a and 44b, which are residues of the resin 44 cured in the resin storage portion 42 and the gate groove 35, are called cull and cold slag. The rib 25 is a sub-gate groove
The resin cured in a certain small groove 36, and a resin (cal) 44
It is integral with b. In this embodiment, one chip 23 is mounted on one substrate 22. However, a plurality of chips 23 are mounted on a large or long substrate, and the plurality of chips 23 are simultaneously molded. It may be a multi-faceted process.

FIG. 5 shows a cutting device 50 for the intermediate product 47. In the drawing, reference numeral 51 denotes an elevating block, on which a punch 52 is provided on its lower surface. 53 is a die.
The middle parts 47 shown in FIG. 4 is placed on the die 53, by lowering the lifting block 51, the inside of the gate trench 35
In the cured resin substrate neck thin section of the distal end of the (local) 44b 2
Punch together with 2. In the present embodiment, the resin (cal) 44b
Neck detail at the boundary of the rib 25 protruding from the mold body 24
44c is punched. Of course, there are small grooves 36-39 on the upper mold.
And the molten resin is directly injected into the cavity 33 from the gate groove 35.
Press-fit and therefore project from mold body 24
The ribs 25 to 28 may not be provided. Thus, the substrate
The resin is cured inside the gate groove 35 at the peripheral portion of 22.
Punched together with the formed cull (resins 44a, 44b)
Removed. In this case, cut from the neck detail 44c
Thereby, cutting can be easily performed. Reference numeral 22a denotes a fragment of the peripheral portion of the substrate 22 that has been punched and separated. In FIG. 4, a broken line a indicates a cutting line by this cutting device, and FIG. 1 shows an electronic component 21 obtained by cutting. According to such a method, there is an advantage that the punching of the substrate 22 and the separation of the culls (resins 44a and 44b) can be performed simultaneously in the same cutting step.

1 and 4, the ribs 26, 2
7 and 28 are formed in order to secure a balance in appearance. Therefore, the ribs 26, 27 and 28 may not be formed by eliminating the small holes 37 to 39. Further, in the above embodiment, the ribs 25 to 28 are formed at the corners of the mold body 24, but they may be formed on the sides of the mold body 24 as shown in FIG. The formation positions of the small grooves 36 to 39 of the mold 31 also change), and the formation positions of the ribs 25 to 28 can be set arbitrarily.

[0021]

As described above, according to the method for manufacturing an electronic component of the present invention, the cull can be separated from the substrate without damaging the circuit pattern formed on the substrate, and the cull can be cut off simultaneously with the punching of the substrate. Since separation can be performed, it is extremely advantageous in terms of production efficiency.

[Brief description of the drawings]

FIG. 1 is a perspective view of an electronic component according to an embodiment of the present invention.

FIG. 2 is a perspective view of an upper mold and a lower mold of a mold press device according to one embodiment of the present invention.

FIG. 3 is a sectional view of a mold press apparatus according to one embodiment of the present invention.

FIG. 4 is a perspective view of an intermediate product according to an embodiment of the present invention.

FIG. 5 is a side view of a cutting device according to an embodiment of the present invention.

FIG. 6 is a perspective view of an electronic component according to another embodiment of the present invention.

FIG. 7 is a cross-sectional view of a conventional mold press device.

FIG. 8 is a side view of a conventional electronic component and a substrate during separation of a cull.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 21 Electronic component 22 Substrate 23 Chip 24 Mold body 25 Rib 26 Rib 27 Rib 28 Rib 31 Upper die 32 Lower die 33 Cavity 35 Gate groove 36 Sub gate groove 50 Cutting device

Claims (2)

(57) [Claims] 1. A substrate on which a chip is mounted is set between an upper die and a lower die of a mold press device, and a molten resin is pressed into a cavity from a gate groove to form a mold body for protecting the chip. after the substrate by the upper and lower molds was separated off from between the upper and lower molds of the substrate, then cutting apparatus neck detail of the tip of the cured resin within the gate trench
By punching with the gate of the peripheral portion of the substrate
A method for manufacturing an electronic component , comprising removing the resin together with the cured resin inside the groove to obtain an electronic component. 2. A sub-gate groove connected to the gate groove.
That the resin has hardened inside the sub-gate groove
Ribs projecting from the mold body formed by
The neck detail, which is the boundary of the cured resin inside the
Punching together with the substrate by the cutting device;
The method for manufacturing an electronic component according to claim 1.