JP2993757B2 - Brazing filler metal for ceramics - Google Patents

Brazing filler metal for ceramics

Info

Publication number
JP2993757B2
JP2993757B2 JP3091454A JP9145491A JP2993757B2 JP 2993757 B2 JP2993757 B2 JP 2993757B2 JP 3091454 A JP3091454 A JP 3091454A JP 9145491 A JP9145491 A JP 9145491A JP 2993757 B2 JP2993757 B2 JP 2993757B2
Authority
JP
Japan
Prior art keywords
ceramics
brazing
metal
filler metal
brazing filler
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP3091454A
Other languages
Japanese (ja)
Other versions
JPH04305072A (en
Inventor
秀和 柳澤
正三郎 岩井
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Tanaka Kikinzoku Kogyo KK
Original Assignee
Tanaka Kikinzoku Kogyo KK
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tanaka Kikinzoku Kogyo KK filed Critical Tanaka Kikinzoku Kogyo KK
Priority to JP3091454A priority Critical patent/JP2993757B2/en
Publication of JPH04305072A publication Critical patent/JPH04305072A/en
Application granted granted Critical
Publication of JP2993757B2 publication Critical patent/JP2993757B2/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Landscapes

  • Ceramic Products (AREA)

Description

【発明の詳細な説明】DETAILED DESCRIPTION OF THE INVENTION

【0001】[0001]

【産業上の利用分野】本発明は、セラミックスと金属、
及びセラミックスとセラミックスを接合する為のセラミ
ックス接合用ろう材に関する。
The present invention relates to ceramics and metals,
And a brazing filler metal for joining ceramics to ceramics.

【0002】[0002]

【従来の技術】従来よりセラミックス接合用ろう材とし
ては、Ag−Cu合金粉末とTi粉末を混合し、これに
樹脂及び有機溶剤を加えて混練しペースト状になしたも
のが、セラミックスとの濡れ性が良く、接合強度が高い
ことから多用されている。
2. Description of the Related Art Conventionally, as a brazing material for joining ceramics, a paste obtained by mixing an Ag-Cu alloy powder and a Ti powder, adding a resin and an organic solvent to the mixture, and kneading the mixture into a paste is used. It is widely used because of its good properties and high bonding strength.

【0003】ところで、上記成分のセラミックス接合用
ろう材は、融点が高い為、ろう付け温度が高い。従っ
て、ろう付け時、セラミックス自体がダメージを受け、
クラックが発生し易くなる。またセラミックスと金属の
ろう付けの場合、熱膨張の違いによりセラミックスにク
ラックが入り、金属に反りが発生し易い。
[0003] By the way, the brazing material for ceramics joining of the above components has a high melting point and therefore a high brazing temperature. Therefore, during brazing, the ceramic itself is damaged,
Cracks easily occur. In the case of brazing ceramics and metal, cracks are formed in the ceramics due to the difference in thermal expansion, and the metal is likely to be warped.

【0004】[0004]

【発明が解決しようとする課題】そこで本発明は、ろう
付け温度を低くでき且つろう付け強度を高くできる低融
点のセラミックス接合用ろう材を提供しようとするもの
である。
SUMMARY OF THE INVENTION Accordingly, an object of the present invention is to provide a low melting point brazing filler metal for ceramics which can lower the brazing temperature and increase the brazing strength.

【0005】[0005]

【課題を解決するための手段】上記課題を解決するため
の本発明のセラミックス接合用ろう材は、Ag30〜60wt
%、Cu20〜45wt%、In20〜40wt%の合金粉末及び残
部Ti又はZr又はHfの水素化物粉末 0.5〜10wt%か
らなる金属ろう材粉末と、樹脂及び有機溶剤とが混練さ
れペースト状になされたものである。
In order to solve the above-mentioned problems, a brazing filler metal for ceramics according to the present invention comprises Ag30 to 60 wt.
%, Cu20 to 45 wt%, In20 to 40 wt% alloy powder and the balance 0.5 to 10 wt% of a hydride powder of Ti or Zr or Hf, a resin and an organic solvent were kneaded to form a paste. Things.

【0006】本発明のセラミックス接合用ろう材に於い
て、金属ろう材粉末の成分組成を上記のように限定した
理由は、融点を 700℃以下にする為で、Agが30wt%未
満では濡れ性が得られず、接合強度も弱くなり、60wt%
を超えると融点が高くなり、コストも高くなる。Cuが
20wt%未満では接合強度が得られず、45wt%を超えると
融点が低くならない。Inが20wt%未満では融点が低く
ならず、40wt%を超えるとろうが流れが良すぎて接合強
度が弱くなる。Ti又はZr又はHfの水素化活性金属
が 0.5wt%未満では接合強度が弱くなり、10wt%を超え
ると接合強度の向上が見られなくなる。
[0006] In the brazing filler metal for ceramics of the present invention, the component composition of the metal brazing filler metal powder is limited as described above because the melting point is set to 700 ° C or less. Not obtained, the bonding strength is weakened, 60 wt%
If the temperature exceeds the above, the melting point will be high and the cost will be high. Cu is
If it is less than 20 wt%, the bonding strength cannot be obtained, and if it exceeds 45 wt%, the melting point does not decrease. If In is less than 20 wt%, the melting point is not lowered, and if it exceeds 40 wt%, the flow of the solder is too good and the bonding strength is weakened. If the hydrogenation active metal of Ti, Zr, or Hf is less than 0.5 wt%, the bonding strength becomes weak, and if it exceeds 10 wt%, no improvement in the bonding strength is observed.

【0007】[0007]

【作用】上記のように構成された本発明のセラミックス
接合用ろう材は、融点が 700℃以下となってろう付け温
度が低く、且つ水素化物が均一に分散しているので、セ
ラミックスと金属及びセラミックス同志のろう付けにお
いて、セラミックスのダメージが抑えられ、クラックが
発生しにくくなる。また金属との熱膨張差が少なくな
り、金属に反りが発生しにくくなる。
The brazing filler metal for ceramics of the present invention having the above-mentioned structure has a melting point of 700 ° C. or less, a low brazing temperature, and a uniform dispersion of hydrides. During brazing of ceramics, damage to the ceramics is suppressed, and cracks are less likely to occur. In addition, the difference in thermal expansion from the metal is reduced, and the metal is less likely to warp.

【0008】[0008]

【実施例】本発明のセラミックス接合用ろう材の実施例
と従来例について説明する。
DESCRIPTION OF THE PREFERRED EMBODIMENTS Embodiments and a conventional example of a brazing filler metal for ceramics according to the present invention will be described.

【0009】下記の表1の左欄に示す成分組成の金属ろ
う材粉末と、樹脂(アルミナ系樹脂)及び有機溶剤(α
−ターピネオール)とが混練されペースト状になされた
実施例1〜3及び従来例のセラミックス接合用ろう材を
用いてセラミックス(AlN)と金属(Cu)をろう付
け(ろう付け温度:実施例は 650℃、従来例は 900℃)
してセラミックス及び金属の状態を検査し、且つ接合強
度を測定した処、下記の表1の右欄に示すような結果を
得た。
A metal brazing powder having the component composition shown in the left column of Table 1 below is mixed with a resin (alumina resin) and an organic solvent (α).
-Terpineol) and brazed ceramics (AlN) and metal (Cu) using the ceramic brazing materials of Examples 1 to 3 and the conventional example which were kneaded into a paste (brazing temperature: 650 in the example). ℃, conventional example is 900 ℃)
Then, the state of ceramics and metal was inspected, and the bonding strength was measured. As a result, the results shown in the right column of Table 1 below were obtained.

【0010】[0010]

【表1】 [Table 1]

【0011】上記の表1で明らかなように従来例のセラ
ミックス接合用ろう材を用いてセラミックス(AlN)
と金属(Cu)をろう付けした場合はAlNにクラック
が入り、Cuに反りが生じ接合強度は8kg/cm2 と低か
ったのに対し、実施例1〜3のセラミックス接合用ろう
材を用いてセラミックス(AlN)と金属(Cu)をろ
う付けした場合は、AlNにクラックが入らず、Cuに
反りが生ぜず、接合強度は10kg/cm2 と高く、低いろう
付け強度で品質の良い安定したセラミックスと金属のろ
う付けができたことが判る。
As is clear from Table 1 above, ceramics (AlN) was produced using the conventional brazing filler metal for ceramics.
When AlN and a metal (Cu) were brazed, AlN was cracked and Cu warped and the bonding strength was as low as 8 kg / cm 2 , whereas the brazing materials for ceramic bonding of Examples 1 to 3 were used. When ceramics (AlN) and metal (Cu) are brazed, AlN does not crack, Cu does not warp, the bonding strength is as high as 10 kg / cm 2 , and the brazing strength is low and the quality is stable. It can be seen that brazing of ceramics and metal was completed.

【0012】[0012]

【発明の効果】以上の通り本発明のセラミックス接合用
ろう材によれば、 700℃以下の低いろう付け温度でセラ
ミックスにクラックを入れず、また金属に反りを生じさ
せずに、セラミックスと金属及びセラミックス同志を安
定した品質の良いろう付けができる。
As described above, according to the brazing filler metal for ceramics according to the present invention, the ceramics and the metal are not cracked at a low brazing temperature of 700 ° C. or less and the metal is not warped. A stable and high-quality brazing of ceramics is possible.

───────────────────────────────────────────────────── フロントページの続き (51)Int.Cl.6 識別記号 FI B23K 35/30 310 B23K 35/30 310C C04B 37/00 C04B 37/00 B (58)調査した分野(Int.Cl.6,DB名) B23K 1/19 C04B 37/00 ──────────────────────────────────────────────────続 き Continuation of front page (51) Int.Cl. 6 identification code FI B23K 35/30 310 B23K 35/30 310C C04B 37/00 C04B 37/00 B (58) Fields surveyed (Int.Cl. 6 , (DB name) B23K 1/19 C04B 37/00

Claims (1)

(57)【特許請求の範囲】(57) [Claims] 【請求項1】 Ag30〜60wt%、Cu20〜45wt%、In
20〜40wt%の合金粉末及び残部Ti又はZr又はHfの
水素化物粉末 0.5〜10wt%からなる金属ろう材粉末と、
樹脂及び有機溶剤とが混練されペースト状になされたセ
ラミックス接合用ろう材。
1. Ag 30-60 wt%, Cu 20-45 wt%, In
A metal brazing powder comprising 20 to 40 wt% of an alloy powder and a balance of 0.5 to 10 wt% of a hydride powder of Ti or Zr or Hf;
A brazing filler metal for ceramics, which is formed by kneading a resin and an organic solvent into a paste.
JP3091454A 1991-03-29 1991-03-29 Brazing filler metal for ceramics Expired - Fee Related JP2993757B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP3091454A JP2993757B2 (en) 1991-03-29 1991-03-29 Brazing filler metal for ceramics

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP3091454A JP2993757B2 (en) 1991-03-29 1991-03-29 Brazing filler metal for ceramics

Publications (2)

Publication Number Publication Date
JPH04305072A JPH04305072A (en) 1992-10-28
JP2993757B2 true JP2993757B2 (en) 1999-12-27

Family

ID=14026815

Family Applications (1)

Application Number Title Priority Date Filing Date
JP3091454A Expired - Fee Related JP2993757B2 (en) 1991-03-29 1991-03-29 Brazing filler metal for ceramics

Country Status (1)

Country Link
JP (1) JP2993757B2 (en)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4077888B2 (en) * 1995-07-21 2008-04-23 株式会社東芝 Ceramic circuit board
JP5935292B2 (en) * 2011-11-01 2016-06-15 三菱マテリアル株式会社 Method for manufacturing power module substrate, method for manufacturing power module substrate with heat sink
JP5957848B2 (en) * 2011-11-02 2016-07-27 三菱マテリアル株式会社 Power module substrate, power module substrate with heat sink, and method for manufacturing power module substrate

Also Published As

Publication number Publication date
JPH04305072A (en) 1992-10-28

Similar Documents

Publication Publication Date Title
JP2783366B2 (en) Silver alloy brazing for bonding ceramic members to each other or directly to metal members
JP2993757B2 (en) Brazing filler metal for ceramics
JP3495770B2 (en) Brazing filler metal for ceramics
JPH04285076A (en) Paste brazing filler metal for joining ceramics
JPS62270483A (en) Ceramic metallizing composition, metallization and metallized product
JP2532114B2 (en) Brazing material
JP3095187B2 (en) Brazing filler metal for metal / ceramics
JP3896432B2 (en) Method for producing metal-ceramic composite substrate and brazing material used therefor
JPH06122563A (en) Ceramic composite material and its production
JPH0769749A (en) Brazing material for ceramic
JP3227868B2 (en) Solder paste
JP2575756B2 (en) Brazing filler metal for ceramics
JPH0615477A (en) Ag brazer
JP2670627B2 (en) Metallized alumina ceramics
JP3223381B2 (en) Bonding material for metal and ceramic
JPH04317471A (en) Production of brazer for bonding ceramics
JP2755455B2 (en) Brazing powder for ceramic bonding
CN115178912B (en) Ti-containing alloy 3 AlC 2 Copper-based active composite solder, preparation method and brazing method thereof
JPH071177A (en) Flux-containing al alloy brazing filler metal
JP3959555B2 (en) Aluminum nitride powder and method for producing degreased body thereof
JP2000178081A (en) Metal-ceramic jointed substrate
JP2986624B2 (en) Active metal brazing
JP3155044B2 (en) Brazing material for joining ceramics and metal and joining method therefor
JPH0570260A (en) Brazing filler metal paste for joining ceramic to metal
JPH0516955B2 (en)

Legal Events

Date Code Title Description
R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

LAPS Cancellation because of no payment of annual fees