JP3033555B2 - Cooling structure - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a cooling structure, and more particularly to a cooling structure in a housing of a communication device or the like in which a plurality of packages are detachably plugged in.

[0002]

2. Description of the Related Art In a housing of a communication device or the like in which a plurality of packages are removably plugged in, a cooling structure using a heat sink is used to make the heat sink uniformly contact the heat generating portion of the plugged-in package, thereby improving cooling efficiency. Is raising the issue.

Conventionally, as a method of bringing a heat sink into contact with a heat-generating portion, a method of making a heat sink for each plug-in package and bringing it into contact has been adopted. Recently, as shown in FIG. 3, a method of sandwiching a heat conductive member (packs 12 and 13) such as rubber between a heat sink 17 and a heat generating surface of an LSI (large-scale integrated circuit) chip 16 has been adopted. ing.

In FIG. 3, an LSI chip 16 is arranged on a board 15, and platters 19 and 20 are inserted into the board 15 so as to sandwich both sides thereof. A heat sink 17 is arranged above the LSI chip 16 via the contact member 11 in which the filling liquid 14 is sealed in the packs 12 and 13.

The heat sink 17 is screwed to the platters 19 and 20 by bolts 22 and the contact member 11 is
It is pressed against the chip 16. In addition, heat sink 1
A flow path through which cooling water 18 flows is provided in 7.

Here, the contact member 11 is an LSI chip 16
In consideration of the fact that the heights of the contact members are often different, the large difference in height is absorbed by changing the thickness of the contact member 11. The surface of the contact member 11 on the side of the heat sink 17 is formed flat, and the heat sink 17 is pressed and fixed to the surface.

The heat sink 17 has a flexible portion 23
The cooling water supply unit 25 is connected to a cooling supply device 25 through two cooling water pipes 23 and 24 provided with a and a to supply and discharge the cooling water 18 to and from the heat sink 17. The cooling supply device 25 includes a water pump 26 and a water tank 27.
And a chiller 28. The above cooling structure is disclosed in Japanese Patent Application Laid-Open No. 4-280460.

[0008]

In the above-described conventional cooling structure, a heat sink corresponding to the shape of each component must be manufactured, which increases the cost. Also, in the case of a movable heat sink, the package itself is strongly compressed and damaged due to variations in component mounting, and conversely, the required cooling performance cannot be expected because the contact area is insufficient because the package is too weak.

Accordingly, an object of the present invention is to solve the above-mentioned problems and to provide a cooling structure capable of improving the cooling efficiency and reducing the cost.

[0010]

SUMMARY OF THE INVENTION A cooling structure according to the present invention is a cooling structure for an electronic equipment housing in which a plurality of packages are detachably plugged in, and is provided corresponding to each of the plurality of packages. And a plurality of movable heat sinks pressed against the heat generating portion of the package; and a pressing member for pressing the plurality of movable heat sinks against the heat generating portions of each of the plurality of packages by the pressure of a viscous substance.

Another cooling structure according to the present invention is a cooling structure for an electronic device housing in which a plurality of packages are detachably mounted on a backboard and plugged in, and is arranged corresponding to each of the plurality of packages. A plurality of movable heat sinks provided and pressed against a heat-generating portion of the package; and a plurality of the movable heat sinks provided to face the backboard with the package interposed therebetween, and the plurality of movable heat sinks being pressured by a viscous substance. And a pressing member that presses against the heat-generating portion.

That is, the cooling structure according to the present invention employs a structure in which a viscous substance is injected into a bracket for pressing the movable heat sink against the heat-generating portion, and a pressure utilizing the viscous substance is employed. The above problem is solved by adopting a structure that transmits pressure.

Thus, in a movable heat sink cooling structure of a communication device in which a plurality of packages are detachably plugged in, it is possible to solve the problem of how to contact a heat sink with packages having different component mounting heights.

[0014]

Next, an embodiment of the present invention will be described with reference to the drawings. FIG. 1 is a perspective view of a cooling structure according to one embodiment of the present invention, and FIG. 2 is a cross-sectional view of the cooling structure according to one embodiment of the present invention.

In these figures, the plug-in package 3 is configured such that a connector 3a is inserted into a connector (not shown) of the back board 2 in the housing 1 and electrically connected thereto.
It is mounted in the housing 1. The mounting component 10 is mounted on the plug-in package 3, and the heat conducting member 4 attached to the movable heat sink 5 is in contact with the mounting component 10, which is a heating member. The movable heat sink 5 and the heat conducting member 4 are provided corresponding to each of the plug-in packages 3.

The movable heat sink 5 is brought into thermal contact with the inside of the heat sink exposed to the outside of the housing 1,
It has a cooling structure that radiates heat to the outside by heat conduction.
The movable heat sink 5 is provided with a projection 5a inserted into the opening 6a of the bracket 6, and projections 5b to 5e inserted into the guide grooves 9a of the guide plate 9. The heat conducting member 4 is formed of an elastic body (for example, silicon rubber or the like) that can be deformed according to the shape of the mounting component 10.

The bracket 6 has an opening 6a through which the protrusion 5a of the movable heat sink 5 is inserted, and a container 7 into which a viscous substance (eg, a viscous gel substance such as grease) 8 is injected. The container 7 is mounted in accordance with the insertion range of the protrusion 5 a of the movable heat sink 5, that is, the mounting component 1.
Opening 6a of projection 5a that can be changed according to the shape of 0
It is formed of an elastic body (for example, silicon rubber or the like) that can be deformed in accordance with the state of entry into the device.

Therefore, by injecting the viscous substance 8 into the container 7, the protrusion 5a protruding into the opening 6a is pressed against the backboard 2, so that the protrusions 5b to 5e of the movable heat sink 5 are connected to the guide plate. The movable heat sink 5 moves while being guided by the guide grooves 9a of the reference numeral 9.

As a result, the movable heat sink 5 is fixed while the heat conducting member 4 is pressed against the mounting component 10. At this time, the pressure between each heat conductive member 4 and the mounting component 10 on each plug-in package 3 becomes equal.

As described above, the plug-in package 3 is mounted on the back board 2 of the housing 1 and the container 7 attached to the bracket 6 provided opposite the back board 2 with the plug-in package 3 interposed therebetween. By injecting the viscous substance 8 and pushing the movable heat sink 5 toward the backboard 2, the movable heat sink 5 is slid.
The pressure between the heat conducting member 4 and the mounting component 10 on each plug-in package 3 which is pressed by the movable heat sink 5 against the mounting component 10 of each plug-in package 3 having a different component mounting height is different. Be even.

With the above structure, it is possible to bring the heat conducting member 4 of each movable heat sink 5 into contact with each plug-in package 3 having a different component mounting height at a uniform pressure, and to obtain a sufficient cooling structure. Can be.

By adopting a structure in which a viscous substance 8 having a low thermal resistance and a viscous substance is injected into the container 7 attached to the bracket 6, the bracket 6 itself also functions as a heat sink, thereby further improving the cooling efficiency. Can be achieved. In this case, it is not necessary to manufacture a different heat sink for each plug-in package 3, and cost reduction can be achieved.

[0023]

As described above, according to the present invention, in a cooling structure for an electronic device housing in which a plurality of packages are detachably plugged in, a plurality of movable heat sinks pressed against a heat-generating portion of the package are provided. And a plurality of movable heat sinks are pressed against the heat-generating portions of each of the plurality of packages by the pressure of the viscous substance, thereby improving cooling efficiency and reducing costs. This has the effect.

[Brief description of the drawings]

FIG. 1 is a perspective view of a cooling structure according to an embodiment of the present invention.

FIG. 2 is a sectional view of a cooling structure according to an embodiment of the present invention.

FIG. 3 is a perspective view of a cooling structure according to a conventional example.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Housing 2 Backboard 3 Plug-in package 4 Heat conduction member 5 Movable heat sink 5a-5e Projection 6 Bracket 6a Opening 7 Container 8 Viscous substance 9 Guide plate 9a Guide groove 10 Mounting parts

Claims (6)

(57) [Claims] 1. A cooling structure for an electronic device housing in which a plurality of packages are detachably plugged in, wherein the plurality of packages are arranged corresponding to the plurality of packages and are pressed against a heat-generating portion of the package. A cooling structure, comprising: a movable heat sink; and a pressing member that presses the plurality of movable heat sinks against heat generating portions of the plurality of packages by a pressure of a viscous substance. 2. The cooling structure according to claim 1, wherein the pressing member includes an insulating container that stores the viscous substance and is deformed according to a moving amount of each of the plurality of movable heat sinks. . 3. A heat conducting member disposed between a heat-generating portion of the package and the movable heat sink corresponding to the heat-generating portion, the heat-conducting member being deformed according to the shape of the heat-generating portion. The cooling structure according to claim 2. 4. A cooling structure for an electronic device housing in which a plurality of packages are detachably mounted on a backboard and plugged in, wherein a plurality of packages are provided corresponding to each of the plurality of packages, and heat generation of the packages is performed. A plurality of movable heat sinks pressed against a portion of the plurality of packages; and a plurality of movable heat sinks provided opposite to the backboard with the package interposed therebetween and pressing the plurality of movable heat sinks against the heat-generating portions of the plurality of packages by the pressure of a viscous substance. A cooling structure comprising a member. 5. The cooling structure according to claim 4, wherein said pressing member includes an insulating container which stores said viscous substance and is deformed according to a movement amount of each of said plurality of movable heat sinks. . 6. A heat conductive member disposed between a heat-generating portion of the package and the movable heat sink corresponding to the heat-generating portion and deformable according to the shape of the heat-generating portion. The cooling structure according to claim 5.