JP3022724B2 - Optical semiconductor module - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an optical semiconductor module used for optical communication equipment or optical measuring equipment.

[0002]

2. Description of the Related Art Conventionally, an optical semiconductor module used for an optical communication device or an optical measuring device is an optical semiconductor module using a confocal lens system, for example, as disclosed in Japanese Patent Laid-Open No. 3-149.
No. 510, "Semiconductor Laser Optical Fiber Coupling Apparatus and Manufacturing Method Thereof" (Conventional Example 1) and Japanese Patent Application Laid-Open No. 5-121841, "Semiconductor Laser Module" (Conventional Example 2).

[0003] As shown in FIG. 8, the optical semiconductor module of Conventional Example 1 is schematically configured to include a semiconductor laser collimator package 70 and an optical fiber collimator 71. The semiconductor laser collimator package 70 includes a semiconductor laser package 76 including a stem 72, a metal pedestal 73, a cap with a window 74, and a semiconductor laser (hereinafter, referred to as an LD) 75, and a semiconductor laser package 76 closest to the semiconductor laser 75. One lens 77 is provided. In the optical fiber collimator 71, the single mode optical fiber 78 and the second lens 79 are held in the same metal sleeve 80 in such a positional relation that the incident parallel light is focused on the end of the single mode optical fiber.

In this optical semiconductor module, the first lens 77 is fixed by an adhesive at a position where the light emitted from the semiconductor laser 75 is converted into a parallel beam, and either the semiconductor laser package 76 or the optical fiber collimator 71 is fixed. For one, so that their optical axes coincide,
After simultaneously adjusting the four axes of the X and Y directions orthogonal to the optical axis and the tilt angles θ and φ of the optical axis, the semiconductor laser collimator package 70 and the optical fiber collimator 71 are opposed to each other. The stem 72 is fixed to the metal sleeve 80 directly by soldering or YAG laser welding at a position where the optical axes coincide with each other.

[0005] As shown in FIG. 9, the optical semiconductor module of Conventional Example 2 has a stem 82 in which a semiconductor laser element (LD) 81 is housed, a thick cap 84 in which a microlens 83 is mounted, and a spherical lens 85. And a spherical lens holding lens barrel 87 holding a fiber ferrule 86.

In this optical semiconductor module, X.X. After adjusting the Y axis and adjusting the position between the lens barrel 87 and the ferrule 86 by adjusting the Z axis,
Two portions between the lens barrel 87 and the thick cap 84 and between the lens barrel 87 and the ferrule 86 are fixed by spot welding.

A two-wavelength compatible optical semiconductor module for coupling outgoing light from two optical semiconductor elements to one optical fiber is disclosed in Japanese Unexamined Patent Application Publication No. 3-129306, entitled "Optical Coupler and Method of Manufacturing the Same". Example 3).

As shown in FIG. 10, the optical semiconductor module of the prior art 3 has two sets of element packages 88 and 89.
And one polarizing element 91 fixed in the casing 90
And a casing 90 facing the emission side surface of the polarizing element 91.
And a single optical fiber 92 fixed to the wall surface. Each element package 88, 89 has one lens 93 and 1 in a package body 88a, 89a.
With two LDs 94 incorporated therein, and a casing 90 facing two incident side surfaces orthogonal to each other of the polarizing element 91.
The package body 88a,
Reference surface 95 formed at one end of 89a is fixed by welding. Each LD 94 is fixed to the other ends of the package bodies 88a and 89a via the stem 96 by welding so that each active layer coincides with the optical axis of the lens 93.

In this optical semiconductor module, while the reference surfaces 95 of the element packages 88 and 89 are kept in close contact with the casing 90, the element packages 88 and 89 are placed in an X.X. After adjusting in such a manner that the optical coupling state between the LD 94 and the optical fiber 92 is maximized by moving in the Y direction, the element packages 88 and 89 are fixedly fixed to the casing 90 by welding. The element package 88,
Adjustment of the position of the optical fiber 89 and the optical fiber 92 in the optical axis direction (Z direction) is performed by the element packages 88 and 89 and the polarizing element 9.
1 is performed by changing the thickness of the glass plate 97 of the transparent member disposed between the first and second glass plates.

[0010]

As described above, in order to fix the collimators to each other, in the configuration of the conventional example 1, the stem 72 of the LD 75 is directly soldered to the metal sleeve 80 holding the lens 79 and the optical fiber 78. Alternatively, it is fixed by YAG laser welding, and in the configuration of Conventional Example 2, between the lens barrel 87 and the thick cap 84 and between the lens barrel 87 and the ferrule 86.
Are welded at two places. Also in the configuration of the third conventional example, the space between the stem 96 for holding the LD 94 and the package bodies 88a and 89a and the package body 88
a, 89a and the casing 90 are welded, and in any of the conventional configurations, it is very difficult to replace or add an LD or replace a fiber.

In addition, since the position of the beam spot is usually different for each package in the element package to be used, there is variation. Therefore, particularly in the configuration of the conventional example 3, when the light from the LD 94 is obliquely emitted, the glass plate 97 When the position adjustment in the Z direction is performed by changing the thickness of the beam spot, the position of the beam spot shifts on the XY plane, and the X and Y directions need to be adjusted again.

When the above-described optical semiconductor module is used in an optical communication device, the wavelength of the optical communication module is set to 1.31 μm only or to both 1.31 μm and 1.55 μm depending on the target communication system. Variations are required. In addition, when used in an optical measurement device, the measurement wavelength is changed (for example, 1.3, 1.31 μm, etc.) or added (for example, 1.31 + 1.55 μm, etc.), and furthermore, the light is changed according to the user's request. Fiber type (SMF: DSF, PANDA, etc.
(For GI fiber, 50/125, 62.5 / 125, etc.)
Various modifications are required, such as changes in Moreover, the remodeling work itself is required with a very short delivery time. And, for this short delivery time, a method such as storage of the optical semiconductor module is required.

However, in the configuration of the optical semiconductor module of the above-described conventional examples 1 and 2, when the optical axis of the LD collimator and the fiber collimator is adjusted, the fixing of the LD collimator is performed by the portions of the stems 72 and 82 of the LDs 75 and 81. Since it is performed directly by soldering or YAG welding,
Without special tools, disassembly was difficult and reassembly was also very difficult. Further, in order to reuse the removed parts, it is essential to make corrections such as removing solder completely. In the worst case, the parts may be damaged and become unusable. This also means that LD
The same problem also occurs in the configuration of the optical semiconductor module of Conventional Example 3 in which the stem 96 of 94 and the element packages 88 and 89 are fixed by welding.

Therefore, in the above-mentioned conventional optical semiconductor module configuration, each type of module must be stored as a finished product or assembled after an order is received. In addition, when the measuring instrument has variations of one wavelength and two wavelengths, it is very difficult to determine at what ratio the one-wavelength module and the two-wavelength module are stored. Further, since the LD collimator and the fiber collimator are expensive, it is desired that even if one component is damaged, only the damaged component is replaced by using the other component as it is. However, it was extremely difficult with the configuration of the conventional optical semiconductor module.

SUMMARY OF THE INVENTION The present invention has been made in view of the above problems, and has as its object that when an LD or a fiber is damaged, only a damaged part can be easily replaced, and a user can change a wavelength and add a wavelength. It is an object of the present invention to provide an optical semiconductor module that can easily respond to a request and a change request of a fiber type.

[0016]

In order to achieve the above object, an optical semiconductor module according to the present invention comprises a lens 11
An optical semiconductor collimator 3 provided on a holder 10 having mounting surfaces 10c and 14a, and an optical semiconductor 7 comprising a light emitting element or a light receiving element arranged such that a light emitting surface or a light receiving surface is located at a focal position of the lens. A fiber 16 disposed on a holder 18 having a mounting surface 18a, a lens 16 and a fiber 15 arranged such that an end face of the core of the fiber is located at a focal position of the lens. , 2b are formed between the optical semiconductor collimator and the fiber collimator so as to couple light between the optical semiconductor and the fiber. And a main body 1 detachably attached to a wall to be mounted, wherein the optical semiconductor collimator or the fiber collimator has an optical axis with respect to the main body. It is characterized in that mounted for fine movement in orthogonal planes.

Further, in addition to the above-described structure, the through-hole 6 is perpendicular to the middle of the through-hole 6 and branches into another wall 20 to penetrate therethrough. An optical semiconductor 22 composed of a light-emitting element or a light-receiving element arranged so that the surface is located is provided on a holder 26 having a mounting surface, and is mounted on another wall surface that desires the branched through hole via the mounting surface 14a. Optical semiconductor collimators 21 and 33 which are detachable and are attached so as to be finely movable on a plane perpendicular to the optical axis thereof, and a multiplexing provided at a branch portion of the through hole connecting the optical semiconductor collimator and the fiber collimator 4. Couplers 32 and 34 composed of optical devices or multiplexers / demultiplexers
May be provided.

Further, the optical semiconductors 7, 22 may be provided detachably with respect to the holders 10, 26.

[0019]

The optical semiconductor module according to the present invention is used as a one-wavelength transmitting module or a receiving module.
An optical semiconductor collimator 3 and a fiber collimator 4 are detachably mounted on the same optical axis with respect to 2b, and one collimator is finely movable with respect to the main body 1 on a plane orthogonal to the optical axis. When the optical axis is adjusted when the fiber collimator 4 is finely movable and the transmission module is configured, the optical semiconductor 7 fixes the optical semiconductor collimator 3 of the light emitting element to the main body 1 and the fiber collimator 4 is The optical semiconductor 7 is caused to emit light while being temporarily fixed to 1, and the fiber collimator 4 is finely moved on a plane perpendicular to the optical axis to fix the fiber collimator 4 at a position where the amount of light coupled to the fiber 15 is maximized. In addition, if the optical semiconductor 7 removes the optical semiconductor collimator 3 of the light emitting element from the main body 1 and replaces the optical semiconductor 7 with the optical semiconductor collimator of the light receiving element, a receiving module can be configured.

The optical semiconductor module according to the present invention is used as a one-wavelength or multi-wavelength module. The optical semiconductor collimator 3 and the fiber are provided on the opposing wall surfaces 2a and 2b of the main body 1 in which the through holes 6 are formed. The collimator 4 is detachably mounted on the same optical axis, and the through-hole 6 branches off and penetrates to another wall surface 20 orthogonal to the middle position.
Opto-semiconductor collimators 21 and 33, which are finely movable with respect to a plane perpendicular to the optical axis, are detachably attached to the main body 1 via the attachment surface 14a on the other wall surface 20 where the branched through hole 6 is desired. . In addition, the optical semiconductor collimators 21 and 3
In the branching portion of the through hole 6 connecting the fiber collimator 3 and the optical collimator 4, optical couplers 32 and 34 composed of a multiplexer or a multiplexer / demultiplexer are provided.
Is provided. Then, as the optical semiconductor collimators 3, 21, and 33 attached to and detached from the main body 1, if the optical semiconductors 7, 22 are combined with the optical semiconductor collimator of the light emitting element and the optical semiconductors 7, 22 are combined with the optical semiconductor collimator of the light receiving element, Any of a transmission module, a reception module, and a transmission / reception module can be configured.

The optical semiconductor collimators 3 and 2
The optical semiconductors 7, 22 in 1, 33 are holders 10, 2,
6, and the holders 10, 26 are attached to the main body 1
Even when the optical semiconductors 7 and 22 are mounted, the selection of the light emitting element or the light receiving element and the change of the wavelength can be quickly performed by exchanging only the optical semiconductors 7 and 22.

[0022]

DESCRIPTION OF THE PREFERRED EMBODIMENTS The optical semiconductor module of each embodiment described below is used especially for a module for GI fiber.

FIG. 1A is a front view, partially in section, showing a first embodiment of an optical semiconductor module according to the present invention, and FIG.
2 is a left side view of the module, and FIG. 2C is a right side view of the module.

The optical semiconductor module of the first embodiment is
An optical semiconductor collimator 3 and a fiber collimator 4 are detachably mounted on a side wall surface 2 in the longitudinal direction of a main body 1 formed in a box shape.

In FIG. 1A, the left side wall 2 of the main body 1 is shown.
In the center of a, a fixing screw hole 5 for detachably fixing the optical semiconductor collimator 3 is formed in a predetermined length in a longitudinal direction orthogonal to the side wall surface 2a. In the fixing screw hole 5, a cavity hole 6 having a diameter smaller than the diameter of the screw hole 5 is formed so as to penetrate the right wall surface 2b. At the upper and lower two places on the right side wall 2b of the main body 1, mounting screw holes 8 are formed in a predetermined length in the longitudinal direction, and the fiber collimator 4 is detachably fixed to the main body 1 in the mounting screw holes 8. Screw 9 is screwed.

As described later, when the optical semiconductor 7 of the optical semiconductor collimator 3 is composed of an LD, light from the LD passes through the cavity 6 to the fiber collimator 4 and Is PD (Photodiode) or APD (Av
alanche Photodiode), the light from the fiber collimator 4 passes through the cavity 6 and is PD or A
It is led to PD.

The optical semiconductor collimator 3 includes an optical semiconductor 7 and
It is schematically constituted by a holder 10 for fixing the optical semiconductor 7. The optical semiconductor 7 is constituted by an LD which is a light emitting element when used as a transmitting module, and a PD or APD which is a light receiving element when used as a receiving module.
It consists of. The lens 10 is fixed to the holder 10 at the axial center of the central thick portion 10a. This lens 1
1 are provided on both sides of the holder 10 with the cavity holes 6 of the main body 1.
And a large-diameter outer opening 13 that accommodates the cap 7a of the optical semiconductor 7 is formed. On the outer periphery of one end of the holder 10, a screw portion 10b screwed into the fixing screw hole 5 of the main body 1 is formed.
A flange portion 14 having a diameter larger than that of the screw portion 10b is integrally formed at a central portion of the outer periphery of the holder 10, and an inner surface of the flange portion 14 has a mounting surface (reference) in parallel with the left wall surface 2a of the main body 1. Surface 14a.

The optical semiconductor 7 is adjusted in the direction of the axis (Z-axis) so that the optical axis coincides with the optical axis of the lens 11 and the light emitting surface or the light receiving surface is located at the focal point of the lens 11. After that, the surface of the stem 7b and the outer opening 1 of the holder 10 are
3 is fixed with solder. The screw portion 10 b of the holder 10 is screwed into the fixing screw hole 5 of the main body 1 until the mounting surface 14 a of the flange portion 14 contacts the left wall surface 2 a of the main body 1. Thereby, the optical semiconductor collimator 3 is fixed to the main body 1.

The fiber collimator 4 is disposed inside the sleeve 17 so that the optical axis of the fiber 15 and the optical axis of the rod lens 16 coincide with each other and the center of the core of the fiber end face 15a is located at the focal point of the rod lens 16. A rod lens 16 is inserted into one end of the optical fiber, and a fiber end face 15a is inserted into the other end.
Is inserted. The fiber collimator 4 has a rectangular plate-like flange portion (holder) 18 which is detachably fixed to the main body 1 in a state where the sleeve 17 is housed in the cavity 6. The inner surface of the flange portion 18 forms a mounting surface (reference surface) 18a that comes into contact with the right wall surface 2b of the main body 1 in parallel. Further, loose insertion holes 19 having a diameter larger than that of the screw 9 screwed into the mounting screw hole 8 of the main body 1 are formed at two positions above and below the flange portion 18. As a result, the fiber collimator 4 moves the plane (X-X) perpendicular to the axis of the fiber 15 by the play between the screw 9 and the loose insertion hole 19.
(Y plane).

Then, the fiber collimator 4 is XY
After fine adjustment of the fiber collimator 15 in the plane,
The mounting surface 18a of the flange portion 18 is the right wall surface 2b of the main body 1.
Is fixed to the main body 1 by screwing the screw 9 into the mounting screw hole 8 of the main body 1 until it comes into contact with the main body 1.

Next, FIG. 2A is a front view of a partial cross section showing a second embodiment of the optical semiconductor module according to the present invention, FIG. 2B is a left side view of the module, and FIG. Is a right side view of the module. The same components as those in the first embodiment are denoted by the same reference numerals, and description thereof is omitted.

The optical semiconductor module of the second embodiment is
It is used as a one-wavelength or two-wavelength module. In the first embodiment described above, the cavity hole 6 branches off at the center and penetrates the bottom wall surface 20, and is on the same optical axis as the fiber collimator 4. The provided optical semiconductor collimator 3 is used as a first optical semiconductor collimator, and a bottom wall 2 orthogonal to the first optical semiconductor collimator 3 is provided.
A second optical semiconductor collimator 21 is detachably provided in the cavity 6 at the center.

The second optical semiconductor collimator 21 has an optical semiconductor 22 and a flange 24 fixed to mounting screw holes 23 formed at two places on the bottom wall 20 of the main body 1. The optical semiconductor 22 is, like the first optical semiconductor collimator 3, a lens 25 fixed at the center of the flange 24.
Is adjusted in the optical axis (XYZ axis) direction to form an optical semiconductor collimator, and then fixed to the holder 26 by soldering. In addition, two places on the left and right of the flange part 24 are:
A loose insertion hole 28 having a larger diameter than the screw 27 screwed into the mounting screw hole 23 of the main body 1 is formed. As a result, the second optical semiconductor collimator 21, like the fiber collimator 4, plays back the optical semiconductor 2 by the play between the screw 27 and the loose insertion hole 28.
Fine movement is possible on a plane (XZ plane) orthogonal to the two optical axes.

On the front side of the main body 1, a cover member 29 is detachably attached. This cover member 29
Screws 31 are attached at two oblique positions on the front wall 30 of the main body 1 located symmetrically. A branch portion of the cavity 6 to which the second optical semiconductor collimator 21 is attached;
That is, the axis intersection portion between the first optical semiconductor collimator 3 and the second optical semiconductor collimator 21 in the cavity 6 is constituted by a multiplexer such as a dichroic mirror or a multiplexer / demultiplexer such as a half mirror. The optical coupling unit 32 provided is detachably provided. The optical coupling section 32 can be fixed from the front side of the main body 1 in a state where the cover member 29 is removed, and couples light between the optical semiconductor collimators 3 and 21 and the fiber collimator 4. It is splitting.

When the optical semiconductor module of this embodiment is used as a one-wavelength module, the cavity 6
A cover member (not shown) is attached so as to cover. This cover member is screwed with a screw 27 into a mounting screw hole 23 in which the second optical semiconductor collimator 21 is attached and detached.

The optical semiconductor module of the second embodiment is
For example, it is optimally used as a light emitting / receiving module of an optical pulse tester having the configuration shown in FIG. The optical pulse tester in this figure includes a timing generator 50, a light emitter 51, a directional coupler 52, a light receiver 53, an amplifier 54, an A / D converter 55, a waveform processor 56, and a display 57. Have been. In this optical pulse tester, the timing generator 5
An optical pulse is emitted from the light emitting section 51 to the fiber under measurement 58 based on the timing signal generated at 0, and the backscattered light and Fresnel reflected light reflected from the fiber under measurement 58 are transmitted through the directional coupler 52. A light is received by the light receiving unit 53 and the received light is amplified by the amplifier 54 and then A / A
The D converter 55 samples the data at each measurement point at a predetermined sampling period, performs waveform processing on the sampled data by the waveform processing unit 56, displays the processed data on the display unit 57, and performs measurement of the loss of the measured fiber 58, searching for a break point, and the like. Is going.

For the optical pulse tester thus configured, the light emitting unit 51 is the first optical semiconductor collimator 3 using LD, and the light receiving unit 53 is the second optical semiconductor collimator 21 using PD or APD. By using the directional coupler 52 as the optical coupling unit 32 using a multiplexer / demultiplexer, the portion indicated by the dashed line in the figure can be constituted by one module.

FIG. 4 is a partially sectional front view showing a third embodiment of the optical semiconductor module according to the present invention. The same components as those in the first and second embodiments include:
The same reference numerals are given and the description is omitted.

The optical semiconductor module of the third embodiment is
In the above-described second embodiment, the main body 1 is extended in the longitudinal direction, and the cavity 6 is branched at two places on the left and right and penetrates the bottom wall 20. In parallel with the second optical semiconductor collimator 21 detachably provided in the left cavity hole 6 of the bottom wall surface 20 of the main body 1, the right cavity hole 6 has the same shape as the second optical semiconductor collimator 21. Third Optical Semiconductor Collimator 33 with Configuration
Is detachably provided. In addition, at the branch portion of the cavity 6 where the third optical semiconductor collimator 33 is attached,
For example, an optical coupling unit 34 composed of a multiplexer such as a dichroic mirror or a multiplexer / demultiplexer such as a half mirror is detachably provided.

The optical semiconductor module of the third embodiment is
For example, it is optimally used as a light emitting / receiving module of an optical pulse tester having the configuration shown in FIG. That is, the optical pulse tester in this figure enters light of two different wavelengths into the measured optical fiber 58 and receives light reflected from the measured optical fiber 58 with the incidence of light of each wavelength. I have. Therefore, in addition to the configuration of the optical pulse tester of FIG. 3, a second light emitting unit 59 and a second directional coupler 60 are provided.

The first light emitting unit 51 and the second light emitting unit 59 are respectively connected to the first optical semiconductor collimator 3 and the second optical semiconductor collimator 21 by using the LD. The light receiving unit 53 is a third optical semiconductor collimator 33 using PD or APD, the first directional coupler 52 is an optical coupling unit 32 using a multiplexer, and the second directional coupler 60 is a multiplexing / demultiplexing unit. By using the optical coupling unit 34 by the filter, the portion indicated by the one-dot chain line in FIG.
It can be composed of two modules.

FIG. 6A is a front view, partially in section, showing a fourth embodiment of the optical semiconductor module according to the present invention, FIG. 6B is a left side view of the module, and FIG. Is a right side view of the module. The same components as those in the first embodiment are denoted by the same reference numerals, and description thereof is omitted.

The optical semiconductor module of the fourth embodiment is
Since the accuracy of the center position of the semiconductor chip with respect to the outer periphery of the stem of the optical semiconductor used in recent years is good, in the first embodiment, in addition to the configuration in which the optical semiconductor collimator 3 can be attached to and detached from the main body 1, the optical semiconductor 7 itself is also a holder. 10 is configured to be detachable. This configuration can be applied to the above-described first to third embodiments.

That is, in this embodiment, the inner opening 12 of the holder 10 in the first embodiment is omitted, and the stepped fitting portion 35 into which the outer periphery and the surface of the stem 7b are fitted is provided in the outer opening of the holder 10. 13 is formed substantially at the center. The fitting portion 35 is formed such that the center of the stem 7b is aligned with the center of the lens 11 when the optical semiconductor 7 is fitted. In addition, a screw portion 1 is provided on the inner wall surface of the outer opening 13.
The screw portion 13a is screwed with a screw portion 36a of a holding member 36 for pressing the bottom surface of the stem 7b in a direction in which the optical semiconductor 7 fits into the fitting portion 35. As a result, the optical semiconductor 7 includes the stem 7 b and the lens 1.
1 is positioned and fixed to the holder 10 in a state where the center axes thereof coincide with each other. The lens 11 is fixed such that the light emitting surface or the light receiving surface of the optical semiconductor 7 is located at the focal point. The outer peripheral center portion of the holder 10 is formed to have a larger diameter with a step than the rear end of the screw portion 10b, and a surface orthogonal to the outer peripheral surface of the step portion is in parallel contact with the left wall surface 2a of the main body 1 (reference surface). 10c is formed. The screw portion 10b of the holder 10 is screwed into the fixing screw hole 5 of the main body 1 until the mounting surface 10c contacts the left wall surface 2a of the main body 1. Thereby, the optical semiconductor collimator 3 is fixed to the main body 1.

FIG. 7 is a front view, partially in section, showing a fifth embodiment of the optical semiconductor module according to the present invention. The same components as those in the first and fourth embodiments include:
The same reference numerals are given and the description is omitted.

The optical semiconductor module of the fifth embodiment is
In the first embodiment, the holder 1 of the optical semiconductor collimator 3
The lens 11 fixed to 0 is fixed to a thick portion 1a integrally formed at an intermediate position of the cavity 6 of the main body 1, and the other configuration is the same as that of the first embodiment.

Next, a method of adjusting the optical axis of the optical semiconductor module configured as described above will be described. First, in the case of the one-wavelength module, the optical semiconductor collimator 3 is fixed to the main body 1 using the optical semiconductor 7 as an LD (ST1). When the optical semiconductor module shown in FIG. 2 or FIG. 4 is used, the unnecessary second optical semiconductor collimator 21, third optical semiconductor collimator 33, and optical coupling portions 32 and 34 are removed from the main body 1, and the optical semiconductor module is removed. A cover member is attached instead of the collimators 21 and 33. Subsequently, the fiber collimator 4 is temporarily fixed to the main body 1 (ST2). In this state,
The optical semiconductor 7 is caused to emit light, and the fiber collimator 4 is set to XY.
Fine movement on a plane fixes the fiber collimator 4 at the position where the amount of light coupled to the fiber 15 is maximized (ST
3).

Next, in the case of a two-wavelength module, FIG.
Alternatively, the optical semiconductor module of FIG. 4 is used. When the optical semiconductor module shown in FIG. 4 is used, unnecessary third optical semiconductor collimator 33 and optical coupling unit 34 are attached to main body 1.
, And a cover member is attached instead of the optical semiconductor collimator 33. First, a multiplexer is fixed to the main body 1 as the optical coupling section 32 (ST4), and then the first optical semiconductor collimator 3 is fixed to the main body 1 (ST5). Subsequently, the fiber collimator 4 is temporarily fixed to the main body 1 so as to be located on the same optical axis as the semiconductor collimator 3 (ST).
6). In this state, the optical semiconductor 7 is caused to emit light, the fiber collimator 4 is slightly moved on the XY plane, and the fiber collimator 4 is moved to a position where the amount of light coupled to the fiber 15 is maximized.
Is fixed (ST7). Next, the second optical semiconductor collimator 2 is positioned so as to be on the orthogonal axis to the fiber collimator 4.
1 is temporarily fixed to the main body 1 (ST8). In this state, the optical semiconductor 22 emits light, the second optical semiconductor collimator 21 is slightly moved on the XZ plane, and the second optical semiconductor collimator 21 is fixed at a position where the amount of light coupled to the fiber 15 is maximized. (ST9). Note that the wavelength is also changed according to the above-described procedure.

Next, when adding a wavelength, the optical semiconductor module shown in FIG. 2 or 4 is used. When the optical semiconductor module of FIG. 4 is used, the unnecessary third optical semiconductor collimator 33 and the optical coupling unit 34 are removed from the main body 1 and a cover member is attached instead of the optical semiconductor collimator 33. First, in the state of a one-wavelength module, a multiplexer is fixed to the main body 1 as the optical coupling unit 32 (S
T10). In this state, in order to readjust light deviated by the thickness of the multiplexer, the optical semiconductor 7 is caused to emit light, the fiber collimator 4 is slightly moved on the XY plane, and the amount of light coupled to the fiber 15 is maximized. The fiber collimator 4 is fixed at a certain position (ST11). This operation is not necessary if the multiplexer is attached to the main body 1 from the beginning. Less than,
The procedure following ST8 in the optical axis adjustment of the two-wavelength module is followed.

Further, when the transmission / reception module is configured after the above-described wavelength addition, the optical semiconductor module of FIG. 4 is used, and the cover member is removed from the main body 1.
A multiplexer / demultiplexer is fixed to the main body 1 as the optical coupling unit 34 (ST
12). In this state, in order to readjust light deviated by the thickness of the multiplexer / demultiplexer, the optical semiconductor 7 is caused to emit light, the fiber collimator 4 is slightly moved on the XY plane, and the amount of light coupled to the fiber 15 is maximized. The fiber collimator 4 is fixed at the position (ST13). Similarly, the optical semiconductor collimator 2
Adjust 6 as well. This operation is not necessary if the multiplexer / demultiplexer is attached to the main body 1 from the beginning. Next, the third optical semiconductor collimator 33 is temporarily fixed to the main body 1 so as to be located on the axis orthogonal to the fiber collimator 4 (ST1).
4). In this state, the optical semiconductor 22 is caused to emit light, the third optical semiconductor collimator 33 is slightly moved on the XZ plane, and the third optical semiconductor collimator 33 is fixed at a position where the amount of light coupled to the fiber 15 is maximized. (ST15).

Therefore, according to each of the above-described embodiments, the optical semiconductor collimators 3, 21, and 33 and the fiber collimator 4 are each configured as a module and can be attached to and detached from the main body 1, so that the fiber is broken or the LD has an abnormal light emission. Can be easily replaced with optical semiconductors and fibers.
Spare replacement parts can be prevented.

The first embodiment, the fourth embodiment and the fifth embodiment
According to the optical semiconductor module of the embodiment, even if the main body 1 and the fiber collimator 4 have the same shape, if the optical semiconductor 7 is an LD, it becomes a transmission module, and the optical semiconductor 7 is a PD or A.
If it is a PD, it can be configured as a receiving module.

Further, according to the optical semiconductor modules of the second and third embodiments, by attaching the second optical semiconductor collimator 21 and the optical coupling section 32 to the main body 1, the optical semiconductor module of one wavelength can be easily manufactured. It can be changed to an optical semiconductor module having two wavelengths. In addition, the first and second
If one LD and one PD (or APD) are used as the optical semiconductors 7 and 22 of the optical semiconductor collimators 3 and 21, respectively, and a multiplexer / demultiplexer is used as the optical coupling unit 32 instead of the multiplexer, the transmission / reception module can be used. Can easily be configured, and can be applied to various uses such as various measuring instruments typified by an optical pulse tester and communication equipment.

Further, according to the optical semiconductor modules of the fourth and fifth embodiments, in the optical semiconductor collimator 3, only the optical semiconductor 7 can be attached to and detached from the holder 10 attached to the main body 1. Even when is mounted on the main body 1, the selection of the light emitting element or the light receiving element and the change of the wavelength can be performed quickly by replacing only the optical semiconductor 7.

By the way, in the above-described embodiment, a configuration in which one fiber collimator 4 and up to three optical semiconductor collimators 3, 21, and 33 are provided detachably with respect to the main body 1 has been described. Alternatively, a configuration in which a plurality of optical semiconductor collimators are attached and detached may be adopted. In this case, one optical semiconductor collimator is provided in the cavity 6 of the main body 1 on the same optical axis as the fiber collimator 4, and the cavity 6 is branched by the number of the remaining optical semiconductor collimators and penetrated from the wall surface of the main body 1. A multiplexer or a multiplexer / demultiplexer is detachably attached to the branch portion of each cavity 6.

Further, in each of the above-described embodiments, the fiber collimator 4 is configured to be detachably attached to the main body 1 so as to be finely movable in the XY plane. The optical semiconductor collimator 3 attached to and detached from the main body 1 on the same optical axis as the fiber collimator 4 may be configured to be finely movable on the XY plane. At the time of optical axis adjustment in this case, the fiber collimator 4 is fixed to the main body 1, and then the optical semiconductor collimator 3 is temporarily fixed to the main body 1 to cause the optical semiconductor 7 to emit light. The optical semiconductor collimator 3 is fixed at a position where the amount of light to be coupled is maximized.

[0057]

As described above, according to the first aspect of the present invention,
According to the optical semiconductor modules of Nos. 1 to 3, since the optical semiconductor collimator and the fiber collimator are each modularized and can be attached to and detached from the main body, even if the fiber is broken or the light emitting element or the light receiving element becomes abnormal, the light Semiconductors and fibers can be easily replaced, and waste of replacement parts can be prevented. Further, even if the main body and the fiber collimator have the same shape, the optical semiconductor can be configured as a transmitting module if the optical semiconductor is a light emitting element, and the receiving module can be configured if the optical semiconductor is a light receiving element.

According to the optical semiconductor module of the second aspect,
The optical semiconductor module having one wavelength can be easily changed to the optical semiconductor module having two wavelengths. Also, if one light emitting element and one light receiving element are used as the optical semiconductor of the optical semiconductor collimator, and a multiplexer / demultiplexer is used as the optical coupling part, the transmission / reception module can be easily configured, and the optical pulse tester can be used. It can be used for various applications such as various measuring instruments and communication devices.

According to the optical semiconductor module of the third aspect,
Since only the optical semiconductor can be attached to and detached from the holder attached to the main body, the selection of the light emitting element or the light receiving element and the change of the wavelength can be quickly performed by exchanging only the optical semiconductor.

[Brief description of the drawings]

FIG. 1 (a) is a front view of a partial cross section showing a first embodiment of an optical semiconductor module of the present invention. (B) Right side view of the module. (C) Left side view of the module.

2A is a front view of a partial cross section showing a second embodiment of the optical semiconductor module, FIG. 2B is a right side view of the module, and FIG. 2C is a left side view of the module.

FIG. 3 is a block diagram showing a configuration example of an optical pulse tester to which the optical semiconductor module of the second embodiment is applied.

FIG. 4 is a plan sectional view showing a third embodiment of the optical semiconductor module.

FIG. 5 is a block diagram showing a configuration example of an optical pulse tester to which the optical semiconductor module of the third embodiment is applied.

FIG. 6 (a) is a front view of a partial section showing an optical semiconductor module according to a fourth embodiment. (B) Right side view of the module. (C) Left side view of the module.

FIG. 7 is a partial cross-sectional front view showing a fifth embodiment of the optical semiconductor module according to the present invention.

FIG. 8 is a diagram showing a configuration of a conventional optical semiconductor module.

FIG. 9 is a diagram showing a configuration of a conventional optical semiconductor module.

FIG. 10 is a diagram showing a configuration of a conventional optical semiconductor module.

[Explanation of symbols]

DESCRIPTION OF SYMBOLS 1 ... Body, 2 ... Side wall surface, 3, 21, 33 ... Optical semiconductor collimator, 4 ... Fiber collimator, 7, 22 ... Optical semiconductor, 10, 26 ... Holder, 26a, 14a, 18a ... Mounting surface, 11, 25 ... Lens, 20 ... bottom wall surface, 32, 34
... optical coupling part.

──────────────────────────────────────────────────続 き Continuation of front page (56) References JP-A-6-235847 (JP, A) JP-A-3-209206 (JP, A) JP-A-3-145606 (JP, A) JP-A-1- 187509 (JP, A) Japanese Utility Model Showa 60-65705 (JP, U) Japanese Utility Model Showa 59-112209 (JP, U) (58) Fields investigated (Int. Cl. ⁷ , DB name) G02B 6/42 G02B 6 / 32

Claims (3)

(57) [Claims] A lens (11) and an optical semiconductor (7) composed of a light-emitting element or a light-receiving element arranged such that a light-emitting surface or a light-receiving surface is located at a focal position of the lens, are provided on a mounting surface ( 1).
4a) an optical semiconductor collimator (3) provided on a holder (10); a lens (16); and a fiber (1) arranged such that the end face of the core of the fiber is located at the focal position of the lens.
5) is provided on a holder (18) having a mounting surface (18a), and a through hole (6) is formed between opposing wall surfaces (2a, 2b). A body (1) in which the optical semiconductor collimator and the fiber collimator are detachably mounted on opposing wall surfaces that desire the through hole via respective mounting surfaces so that light is coupled between the optical semiconductor and the fiber; The optical semiconductor collimator or the fiber collimator has a play insertion hole in a plane orthogonal to the optical axis with respect to the main body.
The optical semiconductor module, characterized in that mounted for fine movement by. 2. The through-hole (6) is orthogonal to the middle of the through-hole (6) and branches through to another wall (20). The lens (25) and a light-emitting surface or a light-emitting surface at the focal position of the lens (2). A light-emitting element or an optical semiconductor (22) comprising a light-receiving element arranged so that a light-receiving surface is located is provided on a holder (26) having a mounting surface ( 26a ), and another wall surface overlooking the branched through hole is provided. An optical semiconductor collimator (21, 33) detachably mounted on the mounting surface through the mounting surface and finely movable by a play insertion hole in a plane perpendicular to the optical axis thereof; and the optical semiconductor collimator and the fiber collimator (4).
2. The optical semiconductor module according to claim 1, further comprising: an optical coupling section (32, 34) provided at a branch portion of the through hole connecting the first and second through holes. 3. The optical semiconductor module according to claim 1, wherein said optical semiconductor (7, 22) is provided detachably with respect to said holder (10, 26).