JP3022725B2 - Optical semiconductor module - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an optical semiconductor module used for optical communication equipment or optical measuring equipment.

[0002]

2. Description of the Related Art Conventionally, an optical semiconductor module used for an optical communication device or an optical measuring device is an optical semiconductor module using a confocal lens system, for example, as disclosed in Japanese Patent Laid-Open No. 3-149.
No. 510, "Semiconductor Laser Optical Fiber Coupling Apparatus and Manufacturing Method Thereof" (Conventional Example 1) and Japanese Patent Application Laid-Open No. 5-121841, "Semiconductor Laser Module" (Conventional Example 2).

[0003] As shown in FIG. 8, the optical semiconductor module of Conventional Example 1 is schematically configured to include a semiconductor laser collimator package 70 and an optical fiber collimator 71. The semiconductor laser collimator package 70 includes a semiconductor laser package 76 including a stem 72, a metal pedestal 73, a cap with a window 74, and a semiconductor laser (hereinafter, referred to as an LD) 75, and a semiconductor laser package 76 closest to the semiconductor laser 75. One lens 77 is provided. The optical fiber collimator 71 holds the single mode optical fiber 78 and the lens system 79 after the second lens in the same metal sleeve 80 in such a positional relationship that the incident parallel light is focused on the end of the single mode optical fiber. Have been.

In this optical semiconductor module, the first lens 77 is fixed by an adhesive at a position where the light emitted from the semiconductor laser 75 is converted into a parallel beam, and either the semiconductor laser package 76 or the optical fiber collimator 71 is fixed. For one, so that their optical axes coincide,
After simultaneously adjusting the four axes of the X and Y directions orthogonal to the optical axis and the tilt angles θ and φ of the optical axis, the semiconductor laser collimator package 70 and the optical fiber collimator 71 are opposed to each other. The stem 72 is fixed to the metal sleeve 80 directly by soldering or YAG laser welding at a position where the optical axes coincide with each other.

[0005] As shown in FIG. 9, the optical semiconductor module of Conventional Example 2 has a stem 82 in which a semiconductor laser element (LD) 81 is housed, a thick cap 84 in which a microlens 83 is mounted, and a spherical lens 85. And a spherical lens holding lens barrel 87 holding a fiber ferrule 86.

In this optical semiconductor module, X.X. After adjusting the Y axis and adjusting the position between the lens barrel 87 and the ferrule 86 by adjusting the Z axis,
Two portions between the lens barrel 87 and the thick cap 84 and between the lens barrel 87 and the ferrule 86 are fixed by spot welding.

A two-wavelength compatible optical semiconductor module for coupling outgoing light from two optical semiconductor elements to one optical fiber is disclosed in Japanese Unexamined Patent Application Publication No. 3-129306, entitled "Optical Coupler and Method of Manufacturing the Same". Example 3).

As shown in FIG. 10, the optical semiconductor module of the prior art 3 has two sets of element packages 88 and 89.
And one polarizing element 91 fixed in the casing 90
And a casing 90 facing the emission side surface of the polarizing element 91.
And a single optical fiber 92 fixed to the wall surface. Each element package 88, 89 has one lens 93 and 1 in a package body 88a, 89a.
With two LDs 94 incorporated therein, and a casing 90 facing two incident side surfaces orthogonal to each other of the polarizing element 91.
The package body 88a,
Reference surface 95 formed at one end of 89a is fixed by welding. Each LD 94 is fixed to the other ends of the package bodies 88a and 89a via the stem 96 by welding so that each active layer coincides with the optical axis of the lens 93.

In this optical semiconductor module, while the reference surfaces 95 of the element packages 88 and 89 are kept in close contact with the casing 90, the element packages 88 and 89 are placed in an X.X. After adjusting in such a manner that the optical coupling state between the LD 94 and the optical fiber 92 is maximized by moving in the Y direction, the element packages 88 and 89 are fixedly fixed to the casing 90 by welding. The element package 88,
Adjustment of the position of the optical fiber 89 and the optical fiber 92 in the optical axis direction (Z direction) is performed by the element packages 88 and 89 and the polarizing element 9.
1 is performed by changing the thickness of the glass plate 97 of the transparent member disposed between the first and second glass plates.

[0010]

As described above, in order to fix the collimators to each other, in the configuration of the conventional example 1, the stem 72 of the LD 75 is directly soldered to the metal sleeve 80 holding the lens 79 and the optical fiber 78. Alternatively, it is fixed by YAG laser welding, and in the configuration of Conventional Example 2, between the lens barrel 87 and the thick cap 84 and between the lens barrel 87 and the ferrule 86.
Are welded at two places. Also in the configuration of the third conventional example, the space between the stem 96 for holding the LD 94 and the package bodies 88a and 89a and the package body 88
a, 89a and the casing 90 are welded, and in any of the conventional configurations, it is very difficult to replace or add an LD or replace a fiber.

In addition, since the position of the beam spot is usually different for each package in the element package to be used, there is variation. Therefore, particularly in the configuration of the conventional example 3, when the light from the LD 94 is obliquely emitted, the glass plate 97 When the position adjustment in the Z direction is performed by changing the thickness of the beam spot, the position of the beam spot shifts on the XY plane, and the X and Y directions need to be adjusted again.

When the above-described optical semiconductor module is used in an optical communication device, the wavelength of the optical communication module is set to 1.31 μm only or to both 1.31 μm and 1.55 μm depending on the target communication system. Variations are required. In addition, when used in an optical measurement device, the measurement wavelength is changed (for example, 1.3, 1.31 μm, etc.) or added (for example, 1.31 + 1.55 μm, etc.), and furthermore, the light is changed according to the user's request. Fiber type (SMF: DSF, PANDA, etc.
(For GI fiber, 50/125, 62.5 / 125, etc.)
Various modifications are required, such as changes in Moreover, the remodeling work itself is required with a very short delivery time. And, for this short delivery time, a method such as storage of the optical semiconductor module is required.

However, in the configuration of the optical semiconductor module of the above-described conventional examples 1 and 2, when the optical axis of the LD collimator and the fiber collimator is adjusted, the fixing of the LD collimator is performed by the portions of the stems 72 and 82 of the LDs 75 and 81. Since it is performed directly by soldering or YAG welding,
Without special tools, disassembly was difficult and reassembly was also very difficult. Further, in order to reuse the removed parts, it is essential to make corrections such as removing solder completely. In the worst case, the parts may be damaged and become unusable. This also means that LD
The same problem also occurs in the configuration of the optical semiconductor module of Conventional Example 3 in which the stem 96 of 94 and the element packages 88 and 89 are fixed by welding.

Therefore, in the above-mentioned conventional optical semiconductor module configuration, each type of module must be stored as a finished product or assembled after an order is received. In addition, when the measuring instrument has variations of one wavelength and two wavelengths, it is very difficult to determine at what ratio the one-wavelength module and the two-wavelength module are stored. Further, since the LD collimator and the fiber collimator are expensive, it is desired that even if one component is damaged, only the damaged component is replaced by using the other component as it is. However, it was extremely difficult with the configuration of the conventional optical semiconductor module.

The light beam of a commonly used LD collimator has an inclination of about ± 3 ° with respect to the vertical direction of the stem due to the mounting accuracy of the LD chip. For this reason, the light is emitted obliquely from the LD collimator in a certain direction with respect to the optical axis. When an optical semiconductor module equipped with such an LD collimator is used for an SM fiber having a narrow allowable NA of incidence, a decrease in the coupling rate due to a shift in the mounting surface of the chip or a shift of the central axis between the lens and the chip. Therefore, the angle of the LD collimator needs to be adjusted.

However, in the module of the prior art 1, since the collimators are fixed to each other by soldering after the adjustment of the optical axis, even if the angle of the LD collimator can be adjusted before assembling the module, the above-mentioned exchange of the LD and the fiber is not required. The problem could not be solved. Further, in the modules of Conventional Example 2 and Conventional Example 3, since the fixing between the collimators and the fixing of the LD stem and the element package are performed by YAG welding, even if the angle of the LD collimator is adjusted, it is about 0.2 °. Therefore, it was not possible to perform a sufficient adjustment including the inclination ± 3 ° with respect to the vertical direction of the stem. Therefore, none of the conventional modules can solve all the problems described above.

Accordingly, the present invention has been made in view of the above problems, and an object of the present invention is to adjust the coupling ratio to a sufficient coupling ratio even if the angle of the light beam with respect to the surface of the stem in the optical semiconductor is inclined. It is an object of the present invention to provide an optical semiconductor module that can easily replace only a damaged component when an LD or a fiber is damaged, and can easily respond to a user's request for changing and adding a wavelength and a request for changing a fiber type.

[0018]

In order to achieve the above object, an optical semiconductor module according to the present invention comprises a lens 12 and a light source comprising a light emitting element or a light receiving element such that a light emitting surface or a light receiving surface is located at a focal position. An optical semiconductor collimator 3 in which a semiconductor 9 is integrated, a holder 5 to which the optical semiconductor collimator is removably attached, a lens 19, and an end surface at the focal point of the lens such that the center end of the core of the fiber is located at the focal position of the lens. A through hole 8 is formed between the fiber collimator 4 provided on the holder 21 having the mounting surface 21a and the opposing wall surfaces 2a and 2b, and the fiber collimator connects the through hole 8 through the mounting surface. The main body 1 is detachably attached to one desired wall surface, and fixing means 6 for fixing the holder 5 to the other wall surface where the through hole of the main body is desired. It is characterized by a door.

Further, in addition to the above-described structure, the through hole 8 is branched perpendicularly from the halfway position to another wall surface 28, and penetrates the other wall surface. The holder 5 is fixed by the fixing means 6, and optical semiconductor collimators 30, 38 in which the lens 12 and the optical semiconductor 9 are integrated are detachably attached to the holder. Optical couplers 35 and 39 composed of a multiplexer or a multiplexer / demultiplexer may be attached to a branch portion of the through hole connecting the fiber collimator 4.

Further, the optical semiconductor 9 may be provided detachably with respect to the holder 5.

[0021]

The optical semiconductor module according to the present invention is used as a one-wavelength module, and a fiber collimator 4 is detachably attached to one of the opposed wall surfaces 2b of the main body 1 in which the through holes 8 are formed. . Also, the other wall surface 2
The holder 5 for detachably holding the optical semiconductor collimator 3 in which the lens 12 and the optical semiconductor 9 are integrated is fixed to a by fixing means 6. When the optical axis is adjusted, for example, when a transmission module is configured, the fiber collimator 4 is fixed to one wall surface 2b of the main body 1, and the optical semiconductor 9 holds the optical semiconductor collimator 3 of the light emitting element to the holder 5.
And positioned on the other wall surface 2a of the main body 1. In this state, the holder 5 is fixed to the main body 1 by the fixing means 6 at a position where the optical semiconductor 9 emits light and the amount of light coupled to the fiber 18 is maximized. In addition, if the optical semiconductor 9 removes the optical semiconductor collimator 3 of the light emitting element from the holder 5 and replaces the optical semiconductor 9 with the optical semiconductor collimator of the light receiving element, a receiving module can be configured.

The optical semiconductor module according to the present invention is used as a single-wavelength or multi-wavelength module. The optical semiconductor collimator 3 is attached to and detached from the opposing wall surfaces 2a and 2b of the main body 1 in which the through holes 8 are formed. The holder 5 that can be held is fixed, and the fiber collimator 4 is detachably attached. The through-hole 8 branches off and penetrates to another wall surface 28 that is orthogonal to the halfway position, and the holder 5 is fixed to the other wall surface 28 that desires the branched through-hole 8 by the fixing means 6. 5 includes optical semiconductor collimators 30 and 38 in which the lens 12 and the optical semiconductor 9 are integrated.
Are detachably attached. Further, a branching portion of the through hole 8 connecting the optical semiconductor collimators 30 and 38 and the fiber collimator 4 has an optical coupling unit 3 composed of a multiplexer or a multiplexer / demultiplexer.
5, 39 are attached. As an optical semiconductor collimator to be attached to and detached from the holder 5, if an optical semiconductor is a combination of an optical semiconductor collimator of a light emitting element and an optical semiconductor is an optical semiconductor collimator of a light receiving element, any one of a transmission module, a reception module, and a transmission / reception module Can be configured.

The optical semiconductor collimators 3 and 3
The optical semiconductors 9 at 0 and 38 can be attached to and detached from the holder 5, and even when the holder 5 is fixed to the main body 1, the optical semiconductors 9 can be replaced by replacing the optical semiconductor collimators 3, 30, and 38.
The selection of the light emitting element or the light receiving element and the change of the wavelength can be performed quickly.

[0024]

DESCRIPTION OF THE PREFERRED EMBODIMENTS The optical semiconductor module of each embodiment described below is used particularly for a module for an SM fiber.

FIG. 1A is a partial sectional front view showing a first embodiment of an optical semiconductor module according to the present invention, and FIG.
2 is a left side view of the module, and FIG. 2C is a right side view of the module.

The optical semiconductor module of the first embodiment is
An optical semiconductor collimator 3 and a fiber collimator 4 are provided on a side wall surface 2 in the longitudinal direction of a main body 1 formed in a box shape and used as a one-wavelength module. More specifically, the optical semiconductor collimator 3
The fiber collimator 4 is detachably attached to the right side wall 2b of the main body 1 via a holder 5, fixed to the left side wall 2a of the main body 1 by a fixing means 6 such as solder, adhesive, or welding (for example, YAG welding). Have been. This configuration can be applied to a third embodiment and a fourth embodiment described later.

In FIG. 1A, the left side wall 2 of the main body 1 is shown.
A fixed projection 7 having an opening 7a is formed at a center of the projection a so as to project a predetermined length in a longitudinal direction orthogonal to the side wall surface 2a. After adjusting the optical axis between the optical semiconductor collimator 3 and the fiber collimator 4, the holder 5 on which the optical semiconductor collimator 3 is mounted is provided on the end face of the opening 7 a of the fixed projection 7.
Are fixed by fixing means 6. The opening 7a
Has a cavity hole 8 having a diameter smaller than the diameter of the opening 7a.
b. At two locations above and below the right side wall 2b of the main body 1, mounting screw holes 10 are formed in a predetermined length in the longitudinal direction, and the fiber collimator 4 is detachably fixed to the main body 1 in the mounting screw holes 10. Screw 11 is screwed.

As will be described later, when the optical semiconductor 9 of the optical semiconductor collimator 3 is constituted by an LD, light from the LD passes through the cavity 8 to the fiber collimator 4 side, and Is constituted by PD or APD, light from the fiber collimator 4 passes through the cavity 8 and is guided to the PD or APD.

The optical semiconductor collimator 3 is formed by integrating an optical semiconductor 9 and a lens 12. Optical semiconductor 9
Is composed of an LD which is a light emitting element when used as a transmitting module, and is a PD (Photodiode) or an APD (Aval) which is a light receiving element when used as a receiving module.
anche Photodiode). On the optical axis of the optical semiconductor 9, at the center of the surface of the cap 9a, a sleeve 13 in which the lens 12 is fitted is fixed.

The holder 5 has an inner opening 14 formed in the same shape as the fixed projection 7 of the main body 1. The inner opening 14 is provided with the stem 9 of the optical semiconductor 9 formed in the center.
It communicates with an outer opening 16 having a smaller diameter than the inner opening 14 via a stepped fitting portion 15 for holding a. A screw portion 17 a is formed on the inner wall surface of the outer opening 16. The screw portion 17 a is provided with a holding member 17 for pressing the bottom surface of the stem 9 a in a direction in which the optical semiconductor 9 fits into the fitting portion 15. The screw portion 17a is screwed. As a result, the optical semiconductor collimator 3 is positioned and fixed to the holder 5 with the outer periphery and the surface of the stem 9 a of the optical semiconductor 9 fitted to the fitting portion 15. Also, holder 5
Is a plane (X-axis) orthogonal to the optical axis direction (Z-axis) of the optical semiconductor 9 between the fiber 18 of the fiber collimator 4 and the optical axis.
After the adjustment of (−Y plane) and the angle adjustment in the tilt direction with respect to the optical axis are performed, the end face of the inner opening 14 is fixed to the end face of the opening 7 a of the fixing projection 7 in the main body 1 by the fixing means 6. You.

The fiber collimator 4 has a sleeve 20 such that the optical axis of the fiber 18 coincides with the optical axis of the rod lens 19, and the center of the fiber end face 18a is located at the focal point of the rod lens 19. The rod lens 19 is inserted into one end of the inside, and the fiber end face 1 is inserted into the other end.
8a is inserted. This fiber collimator 4
With the sleeve 20 housed in the cavity 8, the main body 1
And has a rectangular plate-like flange portion (holder) 21 which is detachably fixed to the device. The inner surface of the flange portion 21 forms a mounting surface (reference surface) 21a that comes into contact with the right wall surface 2b of the main body 1 in parallel. In addition, the flange 2
At two upper and lower positions of 1, a loose insertion hole 22 having a diameter larger than that of the screw 11 screwed into the mounting screw hole 10 of the main body 1 is formed. The fiber collimator 4 is configured such that the screw 11 is screwed into the mounting screw hole 10 of the main body 1 until the mounting surface 21a of the flange portion 21 contacts the right wall surface 2b of the main body 1.
Fixed to

FIG. 2A to be described next is a partially sectional front view showing a second embodiment of the optical semiconductor module according to the present invention, and FIG. 2B is a left side view of the module. (C) is a right side view of the module. The same components as those in the first embodiment are denoted by the same reference numerals, and description thereof is omitted.

The optical semiconductor module of the second embodiment is
In the first embodiment, the optical semiconductor collimator 3 is
In addition to the configuration in which the holder 5 is detachably attached to the main body 1, the holder 5 is fixed to a connecting member 23 that is detachable from the main body 1.

That is, in this embodiment, the fixing projection 7 of the main body 1 in the first embodiment is omitted, and a cylindrical connecting member 23 is detachably fixed to the center of the left side wall 2a of the main body 1. The fixing screw hole 24 communicates with the cavity hole 8 and has a predetermined length in the longitudinal direction orthogonal to the side wall surface 2a. The connecting member 23 has a small-diameter inner opening 25 that penetrates in the axial direction and communicates with the cavity 8 of the main body 1 and a large-diameter outer opening 26 that accommodates the sleeve 13 of the optical semiconductor collimator 3. Have been. At the outer periphery of the distal end of the connecting member 23, a screw portion 23a screwed into the fixing screw hole 24 of the main body 1 is provided.
Are formed. A flange portion 27 having a larger diameter than the screw portion 23a is integrally formed at a central portion of the outer periphery of the connecting member 23, and an inner surface of the flange portion 27 has a mounting surface (in parallel with the left wall surface 2a of the main body 1). Reference surface 27a is formed. The end surface of the outer opening 26 of the connecting member 23 has an optical axis direction (Z axis) of the optical semiconductor 9 between the fiber 18 and the fiber 18 of the fiber collimator 4 and a plane (XY plane) orthogonal to the optical axis. The end face of the inner opening 14 of the holder 5 after the adjustment and the angle adjustment in the tilt direction with respect to the optical axis are fixed by the fixing means 6.

Next, FIG. 3A is a front view of a partial cross section showing a third embodiment of the optical semiconductor module according to the present invention, FIG. 3B is a left side view of the module, and FIG. Is a right side view of the module. Note that the same components as those of the second embodiment are denoted by the same reference numerals, and description thereof is omitted.

The optical semiconductor module of the third embodiment is
It is used as a one-wavelength or two-wavelength module. In the second embodiment described above, the cavity 8 branches off at the center and penetrates the bottom wall 28, and is located on the same optical axis as the fiber collimator 4. The provided optical semiconductor collimator 3 is used as a first optical semiconductor collimator, and a bottom wall 2 orthogonal to the first optical semiconductor collimator 3 is provided.
The second connecting member 29 is detachably attached to the cavity 8 at the center of the center 8, and the second optical semiconductor collimator 30 is detachably attached to the holder 5 fixed to the second connecting member 29. .

That is, in this embodiment, at the center of the bottom wall surface 28 of the main body 1, a fixing screw hole 31 for detachably fixing the second connecting member 29 is communicated with the cavity hole 8 and the side wall surface. A predetermined length is formed in a longitudinal direction orthogonal to 2a.

Then, the second optical semiconductor collimator 30
The outer periphery and the surface of the stem 9 a of the optical semiconductor 9
By screwing the screw portion 17a of the holding member 17 into the screw portion 17a of the outer opening portion 16 in a state fitted to
The bottom surface of the stem 9 a is pressed against the fitting portion 15 and positioned and fixed to the holder 5. In addition, a plane (X-Z) perpendicular to the optical axis direction (Z axis) of the optical semiconductor 9 and the optical axis between the fiber 18 of the fiber collimator 4 is provided on the end face of the outer opening 26 of the second connecting member 29. The end surface of the inner opening 14 of the holder 5 after the adjustment of the plane (plane) and the angle adjustment in the tilt direction with respect to the optical axis are fixed by the fixing means 6.

On the front side of the main body 1, a cover member 32 is detachably attached. This cover member 32
Screws 34 are attached at two oblique positions on the front wall surface 33 of the main body 1 located symmetrically. Further, a branch portion of the cavity 8 to which the second connecting member 29 is attached, that is,
The axis intersection between the first optical semiconductor collimator 3 and the second optical semiconductor collimator 30 in the cavity 8 is constituted by a multiplexer such as a dichroic mirror or a multiplexer / demultiplexer such as a half mirror. The optical coupling unit 35 is provided detachably.
The optical coupling section 35 is configured to be fixable from the front side of the main body 1 in a state where the cover member 32 is removed, and the optical coupling section 35 couples light between the optical semiconductor collimators 3 and 30 and the fiber collimator 4. It is splitting.

When the optical semiconductor module of this embodiment is used as a one-wavelength module, the cavity 8
A cover member (not shown) is attached so as to cover.

The optical semiconductor module of the third embodiment is
For example, it is optimally used as a light emitting / receiving module of an optical pulse tester having the configuration shown in FIG. The optical pulse tester in this figure includes a timing generator 50, a light emitter 51, a directional coupler 52, a light receiver 53, an amplifier 54, an A / D converter 55, a waveform processor 56, and a display 57. Have been. In this optical pulse tester, the timing generator 5
An optical pulse is emitted from the light emitting section 51 to the fiber under measurement 58 based on the timing signal generated at 0, and the backscattered light and Fresnel reflected light reflected from the fiber under measurement 58 are transmitted through the directional coupler 52. A light is received by the light receiving unit 53 and the received light is amplified by the amplifier 54 and then A / A
The D converter 55 samples the data at each measurement point at a predetermined sampling period, performs waveform processing on the sampled data by the waveform processing unit 56, displays the processed data on the display unit 57, and performs measurement of the loss of the measured fiber 58, searching for a break point, and the like. Is going.

Then, for the optical pulse tester thus configured, the light emitting unit 51 is the first optical semiconductor collimator 3 using LD, and the light receiving unit 53 is the second optical semiconductor collimator 30 using PD or APD. By using the directional coupler 52 as the optical coupling unit 35 using a multiplexer / demultiplexer, the portion indicated by the one-dot chain line in the figure can be constituted by one module.

FIG. 5 is a front view, partially in section, showing a fourth embodiment of the optical semiconductor module according to the present invention. The same components as those in the first to third embodiments include:
The same reference numerals are given and the description is omitted.

The optical semiconductor module of the fourth embodiment is
In the third embodiment described above, the main body 1 is extended in the longitudinal direction, and the cavity hole 8 branches off at two places on the left and right and penetrates the bottom wall surface 28. A fixed screw hole 36 is formed in the cavity hole 8 on the right side in a predetermined length so as to communicate with the longitudinal direction orthogonal to the side wall surface 2a. A third connecting member 37 is detachably attached to the right cavity hole 8 in parallel with the second connecting member 29 detachably provided in the left cavity hole 8 of the bottom wall surface 28 of the main body 1. Is provided. A third optical semiconductor collimator 38 is detachably provided on the holder 5 fixed to the third connecting member 37.

Similarly to the second optical semiconductor collimator 30, the third optical semiconductor collimator 38 has a screw 9 of the holding member 17 with the outer periphery and the surface of the stem 9a of the optical semiconductor 9 fitted to the fitting portion 15. By screwing the portion 17a into the screw portion 17a of the outer opening 16, the bottom surface of the stem 9a is pressed against the fitting portion 15 and is positioned and fixed to the holder 5. On the end face of the outer opening 26 of the third connecting member 37,
A plane (X-Z) orthogonal to the optical axis direction (Z axis) of the optical semiconductor 9 and the optical axis between the fiber 18 of the fiber collimator 4 and the optical semiconductor 9.
The end surface of the inner opening 14 of the holder 5 in which the adjustment of the plane) and the adjustment of the angle in the inclination direction with respect to the optical axis are performed by the fixing means 6.
Is fixed by The third optical semiconductor collimator 3
At a branch portion of the cavity 8 where the hole 8 is mounted, an optical coupling portion 39 composed of a multiplexer such as a dichroic mirror or a multiplexer / demultiplexer such as a half mirror is detachably provided.

The optical semiconductor module of the fourth embodiment is
For example, it is optimally used as a light emitting / receiving module of an optical pulse tester having the configuration shown in FIG. That is, the optical pulse tester in this figure enters light of two different wavelengths into the measured optical fiber 58 and receives light reflected from the measured optical fiber 58 with the incidence of light of each wavelength. I have. Therefore, in addition to the configuration of the optical pulse tester of FIG. 4, a second light emitting section 59 and a second directional coupler 60 are provided.

Then, for the optical pulse tester configured as described above, the first light emitting unit 51 and the second light emitting unit 59 are respectively connected to the first optical semiconductor collimator 3 and the second optical semiconductor collimator 30 using LDs. The light receiving unit 53 is a third optical semiconductor collimator 38 by PD or APD, the first directional coupler 52 is an optical coupling unit 35 by a multiplexer, and the second directional coupler 60 is a duplexer. Optical coupling part 3
By setting it to 9, the portion indicated by the one-dot chain line in the figure can be constituted by one module.

Next, a method of adjusting the optical axis of the optical semiconductor module configured as described above will be described. First, in the case of a one-wavelength module, the fiber collimator 4 is fixed to the main body 1 (ST1). Also, the optical semiconductor 9 is fixed to the holder 5 by using the optical semiconductor 9 as an LD (ST).
2). When the optical semiconductor module of FIG. 3 or FIG. 5 is used, unnecessary second optical semiconductor collimator 30 and third optical semiconductor collimator 38 including holder 5 are removed from main body 1 and, instead, the cover is replaced. Attach the members. Further, the optical coupling portions 35 and 39 are detached from the main body 1. In this state, in the configuration of FIG. 1, the optical semiconductor 9 emits light, and the holder 5 on which the optical semiconductor collimator 3 is attached is finely moved in the XYZ axes and the tilt direction of the optical axis.
The holder 5 is fixed to the main body 1 at a position where the amount of light coupled to the fiber 18 becomes maximum (ST3). In the configuration using the connecting member 22 as shown in FIG. 2, after connecting the connecting member 22 to the main body 1 in advance and adjusting the optical axis,
The holder 5 is fixed to the connecting member 22.

Next, in the case of a two-wavelength module, FIG.
Alternatively, the optical semiconductor module of FIG. 5 is used. When the optical semiconductor module shown in FIG. 5 is used, the unnecessary third optical semiconductor collimator 38 including the holder 5 and the
The coupling member 37 is removed together with the cover member, and the optical coupling unit 39 is removed from the main body 1 instead. First, the multiplexer as the optical coupling unit 35 is fixed to the main body 1 (ST4), and then the fiber collimator 4 is fixed to the main body 1 (ST5). Further, the first optical semiconductor collimator 3 and the second optical semiconductor collimator 30 are respectively fixed to the holder 5 (ST6). In this state, the optical semiconductor 9 is caused to emit light, and the holder 5 on which the first optical semiconductor collimator 3 is attached is finely moved in the XYZ axes and the tilt direction of the optical axis, so that the amount of light coupled to the fiber 15 is maximized. The holder 5 is fixed to the main body 1 at a predetermined position (ST7). Similarly, the optical semiconductor 9 is caused to emit light, and the holder 5 on which the second optical semiconductor collimator 30 is mounted is finely moved in the XYZ axes and the tilt direction of the optical axis, so that the amount of light coupled to the fiber 15 is maximized. The holder 5 is fixed to the main body 1 at the position (ST8). In the configuration using the connecting members 23 and 29, the main body 1
After the connecting members 23 and 29 are attached to the optical semiconductor collimators 3 and 30, the optical axis is adjusted for each of the optical semiconductor collimators 3 and 30, and then the holder 5 is fixed to the corresponding connecting members 23 and 29. Note that the wavelength is also changed according to the above-described procedure.

Next, when adding a wavelength, in the configuration of this embodiment, the optical semiconductor collimators 3, 30, and 38
, Or fixed to the connecting members 23, 29, 37 detachable from the main body 1 via the holder 5, it is not easy to readjust the optical axis. For this reason, when there is a possibility of adding a wavelength, the optical coupling unit 35 is added to the main body 1 in advance.
The one-wavelength module is assembled in a state where the multiplexer is fixed, and when the wavelength is added, re-optical axis adjustment of the first optical semiconductor collimator 3 becomes unnecessary. Alternatively, when assembling as a two-wavelength module from the beginning to form a one-wavelength module, the second optical semiconductor collimator 30 may be removed to cope with the situation. In this case, the removed optical semiconductor collimator 30 can be reused.

Further, when the transmission / reception module is configured after the above wavelength addition, the optical semiconductor module of FIG. 5 is used, and the cover member is removed from the main body 1.
A multiplexer / demultiplexer is fixed to the main body 1 as the optical coupling section 39 (ST
9). In this state, in order to readjust light shifted by the thickness of the multiplexer / demultiplexer, the optical semiconductor 9 of the optical semiconductor collimators 3 and 30 is caused to emit light, and the first and second optical semiconductor collimators 3 and 30 are emitted.
The holder 5 on which 30 is attached is finely moved in the inclination directions of the XYZ axes and the optical axis, and the holder 5 is fixed to the main body 1 at a position where the amount of light coupled to the fiber 18 is maximized (ST10). In the configuration using the connecting members 23, 29, and 37, the connecting members 23, 29, and 37 are attached to the main body 1 in advance, and the optical axis is adjusted.
The holder 5 is fixed to 3, 29, 37.

Therefore, according to the above-described embodiments, the optical semiconductor collimators 3, 30, and 38 and the fiber collimator 4 are each modularized, and the optical semiconductor collimators 3, 30, and 38 are fixed to the main body 1 or the holder 5 or Since the fiber collimator 4 can be attached to and detached from the holder 5 that is fixed to the connecting members 23, 29, and 37 that can be attached to and detached from the body 1, and the fiber collimator 4 can be attached to and detached from the body 1, fiber breakage and abnormal light emission in the LD may occur. Even if it occurs, replacement of the optical semiconductor or the fiber can be easily performed, and waste of replacement parts can be prevented.

In each of the embodiments, the angle adjustment of the optical semiconductor collimators 3, 30, and 38 in the direction of inclination of the optical axis can be performed between the main body 1 and the holder 5 or the connecting member 23 detachable from the main body 1.
Since it can be performed between the holder 29 and the holder 5, even if the light emitting surface or the light receiving surface of the optical semiconductor 9 in the optical semiconductor collimators 3, 30, 38 is inclined in the vertical direction with respect to the surface of the stem, the light can be accurately reflected. A sufficient coupling ratio can be obtained by adjusting the axis.

According to the optical semiconductor modules of the first embodiment and the second embodiment, even if the main body 1 and the fiber collimator 4 have the same shape, if the optical semiconductor 9 is an LD, it becomes a transmission module, and the optical semiconductor 9 Can be configured as a receiving module by using PD or APD.

According to the optical semiconductor modules of the third and fourth embodiments, by attaching the second optical semiconductor collimator 30 and the optical coupling portions 35 and 39 to the main body 1, the optical semiconductor module of one wavelength can be obtained. Therefore, it can be easily changed to an optical semiconductor module having two wavelengths. Also, the first
If one LD and one PD (or APD) are used as the optical semiconductors 9 of the second optical semiconductor collimators 3 and 30, and if the multiplexer / demultiplexer is used as the optical coupling unit 35 instead of the multiplexer, transmission / reception is achieved. The module can be easily configured, and can be used for various applications such as various measuring instruments typified by an optical pulse tester and communication equipment.

Further, according to the optical semiconductor modules of the second to fourth embodiments, the optical semiconductor collimators 3, 3
Since the holders 0 and 38 can be attached to and detached from the holder 5 fixed to the main body 1 via the fixing means 6, even when the holder 5 is attached to the main body 1, selection of the light emitting element or the light receiving element can be performed by exchanging only the collimator. The wavelength can be changed quickly.

In the above-described embodiment, a configuration including one fiber collimator 4 and up to three optical semiconductor collimators 3, 30, and 38 has been described. It may be configured to be attached to the connecting members 23, 29, and 37 which can be attached and detached via the holder 5. In this case, it is provided in the cavity hole 8 of the main body 1 on the same optical axis as the fiber collimator 4, and the cavity holes 8 are branched by the number of the remaining optical semiconductor collimators and penetrated from the wall surface of the main body 1, and each cavity A multiplexer or a multiplexer / demultiplexer is detachably attached to the branch portion of the hole 8.

In each of the above-described embodiments, the optical semiconductor collimators 3, 30, and 38 are fixed to the main body 1 via the holder 5, or the connecting members 23, 2 that can be attached to and detached from the main body 1.
Although it was configured to be fixed to 9, 37 via the holder 5,
This configuration may be applied to the fiber collimator 4 so that, for example, the optical semiconductor collimator 3 can be attached to and detached from the main body 1 so as to be finely movable on a plane (XY plane) orthogonal to the optical axis direction. At the time of adjusting the optical axis in this case, the optical semiconductor 9 is caused to emit light with the optical semiconductor collimator 3 fixed to the main body 1 and the holder 5 on which the fiber collimator 4 is mounted is moved in the XYZ axis and the tilt direction of the optical axis. The holder 5 is finely moved, and the holder 5 is fixed to the wall surface of the main body 1 by the fixing means 6 at a position where the amount of light coupled to the fiber 18 is maximized.

[0059]

As described above, according to the first aspect of the present invention,
According to the optical semiconductor modules of (1) to (3), the optical semiconductor collimator and the fiber collimator are each modularized, and the optical semiconductor collimator is detachable from a holder fixed to the main body via fixing means, and the fiber collimator is attached to the main body. With the detachable configuration, even if the fiber is broken or the light emitting element or the light receiving element becomes abnormal, the optical semiconductor or the fiber can be easily replaced, and waste of replacement parts can be prevented. Moreover, since the angle adjustment of the tilt direction of the optical axis of the optical semiconductor collimator can be performed between the main body or the fastening member and the holder, the light emitting surface or light receiving surface of the optical semiconductor in the optical semiconductor collimator is perpendicular to the surface of the stem. Even if it is tilted, the optical axis can be adjusted with high accuracy to obtain a sufficient coupling ratio. In addition, even if the main body and the fiber collimator have the same shape, the transmitting module can be formed by using the optical semiconductor as the light emitting element, and the receiving module can be configured by using the optical semiconductor as the light receiving element.

According to the optical semiconductor module of the second aspect,
The optical semiconductor module having one wavelength can be easily changed to the optical semiconductor module having two wavelengths. Further, if one light emitting element and one light receiving element are used as optical semiconductors of the optical semiconductor collimator, and a multiplexer / demultiplexer is used as an optical coupling unit, a transmission / reception module can be easily configured. And various applications such as various measuring instruments and communication devices.

According to the optical semiconductor module of the third aspect,
Since the optical semiconductor collimator can be attached to and detached from the holder attached to the main body, the selection of the light emitting element or the light receiving element and the change of the wavelength can be performed quickly by replacing only the collimator.

[Brief description of the drawings]

FIG. 1 (a) is a front view of a partial cross section showing a first embodiment of an optical semiconductor module of the present invention. (B) Right side view of the module. (C) Left side view of the module.

2A is a front view of a partial cross section showing a second embodiment of the optical semiconductor module, FIG. 2B is a right side view of the module, and FIG. 2C is a left side view of the module.

FIG. 3 (a) is a partial cross-sectional front view showing a third embodiment of the optical semiconductor module. (B) Right side view of the module. (C) Left side view of the module.

FIG. 4 is a block diagram showing a configuration example of an optical pulse tester to which the optical semiconductor module of the third embodiment is applied.

FIG. 5 is a plan sectional view showing a fourth embodiment of the optical semiconductor module.

FIG. 6 is a block diagram showing a configuration example of an optical pulse tester to which the optical semiconductor module of the fourth embodiment is applied.

FIG. 7 is a diagram showing a configuration of a conventional optical semiconductor module.

FIG. 8 is a diagram showing a configuration of a conventional optical semiconductor module.

FIG. 9 is a diagram showing a configuration of a conventional optical semiconductor module.

[Explanation of symbols]

DESCRIPTION OF SYMBOLS 1 ... Body, 2 ... Side wall surface, 3, 30, 38 ... Optical semiconductor collimator, 4 ... Fiber collimator, 5 ... Holder, 6 ... Fixing means, 9 ... Optical semiconductor, 12 ... Lens, 28 ... Bottom wall surface,
35, 39 ... optical coupling part.

──────────────────────────────────────────────────続 き Continuation of the front page (56) References JP-A-63-38907 (JP, A) JP-A-1-187509 (JP, A) JP-A-6-235847 (JP, A) 65705 (JP, U) Shokai Sho 59-112209 (JP, U) (58) Fields investigated (Int. Cl. ⁷ , DB name) G02B 6/42 G02B 6/32

Claims (3)

(57) [Claims] An optical semiconductor collimator (3) in which a lens (12) and an optical semiconductor (9) comprising a light emitting element or a light receiving element are integrated so that a light emitting surface or a light receiving surface is located at a focal position. A holder (5) to which the optical semiconductor collimator is detachably attached; a lens (19); and a fiber (1) arranged such that the end face of the center of the fiber core is located at the focal position of the lens.
And a fiber collimator (4) provided on a holder (21) having a mounting surface (21a), and a through hole (8) formed between opposed wall surfaces (2a, 2b). A main body (1) detachably attached to one wall surface of the main body through which the through hole is desired, and fixing means (6) for fixing the holder (5) to the other wall surface of the main body where the through hole is desired. An optical semiconductor module comprising: 2. The through hole (8) is orthogonal to the middle of the through hole and branches to another wall (28) to penetrate therethrough. The other wall where the through hole branches is provided with the holder. (5)
Are fixed by the fixing means (6), and optical semiconductor collimators (30, 38) in which the lens (12) and the optical semiconductor (9) are integrated are detachably attached to the holder, The optical semiconductor collimator and the fiber collimator (4)
The optical semiconductor module according to claim 1, wherein an optical coupling section (35, 39) formed of a multiplexer or a multiplexer / demultiplexer is attached to a branch portion of the through hole connecting the first and second through holes. 3. The optical semiconductor module according to claim 1, wherein the optical semiconductor (9) is provided detachably with respect to the holder (5).