JPH07306337A - Optical semiconductor module - Google Patents

Abstract

PURPOSE:To make a light beam possible to be adjusted to have a sufficient coupling rate even if this light beams inclines to the face of a stem of an optical semiconductor, to easily exchange only the damaged parts and to easily deal with a user's request for changing wavelengths and adding wavelengths and further a request for changing fiber kinds. CONSTITUTION:A fiber collimator 4 is attachably and detachably mounted on one opposite wall surfaces 2b of a main body 1 having a cavity hole 8 formed. A holder 5 for attachably and detachably holding an optical semiconductor collimator 3 integrated with a lens 12 and the optical semiconductor 9 is soldered to the other wall surface 2a. The adjustment of the optical axis is executed by fixing the fiber collimator 4 to the one wall surface 2b of the main body 1, mounting the optical semiconductor collimator 3, at the holder 5, allowing the optical semiconductor 9 to emit light in the state of positioning the collimator on the other wall surface 2b of the main body 1 and soldering the holder 5 to the main body 1 in the position where the quantity of the light coupled to the fiber 18 is maximized.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an optical semiconductor module used in optical communication equipment, optical measuring instruments and the like.

[0002]

2. Description of the Related Art Conventionally, as an optical semiconductor module used in an optical communication device or an optical measuring instrument, an optical semiconductor module using a confocal lens system is disclosed, for example, in Japanese Patent Laid-Open No. 3-149.
No. 510 “Semiconductor laser optical fiber coupling device and its manufacturing method” (conventional example 1) and JP-A-5-121841 “semiconductor laser module” (conventional example 2) are available.

As shown in FIG. 8, the optical semiconductor module of the conventional example 1 is roughly constructed by including a semiconductor laser collimator package 70 and an optical fiber collimator 71. The semiconductor laser collimator package 70 includes a semiconductor laser package 76 composed of a stem 72, a metal pedestal 73, a window cap 74, and a semiconductor laser (hereinafter referred to as LD) 75, and a semiconductor laser package fixed closest to the semiconductor laser 75. The lens 77 of No. 1 is provided. The optical fiber collimator 71 holds the single mode optical fiber 78 and the lens system 79 after the second lens in the same metal sleeve 80 in such a positional relationship that the incident parallel light is focused on the end of the single mode optical fiber. Has been done.

In this optical semiconductor module, the first lens 77 is fixed by an adhesive at a position where the light emitted from the semiconductor laser 75 is converted into a parallel beam, and either the semiconductor laser package 76 or the optical fiber collimator 71 is fixed. For one side, so that their optical axes match
After simultaneously adjusting the four axes of the X and Y directions orthogonal to each other in the plane perpendicular to the optical axis and the tilt angles θ and φ of the optical axis, the semiconductor laser collimator package 70 and the optical fiber collimator 71 are opposed to each other. The stem 72 is directly fixed to the metal sleeve 80 by soldering or YAG laser welding at a position where their optical axes coincide with each other.

As shown in FIG. 9, the optical semiconductor module of Conventional Example 2 has a stem 82 in which a semiconductor laser element (LD) 81 is housed, a thick cap 84 to which a microlens 83 is attached, and a spherical lens 85. And a spherical lens holding lens barrel 87 holding a fiber ferrule 86.

In this optical semiconductor module, an X.X.D. is provided between the lens barrel 87 and the thick cap 84. After adjusting the Y axis and adjusting the Z axis between the lens barrel 87 and the ferrule 86 to adjust the position,
The lens barrel 87 and the thick cap 84 are fixed by spot welding at two points between the lens barrel 87 and the ferrule 86.

As an optical semiconductor module compatible with two wavelengths, which combines light emitted from two optical semiconductor elements into one optical fiber, Japanese Patent Application Laid-Open No. 3-129306, "Optical Coupler and Manufacturing Method Therefor" (conventional method). There is an example 3).

As shown in FIG. 10, the optical semiconductor module of Conventional Example 3 has two sets of element packages 88 and 89.
And one polarization element 91 fixed in the casing 90.
And a casing 90 facing the exit side surface of the polarizing element 91.
And one optical fiber 92 fixed to the wall surface of the. Each of the device packages 88 and 89 includes one lens 93 and one lens in the package bodies 88a and 89a.
Two LDs 94 are incorporated, and the casing 90 faces two incident side surfaces of the polarizing element 91 which are orthogonal to each other.
Package body 88a, while being in close contact with the outer wall surface of
A reference surface 95 formed at one end of 89a is fixed by welding. Further, each LD 94 is fixed by welding to the other end of the package main bodies 88a, 89a via the stem 96 so that each active layer is aligned with the optical axis of the lens 93.

In this optical semiconductor module, the device packages 88 and 89 are arranged in the X. After adjusting the LD 94 and the optical fiber 92 to maximize the optical coupling state by moving in the Y direction, the element packages 88 and 89 are fixed to the casing 90 by welding. In addition, the element package 88,
The position adjustment of the optical fiber 89 and the optical fiber 92 with respect to the optical axis direction (Z direction) is performed by each device package 88, 89 and the polarization device 9.
The thickness of the glass plate 97, which is a transparent member arranged between the first and the second members, is changed.

[0010]

As described above, in order to fix the collimators to each other, in the configuration of the conventional example 1, the stem 72 of the LD 75 is directly soldered to the metal sleeve 80 holding the lens 79 and the optical fiber 78. Alternatively, they are fixed by YAG laser welding, and in the configuration of Conventional Example 2, between the lens barrel 87 and the thick cap 84 and between the lens barrel 87 and the ferrule 86.
Welded at two points between and. Also in the configuration of Conventional Example 3, the space between the stem 96 that holds the LD 94 and the package bodies 88a and 89a, and the package body 88.
Since welding is used between the a and 89a and the casing 90, it is very difficult to replace or add the LD or replace the fiber in any of the conventional configurations.

In the device package used, the position of the beam spot is usually different and varies from package to package. Therefore, particularly in the configuration of Conventional Example 3, when the light from the LD 94 is obliquely emitted, the glass plate 97 is used. If the plate thickness is changed to adjust the position in the Z direction, the position of the beam spot shifts on the XY plane, and there is a problem that the adjustment in the X and Y directions becomes necessary again.

By the way, when the above-mentioned optical semiconductor module is used in an optical communication device, the wavelength of the wavelength may be, for example, only 1.31 μm or both 1.31 μm and 1.55 μm depending on the target communication system. Variations are required. In addition to this, when it is used in an optical measuring instrument, the measurement wavelength can be changed (for example, 1.3, 1.31 μm, etc.) or added (for example, 1.31 + 1.55 μm, etc.) according to the user's request, and Fiber type (SMF, DSF, PANDA, etc.
(50/125, 62.5 / 125 etc. for GI fiber)
Various modifications such as changes to the above are required. Moreover, the remodeling work itself is required in a very short delivery time. In order to achieve this short delivery time, methods such as storage of optical semiconductor modules were necessary.

However, in the configurations of the optical semiconductor modules of the conventional example 1 and the conventional example 2 described above, when the optical axes of the LD collimator and the fiber collimator are adjusted, the LD collimator is fixed by the stems 72, 82 of the LDs 75, 81. Since it is done by direct soldering or YAG welding,
It was difficult to disassemble without special tools, and reassembly was also very difficult. Further, in order to reuse the removed parts, it is indispensable to correct them by removing the solder cleanly, and in the worst case, the parts may be damaged and become useless. In addition, this is LD
The same problem occurs in the structure of the optical semiconductor module of Conventional Example 3 in which the stem 96 of 94 and the element packages 88 and 89 are fixed by welding.

Therefore, in the above-described conventional optical semiconductor module configuration, each type of module must be stored as a finished product, or the module must be assembled after an order comes. Moreover, when the measuring instrument has variations of one wavelength and two wavelengths, it has been a very difficult problem to determine the ratio of storage of the one wavelength module and the two wavelength module. Further, since the LD collimator and the fiber collimator are expensive, it is desired that even if one component is damaged, other components are used as they are and only the damaged component is replaced. However, the conventional optical semiconductor module configuration has been extremely difficult.

The light beam of a generally used LD collimator has an inclination of about ± 3 ° with respect to the vertical direction of the stem due to the mounting accuracy of the LD chip. Therefore, the light is emitted obliquely from the LD collimator while being inclined in a certain direction with respect to the optical axis. When an optical semiconductor module including such an LD collimator is used for an SM fiber having a narrow NA of incidence, the coupling rate is lowered due to the displacement on the mounting surface of the chip and the displacement of the central axis between the lens and the chip. Therefore, it is necessary to adjust the angle of the LD collimator.

However, in the module of the conventional example 1, since the collimators are fixed by soldering after the adjustment of the optical axis, even if the angle of the LD collimator can be adjusted before the module is assembled, the above-mentioned LD and fiber replacement is concerned. I couldn't solve the problem. Further, in the modules of the conventional example 2 and the conventional example 3, since the collimators are fixed to each other and the LD stem and the element package are fixed by YAG welding, even if the angle of the LD collimator is adjusted, it is around 0.2 °. Therefore, it was impossible to perform sufficient adjustment including the inclination of the stem with respect to the vertical direction of ± 3 °. Therefore, none of the conventional modules can solve all the problems described above.

Therefore, the present invention has been made in view of the above problems, and an object thereof is to adjust a sufficient coupling rate even if the angle of a light beam with respect to the surface of a stem in an optical semiconductor is inclined. It is an object of the present invention to provide an optical semiconductor module which can easily replace only the damaged component when the LD or the fiber is damaged and can easily meet the user's wavelength change and wavelength addition requests, and further the fiber type change request.

[0018]

In order to achieve the above object, an optical semiconductor module according to the present invention is an optical semiconductor module including a lens 12 and a light emitting element or a light receiving element so that the light emitting surface or the light receiving surface is located at a focal position. An optical semiconductor collimator 3 in which a semiconductor 9 is integrated, a holder 5 to which the optical semiconductor collimator is detachably attached, a lens 19, and an optical fiber collimator 3 are arranged such that the end face of the core of the fiber is located at the focal position of the lens. A through hole 8 is formed between the fiber collimator 4 provided on the holder 21 having the mounting surface 21a and the facing wall surfaces 2a and 2b, and the fiber collimator is connected to the through hole through the mounting surface. A main body 1 detachably attached to one desired wall surface, and a fixing means 6 for fixing the holder 5 to the other wall surface of the main body in which the through hole is desired are provided. It is characterized by a door.

In addition to the above-mentioned structure, the through hole 8 is branched from the midway position thereof to another wall surface 28 so as to be orthogonal thereto, and the other wall surface where the through hole is branched has the above-mentioned structure. The holder 5 is fixed by the fixing means 6, and optical semiconductor collimators 30 and 38 in which the lens 12 and the optical semiconductor 9 are integrated are detachably attached to the holder. The optical coupling portions 35 and 39 formed of a multiplexer or a multiplexer / demultiplexer may be attached to the branch portion of the through hole connecting to the fiber collimator 4.

Further, the optical semiconductor 9 may be detachably attached to the holder 5.

[0021]

The optical semiconductor module of claim 1 is used as a one-wavelength module, and the fiber collimator 4 is removably attached to one wall surface 2b of the body 1 in which the through hole 8 is formed. . Also, the other wall 2
A holder 5 that detachably holds the optical semiconductor collimator 3 in which the lens 12 and the optical semiconductor 9 are integrated is fixed to a by fixing means 6. Then, for example, when the optical axis is adjusted when the transmission module is configured, the fiber collimator 4 is fixed to the one wall surface 2b of the main body 1, and the optical semiconductor 9 holds the optical semiconductor collimator 3 of the light emitting element in the holder 5.
It is attached to and is positioned on the other wall surface 2a of the main body 1. In this state, the optical semiconductor 9 is caused to emit light and the holder 5 is fixed to the main body 1 by the fixing means 6 at a position where the amount of light coupled to the fiber 18 becomes maximum. The optical semiconductor 9 is a light emitting element, and the optical semiconductor collimator 3 is removed from the holder 5, and the optical semiconductor 9 is replaced with an optical semiconductor collimator which is a light receiving element.

The optical semiconductor module of claim 2 is used as a one-wavelength or multi-wavelength module, and the optical semiconductor collimator 3 is attached to and detached from the opposing wall surfaces 2a and 2b of the main body 1 in which the through holes 8 are formed. The holder 5 that holds the fiber collimator 4 is fixed, and the fiber collimator 4 is detachably attached. The through hole 8 is branched and pierced into another wall surface 28 orthogonal to the midway position, and the holder 5 is fixed by the fixing means 6 to the other wall surface 28 that desires the branched through hole 8. 5 is an optical semiconductor collimator 30, 38 in which the lens 12 and the optical semiconductor 9 are integrated.
Is detachably attached. In addition, at the branch portion of the through hole 8 that connects the optical semiconductor collimators 30 and 38 and the fiber collimator 4, the optical coupling portion 3 formed of a multiplexer or a multiplexer / demultiplexer.
5, 39 are attached. Then, as an optical semiconductor collimator that is attached to and detached from the holder 5, if an optical semiconductor collimator in which an optical semiconductor is a light emitting element and an optical semiconductor collimator in which an optical semiconductor is a light receiving element are combined, any one of a transmitting module, a receiving module, and a transmitting / receiving module Can be configured.

Further, the above-mentioned optical semiconductor collimators 3 and 3
The optical semiconductors 9 at 0 and 38 can be attached to and detached from the holder 5, and even when the holder 5 is fixed to the main body 1, by exchanging the optical semiconductor collimators 3, 30, and 38,
It is possible to quickly select the light emitting element or the light receiving element and change the wavelength.

[0024]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS The optical semiconductor modules of the respective embodiments described below are particularly used for SM fiber modules.

FIG. 1 (a) is a partially sectional front view showing a first embodiment of an optical semiconductor module according to the present invention, and FIG. 1 (b).
Is a left side view of the module, and FIG. 7C is a right side view of the module.

The optical semiconductor module of the first embodiment is
It is used as a module for one wavelength, and an optical semiconductor collimator 3 and a fiber collimator 4 are provided to face each other on a longitudinal side wall surface 2 of a box-shaped main body 1. To explain further, the optical semiconductor collimator 3 is
It is fixed to the left side wall surface 2a of the main body 1 via a holder 5 by fixing means 6 such as solder, adhesive, and welding (for example, YAG welding), and the fiber collimator 4 is detachably attached to the right side wall surface 2b of the main body 1. Has been. This configuration can also be applied to the third and fourth embodiments described later.

In FIG. 1A, the left side wall surface 2 of the main body 1
A fixed projection 7 having an opening 7a is formed at the center of a so as to project by a predetermined length in the longitudinal direction orthogonal to the side wall surface 2a. At the end face of the opening 7a of the fixed protrusion 7, after the optical axis between the optical semiconductor collimator 3 and the fiber collimator 4 is adjusted, the holder 5 to which the optical semiconductor collimator 3 is attached is attached.
Are fixed by the fixing means 6. Also, the opening 7a
Has a cavity hole 8 having a diameter smaller than that of the opening 7a on the right side wall surface 2.
It is formed so as to penetrate b. Mounting screw holes 10 are formed in a predetermined length in the longitudinal direction at upper and lower portions of the right side wall surface 2b of the main body 1, and the fiber collimator 4 is detachably fixed to the main body 1 in the mounting screw holes 10. The screw 11 for screwing is screwed.

Then, as will be described later, when the optical semiconductor 9 of the optical semiconductor collimator 3 is composed of an LD, the light from the LD passes through the cavity 8 to the fiber collimator 4 side, and the optical semiconductor 9 Is composed of PD or APD, the light from the fiber collimator 4 passes through the cavity 8 and is guided to the PD or APD.

The optical semiconductor collimator 3 is constructed by integrating the optical semiconductor 9 and the lens 12. Optical semiconductor 9
Is composed of an LD which is a light emitting element when used as a transmitter module, and a PD (Photodiode) or APD (Aval which is a light receiving element when used as a receiver module.
anche Photodiode). On the optical axis of the optical semiconductor 9, a sleeve 13 having a lens 12 fitted therein is fixed to the center of the surface of the cap 9a.

The holder 5 has an inner opening 14 formed in the same shape as the fixed projection 7 of the main body 1. The inner opening 14 is formed by the stem 9 of the optical semiconductor 9 formed in the center.
It communicates with an outer opening 16 formed to have a smaller diameter than the inner opening 14 via a stepped fitting portion 15 for holding a. A screw portion 17a is formed on the inner wall surface of the outer opening 16, and the screw portion 17a has a pressing member 17 for pressing the bottom surface of the stem 9a in a direction in which the optical semiconductor 9 is fitted in the fitting portion 15. The screw portion 17a is screwed. As a result, the optical semiconductor collimator 3 is positioned and fixed to the holder 5 with the outer circumference and the surface of the stem 9a of the optical semiconductor 9 fitted in the fitting portion 15. Also, the holder 5
Is an optical axis direction (Z axis) of the optical semiconductor 9 with the fiber 18 of the fiber collimator 4 and a plane (X
-Y plane) and the angle in the direction of inclination with respect to the optical axis are adjusted, and then the end face of the inner opening 14 is fixed to the end face of the opening 7a of the fixing projection 7 of the main body 1 by the fixing means 6. It

The fiber collimator 4 has a sleeve 20 so that the optical axis of the fiber 18 and the optical axis of the rod lens 19 coincide with each other, and the end face of the fiber end face 18a at the center of the core is located at the focal point of the rod lens 19. The rod lens 19 is fitted and inserted into one end side of the inside, and the fiber end surface 1 is attached to the other end side.
8a is inserted. This fiber collimator 4 is
With the sleeve 20 accommodated in the cavity 8, the main body 1
It has a square plate-shaped flange portion (holder) 21 that is detachably fixed to the. The inner side surface of the flange portion 21 forms a mounting surface (reference surface) 21a that comes into contact with the right side wall surface 2b of the main body 1 in parallel. Also, the flange portion 2
Free insertion holes 22 having a diameter larger than that of the screw 11 screwed into the mounting screw hole 10 of the main body 1 are formed at two positions above and below the device 1. The fiber collimator 4 is constructed by screwing a screw 11 into a mounting screw hole 10 of the main body 1 until the mounting surface 21a of the flange portion 21 contacts the right side wall surface 2b of the main body 1.
Fixed to.

FIG. 2A, which will be described next, is a partial cross-sectional front view showing a second embodiment of an optical semiconductor module according to the present invention, and FIG. 2B is a left side view of the same module. (C) is a right side view of the module. The same components as those in the first embodiment are designated by the same reference numerals and the description thereof will be omitted.

The optical semiconductor module of the second embodiment is
In the first embodiment, the optical semiconductor collimator 3 has the holder 5
In addition to the structure that is detachably attached to the holder 5, the holder 5 is fixed to the connecting member 23 that is detachable from the main body 1.

That is, in this embodiment, the fixing projection 7 of the main body 1 in the first embodiment is omitted, and the cylindrical connecting member 23 is detachably fixed to the center of the left wall surface 2a of the main body 1. The fixing screw hole 24 is communicated with the cavity hole 8 and has a predetermined length in the longitudinal direction orthogonal to the side wall surface 2a. The connecting member 23 has a small diameter inner opening 25 penetrating in the axial direction and communicating with the cavity 8 of the main body 1, and a large diameter outer opening 26 for accommodating the sleeve 13 of the optical semiconductor collimator 3. Has been done. On the outer periphery of the distal end of the connecting member 23, a screw portion 23 a screwed into the fixing screw hole 24 of the main body 1.
Are formed. A flange portion 27 having a diameter larger than that of the screw portion 23a is integrally formed in a central portion of the outer periphery of the connecting member 23, and an inner surface of the flange portion 27 is attached to a mounting surface (which is in contact with the left wall surface 2a of the main body 1 in parallel). The reference surface) 27a is formed. In addition, the end face of the outer opening 26 of the connecting member 23 is in the optical axis direction (Z axis) of the optical semiconductor 9 between the fiber 18 of the fiber collimator 4 and a plane (XY plane) orthogonal to the optical axis. The end surface of the inner opening 14 of the holder 5, which has been adjusted and adjusted in the tilt direction with respect to the optical axis, is fixed by the fixing means 6.

Next, FIG. 3A is a partially sectional front view showing an optical semiconductor module according to a third embodiment of the present invention, FIG. 3B is a left side view of the same module, and FIG. [Fig. 4] is a right side view of the module. The same components as those in the second embodiment are designated by the same reference numerals and the description thereof will be omitted.

The optical semiconductor module of the third embodiment is
It is used as a module for one wavelength or two wavelengths, and in the above-described second embodiment, the cavity hole 8 branches at the center and penetrates the bottom wall surface 28, and is on the same optical axis as the fiber collimator 4. The provided optical semiconductor collimator 3 is used as a first optical semiconductor collimator, and the bottom wall surface 2 orthogonal to this is provided.
8. A second connecting member 29 is detachably attached to the central cavity hole 8, and a second optical semiconductor collimator 30 is detachably attached to the holder 5 fixed to the second connecting member 29. .

That is, in this embodiment, a fixing screw hole 31 for detachably fixing the second connecting member 29 is provided in the center of the bottom wall surface 28 of the main body 1 so as to communicate with the cavity hole 8 and the side wall surface. A predetermined length is formed in the longitudinal direction orthogonal to 2a.

Then, the second optical semiconductor collimator 30
The outer circumference and the surface of the stem 9a of the optical semiconductor 9 are the fitting portion 1
5, the threaded portion 17a of the pressing member 17 is screwed into the threaded portion 17a of the outer opening 16,
The bottom surface of the stem 9a is pressed against the fitting portion 15 and positioned and fixed to the holder 5. Further, on the end face of the outer opening 26 of the second connecting member 29, the optical axis direction (Z axis) of the optical semiconductor 9 with the fiber 18 of the fiber collimator 4 and a plane (X-Z) orthogonal to the optical axis. The fixing means 6 fixes the end surface of the inner opening 14 of the holder 5 on which the adjustment of the plane) and the angle adjustment in the tilt direction with respect to the optical axis have been performed.

A cover member 32 is detachably attached to the front side of the main body 1. This cover member 32 is
It is attached by screws 34 at two diagonal positions on the front wall surface 33 of the main body 1 which are symmetrically located. In addition, the branch portion of the cavity hole 8 to which the second connecting member 29 is attached, that is,
At the axial intersection of the first optical semiconductor collimator 3 and the second optical semiconductor collimator 30 in the cavity 8, for example, a multiplexer / demultiplexer such as a dichroic mirror or a half mirror is used. The optical coupling part 35 is detachably provided.
The optical coupling portion 35 is configured such that it can be fixed from the front side of the main body 1 in a state where the cover member 32 is removed, and the optical coupling portion 35 combines light between the optical semiconductor collimators 3 and 30 and the fiber collimator 4. It is splitting.

When the optical semiconductor module of this embodiment is used as a one-wavelength module, the cavity 8
A cover member (not shown) is attached so as to cover the.

The optical semiconductor module of the third embodiment is
For example, it is optimally used as a light emitting / receiving module of an optical pulse tester having the configuration shown in FIG. The optical pulse tester in this figure includes a timing generation unit 50, a light emitting unit 51, a directional coupler 52, a light receiving unit 53, an amplification unit 54, an A / D converter 55, a waveform processing unit 56, and a display unit 57. Has been done. In this optical pulse tester, the timing generator 5
An optical pulse is emitted from the light emitting section 51 to the measured fiber 58 based on the timing signal generated by 0, and the backscattered light and Fresnel reflected light reflected from the measured fiber 58 are passed through the directional coupler 52. The light is received by the light receiving section 53, and the received light is amplified by the amplifier 54 and then A /
The D converter 55 performs sampling at each measurement point at a predetermined sampling period, waveform-processes each sampled data in the waveform processing unit 56, and displays the data on the display unit 57. Is going.

With respect to the optical pulse tester configured as described above, the light emitting section 51 is the first optical semiconductor collimator 3 by the LD, and the light receiving section 53 is the second optical semiconductor collimator 30 by the PD or APD. By using the directional coupler 52 as the optical coupler 35 formed of a multiplexer / demultiplexer, the portion indicated by the alternate long and short dash line in the figure can be configured by one module.

Next, FIG. 5 is a partial cross-sectional front view showing an optical semiconductor module according to a fourth embodiment of the present invention. The same constituent elements as those in the first to third embodiments include
The same numbers are assigned and the description thereof is omitted.

The optical semiconductor module of the fourth embodiment is
In the third embodiment described above, the main body 1 is extended in the longitudinal direction, and the cavity hole 8 is branched into two portions on the left and right and penetrates the bottom wall surface 28. A fixing screw hole 36 is formed in the right-side cavity hole 8 so as to communicate with the side wall surface 2a in the longitudinal direction, and has a predetermined length. Then, in parallel to the second connecting member 29 detachably provided in the cavity hole 8 on the left side of the bottom wall surface 28 of the main body 1, the third connecting member 37 can be detachably attached to the cavity hole 8 on the right side. It is provided. A third optical semiconductor collimator 38 is detachably attached to the holder 5 fixed to the third connecting member 37.

The third optical semiconductor collimator 38, like the second optical semiconductor collimator 30, has the stem 9a of the optical semiconductor 9 with the outer periphery and the surface fitted to the fitting portion 15, and the screw of the pressing member 17. By screwing the portion 17a into the screw portion 17a of the outer opening 16, the bottom surface of the stem 9a is pressed against the fitting portion 15 and positioned and fixed to the holder 5. On the end surface of the outer opening 26 of the third connecting member 37,
Between the fiber 18 of the fiber collimator 4 and the optical axis direction (Z axis) of the optical semiconductor 9 and a plane (XZ
The end surface of the inner opening portion 14 of the holder 5, which has been subjected to the adjustment of the plane) and the angle in the tilt direction with respect to the optical axis, is fixed by the fixing means 6.
Fixed by. In addition, the third optical semiconductor collimator 3
An optical coupling section 39 composed of a multiplexer / demultiplexer such as a dichroic mirror or a multiplexer / demultiplexer such as a half mirror is detachably provided at a branch portion of the cavity 8 to which 8 is attached.

The optical semiconductor module of the fourth embodiment is
For example, it is optimally used as a light emitting / receiving module of an optical pulse tester having the configuration shown in FIG. That is, the optical pulse tester in this figure receives light of two different wavelengths into the optical fiber 58 to be measured, and receives light reflected from the optical fiber 58 to be measured with the incidence of light of each wavelength. There is. Therefore, in addition to the configuration of the optical pulse tester of FIG. 4, a second light emitting section 59 and a second directional coupler 60 are provided.

Then, in the optical pulse tester configured as described above, the first light emitting section 51 and the second light emitting section 59 are respectively the first optical semiconductor collimator 3 and the second optical semiconductor collimator 30 which are LDs. The light receiving unit 53 is the third optical semiconductor collimator 38 made of PD or APD, the first directional coupler 52 is the optical coupling unit 35 made of a multiplexer, and the second directional coupler 60 is the demultiplexer. Optical coupling part 3
By setting the number to 9, the portion indicated by the alternate long and short dash line in the figure can be configured by one module.

Next, a method of adjusting the optical axis of the optical semiconductor module configured as described above will be described. First, in the case of the one-wavelength module, the fiber collimator 4 is fixed to the main body 1 (ST1). Further, the optical semiconductor 9 is used as an LD to fix the optical semiconductor collimator 3 to the holder 5 (ST
2). When the optical semiconductor module shown in FIG. 3 or 5 is used, the unnecessary second optical semiconductor collimator 30 and third optical semiconductor collimator 38 including the holder 5 are removed from the main body 1, and the cover is used instead. Attach the members. Further, the optical coupling portions 35 and 39 are removed from the main body 1. In this state, in the configuration of FIG. 1, the optical semiconductor 9 is caused to emit light, and the holder 5 to which the optical semiconductor collimator 3 is attached is finely moved in the XYZ axis and the tilt direction of the optical axis.
The holder 5 is fixed to the main body 1 at a position where the amount of light coupled to the fiber 18 is maximized (ST3). Further, in the configuration using the connecting member 22 as shown in FIG. 2, after the connecting member 22 is attached to the main body 1 in advance and the optical axis is adjusted,
The holder 5 is fixed to the connecting member 22.

Next, in the case of a two-wavelength module, as shown in FIG.
Alternatively, the optical semiconductor module of FIG. 5 is used. When the optical semiconductor module of FIG. 5 is used, an unnecessary third optical semiconductor collimator 38 including the holder 5 is included in the main body 1.
The connection member 37 is removed together with the cover member, and the optical coupling unit 39 is removed from the main body 1 instead. First, the multiplexer as the optical coupling unit 35 is fixed to the main body 1 (ST4), and then the fiber collimator 4 is fixed to the main body 1 (ST5). Further, the first optical semiconductor collimator 3 and the second optical semiconductor collimator 30 are fixed to the holder 5 (ST6). In this state, the optical semiconductor 9 is caused to emit light, and the holder 5 to which the first optical semiconductor collimator 3 is attached is finely moved in the X-Y-Z axis and the tilt direction of the optical axis to maximize the amount of light coupled to the fiber 15. The holder 5 is fixed to the main body 1 at this position (ST7). Similarly, the optical semiconductor 9 is caused to emit light, and the holder 5 to which the second optical semiconductor collimator 30 is attached is finely moved in the X-Y-Z axis and the tilt direction of the optical axis to maximize the amount of light coupled to the fiber 15. The holder 5 is fixed to the main body 1 at the position (ST8). Further, in the configuration using the connecting members 23 and 29, the main body 1 is previously prepared.
After connecting the connecting members 23 and 29 to the optical semiconductor collimators 3 and 30, the optical axes of the optical semiconductor collimators 3 and 30 are adjusted, and then the holder 5 is fixed to the corresponding connecting members 23 and 29. In addition, when changing the wavelength, the procedure described above is performed.

Next, when wavelengths are added, in the structure of this embodiment, the optical semiconductor collimators 3, 30 and 38 are arranged in the holder 5.
The optical axis readjustment is not easy because it is fixed to the main body 1 via the holder 1, or is fixed to the connecting members 23, 29, and 37 that are detachable from the main body 1 via the holder 5. Therefore, if there is a possibility of adding a wavelength, the optical coupling unit 35 is previously attached to the main body 1.
The one-wavelength module is assembled with the multiplexer as described above fixed, and the re-optical axis adjustment of the first optical semiconductor collimator 3 becomes unnecessary when adding a wavelength. Alternatively, when the two-wavelength module is assembled from the beginning to form the one-wavelength module, the second optical semiconductor collimator 30 may be removed. In this case, the removed optical semiconductor collimator 30 can be reused.

Further, in the case of constructing the transmitting / receiving module after adding the above-mentioned wavelength, the optical semiconductor module of FIG. 5 is used, and the cover member is removed from the main body 1,
A multiplexer / demultiplexer is fixed to the main body 1 as the optical coupling section 39 (ST
9). In this state, in order to readjust the light deviated by the plate thickness of the multiplexer / demultiplexer, the optical semiconductors 9 of the optical semiconductor collimators 3 and 30 are caused to emit light, and the first and second optical semiconductor collimators 3 and 3.
The holder 5 to which 30 is attached is finely moved in the tilt directions of the XYZ axes and the optical axis, and the holder 5 is fixed to the main body 1 at the position where the amount of light coupled to the fiber 18 is maximum (ST10). In the configuration using the connecting members 23, 29, 37, the connecting members 23, 29, 37 are attached to the main body 1 in advance, the optical axis is adjusted, and then the connecting member 2 is used.
The holder 5 is fixed to 3, 29 and 37.

Therefore, according to each of the above-mentioned embodiments, the optical semiconductor collimators 3, 30, 38 and the fiber collimator 4 are modularized, and the optical semiconductor collimators 3, 30, 38 are fixed to the holder 1 or the holder 5. Since the fiber collimator 4 is attachable to and detachable from the holder 5 fixed to the connecting members 23, 29, 37 which are attachable to and detachable from the main body 1, the fiber is broken or the LD emits light abnormally. Even if it occurs, it is possible to easily replace the optical semiconductor and the fiber, and it is possible to prevent waste of replacement parts.

Further, in each embodiment, the angle adjustment of the optical semiconductor collimators 3, 30, 38 in the tilt direction of the optical axis is performed between the main body 1 and the holder 5 or the connecting member 23 detachable from the main body 1.
Since it can be performed between the holders 5 and 29 and 37, even if the light emitting surface or the light receiving surface of the optical semiconductor 9 in the optical semiconductor collimators 3, 30, and 38 is tilted in the vertical direction with respect to the surface of the stem, the light can be accurately emitted. The axis can be adjusted to obtain a sufficient bonding rate.

According to the optical semiconductor modules of the first and second embodiments, even if the main body 1 and the fiber collimator 4 have the same shape, if the optical semiconductor 9 is an LD, it becomes a transmitter module and the optical semiconductor 9 If it is PD or APD, it can be configured as a receiving module.

Further, according to the optical semiconductor modules of the third and fourth embodiments, by mounting the second optical semiconductor collimator 30 and the optical coupling portions 35, 39 on the main body 1, the optical semiconductor module of one wavelength can be obtained. Can be easily changed to a two-wavelength optical semiconductor module. Also, the first
If one LD and one PD (or APD) are used as the optical semiconductors 9 of the second optical semiconductor collimators 3 and 30, and a multiplexer / demultiplexer is used instead of the multiplexer as the optical coupling unit 35, transmission / reception is performed. The module can be easily configured and can be applied to various applications such as various measuring instruments typified by an optical pulse tester and communication equipment.

Furthermore, according to the optical semiconductor modules of the second to fourth embodiments, the optical semiconductor collimators 3 and 3 are used.
Since 0 and 38 can be attached to and detached from the holder 5 fixed to the main body 1 via the fixing means 6, even when the holder 5 is attached to the main body 1, it is possible to select a light emitting element or a light receiving element by exchanging only the collimator. The wavelength can be changed promptly.

By the way, in the above-mentioned embodiment, the configuration provided with one fiber collimator 4 and up to three optical semiconductor collimators 3, 30, 38 has been described, but the number of optical semiconductor collimators is not limited to three, and the main body 1 is composed. The holder 5 may be attached to the detachable connecting members 23, 29, and 37. In this case, it is provided in the cavity hole 8 of the main body 1 on the same optical axis as the fiber collimator 4, and the cavity hole 8 is branched by the number of the remaining optical semiconductor collimators and penetrated from the wall surface of the main body 1. A multiplexer or a multiplexer / demultiplexer is detachably attached to the branch portion of the hole 8.

In each of the above-mentioned embodiments, the optical semiconductor collimators 3, 30, 38 are fixed to the main body 1 via the holder 5, or the connecting members 23, 2 detachable from the main body 1.
Although it is configured to be fixed to 9, 37 via the holder 5,
This configuration may be applied to the fiber collimator 4 so that, for example, the optical semiconductor collimator 3 can be attached / detached to / from the main body 1 so as to be finely movable on a plane (XY plane) orthogonal to the optical axis direction thereof. When adjusting the optical axis in this case, the optical semiconductor 9 is caused to emit light with the optical semiconductor collimator 3 fixed to the main body 1, and the holder 5 to which the fiber collimator 4 is attached is moved in the XYZ axis and the tilt direction of the optical axis. The holder 5 is finely moved and fixed to the wall surface of the main body 1 by the fixing means 6 at a position where the amount of light coupled to the fiber 18 is maximized.

[0059]

As described above, according to the first aspect of the present invention.
According to the optical semiconductor modules 3 to 3, the optical semiconductor collimator and the fiber collimator are modularized, and the optical semiconductor collimator is attachable to and detachable from the holder fixed to the main body via the fixing means. Since the structure is detachable, even if the fiber is broken or an abnormality occurs in the light emitting element or the light receiving element, the optical semiconductor and the fiber can be easily replaced, and the waste of replacement parts can be prevented. Moreover, since the angle adjustment of the tilt direction of the optical axis of the optical semiconductor collimator can be performed between the main body or the fastening member and the holder, the light emitting surface or the light receiving surface of the optical semiconductor in the optical semiconductor collimator is perpendicular to the surface of the stem. Even if it is tilted, the optical axis can be adjusted with high accuracy to obtain a sufficient coupling rate. Even if the main body and the fiber collimator have the same shape, a light emitting element may be used as a transmitting module and a light receiving element may be used as an optical semiconductor as a receiving module.

According to the optical semiconductor module of claim 2,
The one-wavelength optical semiconductor module can be easily changed to the two-wavelength optical semiconductor module. Further, if one light emitting element and one light receiving element are used as the optical semiconductors of the optical semiconductor collimator, and a multiplexer / demultiplexer is used as the optical coupling section, the transceiver module can be simply configured. It can be used for various applications such as various measuring instruments and communication equipment represented by.

According to the optical semiconductor module of claim 3,
Since the optical semiconductor collimator can be attached to and detached from the holder attached to the main body, it is possible to quickly select the light emitting element or the light receiving element and change the wavelength by exchanging only the collimator.

[Brief description of drawings]

FIG. 1 (a) is a partial cross-sectional front view showing an optical semiconductor module according to a first embodiment of the present invention (b) is a right side view of the module (c) is a left side view of the module

FIG. 2 (a) is a front view of a partial section showing an optical semiconductor module according to a second embodiment. (B) is a right side view of the module. (C) is a left side view of the module.

FIG. 3A is a front view of a partial cross section showing a third embodiment of an optical semiconductor module. FIG. 3B is a right side view of the module. FIG. 3C is a left side view of the module.

FIG. 4 is a block diagram showing a configuration example of an optical pulse tester to which an optical semiconductor module of a third embodiment is applied.

FIG. 5 is a plan sectional view showing a fourth embodiment of an optical semiconductor module.

FIG. 6 is a block diagram showing a configuration example of an optical pulse tester to which an optical semiconductor module of a fourth embodiment is applied.

FIG. 7 is a diagram showing a configuration of a conventional optical semiconductor module.

FIG. 8 is a diagram showing a configuration of a conventional optical semiconductor module.

FIG. 9 is a diagram showing a configuration of a conventional optical semiconductor module.

[Explanation of symbols]

1 ... Main body, 2 ... Side wall surface, 3, 30, 38 ... Optical semiconductor collimator, 4 ... Fiber collimator, 5 ... Holder, 6 ... Fixing means, 9 ... Optical semiconductor, 12 ... Lens, 28 ... Bottom wall surface,
35, 39 ... Optical coupling section.

Claims (3)

[Claims] 1. An optical semiconductor collimator (3) in which a lens (12) and an optical semiconductor (9) including a light emitting element or a light receiving element are integrated so that a light emitting surface or a light receiving surface is located at a focal position. , A holder (5) to which the optical semiconductor collimator is detachably attached, a lens (19), and a fiber (1) arranged so that the end face of the fiber core is located at the focal position of the lens.
8) and a fiber collimator (4) provided on a holder (21) having a mounting surface (21a), and a through hole (8) is formed between opposing wall surfaces (2a, 2b), and the fiber collimator is mounted. A main body (1) detachably attached to one wall surface through which a desired one of the through holes is provided, and a fixing means (6) for fixing the holder (5) to the other wall surface of the main body through which the through hole is desired. An optical semiconductor module comprising: 2. The through hole (8) is orthogonal to the middle position of the through hole and branches into another wall surface (28) to penetrate therethrough, and the other wall surface branched from the through hole has the holder. (5)
Is fixed by the fixing means (6), and an optical semiconductor collimator (30, 38) in which the lens (12) and the optical semiconductor (9) are integrated is detachably attached to the holder, The optical semiconductor collimator and the fiber collimator (4)
The optical semiconductor module according to claim 1, wherein an optical coupling portion (35, 39) including a multiplexer or a multiplexer / demultiplexer is attached to a branching portion of the through hole that connects with. 3. The optical semiconductor module according to claim 1, wherein the optical semiconductor (9) is detachably attached to the holder (5).