JP3000808B2 - Electronic component supply device - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an electronic component supply apparatus for mounting chips discharged from a chute on a substrate.

[0002]

2. Description of the Related Art Semiconductor chips such as SOP and QFP
As a means for supplying the electronic component mounting apparatus, a tube feeder is known in addition to the tape feeder and the tray feeder.

[0003] The tube feeder includes a tube stocker for holding a tube containing chips in a forwardly inclined state,
In connection with this, a chute portion for sliding down the chip and a chip receiving member for receiving the chip discharged from the chute portion are provided (for example, Japanese Patent Laid-Open No. 2-271699 proposed earlier by the present applicant). No., etc.).

FIG. 8 is a plan view showing a process until a chip delivered from a conventional tube feeder is mounted on a substrate positioned in an electronic component mounting apparatus.

In FIG. 8, X1 is the X table on the electronic component mounting apparatus side, Y1 is the same Y table, 1 is the substrate positioned on these XY tables X1 and Y1, MX and MY are the tables X1 and Y1. A driving motor, H is a transfer head, and N is a nozzle held by the head H and sucking the chip P. TF is a tube feeder,
B is a tube stocker, A is a chute, and C is a chip P receiving material.

[0006]

Here, the chip P, which has reached the receiving material C through the tube stocker B and the chute A, is picked up by the nozzle N of the transfer head H, and finally reaches a predetermined position on the substrate 1. Implemented on location. However, the position and posture of the chip P that has reached the receiving material C by sliding down the chute portion A as indicated by an arrow NY are generally not constant as shown in the figure. Therefore, in the technique using the conventional tube feeder, the chip P on the receiving material C cannot be directly mounted on the substrate 1 by the nozzle N without correcting the displacement.

Therefore, first, the chip P on the receiving material C is picked up by the nozzle N, and is once mounted on another position shift correction stage D (see the solid arrow). And the fixed nail L1,
This stage D is moved by a position regulating means such as a movable claw L2.
The upper chip P is set as an ideal position / posture (see a broken line). Thereafter, the chip P is picked up again by the nozzle N and mounted on the substrate 1 (see the broken arrow).

However, in the field of mounting electronic components on a substrate, it is required to mount a large number of chips P in a short time.
The mounting cannot be performed unless it goes through a position shift correction stage provided separately from the tube feeder and the substrate, and there is a problem that a loss time is inevitable.

Accordingly, an object of the present invention is to provide an electronic component supply device capable of mounting chips quickly.

[0010]

According to the present invention, there is provided a receiving member for chips, and a receiving position for connecting the receiving member to a lower end of the chute portion in a forwardly inclined posture to receive chips discharged from the chute portion; a Y-direction moving means for moving the chips received instead the orientation in a horizontal posture from the stoop between two positions of the pick-up position to pass to the transfer head in the Y direction, the Y direction
With the movement in the Y direction by the direction moving means,
X direction moving means for moving X in the X direction, and a pickup
The X-direction moving means having an X-claw and a Y-claw
And the X-direction moving means moves the receiving material in the X and Y directions.
And insert the tip on the receiving material into these X nails and Y nails.
There is provided a position regulating means for correcting the displacement of the chip on the receiving material by abutting .

[0011]

[Action] smoothly fraud and mitigating risk chute to the above configuration, chips delivery to the receiving material of the chip transport section, Y-direction moving hands
Transferred to the pickup position of the transfer head by the step
However, at this time, the receiving material is moved in the Y direction by the Y direction moving means.
With the movement, the receiving material is also moved in the X direction,
The displacement is corrected by bringing the chip into contact with the X nail and the Y nail of the position regulating means . That is, the chip is
When transferring from the picking position to the pickup position,
A shift correction is performed. Thus, chips on the receiving material, there is no need to bypass the like position correcting stage, transfer
When picked up by the head, it is mounted on the substrate as it is. Therefore, it is possible to reduce the loss time due to the detour and realize the quick mounting.

[0012]

Next, an embodiment of the present invention will be described with reference to the drawings.

FIG. 1 is a perspective view showing an electronic component supply device of the present embodiment, FIG. 2 is a perspective view of a chip transfer section, and FIGS. 3 to 7 are explanatory views of the operation of the transfer section. In FIG. 1, the same components as those in FIG. 8 showing the conventional device are denoted by the same reference numerals, and description thereof will be omitted. R is a conveyor for positioning the substrate 1.

Reference numeral BA denotes a base on which a number of tube feeders TF are juxtaposed. Reference numeral 2 denotes a base material of the tube feeder TF, and reference numeral 3 denotes a base standing upright on the base material 2. The chute portion A is mainly composed of the tunnel body 4, and the tunnel body 4 is configured to be inclined on the base 3 in a forwardly inclined posture. The chute A slides down the chip P sent from the tube 8.

B is a tube stocker, of which 5
Is a long plate-shaped frame connected to the upper part of the tunnel body 4, and brackets 6, 7 for positioning the upper end and the lower end of the tube 8 are provided upright at both ends thereof. This tube 8 has a thin tube shape, and SOP and Q
Many chips P such as FPs are stored. Tube 8
Are stacked in a forwardly inclined posture, and the empty lowermost tube 8 is dropped from the frame 5 and collected.

Reference numeral C denotes a chip transfer section provided below the chute section A and supported movably on the base BA in the direction of the arrow. Reference numeral 11 denotes a transfer table provided with all the components of the chip transfer unit C. SC is a feed screw screwed into a feed nut in the transfer table 11, and is rotatably supported by a bearing BG. This feed screw S
C is a drive motor. Accordingly, when the motor MX2 is driven, the chip transfer section C is moved onto the base BA as shown in FIG.
In the direction of the arrow (X direction).
Can be positioned at the front of the tube feeder TF to supply the chips P to the nozzles N of the transfer head H.
That is, the feed screw SC and the motor MX2 are
The receiving material 14 is moved to the predetermined tube by moving the
First X-direction moving means located at the front of feeder TF
It has become. Now, the chip transfer section C will be described in detail with reference to FIG.

GY is a Y guide provided substantially at the center of the transfer table 11, and 12 is a Y-movable movable in the Y-direction on the transfer table 11 by a slider SY slidably engaged with the Y guide GY. Plate and GX are X guides provided on the Y moving plate 12, 13 is an X moving plate which is movable in the X direction on the Y moving plate 12 by the slider SX, 14
Is a receiving material of the chip P. The front surface of the receiving member 14 is hinged to the front surface of the X-moving plate 13 by a hinge 13a, and a step 14a that engages with the lower portion of the chip P is provided in front of the upper surface. When the chip P is engaged with the step 14a, the suction hole 14 is opened toward substantially the center of the lower surface of the chip P.
b (see FIG. 7) is opened, and the suction hole 14b communicates with the suction means V. Therefore, the receiving member 14 can be moved in the X and Y directions, and can be set in the horizontal posture or the forward inclined posture by the hinge 13a.

KX is a tension spring interposed between the Y moving plate 12 and the X moving plate 13 in the X direction, and KZ is interposed between the Y moving plate 12 and the rear of the X moving plate 13 in the Z direction. It is a pull spring. Reference numeral 15 denotes a shaft having one end inserted into the rear portion of the receiving member 14 in the X direction, F1 denotes a Z cam follower rotatably mounted on the other end of the shaft 15,
C1 is a Z cam having a profile surface C1a which faces in the Y direction and is horizontally in contact with the Z cam follower F1. This Z cam C1 is provided near the middle of the edge of the transfer table 11 on the near side in FIG. 2, and the tracing surface C1a is inclined upward as it approaches the tunnel body 4 from horizontal. Reference numeral 16 denotes a connecting rod connected from the X moving plate 13 to the back side in the X direction, F2 denotes an X cam follower which is attached at a fixed position on the back side of the connecting rod 16, and C2 denotes the Z of the transfer table 11. The X cam follower F2 is provided on the opposite side of the cam C1 in the Y direction, and has a surface C2a on which the X cam follower F2 vertically contacts. This profile surface C2a
There are a portion parallel to the Y direction and a portion which is inclined at the front side of the transfer table 11 toward the center of the table 11.

Reference numeral 17 denotes a positioning rod standing on the transfer table 11 as a position restricting means for correcting the positional deviation of the chip P on the receiving member 14 at the pickup position Q, as will be described later. Has an L-shape in a horizontal plane, one side of which is an X-claw 17a, and the other side of which is Y-shaped.
It is a nail 17b. CY is a cylinder having a rod RD connected to the Y moving plate 12 as a Y-direction moving means, and CY1 and CY2 are tip stopper cylinders in which the rods R1 and R2 can protrude and retract from the forward inclined bottom surface of the chute portion 4. It is. Among them, CY1 is a first chip stopper cylinder for holding chips P waiting to be discharged from the chute portion 4, and CY2 is a second chip stopper cylinder for holding subsequent chips P, P...

The electronic component supply device of this embodiment has the above-described configuration, and its operation will now be described with reference to FIG.

First, in the initial state, FIG.
As shown in a side view in FIG. 4, it is assumed that the Y moving plate 12 is positioned substantially at the center of the transfer table 11 in the Y direction, and the X moving plate 13 is positioned substantially at the center of the Y moving plate 12 in the X direction. In this state, the Z cam follower F1 is located at the front of the Z cam C1.
The X cam follower F2 contacts the center of the X cam C2, and the receiving member 14 is parallel to the X moving plate 13. Next, cylinder C
When Y is driven to retract the rod RD (that is, pull the Y moving plate 12), the X cam follower F2 keeps in contact with a portion parallel to the Y direction of the X cam C2 in the profile surface C2a. Numeral 12 is guided by the Y guide GY to move in the Y direction, and the X moving plate 13 moves the receiving member 14 in the Y direction in the initial state with respect to the X direction by the spring force of the tension spring KX. Note that, at this time, since the profile surface C1a of the Z cam C1 is horizontal, the receiving member 14 remains horizontal for a while. Then, when the rod RD is further immersed and the receiving member 14 approaches the tunnel body 4, the above-described contour surface C1a starts to incline upward, and the receiving member 1
4 takes a forward leaning posture, and the extension spring KZ extends. further,
When the rod RD is retracted, the Z cam follower F1 reaches the apex of the profiled surface C1a as shown by the chain line in FIGS. , And the rear end (right side in FIG. 4) of the receiving member 14 is connected to the bottom surface 4a. Here, the tip stop cylinder CY1,
The CY2 protrudes the rods R1 and R2, among which the first tip stop cylinder CY1 is driven to immerse the rod R1 and lower the tip P waiting at the lowermost portion in the direction of the arrow N2. Then, the tip P is engaged with the step 14 a of the receiving member 14. Then, the suction means V is driven, and the chip P is sucked to the receiving material 14 by the suction hole 14b. On the other hand, the rod R1 of the first tip stopper cylinder CY1 is again projected so that the second tip stopper cylinder CY2
Is immersed, the lowermost one of the following chips P is slid down, and stopped by the rod R1. At the same time, the rod R2 is made to protrude so that the following chip P does not slide down.

Next, the position of the solid line shown in FIGS.
4 takes a forwardly inclined posture), and passes through the solid line positions in FIGS. 3 and 4 to protrude the rod RD of the cylinder CY. Then, the Z cam follower F1 separates from the Z cam C1, but the receiving material 14 keeps being in contact with the X moving plate 13 in parallel due to the spring force of the pulling spring KZ. When the rod RD is further protruded and the receiving member 14 approaches the positioning rod 17, the copying surface C2a of the X cam C2 starts to incline toward the center of the transfer table 11. As a result, the X moving plate 13 moves downward (X direction) in FIG. 5 while being guided by the X guide GX on the Y moving plate 12 against the pulling spring KX. And
The tip P on the receiving member 14 is
a, abuts against the Y-claw 17b, and the displacement of the chip P from the ideal position is corrected. That is, the Y direction moving means
Cylinder CY, X cam C2, X cam follower F2
In order to bring the chip P into contact with the Y-claw 17b,
4 is a second X-direction moving means for moving X in the X direction.

FIG. 7 (FIG. 6 is an enlarged sectional view taken along the line MM).
The position where the chip P contacts the positioning rod 17 is the pickup position Q of the transfer head H as shown in FIG. Thereafter, the chip P is attracted to the nozzles N of the head H, and the chip P is directly mounted on the substrate 1 without passing through a position shift correction stage or the like from the chip transfer section C as shown by an arrow in FIG. Note that, as shown in FIG.
The tips of the a and Y claws 17b are tapered so that these claws 17a and 17b do not hinder the suction operation of the nozzle N. In this state, a clearance t is provided between the lower end of the tip of the claw 17a and the step 14a.

According to this embodiment, a single cylinder C
By driving only Y, the reception of the chip P from the tunnel body 4, the transfer to the pickup position Q, and the correction of the displacement of the chip P can be completed, and the tact time can be further reduced.

It should be noted this means is a is no limited to the illustrated example, for example, the upper Symbol moving means may variously change and moving table, feed screw instead of the cylinder CY. In short, the receiving material of the chip and the receiving material are connected to the lower end of the chute portion in the forward inclined posture to receive the chips discharged from the chute portion, and the posture is changed from the forward inclined posture to the horizontal posture. A moving means for moving between the two positions, a pick-up position for transferring the received chip to the transfer head, and a position regulating means for correcting a positional shift of the chip on the receiving material at the pick-up position; It is only necessary to be provided on the transfer table.

[0026]

According to the present invention , the amount of water discharged from the chute portion is reduced.
Received chip on the receiving material, and then by the Y-direction moving means.
Move the receiving material in the Y direction and pick the chips on the receiving material.
Move to the up position, but in this way
To transfer the receiving material from the take position to the pickup position
When moving in the direction, also move the receiving material in the X direction,
In order for the tip to contact the X and Y claws of the position
This makes it possible to correct the chip displacement. did
Pick up the chip on the receiving material from the receiving position.
When transferring to the tip position, the position of the chip on the transfer table
Receiving a tip as it can be corrected
After transferring from the position to the pickup position,
Immediately picked up from the transfer table
Since it can be mounted directly on the board, it takes less time
Time can be reduced, and high-speed mounting of a chip can be realized .

[Brief description of the drawings]

FIG. 1 is a perspective view of an electronic component supply device according to an embodiment of the present invention.

FIG. 2 is a perspective view of a chip transfer unit of the electronic component supply device according to one embodiment of the present invention.

FIG. 3 is an operation explanatory diagram of the electronic component supply device according to one embodiment of the present invention.

FIG. 4 is an operation explanatory diagram of the electronic component supply device according to one embodiment of the present invention.

FIG. 5 is an operation explanatory view of the electronic component supply device according to one embodiment of the present invention.

FIG. 6 is an operation explanatory view of the electronic component supply device according to one embodiment of the present invention.

FIG. 7 is an operation explanatory view of the electronic component supply device according to one embodiment of the present invention.

FIG. 8 is a plan view of a conventional electronic component supply device.

[Explanation of symbols]

11 Transfer Table 14 Receiving Material 17 Position Controlling Means (Positioning Rod) 17a X Claw 17b Y Claw P Tip A Shooting Part C Chip Transfer Part C2 X Cam (Second X Direction Moving Means) F2 X Cam Follower (Second X Direction) Moving means) CY cylinder (Y direction moving means) Q Pickup position H Transfer head SC Feed screw (first X direction moving means) MX2 motor (First X direction moving means)

Claims (1)

(57) [Claims] 1. A chute portion which is held in a forwardly inclined posture and slides down a chip sent out from a tube, and a chip transfer portion provided below the chute portion, wherein the chip transfer portion is provided with a chip transfer portion. Receiving material and the receiving material were connected to the lower end of the chute portion in a forwardly inclined position to receive chips discharged from the chute portion, and received from the forwardly inclined position to a horizontal position. A Y-direction moving means for moving in the Y-direction between two positions including a pickup position for transferring the chip to the transfer head, and a Y-direction moving means for moving the chip in the Y-direction.
This receiving material is moved in the X direction with the movement in the direction
X-direction moving means, X-claw and Y at pickup position
A claw, and the Y-direction moving means and the X-direction moving means
To move the receiving material in the X direction and the Y direction.
A position regulating means for correcting the displacement of the chip on the receiving material by bringing the chip on the material into contact with the X-claw and the Y-claw.
Electronic component feeding apparatus characterized by comprising.