JP3011147B2 - Solid actuator manufacturing apparatus, solid actuator manufacturing method, and solid actuator manufacturing apparatus control program recording medium - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an apparatus and method for manufacturing a solid actuator, and a recording medium for a control program for a solid actuator manufacturing apparatus. About.

[0002]

2. Description of the Related Art Generally, after wire bonding, a connection continuity check of the bonding wire is performed. Japanese Patent Application Laid-Open No. 61-12040 discloses a technique for inspecting connection failure of semiconductor bonding. This prior art will be described with reference to FIG.

In FIG. 1, first, one end of a wire 1 is first bonded by crimping a ball 2 to an electrode on a semiconductor chip 4. In the drawings, 5a and 5b are leads (pads), and 3 is a capillary.

After the first bonding is completed, the second bonding
For bonding, the capillary 3 moves onto the lead 5b. On the way, the lead 5a is grounded,
A current 13 is passed from one end of the wire 1 to perform a characteristic test of the chip 4, that is, a continuity test to determine whether there is an electrical connection between the wire 1 and the chip 4. This continuity test
Since the inspection time is short, the inspection can be performed after the end of the first bonding until the second bonding. As a result of the continuity test, it can be checked whether or not bonding has occurred.

[0005]

By the way, a head of an ink jet printer, which is a typical example of a solid actuator, generally has a structure as shown in FIG.
Grooves 11a-1 having an inner surface coated with an electrode layer
1 g has a structure formed on the surface of the substrate 13. The bonding pad 1 is provided on the surface of the substrate 13.
01a to 101c are formed. And the groove 11
b, the electrode and the bonding pad 101a, the electrode coated on the inner surface of the groove 11d, the bonding pad 101b, and the groove 11f.
Are electrically connected to the electrodes coated on the inner surfaces thereof and the bonding pads 101c, respectively. In addition,
The grooves 11a, 11c, 11e and 11g are provided on the common electrode 1
04 is electrically connected.

On the surface of another substrate 14, the substrate 13
Bonding pads 102a to 102c are provided corresponding to the bonding pads 101a to 101c on the surface of the substrate. These corresponding bonding pads are electrically connected by bonding wires. For example, the bonding pad 101b and the bonding pad 102b are electrically connected by the bonding wire 12.

Here, the cross section taken along the line YY in FIG.
This is shown in FIG. As shown in FIG. 2B, the electrode coated on the inner surface of the groove 11d is electrically connected to the bonding pad 101b. Then, the bonding pads 101b on the substrate 13 and the bonding pads 102b on the substrate 14 are electrically connected by the bonding wires 12.

Further, as shown in FIG. 1C, an ink pressure chamber is formed by covering the grooves 11a to 11g with a cover 10 as shown in FIG. Next, the formed ink pressure chamber will be described with reference to FIG.

In FIG. 1, the lids 10 are provided in the grooves 11a to 11g.
12A is a cross section taken along the line ZZ in FIG. As shown in FIG.
The ink is filled alternately with respect to a to 11 g. That is, among the grooves 11a to 11g, the grooves 11b, 11d,
11e is filled with ink.

When a predetermined voltage is applied between the common electrode 104 and the bonding pad 101b to drive the column, the pillars (groove 11d and the groove 11d) adjacent to the groove 11d electrically connected to the bonding pad 101b are driven. 1
1c and the columns between the grooves 11d and 11e) contract. Then, the volume of the ink pressure chamber due to the groove 11d is reduced, and the ink in the chamber is ejected. Printing is performed on unillustrated paper or the like by the ejected ink.

When the substrate 13 is made of a piezoelectric material, it is assumed that a polarization process is performed in advance in the direction of arrow y in FIG.

A case will be considered in which the head of such an ink-jet printer is manufactured by the wire bonding according to the above-described prior art. In such a case, in the above-described related art, only the continuity check between the probe arranged in contact with the wire of the wire bonding apparatus and the bonding pad is performed, and the electrical operation of the solid actuator itself such as the head of the inkjet printer is performed. The disadvantage is that the properties need to be measured again. Further, particularly when the solid actuator is a piezoelectric material such as a head of an ink jet printer, there is a drawback that a work of applying a voltage and orienting molecules in one direction must be performed separately.

SUMMARY OF THE INVENTION The present invention has been made to solve the above-mentioned drawbacks of the prior art, and it is an object of the present invention to eliminate the need to measure only the electrical characteristics of the solid actuator itself again, and to separately perform the polarization process. An object of the present invention is to provide a solid actuator manufacturing apparatus and a manufacturing method which do not need to be provided, and a control program recording medium for a solid actuator manufacturing apparatus.

[0014]

According to the present invention, there is provided an apparatus for manufacturing a solid actuator, comprising: means for performing wire bonding connection to first and second pads provided on a substrate of a solid actuator; Means for performing a continuity check of the first and second pads and the ground pad after the continuity check. Means for performing a characteristic check as to whether or not the characteristic impedance value between the first and second pads and the ground pad is a predetermined value after this check; and
Means for checking whether or not cracks have occurred on the surface of the electrode layer which is electrically connected to the pads of the solid actuator and which is provided on a driving portion driven from the outside in the solid-state actuator; and Means for performing a polarization process.

In the method of manufacturing a solid actuator according to the present invention, a step of performing wire bonding connection to first and second pads provided on a substrate of the solid actuator, and a step of performing continuity check of the bonding-connected wire. A method for performing a capacity check as to whether or not a capacity between the first and second pads and a ground pad is a predetermined value after the continuity check; and Performing a characteristic check as to whether or not a characteristic impedance value between the first and second pads and the ground pad is a predetermined value;
Performing a crack check on the surface of an electrode layer provided on a driving portion that is electrically connected to each of the pads and that is externally driven in the solid actuator, and that the substrate has a crack after the check. Performing a polarization process.

According to the present invention, there is provided a solid-state actuator manufacturing apparatus control program recording medium, comprising: means for connecting a computer to first and second pads provided on a substrate of a solid actuator by wire bonding; Means for checking the continuity of the first and second pads after the continuity check, and means for checking whether the capacity between the first and second pads and the ground pad is a predetermined value. Means for checking whether or not the characteristic impedance value between the second pad and the ground pad is a predetermined value. After the check, the solid-state actuator is electrically connected to the first and second pads, respectively. Whether cracks are formed on the surface of the electrode layer provided on the driving part driven from the outside Means for performing a crack check of emergence, means for performing polarization processing of the substrate after this check,
A program for functioning as a program is recorded.

In short, according to the present invention, a contact needle (probe)
Is brought into contact with the bonding pad, and connection inspection, actuator characteristic inspection, polarization processing, etc. are performed simultaneously with the bonding step, so that the actuator can be manufactured at high speed and the manufacturing process can be simplified. In addition, since the bonding process can be stopped at the same time when the occurrence of the defect is detected, there is an advantage that the subsequent unnecessary production need not be performed.

[0018]

Next, an embodiment of the present invention will be described with reference to the drawings.

FIG. 1 is a diagram showing the configuration of a main part of an embodiment of a solid actuator manufacturing apparatus according to the present invention, and the same parts as those in FIG.
In the figure, the solid-actuator manufacturing apparatus according to the present embodiment is configured to include switches A to D that are controlled to be switched by a control unit described later, and a reel R around which a bonding wire 105 is wound.

The switch A includes probes 103b to 103e.
And bonding wire 1 wound on reel R
The electric connection state of the switch 05 and the switch B and the switch D is switched. The switch B switches the electrical connection between the bonding wire 105 and the probe 103a wound around the reel R and the switch C. The switch C switches the electrical connection state between the ohmmeter 108, the capacitance meter 109, the impedance analyzer 110, the curve tracer 111, the polarization power supply 112, and the switches A and B. Switch D is connected to switches A to C and ground potential 1
13 for switching the electrical connection state.

By controlling these four switches A to D, the electric connection state shown in FIGS. 2 to 5 can be realized.

First, FIG. 2 showing the first bonding process
Referring to FIG. 2, the probe 103 is electrically connected to the bonding pad 101 on the surface of the substrate 13. The probe 103 is connected to the ground potential 113 and the resistance meter 10.
8 is electrically connected to one end. In addition, resistance meter 1
08 is electrically connected to the bonding wire 105 at the other end.

This state can be realized by controlling each switch as follows. That is, the probe 103c in FIG. 1 and the resistance meter 108 are electrically connected by setting the switches A and C. Also, the resistance meter 10 in FIG.
8 and the bonding wire 105 are electrically connected by setting the switches B and C. In addition, if necessary
The probe 103a in the figure and the ground potential 113 are electrically connected by setting the switch D.

In this state, when the tip of the bonding wire 105 is electrically connected to the bonding pad 101c by the wire bonding connection method, if the resistance indicated by the ohmmeter 108 changes from infinity to zero,
This means that the correct bonding connection has been made to the bonding pad 101c.

Referring to FIG. 3 showing a second bonding process performed after the first bonding process of FIG. 2, the probe 103 is electrically connected to the bonding pad 102 on the surface of the substrate 14. . The probe 103 is electrically connected to the ground potential 113 and one end of the resistance meter 108. Further, the other end of the ohmmeter 108 is electrically connected to the bonding wire 105.

This state can be realized by controlling each switch as follows. That is, the probe 103e in FIG. 1 and the ohmmeter 108 are electrically connected by setting the switches A and C. Also, the resistance meter 10 in FIG.
8 and the bonding wire 105 are electrically connected by setting the switches B and C. In addition, if necessary
The probe 103e and the ground potential 113 in FIG.

In this state, if the resistance value indicated by the resistance meter 108 changes from infinity to zero when the intermediate portion of the bonding wire 105 is electrically connected to the bonding pad 102 by the wire bonding connection method,
This means that the correct bonding connection has been made to the bonding pad 102c.

Referring to FIG. 4 showing a crack inspection performed after the first and second bonding processes are completed, the probe 103 is connected to the common electrode 104 on the surface of the substrate 13.
Is electrically connected to And the probe 103
Is electrically connected to the ground potential 113 and one end of the curve tracer 111. Further, the curve tracer 11
The other end of 1 is electrically connected to the bonding wire 105.

This state can be realized by controlling each switch as follows. That is, the probe 103a and the curve tracer 111 in FIG. 1 are electrically connected by setting the switches B and C. In addition, the curve tracer 111 and the bonding wire 105 in the figure are electrically connected by setting the switches A and B. Further, if necessary, the probe 103a in the figure and the ground potential 113 are electrically connected by setting the switch D.

In this state, the curve tracer 11
By measuring the input / output characteristics of the high-frequency signal by the method 1, it is possible to confirm whether or not cracks have occurred on each bonding pad of the solid actuator, that is, on the surface of the electrode. That is, when no crack occurs, impedance matching is achieved, and the input / output characteristics of the high-frequency signal have a uniform waveform. On the other hand, when a crack has occurred, impedance matching is not achieved, and the waveform of the input / output characteristics of the high-frequency signal is disturbed. Therefore, with this curve tracer 111,
It can be checked whether a crack has occurred in the solid actuator.

After confirming whether or not a crack has occurred in the solid actuator, the solid actuator is connected to a capacitance meter 109 or an impedance analyzer 110 instead of the curve tracer 111 to check the characteristics of the solid actuator again. In this case, the connection state may be changed by controlling the switch C.

Finally, as shown in FIG. 5, the polarization power supply 112 is connected, and polarization processing is performed on the solid actuator. Referring to FIG. 5, the probe 103 is electrically connected to the common electrode 104 on the surface of the substrate 13. The probe 103 is electrically connected to the ground potential 113 and one end of the polarization power supply 112. Further, the other end of the polarization power supply 112 is connected to the bonding wire 10.
5 is electrically connected.

This state can be realized by controlling each switch as follows. That is, the probe 103a in FIG. 1 and the polarization power supply 112 are electrically connected by setting the switches B and C. The polarization power supply 112 and the bonding wire 105 in FIG.
Electrical connection by setting Further, if necessary, the probe 103a in the figure and the ground potential 113 are electrically connected by setting the switch D.

In this state, the molecular orientation of the piezoelectric material to which the electric field is applied by the polarization power supply 112 is aligned. This state is a polarization state, and the polarization direction is the direction indicated by the arrow in FIG. 14 described above. When the solid actuator is made of a material other than a piezoelectric material, the polarization process by connecting the polarization power supply 112 is unnecessary.

The switching setting control of each of the switches A to D described above is performed by a control unit as shown in FIG. That is, as shown in FIG.
A control signal is outputted from the switch 20 to each of the switches A to D, thereby electrically connecting the contacts inside the switches A to D. It is assumed that the output control signal is a signal necessary to realize each step of FIGS. 7 to 10 described later.

As shown in FIG. 6B,
Switching setting control of each of the switches A to D may be performed according to a control signal from the CPU. In this case, the control unit 120 may output a control signal in accordance with a command from the CPU 121 to electrically connect the contacts inside the switches A to D. The output control signals are also shown in FIGS.
It is assumed that the signal is a signal necessary to realize each step.

Next, a manufacturing method using the present manufacturing apparatus will be described with reference to flowcharts shown in FIGS.

Referring to FIG. 7, the whole operation of the present manufacturing apparatus is shown. As shown in the figure,
First, in the present apparatus, a short-circuit check is performed using the resistance meter 108 described above (step S61). The short-circuit check in step S61 will be described later in detail with reference to FIG.

Further, the capacitance value and the characteristic impedance are checked using the above-described capacitance meter 109 and impedance analyzer 110 (step S62). The characteristic check in step S62 will be described later in detail with reference to FIG.

It should be noted that, regardless of the order of the short-circuit check, the capacitance value check, and the characteristic impedance check in steps S61 and S62,
It may be performed in the reverse order.

After performing the checks in steps S61 and S62, the processes in steps S63 to S69 are performed. First, as shown in FIG. 2 described above, the first bonding and the continuity check are performed (step S6).
3). Subsequently, as shown in FIG.
Perform bonding and continuity check (step S6)
4).

If there is no problem as a result of the first and second bonding and the continuity check, it is next checked whether or not cracks have occurred on the surface of the electrode layer (step S65). If there is no problem as a result of the crack check, the capacitance value and the characteristic impedance are checked again (step S66).

If there is no problem as a result of this characteristic recheck, if the solid actuator is a piezoelectric material, a polarization process (step S67) and a check on the polarization process (step S68) are performed.

The processing in steps S63 to S68 is performed for all bonding pads (steps S69 → S63 →...). When the processing is completed for all the bonding pads, the operation of the present apparatus ends (step S69 → S70). Step S6
The processing of 3 to S69 will be described later in detail with reference to FIG.

Next, referring to FIG. 8, step S in FIG.
The short-circuit check at 61 will be described in detail. As shown in the figure, first, one of the contact needles in contact with the solid actuator side is connected to the ground pad 104.
Then, the other is brought into contact with the other pad 101b. That is, the switches A to D are controlled so that an ohmmeter is connected between the electrode layers of two adjacent grooves (driven portions) (step S71). The ohmmeter checks whether a short circuit has occurred. If the short circuit has not occurred, the electrode layers of the next two adjacent grooves are checked (steps S72 → S73).

If there is a short circuit, a notification that a failure has occurred is given and the operation is terminated (steps S72 → S74 → S7).
6).

This short-circuit check is performed for all of the electrode layers of two adjacent grooves, that is, for all contact needles (all pads) (steps S75 → S72 →).
…).

Next, referring to FIG. 9, step S in FIG.
The characteristic check at 62 will be described in detail. As shown in the figure, first, one of the contact needles in contact with the solid actuator side is connected to the ground pad 104.
Then, the other is brought into contact with the other pad 101b. That is, the switches A to D are controlled so that the capacitance meters are connected between the electrode layers of the two adjacent grooves (step S8).
1). It is checked whether or not the capacitance value measured by the capacitance meter is a predetermined value. If the capacitance value is the predetermined value, the switches A to D are controlled to connect an impedance analyzer instead of the capacitance meter (step S83). .

It is checked whether or not the characteristic impedance value measured by the impedance analyzer is a predetermined value. If the value is the predetermined value, the contact needle of the electrode layer of the next two adjacent grooves, that is, the next contact needle 103c (Steps S84 → S85 → S8)
6).

The above check is performed for all contact needles, that is, for all pads (step S85 →
S88).

If the capacitance value or the characteristic impedance value is not the default value, a notification that a failure has occurred is given and the operation is terminated (steps S82 → S87 → S88, step S84 →
S87 → S88).

Further, steps S63 to S69 in FIG.
The first and second bonding, crack check, and other processing will be described with reference to FIG. First,
The connection is switched by controlling the switches A to D (step S9)
1). After this switching, the first bonding and its conduction check are performed (steps S92 → S93). If the continuity is confirmed as a result of the continuity check, the second bonding and the continuity check are performed (step S94).
→ S95 → S96).

As a result of the continuity check, if it is confirmed that the continuity is established, the switches A to D are controlled to switch the connection (steps S97 → S98). After this switching, it is checked whether a crack has occurred (step S9).
9). As a result of the crack check, if no problem occurs, the characteristic re-check and the polarization process are sequentially performed (Step S).
99 → S100 → S101 → S102 → S103 → S1
04).

The above processing is sequentially performed on the electrode layer surfaces of two adjacent grooves until the processing for all contact needles is completed (S105 → S106 → S91 →
…). That is, the above processing is performed on the contact needles 103b, 103c... And the pads 101b, 101c.
When the processing for all the contact needles ends, the operation ends (step S105 → S108).

In step S94 or S97, if there is a problem as a result of the continuity check, the occurrence of a failure is notified, and the operation ends (step S94 → S10).
7 → S108, step S97 → S107 → S10
8). In step 99, if a problem has occurred as a result of the crack check, the occurrence of a failure is notified, and the operation ends (steps S100 → S107 → S10).
8).

As a result of the characteristic recheck, if a problem has occurred, the occurrence of a failure is notified, and the operation ends (steps S102 → S107 → S108). If a problem has occurred as a result of the polarization processing, a notification that a failure has occurred is given, and the operation ends (steps S104 → S107 → S10).
8).

The crack check, the characteristic recheck, and the polarization check described above may be performed in any order, regardless of the check order.

By the way, by preparing a recording medium on which a program for realizing each of the processes shown in FIGS. 7 to 10 described above is recorded and using this to control each switch in FIG.
Obviously, operations similar to those described above can be performed. As this recording medium, various recording media can be used in addition to the semiconductor memory and the magnetic disk device not shown in FIG.

It is apparent that the same operation as described above can be performed by controlling the computer with the program recorded on the recording medium. As this recording medium, various recording media other than the semiconductor memory and the magnetic disk device can be used.

The present invention can take the following aspects in connection with the description of the claims.

(1) The solid-state actuator according to any one of claims 1 to 8, wherein the continuity check is performed by connecting an ohmmeter to the wire and the first and second pads. manufacturing device.

(2) The solid actuator manufacturing apparatus according to claim 1, wherein the capacitance check is performed by connecting a capacitance meter to the first and second pads and a ground pad.

(3) The apparatus according to claim 2, wherein the characteristic check is performed by connecting an impedance analyzer to the first and second pads and a ground pad.

(4) The apparatus according to claim 3, wherein the crack check is performed by connecting a curve tracer to the electrode.

(5) The solid-state actuator according to any one of claims 9 to 16, wherein the continuity check is performed by connecting an ohmmeter to the wire and the first and second pads. Production method.

(6) The method according to claim 9, wherein the capacitance check is performed by connecting a capacitance meter to the first and second pads and a ground pad.

(7) The method according to claim 10, wherein the characteristic check is performed by connecting an impedance analyzer to the first and second pads and the ground pad.

(8) The method for manufacturing a solid actuator according to claim 11, wherein the crack check is performed by connecting a curve tracer to the electrode.

(9) The manufacturing of a solid actuator according to any of claims 17 to 24, wherein the continuity check is performed by connecting an ohmmeter to the wire and the first and second pads. Device control program recording medium.

(10) The recording medium according to claim 17, wherein the capacitance check is performed by connecting a capacitance meter to the first and second pads and a ground pad. .

(11) The recording medium according to claim 18, wherein the characteristic check is performed by connecting an impedance analyzer to the first and second pads and a ground pad. .

(12) The recording medium according to claim 19, wherein the crack check is performed by connecting a curve tracer to the electrode.

(13) An apparatus for manufacturing a solid actuator, wherein the solid actuator is an ink jet head of a printer.

(14) A method for manufacturing a solid actuator, wherein the solid actuator is an ink jet head of a printer.

(15) The solid actuator manufacturing apparatus control program recording medium, wherein the solid actuator is an ink jet head of a printer.

[0076]

As described above, according to the present invention, the contact needle is brought into contact with the bonding pad, and the connection inspection, the characteristic inspection of the actuator, the polarization processing, etc. are performed simultaneously with the bonding step, so that the actuator can be manufactured at a high speed. In addition, there is an effect that the manufacturing process can be simplified. In addition, since the bonding process can be stopped at the same time when the occurrence of the defect is detected, there is also an effect that the subsequent useless production need not be performed.

[Brief description of the drawings]

FIG. 1 is a diagram showing a configuration of a main part of a solid actuator manufacturing apparatus according to an embodiment of the present invention.

FIG. 2 is a diagram illustrating a connection state of a contact needle and an ohmmeter in a first bonding and a continuity check in the solid actuator manufacturing apparatus of FIG. 1;

FIG. 3 is a view showing a connection state of a contact needle and an ohmmeter in a second bonding and a continuity check in the solid actuator manufacturing apparatus of FIG. 1;

FIG. 4 is a view showing a connection state of a contact needle and a curve tracer in a crack check in the solid actuator manufacturing apparatus of FIG. 1;

5 is a diagram showing a connection state of a contact needle and a polarization power supply in a polarization process in the solid actuator manufacturing apparatus of FIG.

6A is a diagram illustrating an example of a connection relationship between each switch and a control unit, and FIG. 6B is a diagram illustrating another example of a connection relationship between each switch and a control unit;

FIG. 7 is a flowchart showing an operation of the solid actuator manufacturing apparatus of the present invention.

FIG. 8 is a flowchart showing a detailed operation of the solid actuator manufacturing apparatus in the short-circuit check in FIG. 6;

9 is a flowchart showing a detailed operation of the solid-state actuator manufacturing apparatus in checking a capacitance value and an impedance characteristic in FIG. 6;

FIG. 10 is a flowchart showing a detailed operation of the solid-state actuator manufacturing apparatus in bonding and conduction check, crack check, and property check polarization check in FIG. 6;

FIG. 11 is a diagram illustrating a general semiconductor bonding connection failure inspection process.

12A is a perspective view illustrating a structure of a head of an inkjet printer, and FIGS. 12B and 12C are cross-sectional views illustrating a structure of a head of the inkjet printer.

FIG. 13 is a cross-sectional view illustrating a structure of an inkjet head in a state where ink is filled.

FIG. 14 is a sectional view showing a polarization state of the ink jet head.

[Explanation of symbols]

 13, 14 Substrate 103, 103a to 103e Probe 105 Bonding wire 108 Resistance meter 109 Capacitance meter 110 Impedance analyzer 111 Curve tracer 112 Polarized power supply A to D Switch R reel

Claims (24)

(57) [Claims] 1. A solid actuator manufacturing apparatus comprising: means for performing wire bonding connection to first and second pads provided on a substrate of a solid actuator; and means for checking continuity of the wire connected by bonding. The first and the second after the continuity check.
A solid-state actuator manufacturing device including means for checking whether or not the capacitance between the pad and the ground pad is a predetermined value. 2. A solid actuator manufacturing apparatus comprising: means for performing wire bonding connection to first and second pads provided on a substrate of a solid actuator; and means for checking continuity of the wire connected by bonding. The first and the second after the continuity check.
A solid-state actuator manufacturing apparatus, comprising means for checking whether or not the characteristic impedance value between the pad and the ground pad is a predetermined value. 3. An apparatus for manufacturing a solid actuator, comprising: means for performing wire bonding connection to first and second pads provided on a substrate of a solid actuator; and means for checking continuity of the wire connected by bonding. The first and the second after the continuity check.
Wherein the solid actuator includes means for checking whether a crack has occurred on the surface of an electrode layer provided on a driving portion which is electrically connected to each of the pads and which is externally driven in the solid actuator. Actuator manufacturing equipment. 4. An apparatus for manufacturing a solid actuator, comprising: means for performing wire bonding connection to first and second pads provided on a substrate of a solid actuator; and means for checking continuity of the wire connected by bonding. And a means for performing a polarization process on the substrate after the continuity check. 5. A solid actuator manufacturing apparatus including means for performing wire bonding connection to first and second pads provided on a substrate of a solid actuator, and means for checking continuity of the wire connected by bonding. The first and the second after the continuity check.
Means for checking whether the capacitance between the pad and the ground pad is a predetermined value, and after this check, the characteristic impedance value between the first and second pads and the ground pad is a predetermined value. Means for performing a characteristic check as to whether or not there is, on the surface of an electrode layer provided on a driving portion which is electrically connected to the first and second pads and which is driven from the outside in the solid-state actuator after the check; An apparatus for manufacturing a solid actuator, comprising: means for checking whether a crack has occurred, and means for performing polarization processing of the substrate after the check. 6. A solid actuator manufacturing apparatus comprising: means for performing wire bonding connection to first and second pads provided on a substrate of a solid actuator; and means for checking continuity of the wire connected by bonding. A solid actuator manufacturing apparatus, further comprising means for checking for short-circuit between the first and second pads and a ground pad before the continuity check. 7. An apparatus for manufacturing a solid actuator, comprising: means for performing wire bonding connection to first and second pads provided on a substrate of a solid actuator; and means for checking continuity of the wire connected by bonding. Wherein the first and the second are performed before the continuity check.
A solid-state actuator manufacturing device including means for checking whether or not the capacitance between the pad and the ground pad is a predetermined value. 8. A solid actuator manufacturing apparatus including means for performing wire bonding connection to first and second pads provided on a substrate of a solid actuator, and means for checking continuity of the wire connected by bonding. Wherein the first and the second are performed before the continuity check.
A solid-state actuator manufacturing apparatus, comprising means for checking whether or not the characteristic impedance value between the pad and the ground pad is a predetermined value. 9. A method of manufacturing a solid actuator, comprising the steps of: performing a wire bonding connection to first and second pads provided on a substrate of a solid actuator; and performing a continuity check on the bonded wire. Wherein after the continuity check, the first
And a step of performing a capacity check as to whether or not a capacity between the second pad and the ground pad is a predetermined value. 10. A method of manufacturing a solid actuator, comprising the steps of: performing a wire bonding connection to first and second pads provided on a substrate of a solid actuator; and performing a continuity check on the bonded wire. And performing a characteristic check as to whether a characteristic impedance value between the first and second pads and a ground pad is a predetermined value after the continuity check. . 11. A method for manufacturing a solid actuator, comprising the steps of: performing a wire bonding connection to first and second pads provided on a substrate of a solid actuator; and performing a continuity check on the bonded wire. Wherein, after the continuity check, whether cracks are generated on the surface of the electrode layer provided on a driving portion that is electrically connected to the first and second pads and that is externally driven in the solid-state actuator. Performing a crack check of the solid actuator. 12. A method for manufacturing a solid actuator, comprising the steps of: performing a wire bonding connection to first and second pads provided on a substrate of a solid actuator; and performing a continuity check on the bonding-connected wires. And a step of performing a polarization process on the substrate after the continuity check. 13. A method of manufacturing a solid actuator, comprising the steps of: performing a wire bonding connection to first and second pads provided on a substrate of a solid actuator; and performing a continuity check on the bonded wire. Performing a capacitance check as to whether or not the capacitance between the first and second pads and the ground pad is a predetermined value after the continuity check; and after performing the check, the first and second pads Performing a characteristic check to determine whether or not the characteristic impedance value between the first and second pads is a predetermined value. After this check, cracks are formed on the surfaces of the electrodes electrically connected to the first and second pads, respectively. A step of performing a crack check to determine whether a crack has occurred, and a step of performing a polarization process on the substrate after the check. And a method for manufacturing a solid actuator. 14. A method of manufacturing a solid actuator, comprising the steps of: performing a wire bonding connection to first and second pads provided on a substrate of a solid actuator; and performing a continuity check on the bonding-connected wires. A method for manufacturing a solid actuator, comprising a step of checking for a short circuit between the first and second pads and a ground pad before the continuity check. 15. A method of manufacturing a solid actuator, comprising: performing a wire bonding connection to first and second pads provided on a substrate of a solid actuator; and performing a continuity check on the bonded wire. And a step of performing a capacity check of whether or not a capacity between the first and second pads and a ground pad is a predetermined value before the continuity check. 16. A method of manufacturing a solid actuator, comprising the steps of: performing a wire bonding connection to first and second pads provided on a substrate of a solid actuator; and performing a continuity check on the bonded wire. Wherein a step of performing a characteristic check on whether a characteristic impedance value between the first and second pads and a ground pad is a predetermined value before the continuity check is included. Method. 17. A computer, comprising: means for performing wire bonding connection to first and second pads provided on a substrate of a solid actuator; means for performing continuity checking of the wire connected by bonding; A program for recording a program for functioning as a solid actuator manufacturing apparatus control program, wherein a program for functioning as a means for checking whether or not the capacitance between the first and second pads and the ground pad is a predetermined value is recorded. recoding media. 18. A computer, comprising: means for performing wire bonding connection to first and second pads provided on a substrate of a solid actuator; means for performing continuity check of the wire connected by bonding; A solid-state actuator manufacturing apparatus having recorded thereon a program for functioning as a means for checking whether or not a characteristic impedance value between the first and second pads and a ground pad is a predetermined value. Control program recording medium. 19. A computer, comprising: means for performing wire bonding connection to first and second pads provided on a substrate of a solid actuator; means for performing continuity checking of the wire connected by bonding; Means for checking whether a crack has occurred on the surface of an electrode layer which is electrically connected to the first and second pads, respectively, and which is provided on a driving portion driven from the outside in the solid-state actuator, A recording medium for controlling a solid actuator manufacturing apparatus, wherein a program for causing the program to function is recorded. 20. A computer, comprising: means for performing wire bonding connection to first and second pads provided on a substrate of a solid actuator; means for performing continuity checking of the wire connected by bonding; A program recording medium for controlling a solid actuator manufacturing apparatus, wherein a program for functioning as a means for performing a polarization process of the substrate is recorded. 21. A computer, comprising: means for performing wire bonding connection to first and second pads provided on a substrate of a solid actuator; means for performing continuity checking of the wire connected by bonding; Means for checking whether or not the capacitance between the first and second pads and the ground pad is a predetermined value, and the characteristic between the first and second pads and the ground pad after this check. Means for performing a characteristic check as to whether or not the impedance value is a predetermined value; and after the check, a means for electrically connecting to the first and second pads, respectively, which is provided in a drive portion driven from the outside in the solid-state actuator. Means for checking whether a crack has occurred on the surface of the electrode layer, A recording medium for controlling a solid-actuator manufacturing apparatus, wherein a program for functioning as a means for performing a polarization process is recorded. 22. A computer, comprising: means for performing wire bonding connection to first and second pads provided on a substrate of a solid actuator; means for performing continuity checking of the bonding-connected wires; A program for functioning as a means for checking the presence or absence of a short circuit between the first pad and the second pad. 23. A computer, comprising: means for performing wire bonding connection to first and second pads provided on a substrate of a solid-state actuator; means for performing continuity checking of the wire connected by bonding; A program for functioning as a means for checking whether or not the capacity between the first and second pads and the ground pad is a predetermined value. Program recording medium. 24. A computer, comprising: means for performing wire bonding connection to first and second pads provided on a substrate of a solid actuator; means for performing continuity checking of the wire connected by bonding; A program for functioning as a means for checking whether or not a characteristic impedance value between the first and second pads and a ground pad is a predetermined value. Device control program recording medium.