JP2958188B2 - Multilayer wiring board - Google Patents
Multilayer wiring boardInfo
- Publication number
- JP2958188B2 JP2958188B2 JP4107108A JP10710892A JP2958188B2 JP 2958188 B2 JP2958188 B2 JP 2958188B2 JP 4107108 A JP4107108 A JP 4107108A JP 10710892 A JP10710892 A JP 10710892A JP 2958188 B2 JP2958188 B2 JP 2958188B2
- Authority
- JP
- Japan
- Prior art keywords
- circuit wiring
- insulating film
- oxide
- niobium
- wiring
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 229910052758 niobium Inorganic materials 0.000 claims description 18
- 239000010955 niobium Substances 0.000 claims description 18
- GUCVJGMIXFAOAE-UHFFFAOYSA-N niobium atom Chemical compound [Nb] GUCVJGMIXFAOAE-UHFFFAOYSA-N 0.000 claims description 18
- 239000000758 substrate Substances 0.000 claims description 14
- 229910052575 non-oxide ceramic Inorganic materials 0.000 claims description 6
- 239000011225 non-oxide ceramic Substances 0.000 claims description 6
- 239000011224 oxide ceramic Substances 0.000 claims description 6
- 229910052574 oxide ceramic Inorganic materials 0.000 claims description 6
- 239000002861 polymer material Substances 0.000 claims description 5
- 239000000696 magnetic material Substances 0.000 claims description 3
- 239000010408 film Substances 0.000 description 33
- 239000000919 ceramic Substances 0.000 description 12
- 238000000034 method Methods 0.000 description 9
- 230000005540 biological transmission Effects 0.000 description 7
- 239000000463 material Substances 0.000 description 7
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 5
- 229910052760 oxygen Inorganic materials 0.000 description 5
- 239000001301 oxygen Substances 0.000 description 5
- 229920001721 polyimide Polymers 0.000 description 5
- 239000009719 polyimide resin Substances 0.000 description 5
- 239000000843 powder Substances 0.000 description 5
- 229910017309 Mo—Mn Inorganic materials 0.000 description 3
- 229910052751 metal Inorganic materials 0.000 description 3
- 239000002184 metal Substances 0.000 description 3
- 239000003960 organic solvent Substances 0.000 description 3
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 description 3
- 239000002994 raw material Substances 0.000 description 3
- 239000002904 solvent Substances 0.000 description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- ZOKXTWBITQBERF-UHFFFAOYSA-N Molybdenum Chemical compound [Mo] ZOKXTWBITQBERF-UHFFFAOYSA-N 0.000 description 2
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- PMHQVHHXPFUNSP-UHFFFAOYSA-M copper(1+);methylsulfanylmethane;bromide Chemical compound Br[Cu].CSC PMHQVHHXPFUNSP-UHFFFAOYSA-M 0.000 description 2
- KZHJGOXRZJKJNY-UHFFFAOYSA-N dioxosilane;oxo(oxoalumanyloxy)alumane Chemical compound O=[Si]=O.O=[Si]=O.O=[Al]O[Al]=O.O=[Al]O[Al]=O.O=[Al]O[Al]=O KZHJGOXRZJKJNY-UHFFFAOYSA-N 0.000 description 2
- 238000010292 electrical insulation Methods 0.000 description 2
- WPBNNNQJVZRUHP-UHFFFAOYSA-L manganese(2+);methyl n-[[2-(methoxycarbonylcarbamothioylamino)phenyl]carbamothioyl]carbamate;n-[2-(sulfidocarbothioylamino)ethyl]carbamodithioate Chemical compound [Mn+2].[S-]C(=S)NCCNC([S-])=S.COC(=O)NC(=S)NC1=CC=CC=C1NC(=S)NC(=O)OC WPBNNNQJVZRUHP-UHFFFAOYSA-L 0.000 description 2
- 238000002844 melting Methods 0.000 description 2
- 230000008018 melting Effects 0.000 description 2
- 229910052750 molybdenum Inorganic materials 0.000 description 2
- 239000011733 molybdenum Substances 0.000 description 2
- 229910052863 mullite Inorganic materials 0.000 description 2
- 229920000642 polymer Polymers 0.000 description 2
- 230000008054 signal transmission Effects 0.000 description 2
- 229910010271 silicon carbide Inorganic materials 0.000 description 2
- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 description 2
- 238000004528 spin coating Methods 0.000 description 2
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 description 2
- 229910052721 tungsten Inorganic materials 0.000 description 2
- 239000010937 tungsten Substances 0.000 description 2
- HLBLWEWZXPIGSM-UHFFFAOYSA-N 4-Aminophenyl ether Chemical compound C1=CC(N)=CC=C1OC1=CC=C(N)C=C1 HLBLWEWZXPIGSM-UHFFFAOYSA-N 0.000 description 1
- 229910018072 Al 2 O 3 Inorganic materials 0.000 description 1
- ODINCKMPIJJUCX-UHFFFAOYSA-N Calcium oxide Chemical compound [Ca]=O ODINCKMPIJJUCX-UHFFFAOYSA-N 0.000 description 1
- MQJKPEGWNLWLTK-UHFFFAOYSA-N Dapsone Chemical compound C1=CC(N)=CC=C1S(=O)(=O)C1=CC=C(N)C=C1 MQJKPEGWNLWLTK-UHFFFAOYSA-N 0.000 description 1
- CPLXHLVBOLITMK-UHFFFAOYSA-N Magnesium oxide Chemical compound [Mg]=O CPLXHLVBOLITMK-UHFFFAOYSA-N 0.000 description 1
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 1
- WKDNYTOXBCRNPV-UHFFFAOYSA-N bpda Chemical compound C1=C2C(=O)OC(=O)C2=CC(C=2C=C3C(=O)OC(C3=CC=2)=O)=C1 WKDNYTOXBCRNPV-UHFFFAOYSA-N 0.000 description 1
- 238000007606 doctor blade method Methods 0.000 description 1
- 230000001747 exhibiting effect Effects 0.000 description 1
- 238000007733 ion plating Methods 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 238000000206 photolithography Methods 0.000 description 1
- 238000005096 rolling process Methods 0.000 description 1
- 238000007650 screen-printing Methods 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 239000002002 slurry Substances 0.000 description 1
- 238000004544 sputter deposition Methods 0.000 description 1
- 230000003746 surface roughness Effects 0.000 description 1
- 229920001187 thermosetting polymer Polymers 0.000 description 1
- 239000010409 thin film Substances 0.000 description 1
Landscapes
- Superconductor Devices And Manufacturing Methods Thereof (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
Description
【０００１】本発明は配線基板に関し、より詳細にはジ
ョセフソン素子等の超電導素子が搭載接続される回路基
板やパッケージに使用される多層配線基板に関するもの
である。The present invention relates to a wiring board, and more particularly to a multilayer wiring board used for a circuit board or a package on which a superconducting element such as a Josephson element is mounted and connected.
【０００２】[0002]
【従来の技術】従来、回路基板や半導体素子を収容する
パッケージ等に用いられる多層配線基板はその回路配線
がＭｏーＭｎ法等の厚膜形成技術によって形成されてい
る。2. Description of the Related Art Hitherto, in a multilayer wiring board used for a circuit board or a package for accommodating a semiconductor element, the circuit wiring is formed by a thick film forming technique such as the Mo-Mn method.
【０００３】このＭｏーＭｎ法は通常、タングステン、
モリブデン、マンガン等の高融点金属粉末に有機溶剤、
溶媒を添加混合し、ペースト状となした金属ペーストを
生セラミック体の外表面にスクリーン印刷法により所定
パターンに印刷塗布し、次にこれを複数積層するととも
に還元雰囲気中で焼成し、高融点金属粉末と生セラミッ
ク体とを焼結一体化させる方法である。[0003] This Mo-Mn method is generally used for tungsten,
Organic solvents for high melting point metal powders such as molybdenum and manganese,
A solvent is added and mixed, and a paste-shaped metal paste is printed and applied on the outer surface of the green ceramic body in a predetermined pattern by a screen printing method. Then, a plurality of these are laminated and fired in a reducing atmosphere to obtain a high melting point metal. This is a method in which the powder and the green ceramic body are sintered and integrated.
【０００４】尚、前記回路配線が形成されるセラミック
体としては通常、酸化アルミニウム質焼結体やムライト
質焼結体等の酸化物系セラミックス、或いは表面に酸化
物膜を被着させた窒化アルミニウム質焼結体や炭化珪素
質焼結体等の非酸化物系セラミックスが使用されてい
る。The ceramic body on which the circuit wiring is formed is usually an oxide ceramic such as an aluminum oxide sintered body or a mullite sintered body, or an aluminum nitride having an oxide film deposited on the surface. Non-oxide ceramics such as a sintered compact and a silicon carbide sintered compact are used.
【０００５】しかしながら、このＭｏーＭｎ法を用いて
回路配線を形成した多層配線基板は、回路配線がタング
ステンやモリブデン、マンガン等から成り、該タングス
テン等はその電気抵抗値が高く、電気信号の高速伝達が
不可であることから信号の伝達速度が高速であるジョセ
フソン素子等の超電導素子を接続した場合、超電導素子
本来の高速駆動の機能を充分発揮させることができない
という欠点を有していた。However, in a multilayer wiring board in which circuit wiring is formed by using the Mo-Mn method, the circuit wiring is made of tungsten, molybdenum, manganese, or the like. When a superconducting element such as a Josephson element that transmits signals at a high speed is connected because transmission is impossible, there is a drawback that the original high-speed driving function of the superconducting element cannot be sufficiently exhibited.
【０００６】そこで上記欠点を解消するためにセラミッ
ク体表面に薄膜形成技術によって超電導材料であるニオ
ブから成る回路配線とスピンコート法によって形成され
るポリイミド樹脂から成る絶縁膜を順次、交互に被着さ
せて多層配線基板となすことが考えられる。かかる多層
配線基板によれば回路配線が超電導材料から成り、電気
信号の高速伝達が可能であることから回路配線に信号の
伝達速度が高速であるジョセフソン素子等の超電導素子
を接続したとしても回路配線が超電導素子の高速駆動の
機能を阻害することはなく、超電導素子に回路配線を介
して電気信号を高速で出し入れすることが可能となる。In order to solve the above-mentioned drawbacks, a circuit wiring made of niobium, which is a superconducting material, and an insulating film made of a polyimide resin formed by a spin coating method are sequentially and alternately applied to the surface of the ceramic body. To form a multilayer wiring board. According to such a multilayer wiring board, the circuit wiring is made of a superconducting material, and high-speed transmission of an electric signal is possible, so even if a superconducting element such as a Josephson element having a high signal transmission speed is connected to the circuit wiring, The wiring does not impede the function of high-speed driving of the superconducting element, and electric signals can be transferred to and from the superconducting element at high speed via circuit wiring.
【０００７】[0007]
【発明が解決しようとする課題】しかしながら、この多
層配線基板においてはセラミック体表面にまずニオブか
ら成る回路配線が被着されること、該ニオブは極めて酸
化され易い材質であること等からニオブから成る回路配
線とポリイミド樹脂から成る絶縁膜とをセラミック体表
面に交互に多層に積層した場合、ポリイミド樹脂を熱硬
化させる際の熱によってニオブがセラミック体の酸素と
反応し、超電導性のない酸化物を生成してしまい、その
結果、回路配線は電気信号の高速伝達が不可となり、信
号の伝達速度が高速であるジョセフソン素子等の超電導
素子を接続した際、超電導素子本来の高速駆動の機能を
充分発揮させることができないという欠点を誘発する。However, in this multi-layer wiring board, circuit wiring made of niobium is first adhered to the surface of the ceramic body, and niobium is made of niobium because it is a material that is extremely easily oxidized. When circuit wiring and an insulating film made of polyimide resin are alternately laminated in multiple layers on the surface of the ceramic body, niobium reacts with oxygen of the ceramic body due to heat at the time of thermosetting the polyimide resin, and oxides without superconductivity are formed. As a result, high-speed transmission of electric signals is impossible for circuit wiring, and when superconducting elements such as Josephson elements that transmit signals at high speed are connected, the original high-speed driving function of superconducting elements Induces the drawback of not being able to exert.
【０００８】[0008]
【発明の目的】本発明は上記欠点に鑑み案出されたもの
で、その目的は回路配線の電気信号の高速伝達を可能と
して、ジョセフソン素子等の超電導素子を接続した際、
超電導素子本来の高速駆動の機能を充分発揮させること
ができる多層配線基板を提供することにある。SUMMARY OF THE INVENTION The present invention has been devised in view of the above-mentioned drawbacks, and an object of the present invention is to enable high-speed transmission of electric signals of circuit wiring and to connect a superconducting element such as a Josephson element.
It is an object of the present invention to provide a multilayer wiring board capable of sufficiently exhibiting a high-speed driving function inherent in superconducting elements.
【０００９】[0009]
【課題を解決するための手段】本発明の多層積層基板は
酸化物系セラミックスもしくは表面に酸化物膜を有する
非酸化物系セラミックスから成る基体上に、高分子材料
から成る絶縁膜とニオブから成る回路配線とを、絶縁膜
を第一層目として交互に積層したことを特徴とするもの
である。The multilayer laminated substrate according to the present invention comprises an insulating film made of a polymer material and a niobium film on a substrate made of an oxide ceramic or a non-oxide ceramic having an oxide film on its surface. The circuit wiring is alternately laminated with the insulating film as a first layer.
【００１０】[0010]
【作用】本発明の多層配線基板によれば酸化物系セラミ
ックスもしくは表面に酸化物膜を有する非酸化物系セラ
ミックスから成る基体表面にまずポリイミド樹脂等の高
分子材料から成る絶縁膜が被着され、その上にニオブか
ら成る回路配線が形成されることから回路配線のニオブ
が基体の酸素と接触反応し、超電導性のない酸化物を生
成することはなく、その結果、回路配線の電気信号の高
速伝達が可能となる。According to the multilayer wiring board of the present invention, an insulating film made of a polymer material such as a polyimide resin is first applied to the surface of a substrate made of an oxide ceramic or a non-oxide ceramic having an oxide film on the surface. Since the circuit wiring made of niobium is formed thereon, the niobium of the circuit wiring does not react with the oxygen of the base to form an oxide having no superconductivity, and as a result, the electric signal of the circuit wiring is not generated. High speed transmission becomes possible.
【００１１】[0011]
【実施例】次に本発明を添付図面に基づき詳細に説明す
る。図１は本発明の多層配線基板の一実施例を示す断面
図であり、１は基体、２は絶縁膜、３は回路配線であ
る。BRIEF DESCRIPTION OF THE DRAWINGS FIG. FIG. 1 is a sectional view showing an embodiment of a multilayer wiring board according to the present invention, wherein 1 is a base, 2 is an insulating film, and 3 is a circuit wiring.
【００１２】前記基体１は酸化アルミニウム質焼結体、
ムライト質焼結体等の酸化物系セラミックス、或いは表
面に酸化物膜を有する窒化アルミニウム質焼結体や炭化
珪素質焼結体等の非酸化物系セラミックスから成り、例
えば酸化アルミニウム質焼結体から成る場合には、アル
ミナ(Al 2 O 3 ) 、シリカ(SiO2 ) 、カルシア(CaO)、
マグネシア(MgO) 等の原料粉末に適当な有機溶剤、溶媒
を添加混合して泥漿状となすとともにこれを従来周知の
ドクターブレード法やカレンダーロール法を採用するこ
とによってセラミックグリーンシート( セラミック生シ
ート) を形成し、しかる後、前記セラミックグリーンシ
ートに適当な打ち抜き加工を施し、所定形状となすとと
もに高温( 約1600℃) で焼成することによって、或いは
アルミナ等の原料粉末に適当な有機溶剤、溶媒を添加混
合するとともに該原料粉末をプレス成形機によって所定
形状に成形し、次に前記成形体を約1600℃の温度で焼成
することによって製作される。The substrate 1 is made of an aluminum oxide sintered body,
Oxide ceramics such as mullite sintered bodies, or non-oxide ceramics such as aluminum nitride sintered bodies and silicon carbide sintered bodies having an oxide film on the surface, such as aluminum oxide sintered bodies When consisting of alumina (Al 2 O 3 ), silica (SiO 2 ), calcia (CaO),
A ceramic green sheet (ceramic green sheet) is obtained by adding a suitable organic solvent and a solvent to a raw material powder such as magnesia (MgO) and mixing the mixture to form a slurry and employing a conventionally known doctor blade method or calendar roll method. After that, the ceramic green sheet is appropriately punched, formed into a predetermined shape and fired at a high temperature (about 1600 ° C.), or an appropriate organic solvent or solvent is added to a raw material powder such as alumina. The raw material powder is molded into a predetermined shape by a press molding machine while being added and mixed, and then the molded body is fired at a temperature of about 1600 ° C.
【００１３】前記酸化物系セラミックス、或いは表面に
酸化物膜を有する非酸化物系セラミックスから成る基体
１は後述する絶縁膜２と回路配線３とより成る多層配線
を支持する作用を為し、表面には絶縁膜2 と回路配線3
とが絶縁膜2 を第一層目として交互に被着積層される。The substrate 1 made of the above-mentioned oxide-based ceramics or non-oxide-based ceramics having an oxide film on the surface serves to support a multilayer wiring composed of an insulating film 2 and a circuit wiring 3 which will be described later. Has insulating film 2 and circuit wiring 3
Are alternately deposited and laminated using the insulating film 2 as a first layer.
【００１４】また前記基体１表面に被着される絶縁膜２
はポリイミド樹脂等の高分子材料から成り、例えば 4,
4'ージアミノジフェニルエーテル50モル% 、ジアミノジ
フェニルスルホン50モル% 、3,3',4,4' ービフェニルテ
トラカルボン酸二無水物から成るポリマ溶液を基体１上
面にスピンコーティング法により塗布し、しかる後、40
0 ℃の熱を加えてポリマ溶液を熱架橋させることによっ
て形成される。An insulating film 2 deposited on the surface of the substrate 1
Is made of a polymer material such as a polyimide resin.
A polymer solution consisting of 50 mol% of 4 'diaminodiphenyl ether, 50 mol% of diaminodiphenylsulfone, and 3,3', 4,4'-biphenyltetracarboxylic dianhydride is applied to the upper surface of the substrate 1 by spin coating. Later, 40
It is formed by applying heat at 0 ° C. to thermally crosslink the polymer solution.
【００１５】前記絶縁膜2 は回路配線3 が基体１表面に
直接、接触するのを防止するとともに各回路配線3 間の
電気的絶縁を保持する作用を為し、その厚みが8.0 μm
未満であると回路配線3 が基体１表面に接触して、回路
配線3 に酸化物が生成したり、各回路配線3 間の電気的
絶縁の信頼性が低下したりする傾向にあり、また30.0μ
m を越えると絶縁膜2 内に該絶縁膜2 を形成する際に発
生する大きな応力が内在し、絶縁膜２と基体１及び回路
配線3 との被着強度が低下する危険性がある。The insulating film 2 functions to prevent the circuit wiring 3 from directly contacting the surface of the substrate 1 and to maintain electrical insulation between the circuit wirings 3 and has a thickness of 8.0 μm.
If it is less than 3, the circuit wiring 3 comes into contact with the surface of the base 1 to generate an oxide on the circuit wiring 3 or the reliability of electrical insulation between the circuit wirings 3 tends to decrease, and 30.0 μ
If it exceeds m, a large stress is generated inside the insulating film 2 when the insulating film 2 is formed, and there is a risk that the adhesion strength between the insulating film 2 and the substrate 1 and the circuit wiring 3 may be reduced.
【００１６】従って、前記絶縁膜2 はその厚みを8.0 乃
至30.0μm の範囲としておくことが好ましい。Therefore, it is preferable that the thickness of the insulating film 2 be in the range of 8.0 to 30.0 μm.
【００１７】また前記基体１の表面に被着した絶縁膜２
の上面には回路配線3 が所定パターンに被着形成されて
おり、該回路配線３は電気信号を伝達するための伝達路
として作用を為し、超電導材料であるニオブで形成され
ている。The insulating film 2 adhered to the surface of the substrate 1
A circuit wiring 3 is formed in a predetermined pattern on the upper surface of the substrate. The circuit wiring 3 functions as a transmission path for transmitting an electric signal, and is formed of niobium as a superconducting material.
【００１８】前記回路配線３を構成するニオブは超電導
材料であり、電気信号の高速伝達を可能とすることから
回路配線３に電気信号の伝達速度が高速であるジョセフ
ソン素子等の超電導素子を接続することができる。The niobium forming the circuit wiring 3 is a superconducting material, and a superconducting element such as a Josephson element having a high electric signal transmission speed is connected to the circuit wiring 3 because the electric signal can be transmitted at a high speed. can do.
【００１９】また前記回路配線３を構成するニオブは非
磁性材料であり、そのため回路配線３に電気信号が伝達
したとしても回路配線３内に磁場が残留することはな
く、その結果、前記残留磁場によって電気信号にノイズ
が入り込むのを皆無としてジョセフソン素子等の超電導
素子を正常、且つ安定に作動させることができる。The niobium forming the circuit wiring 3 is a non-magnetic material, so that even if an electric signal is transmitted to the circuit wiring 3, no magnetic field remains in the circuit wiring 3, and as a result, the residual magnetic field Accordingly, the superconducting element such as the Josephson element can be normally and stably operated without any noise entering the electric signal.
【００２０】尚、前記ニオブから成る回路配線３は従来
周知の薄膜形成技術を採用することによって基体１表面
の絶縁膜2 上に被着形成され、具体的には絶縁膜2 の上
面にニオブをスパッタリング法やイオンプレーティング
法により被着するとともにこれをフォトリソグラフィ技
術により所定パターンに加工することによって形成され
る。この場合、基体１の表面にはまず絶縁膜２が被着さ
れるため回路配線３が直接、基体１表面に接触すること
はなく、回路配線3 と基体１に含まれる酸素とが反応し
回路配線３に酸化物が生成されるのが皆無となって回路
配線３の超電導性を維持することができる。従って、前
記回路配線３はその電気信号の高速伝達が可能となり、
ジョセフソン素子等の超電導素子を接続した際、超電導
素子本来の高速駆動の機能を充分発揮させることができ
る。The circuit wiring 3 made of niobium is formed on the insulating film 2 on the surface of the substrate 1 by employing a conventionally known thin film forming technique. Specifically, niobium is formed on the upper surface of the insulating film 2. It is formed by being applied by a sputtering method or an ion plating method and being processed into a predetermined pattern by a photolithography technique. In this case, since the insulating film 2 is first deposited on the surface of the base 1, the circuit wiring 3 does not directly contact the surface of the base 1, and the circuit wiring 3 reacts with oxygen contained in the base 1 to cause a circuit. Oxide is not generated in the wiring 3 at all, and the superconductivity of the circuit wiring 3 can be maintained. Therefore, the circuit wiring 3 can transmit the electric signal at high speed,
When a superconducting element such as a Josephson element is connected, the high-speed driving function inherent to the superconducting element can be sufficiently exhibited.
【００２１】また前記ニオブから成る回路配線３はその
厚みが1.0 μm 未満であると基体１に被着された絶縁膜
２の表面粗さに起因して回路配線３中に厚みが極めて薄
い部分が形成されて回路配線３に電気信号を正常に伝達
させるが困難となり、また5.0 μm を越えると回路配線
３内に該回路配線３を形成する際に発生する大きな応力
が内在し、絶縁膜２と回路配線３との接合強度が低下す
る傾向にある。従って、前記ニオブから成る回路配線３
はその厚みを1.0 乃至5.0 μm の範囲としておくことが
好ましい。If the thickness of the circuit wiring 3 made of niobium is less than 1.0 μm, an extremely thin portion in the circuit wiring 3 may be caused by the surface roughness of the insulating film 2 attached to the base 1. When formed, it becomes difficult to transmit an electrical signal to the circuit wiring 3 normally, and when the thickness exceeds 5.0 μm, a large stress generated when the circuit wiring 3 is formed is present inside the circuit wiring 3, and the insulating film 2 The bonding strength with the circuit wiring 3 tends to decrease. Therefore, the circuit wiring 3 made of niobium is used.
It is preferable that the thickness thereof is in the range of 1.0 to 5.0 μm.
【００２２】更に前記ニオブから成る回路配線３はその
露出する表面に銅等の非磁性材料を3.0 乃至10.0μm の
厚みに被着させて回路配線３を被覆しておくと、回路配
線３の露出部が大気中の酸素と反応し酸化物を生成して
回路配線３の超電導性が喪失するのを有効に防止するこ
とができるとともに回路配線３に電気信号を伝達させた
際、回路配線３を被覆する層に磁場が残留するのを皆無
とし、該残留磁場によって電気信号にノイズが入り込む
のを防止することができる。従って、前記回路配線３は
その露出する表面に銅等の非磁性材料を3.0 乃至10.0μ
m の厚みに被着させて被覆しておくことが好ましい。The circuit wiring 3 made of niobium is coated with a non-magnetic material such as copper to a thickness of 3.0 to 10.0 μm on the exposed surface to cover the circuit wiring 3. It is possible to effectively prevent loss of superconductivity of the circuit wiring 3 by reacting the circuit wiring 3 with the oxygen in the atmosphere to generate an oxide, and to transmit an electric signal to the circuit wiring 3 when the circuit wiring 3 is transmitted. It is possible to prevent a magnetic field from remaining in the layer to be coated, and to prevent noise from entering an electric signal due to the residual magnetic field. Therefore, the circuit wiring 3 is coated with a nonmagnetic material such as copper on the exposed surface in a range of 3.0 to 10.0 μm.
It is preferable to apply and coat to a thickness of m.
【００２３】かくして本発明の多層配線基板によれば回
路配線３にジョセフソン素子等の超電導素子を電気的に
接続し、回路配線３を介して超電導素子に電気信号を出
し入れすることによって回路基板やパッケージとして機
能する。Thus, according to the multilayer wiring board of the present invention, a superconducting element such as a Josephson element is electrically connected to the circuit wiring 3 and an electric signal is input / output to / from the superconducting element via the circuit wiring 3 so that Functions as a package.
【００２４】尚、本発明は上述した実施例に限定される
ものではなく、本発明の要旨を逸脱しない範囲であれば
種々の変更は可能である。The present invention is not limited to the above-described embodiment, and various modifications can be made without departing from the gist of the present invention.
【００２５】[0025]
【発明の効果】本発明は酸化物系セラミックス、或いは
表面に酸化物膜を有する非酸化物系セラミックスから成
る基体上に、高分子材料から成る絶縁膜と超電導材料で
あるニオブから成る回路配線とを、絶縁膜を第一層目と
して交互に積層させたことから前記基体の表面に回路配
線が直接、接触することはなく、その結果、絶縁膜を熱
硬化させる際の熱によって回路配線と基体に含まれる酸
素とが反応し回路配線に酸化物が生成されることは一切
ない。According to the present invention, an insulating film made of a polymer material and a circuit wiring made of niobium as a superconducting material are formed on a substrate made of an oxide ceramic or a non-oxide ceramic having an oxide film on the surface. Are alternately laminated with the insulating film as the first layer, so that the circuit wiring does not directly contact the surface of the base, and as a result, the circuit wiring and the base are heated by heat when the insulating film is thermally cured. Does not react with oxygen contained in the circuit wiring to generate oxides at all.
【００２６】従って、本発明の多層配線基板は回路配線
の超電導性が維持され、電気信号の高速伝達が可能とな
って、ジョセフソン素子等の超電導素子を接続した際、
超電導素子本来の高速駆動の機能を充分発揮させること
ができる。Therefore, in the multilayer wiring board of the present invention, the superconductivity of the circuit wiring is maintained, the high-speed transmission of electric signals becomes possible, and when a superconducting element such as a Josephson element is connected,
The high-speed drive function inherent in the superconducting element can be sufficiently exhibited.
【図１】本発明の多層配線基板の一実施例を示す断面図
である。FIG. 1 is a sectional view showing one embodiment of a multilayer wiring board of the present invention.
１・・・・基体 ２・・・・絶縁膜 ３・・・・回路配線 DESCRIPTION OF SYMBOLS 1 ... Base 2 ... Insulating film 3 ... Circuit wiring
───────────────────────────────────────────────────── フロントページの続き (58)調査した分野(Int.Cl.6，ＤＢ名) H01L 39/24 H01L 39/22 H01L 39/00 H05K 3/46 ──────────────────────────────────────────────────続 き Continued on the front page (58) Field surveyed (Int.Cl. 6 , DB name) H01L 39/24 H01L 39/22 H01L 39/00 H05K 3/46
Claims (1)
物膜を有する非酸化物系セラミックスから成る基体上
に、高分子材料から成る絶縁膜とニオブから成る回路配
線とを、絶縁膜を第一層目として交互に積層し、回路配
線を絶縁膜で挟み込むとともに回路配線の露出する表面
を非磁性材料で被覆したことを特徴とする多層配線基
板。An insulating film made of a polymer material and a circuit wiring made of niobium are formed on a substrate made of an oxide ceramic or a non-oxide ceramic having an oxide film on the surface. alternately laminated as eyes, circuit arrangement
Exposed surface of circuit wiring while wire is sandwiched between insulating films
Coated with a non-magnetic material .
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4107108A JP2958188B2 (en) | 1992-04-27 | 1992-04-27 | Multilayer wiring board |
| US08/257,486 US5474834A (en) | 1992-03-09 | 1994-06-09 | Superconducting circuit sub-assembly having an oxygen shielding barrier layer |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4107108A JP2958188B2 (en) | 1992-04-27 | 1992-04-27 | Multilayer wiring board |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH05304224A JPH05304224A (en) | 1993-11-16 |
| JP2958188B2 true JP2958188B2 (en) | 1999-10-06 |
Family
ID=14450676
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP4107108A Expired - Fee Related JP2958188B2 (en) | 1992-03-09 | 1992-04-27 | Multilayer wiring board |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2958188B2 (en) |
Families Citing this family (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3457851B2 (en) * | 1997-06-30 | 2003-10-20 | 京セラ株式会社 | Electronic circuit components |
| CA3058731C (en) | 2017-09-07 | 2022-07-05 | Google Llc | Flexible wiring for low temperature applications |
| JP2023542894A (en) | 2020-09-16 | 2023-10-12 | グーグル エルエルシー | Butt joint flex circuit board interconnect and its manufacturing method |
| WO2022060964A1 (en) | 2020-09-16 | 2022-03-24 | Google Llc | Overlap joint flex circuit board interconnection |
| CA3192869A1 (en) | 2020-09-16 | 2022-03-24 | John Martinis | Superconducting flex circuit boards having metal structures for improved interfacing characteristics |
| JP7095136B2 (en) * | 2021-03-09 | 2022-07-04 | グーグル エルエルシー | Flexible wiring for low temperature applications |
-
1992
- 1992-04-27 JP JP4107108A patent/JP2958188B2/en not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| JPH05304224A (en) | 1993-11-16 |
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| Date | Code | Title | Description |
|---|---|---|---|
| LAPS | Cancellation because of no payment of annual fees |