JP3009285U - Cooling structure suitable for heat transfer - Google Patents

Abstract

(57) [Abstract] [Purpose] To provide a cooling structure suitable for heat transfer. [Structure] Mainly includes an electronic cooling element 1 using a semiconductor, a heat pipe 2, a heat dissipation board 3 and a fixed board 4. The electronic cooling element 1 is connected to a DC power source 5, and a cold surface generated after energization is a cooling medium. On the surface of the body 6, the heat surface is flatly attached to the flat end of the heat dissipation board 3, the other surface of the heat dissipation board 3 has some grooves 31, and the main body of the heat pipe 2 has an evaporation portion 21, It is divided into a heat insulating portion 22 and a condensation portion 23, the evaporation portion 21 is embedded in the groove 31 of the heat dissipation substrate 3, the condensation portion 23 is connected to the heat dissipation system, and the heat pipe 2 is combined with the fixed substrate 4 having a groove. The cooling medium 6, the heat dissipation board 3 and the fixed board 4 are connected by the screw 41,
Further, when the screw 41 penetrates the fixed substrate 4 and the heat dissipation substrate 3, the screw 41 is provided with one bush 42 to be insulated.

Description

[Detailed description of the device]

[0001]

[Industrial applications]

 The present invention relates to a type of electronic cooling structure, and more particularly, to a type of cooling structure suitable for heat transfer, in which an electronic cooling element is combined with a heat pipe, a heat dissipation substrate and a fixed substrate.

[0002]

[Prior art]

 The electronic cooling (freezing) element achieves the purpose of freezing, cooling, or cooling simply by passing an electric current, and no large cooling equipment is required, so that it exerts its effect in a narrow place.

[0003]

[Problems to be solved by the device]

 An object of the present invention is to provide an electronic cooling device having a further improved cooling effect.

[0004]

[Means for Solving the Problems]

 The cooling structure suitable for heat transfer of the present invention mainly includes an electronic cooling element using a semiconductor, a heat pipe, a heat dissipation board and a fixed board, and the electronic cooling element formed of the semiconductor is connected to a DC power source. After the power is turned on, a cold surface and a hot surface are generated. Among them, the cold surface is stuck flat on the surface of the cooling medium, and the hot surface is stuck flat on the flat end of the heat dissipation board. The other surface of the heat pipe has a slight groove, and the body of the heat pipe is divided into an evaporation portion, a heat insulation portion and a condensation portion, and the evaporation portion is provided by being embedded in the groove of the heat dissipation substrate. Is connected to a heat dissipation system, and the fixed board having a groove is further combined, and the cooling medium, the heat dissipation board and the fixed board are connected by a screw, and the screw penetrates the fixed board and the heat dissipation board. Screw, the screw Insulated by ssing.

[0005]

[Action]

 The present invention mainly connects a heat pipe to an electronic cooling element that uses a semiconductor, transfers the amount of heat generated by the electronic cooling element through the heat pipe, transfers the amount of heat to the other end of the heat pipe, and Alternatively, the amount of heat is conducted and released quickly by circulating cooling of the liquid. Alternatively, a pair of heat pipes according to the present invention may be combined to conduct heat effectively by the transfer, further enhancing the effect of the semiconductor cooling device.

[0006]

【Example】

 FIG. 1 is an exploded perspective view of an embodiment of the present invention. The present invention mainly relates to an electronic cooling element (1) using a semiconductor, a heat pipe (2), and a heat dissipation board (3) having an effect of combining the electronic cooling element (1) and the heat pipe (2). Includes large components such as fixed board (4).

Among them, a high-purity bismuth (BI) and tellurium (TE) alloy is used as a semiconductor material of the electronic cooling element (1) using a semiconductor to form a P-type semiconductor and an N-type semiconductor. . The thermoelectric cooler (1) is connected to the external DC power supply (5), and after energization, it emits heat from the cold surface (forming the heat absorption surface based on the principle of energy transfer) and the heat surface (based on the principle of energy transfer). Form a surface). The cold side is stuck flat on the surface of the cooling medium (6), and the hot side is stuck flat on the side surface which is the plane of the heat dissipation board (3). The heat dissipation substrate (3) has a heat conduction function, and two grooves (31) are provided on the other surface thereof. The groove (31) serves to embed the heat pipe (2).

The heat pipe (2) is divided into three parts, as shown in FIG. That is, the evaporation part (21), the adiabatic part (22) (This is a heat transfer path that exhibits a temperature difference that is not so obvious during rapid heat transfer, and its action is a slight heat transfer process.) , And the condensation part (23). In addition, the inner surface of the heat pipe (2) is covered with a layer of porous capillary wick (24) (WICK). The space in the middle of the heat pipe (2) is a vapor cavity (25) (VAPOR SPACE), the evaporation portion (21) of the heat pipe (2) is mounted on the groove (31) of the heat dissipation substrate (3), and It is combined with the fixed board (4) having two grooves and the screw (41), and the cooling medium (6), the heat dissipation board (3) and the fixed board (4) are flatly stuck together to form one body. To be done. In addition, when the screw (41) penetrates the heat dissipation board (3) and the fixed board (4), one bushing (42) (see FIG. 3) must be provided to insulate and support the screw (41). This prevents the fixed substrate (4) from transferring heat energy from the screw (41) to the surface of the cooling medium (6) and affecting the cooling effect of the cooling medium (6). At the same time, a slight heat radiation fin (7) is provided on the condensation portion (23) (that is, the heat radiation portion) of the heat pipe (2), so that it is used for heat radiation.

The present invention has the above-mentioned structure, its application is very wide, and it can be used by connecting to a general DC power supply. Hereinafter, an embodiment in which the present invention is applied to an automobile ice box will be described: As shown in FIG. 4, a cooling medium (6) (in this application example, an ice box) and an electronic cooling element using a semiconductor. The cooling surface of (1) is bonded, and the hot surface and the heat dissipation board (3) are bonded. When the electronic cooling element (1) is passed through a DC power source to generate a cold surface and a hot surface, the heat energy of the hot surface passes through the heat dissipation substrate (3) and the evaporation portion (21) of the heat pipe (2) (ie, It is absorbed in the heat absorption part), absorbed in the evaporation part and quickly conducted to the condensation part (23) (that is, the heat dissipation part), and further combined with the heat dissipation fin (7) and the fan (8), the forced air cooling method or The heat is quickly diffused by other cooling methods. As a result, the heat of the cooling medium (6) (ice box) is quickly absorbed by the cold surface of the electronic cooling element (1), and the purpose of cooling the object waiting for cooling in the ice box is reached. Also, when the heat on the hot side of the thermoelectric cooler (1) is spread quickly, the temperature on the cold side becomes lower and lower, so that the heat of the cooling medium (6) becomes more and more easily. It is absorbed by the cold surface of 1) and achieves the effect of cooling or freezing.

The point to be clarified here is that the present invention is a heat dissipation method and is not limited to the air-cooling method. Of course, a water-cooling method of circulating water flow may be combined according to actual demand. Alternatively, one or a plurality of sets of heat pipes may be additionally provided, and the heat radiation effect can be similarly achieved. And the method of heat dissipation is not the scope of the present invention. Any of general air-cooled type, water-cooled type and other types can be used in combination with the present invention.

In addition, when a direct current passes through a joint surface of two different metals or semiconductors, it may generate a heat absorption (cooling) or heat dissipation (heating) phenomenon, but if the direct current flows in the opposite direction. When the DC power supply is connected in reverse to the electronic cooling element (1) using the semiconductor, the cold surface and the hot surface of the electronic cooling element (1) are different from each other. . That is, the original hot surface changes to a cold surface and the original cold surface changes to a hot surface. Therefore, the cooling medium is changed to a heating medium, and therefore, the heat absorbing portion (evaporating portion) of the heat pipe (2) is changed to a heat radiating portion, and the original heat radiating portion (condensing portion) is a heat absorbing portion. In this way, the polarity of the DC power supply can be used to change the cold heat of the thermoelectric cooling device using semiconductors, and it is possible to design either a cooling system or a heating system according to demand. In addition, the present invention may attach one or more sets of heat pipes to the hot surface of the electronic cooling element at the same time, and the heat pipes may be a single tube combination, a two tube combination, or a multiple tube combination. Design as required for the cooling medium or heating medium.

[0012]

[Effect of device]

 The present invention uses a phenomenon in which a DC power source is connected to an electronic cooling element using a semiconductor, a cold surface and a hot surface are generated when an electric current is applied to the electronic cooling element, and a good heat transfer effect of a heat pipe is used. By combining the above, the efficiency of the cooling medium or the heating medium can be increased. Moreover, the present invention can be widely applied.

[Brief description of drawings]

FIG. 1 is an exploded perspective view of the present invention.

FIG. 2 is a cross-sectional view of a heat pipe of the present invention.

FIG. 3 is a partial sectional view of the present invention.

FIG. 4 is a perspective view of an embodiment applied to an automobile ice box of the present invention.

[Explanation of symbols]

1 ... Electronic cooling element 2 ... Heat pipe 3 ...
・ Heat dissipation substrate 4 ・ ・ ・ Fixed substrate 5 ・ ・ ・ DC power supply 6 ・ ・ ・ Cooling medium 31 ・ ・ ・ Groove 21 ・ ・ ・ Evaporation part 22 ・ ・ ・ Heat insulation part 23 ・ ・ ・ Condensation part 24 ・ ・ ・ Wick 25 ...
Vapor cavity 41 ・ ・ ・ Screw 42 ・ ・ ・ Adiabatic bushing 7 ・ ・ ・
Heat dissipation fin 8 ・ ・ ・ Fan

Claims (1)

[Scope of utility model registration request] 1. An electronic cooling element mainly using a semiconductor,
It includes a heat pipe, a heat dissipation board and a fixed board, of which the electronic cooling element is connected to a DC power source, the cold surface generated after energization is the surface of the cooling medium, and the hot surface is the flat end of the heat dissipation board. And the other surface of the heat dissipation substrate has a slight groove, and the main body of the heat pipe is divided into an evaporation portion, a heat insulation portion and a condensation portion, and the evaporation portion is filled in the groove of the heat dissipation substrate. The fixing part is connected to a heat dissipation system, and the fixed substrate having a groove is further combined, and the cooling medium, the heat dissipation substrate and the fixed substrate are connected by a screw, and the screw is fixed. A cooling structure suitable for heat transfer, in which a screw is provided with one bush to insulate the board and the heat dissipation board when the board penetrates the board.