JP2957081B2 - Component mounting machine - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an improvement in a component mounter for mounting an electronic component on a substrate by a suction mechanism.

[0002]

2. Description of the Related Art In a conventional component mounter, although not shown, a plurality of tape feeders on which a plurality of electronic components are adhered are arranged in a wound state inside a main body frame.
X and Y for mounting electronic components vacuum-adsorbed from the tape feeder on the surface of the substrate are provided inside the main body frame.
A suction nozzle that can move in the direction is suspended.

The suction nozzle has a function of vacuum-sucking an electronic component from the tape feeder. However, the quality of the vacuum suction is very important because it greatly affects the mounting operation of the electronic component. Therefore, it is necessary to perform an operation of determining whether or not the electronic component is vacuum-sucked by the suction nozzle, and the determination of the quality is conventionally performed by utilizing a differential pressure of the vacuum pressure of the suction nozzle. I was

That is, when an electronic component on a tape feeder is normally sucked by the suction nozzle,
In the case of erroneous suction such as oblique suction or standing suction, a differential pressure is generated in the vacuum pressure inside the suction nozzle. Therefore, in view of this point, conventionally, the differential pressure of the vacuum pressure inside the suction nozzle is detected by an expensive differential pressure sensor, and the quality at the time of negative pressure suction is determined.

Incidentally, there is a problem with respect to the detection of the erroneous suction, so that it will be described in further detail later.

Further, the above-mentioned board is detachably set to a holding portion inside the main body frame from outside the component mounter, and is taken out from the holding portion of the main body frame after mounting the electronic component. With the cultivation of small varieties, there is a tendency that the frequency of using a plurality of types of products is more and more than the same type of products. But today,
A plurality of types of boards with different dimensions and thicknesses are used, but when the type of board changes (model change), the setup on the component mounting machine side is changed, ie, board thickness, board size, support pin positions Changes or program changes are required. Conventionally, such a changeover is performed after the component mounter is stopped, and then the worker bends down and puts his head inside the component mounter.

[0007] This setup change has the same problem as described above, and will be described in more detail later.

[0008]

Since the conventional component mounter is configured as described above, there are a number of problems described below.

First, with today's downsizing of electronic components, the suction hole at the tip of the suction nozzle is reduced (smaller) in diameter, and the difference in vacuum pressure is reduced even in the case of erroneous suction such as standing suction. Is disappearing. For this reason, in the case of standing suction, erroneous suction must be detected using a parallel light linear sensor in addition to the differential pressure sensor. As described above, there is a problem that a plurality of expensive detectors must be used when detecting mis-adsorption. In addition, the parallel light linear sensor is expensive, and it is difficult to align the light projection and light reception. In addition, the above-described setup change work has been problematic in that the worker has to bend down and put his head inside the component mounter, making the work itself difficult and very complicated. In particular, changing and adjusting the positions of the support pins with respect to the substrate thickness took a very long time.

Also, during the changeover work, the component mounting machine must be stopped naturally, and there is a serious problem that a reduction in the operating rate cannot be avoided at all. To explain this point more specifically, for example, when the mounting tact time of the component mounter is set to 1.4 seconds on average and 50 points are mounted per board, the time required for mounting electronic components is 70 seconds, and Assuming that the replacement takes 10 seconds, it takes about 80 × 100 = 8000 seconds (2 hours and 20 minutes) to mount 100 sheets. As described above, assuming that the mounting of one type of board is completed in 2 hours and 20 minutes, if it takes 30 to 40 minutes to set up the switching of the next model, the component mounter must be stopped during that time. Obviously, this leads to a significant decrease in the operating rate.

Furthermore, conventionally, in order to ensure the safety of the worker, an area sensor is installed on the front of the main body frame, and when the worker puts his hand during the mounting work, the component mounting machine stops. It had to be structured like this.

SUMMARY OF THE INVENTION The present invention has been made in view of the above, and provides a component mounter which can omit a plurality of expensive detectors, simplify the setup change operation, and maintain and improve the operation rate. It is intended to provide.

[0013]

According to the present invention, in order to achieve the above-mentioned object, a component supply means arranged inside a main body frame, a board located inside the main body frame, A movable suction mechanism for sucking the component and holding it with the holding claws, and mounting the sucked component on the substrate; and a distortion determining unit for determining whether or not the component is sucked based on the strain at the time of holding the holding claw. And a plurality of substrate stages for mounting a plurality of types of substrates having different dimensions, etc., and a plurality of substrate stages for mounting the substrates. In addition, another substrate having a different size or the like is mounted on another substrate stage located outside the main body frame.

The suction mechanism according to the present invention includes a case having a tapered portion near the opening end of the inner peripheral surface, a component which is inserted into the case so as to be able to move up and down, and suctions the component of the component supply means under a negative pressure. A suction nozzle for mounting the component to which the negative pressure-sucked component is mounted on a substrate, and a plurality of openable and closable holding claws disposed on the suction nozzle and configured to hold the component that has been negatively-suctioned due to non-contact with the taper portion An elastic body interposed between the suction nozzle and the holding claw to urge the holding claw in the holding direction, wherein the holding claw determines the quality of the component suction based on a distortion at the time of holding the holding claw. The distortion determining means is mounted.

Further, the substrate stage in the present invention comprises a substantially box-shaped main body having an open surface, an X-axis extending between both side surfaces inside the main body and located in front of the main body, and a front and rear inside of the main body. A plurality of Y-axes erected between the surfaces and located on both sides of the inside, a fixed rail provided through the plurality of Y-axes and fixed to the front inside the main body, and a plurality of Y-axes A movable rail that is disposed opposite to the fixed rail and that can be displaced in the front-rear direction and that detachably sandwiches the substrate between the fixed rail and the fixed rail; It comprises a fixed reference pin and a displaceable movable reference pin that penetrates the X-axis and is disposed on the other side inside the main body.

[0016]

According to the present invention having the above-described structure, when the sucked component is located at a regular position, the urging force of the elastic body acts on each of the plurality of holding claws. It takes stress. However, this predetermined stress is detected by the distortion determination means, and the appropriateness of the suction of the component is clearly determined. At this time, if the distortion judging means does not detect any stress, a suction error of the part is found out. If the strain judging means detects excessive stress or slight stress, oblique suction or standing suction is performed. The adsorption error of is clearly found.

According to the present invention having the above structure,
When components are mounted on a substrate, a plurality of substrate stages may be prepared, and another substrate having a different size and thickness may be set on another substrate stage during mounting of the substrate on one substrate stage. In this way, even if it takes a very long time to change or adjust the position of the support pins with respect to the board thickness, it is not necessary to stop the component mounter, so that a decrease in the operation rate can be easily eliminated. .

[0018]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS The present invention will be described below in detail with reference to one embodiment shown in FIGS.

In the component mounter according to the present invention, a plurality of tape feeders 7 are juxtaposed inside the main body frame 1, and the electronic components 8 sucked from the tape feeders 7 by the suction nozzles 94 are mounted on the substrate 10. A suction gauge 9 for suspending the electronic component 8 is provided on a holding claw 98 of the suction mechanism 9 for determining whether or not the electronic component 8 is suctioned based on distortion during holding. Inside the frame 1, one of a plurality of substrate stages 11 on which the substrate 10 is mounted is detachably provided from the outside.

The main body frame 1 is, as shown in FIG.
An opening surface (not shown) extending from the front surface to the upper surface is covered with an openable and closable cover 2, and an overhanging base 3 projecting forward is horizontally provided on the front surface. , Holding portion (not shown) inside main body frame 1
A substrate stage 11 slidably disposed (see the arrow in FIG. 2) is removably mounted. A plurality of operation buttons and the like 4 are provided on one side of the front surface of the main body frame 1, and the component mounting machine operates based on the operation of the plurality of operation buttons and the like 4. On one side of the upper surface of the main body frame 1, a work lamp 5 that lights up to indicate the state of the component mounter is provided upright. Further, substantially U-shaped guards 6 are horizontally arranged on both side surfaces and the rear surface of the main body frame 1 from the viewpoint of safety.

In this embodiment, the component mounter shown in FIG. 2 is shown. However, other shapes and structures may be used as long as they perform the same operation and function. Needless to say, a plurality of rollers or the like for smoothing the sliding of the substrate stage 11 may be rotatably juxtaposed from the surface of the overhanging base 3 to the surface of the holding portion of the main body frame 1. The sliding of the substrate stage 11 may be either manual or automatic. Further, needless to say, a plurality of substrate stages 11 may be stacked on the overhanging table 3 and the plurality of substrate stages 11 may be slid one by one on the holding portion of the main body frame 1.

The plurality of tape feeders (component supply means) 7 have a plurality of electronic components (components) 8 attached and detached in a line at predetermined intervals, as shown in FIGS. The component mounting machine is attached freely or enclosed in a concave portion of a tape subjected to embossing, and is wound side by side on one side inside the main body frame 1 in a line. And has a function of sequentially supplying the electronic components 8 by being wound up with the operation of.

The electronic component 8 may be a chip capacitor, a resistor, or the like, but is not limited to these electronic components, and may be a glass diode, a connector, or the like. In this embodiment, the electronic component 8 is supplied. However, an odd-shaped component or a component other than the electronic component 8 may be used. Further, in the present embodiment, a plurality of tape feeders 7 are used. However, it is needless to say that any other component supplying means having a function of sequentially supplying the electronic components 8 may be used. .

On the other hand, as shown in FIG. 1, the suction mechanism 9 moves above the inside of the main body frame 1 in the X and Y directions based on the rotation of a ball screw (not shown).
A suction nozzle 94 for sucking the electronic component 8 from the tape feeder 7 under a negative pressure is inserted into the case 90 in a vertically movable manner.
A plurality of holding claws 98 for positioning and holding the electronic component 8 that has been suctioned under negative pressure are provided.

The case 90 is formed in a substantially cylindrical shape having an open lower end, and has a reduced diameter portion 91 and an enlarged diameter portion 92 formed on the inner peripheral surface thereof. A tapered portion 93 is obliquely provided between the enlarged diameter portions 92. The suction nozzle 94 is provided with a through hole 95 for suctioning a negative pressure in the inner longitudinal direction, a plurality of pin mounting portions 96 protruding from the outer peripheral surface, and a plurality of spout mounting portions 97. Is protruding. The plurality of pin mounting portions 96 include holding claws 98 for centering and holding the electronic component 8.
Are pivotally attached to each other so that they can be opened and closed.
Rollers 99 that are in sliding contact with the large-diameter portion 92 or the tapered portion 93 are rotatably mounted on the upper end portions thereof. Furthermore, the holding claws 9 are attached to the plurality of sprung mounting portions 97.
A compression ridge (elastic body) 100 for urging each of the elastic members 8 in the closing holding direction is attached.

However, when the roller 99 slides on the tapered portion 93 on the inner peripheral surface when the plurality of holding claws 98 are lowered, the plurality of holding claws 98 are released while compressing the compressed ridge 100, and when the roller 99 is raised, the holding claws 98 are brought into contact with the enlarged diameter portion 92 on the inner peripheral surface. When the roller 99 slides, the roller 99 is closed by the elastic force of the compression ridge 100. Further, a strain gauge (strain determining means) 101 is attached to the holding claw 98, and the strain gauge 101 attracts the electronic component 8 from the stress (strain) acting on the holding claw 98 by the elastic force of the compression ridge 100. Has the function of judging the quality.

In the above embodiment, the suction mechanism 9 which moves in the X and Y directions based on the rotation of the ball screw is shown. However, the structure and the number are not limited as long as they have the same function. Absent. In the above embodiment, the case using the substantially cylindrical case 90 is shown, but the present invention is not limited to this shape. In the above embodiment, the suction nozzle 94 shown in FIG. 1 is used. However, other names, shapes, structures, and numbers may be used as long as they have the same function. Further, in the above-described embodiment, the suction nozzle 94 that suctions by utilizing the negative pressure action is shown, but the present invention is not limited to the negative pressure action as long as it has the same function. Further, in the above embodiment, the compression ridge 10
0 is used, but other types of existing elastic members or other elastic members such as rubber may be used as long as they perform the same function, or the compression member 100 or another elastic member may be replaced with another elastic member. Obviously, it may be attached to the place. Further, in the above-described embodiment, an example using the plurality of holding claws 98 shown in FIG. 1 is shown.
It goes without saying that the shape, structure, and number may be used. In the above-described embodiment, the plurality of holding claws 98 hold the electronic component 8. However, if the holding claw 98 performs the same operation,
It is needless to say that the present invention is not limited to the holding mode, but may be another mode such as pinching, gripping, gripping, or holding. further,
In the above embodiment, the strain gage 101 is attached to one holding claw 98, but the strain gage 101 may be attached to each of the plurality of holding claws 98. Further, it is clear that the strain gauge 101 is not necessarily required as long as it has substantially the same function.

Further, as shown in FIGS. 3 to 5, the above-mentioned substrate stage 11 is provided inside a substantially box-shaped main body 110 having an open surface, with a fixed rail 116 positioned in front of the inside thereof. And fixed rail 11
A movable rail 118 that sandwiches the substrate 10 is disposed between the main body 110 and the fixed reference pin 1.
21 is fixedly provided, and a movable reference pin 123 is displaceably disposed on the other side inside the main body 110.

As shown in FIGS. 3 and 5, a handle 111 having a substantially concave shape is horizontally inserted in the center of the front of the main body 110, and the operator can work while holding the handle 111. Become. As shown in FIG. 4, a support pin mounting plate 112 is placed on the inner bottom surface of the main body 110, and a plurality of support pins 113 for horizontally supporting the substrate 10 are provided on the surface of the support pin mounting plate 112. It is erected. The support pin mounting plate 112 and the plurality of support pins 11
3 is used so that its height and length correspond to the thickness of the substrate 10. This is based on the reason that, in the case of surface mounting of the substrate 10, the mounting reference is the upper surface of the substrate 10, so that even if the thickness of the substrate 10 changes, the upper surface of the substrate 10 must have the same dimensions. It is.

In addition, between both side surfaces inside the main body 110,
As shown in FIG.
Is horizontally mounted, and a pair of Y-axes 115 located on both sides inside the main body 110 are horizontally supported between front and rear surfaces. A fixed rail 116 located in front of the inside of the main body 110 is fitted and fixed to the pair of Y-axes 115, and a plate-shaped lid 117 for preventing the board 10 from floating is fixed on the upper surface of the fixed rail 116. It is mounted so that it can rotate in the direction. A movable rail 118 facing the fixed rail 116 is disposed on the pair of Y-axes 115 so as to be displaceable in the Y direction. A plate-shaped upper surface of the movable rail 118 is provided to prevent the substrate 10 from floating. Lid 11
9 is mounted so as to be rotatable in the vertical direction, and the substrate 10 is detachably horizontally held between the movable rail 118 and the fixed rail 116 (see FIG. 4). Also,
A fixed reference pin mounting plate 120 located on one side inside the main body 110 is fitted to the X axis 114, and the fixed reference pin mounting plate 120 is fixed by penetrating through the reference hole 10 a of the substrate 10. The reference pin 121 is provided upright. As shown in FIG. 3, a movable reference pin mounting plate 122 that is displaceable in the X direction and is located on the other side inside the main body 110 is fitted through the X axis 114.
2, a movable reference pin 123 that stands through the reference hole 10b of the substrate 10 for positioning is provided upright. However, by appropriately displacing the movable rail 118 and the movable reference pin mounting plate 122, the substrate stage 11 can securely and easily mount a plurality of types of substrates 10 having different dimensions on the opening surface (FIG. 3). reference).

Although the above-described embodiment uses the substantially box-shaped main body 110 having an open surface, the present invention is not limited to this name, shape, and structure as long as it performs the same function. Alternatively, rotatable rollers, wheels, and the like for facilitating the movement may be provided at the lower four corners of the main body 110, for example. Also, the X axis 114 and the Y axis 115
It is needless to say that the number and arrangement of the pieces may be appropriately changed. In the above embodiment, the fixed rail 11
6 and movable rails 118 are provided with lids 117 and 119 for preventing the board 10 from floating, respectively.
If the substrate 10 does not float, the lid 117.11
9 may be omitted. Further, it goes without saying that the arrangement of the fixed reference pin 121 and the movable reference pin 123 may be appropriately changed.

Therefore, when mounting the electronic components 8 on the substrate 10, a plurality of substrate stages 11 are first prepared. The substrate 10 to be used immediately is set on one substrate stage 11, and the next substrate 10 having a different size and thickness is set on the other substrate stage 11. In these operations, while the substrate 10 of one substrate stage 11 is being mounted, another substrate 10 having a different size and thickness may be set on another substrate stage 11 located outside the main body frame 1. It may be performed at the same time if there is a reasonable margin.
In this way, even if the support pins 1
Even if it takes a long time to change or adjust the position of the position 13, it is not necessary to stop the component mounting machine, so that it is obvious that the decrease in the operation rate can be solved very easily.

To set the substrate 10 on the substrate stage 11, first, the movable rail 118 is appropriately displaced toward the back of the main body 110 and the movable reference pin mounting plate 122
Is appropriately displaced in the X direction. And the movable rail 118
And the fixed rail 11
6, the front end of the substrate 10 is locked,
Then, the substrate 10 is horizontally held between the fixed rails 116 and the fixed rails 116, and the reference holes 10a and 10b of the substrate 10 are fitted into the fixed reference pins 121 and the movable reference pins 123, respectively.
If covered with 9, the substrate 10 can be set on the substrate stage 11 reliably and easily.

When a substrate 10 having a different size and thickness is set on another substrate stage 11 located outside the main body frame 1 during the mounting, the positions of the support pins 113 and the like are changed and adjusted. The movable rail 118 is appropriately displaced in the Y direction from the current position, and the movable reference pin mounting plate 122 is appropriately displaced in the X direction from the current position. Then, the rear end of the substrate 10 is locked on the movable rail 118, and the front end of the substrate 10 is locked on the fixed rail 116. The movable rail 118 and the fixed rail 116 hold the substrate 10 horizontally. And movable reference pin 12
After the reference holes 10a and 10b of the substrate 10 are respectively fitted into the substrate 3 and covered with the lids 117 and 119, another substrate stage 1
1, the substrates 10 having different dimensions and thicknesses can be reliably and easily set.

When there are a plurality of substrate stages 11 located outside the main body frame 1, substrates 10 having different dimensions and thicknesses may be set on all of the substrate stages 11, respectively. Obviously, substrates 10 having different dimensions and thicknesses may be set on some of the substrate stages 11.

When the electronic component 8 is mounted on the board 10, the board 1 is inserted from the overhanging base 3 of the component mounter.
Then, the substrate stage 11 on which the “0” is mounted is shifted and set, and then a predetermined operation button of the component mounter may be operated. Then, based on the rotation of the ball screw, the suction mechanism 9 sequentially moves in the X and Y directions to position the suction nozzle 94 directly above the electronic component 8 on the tape feeder 7, and the case 90 in which the suction nozzle 94 is stopped. Descend from. When the suction nozzle 94 is lowered in this way, the rollers 99 of the plurality of holding claws 98 are in sliding contact with the tapered portion 93 from the enlarged diameter portion 92 on the inner peripheral surface of the case 90 while rotating.
8 open each while compressing the compression ridge 100,
In this state, the electronic component 8 is suctioned to the suction nozzle 94 by vacuum suction.

Next, the suction nozzle 94 is raised, and the rollers 99 of the plurality of holding claws 98 are moved to the tapered portion 93
, Respectively, while rotating and slidingly contacting the enlarged diameter portion 92, the plurality of holding claws 98 are respectively closed at the original positions by the restoring action of the compression ridge 100, and the electronic component 8 sucked under negative pressure contacts the plurality of holding claws 98. Centered and held. At this time, if the negatively attracted electronic component 8 is present at the correct position, the resilient pressing force of the plurality of compression ridges 100 acts on the plurality of holding claws 98, respectively. It takes. However, the predetermined stress is detected by the strain gauge 101 to clearly determine the appropriateness of the suction of the electronic component 8 (see FIG. 1). If the strain gauge 101 does not detect any stress, a suction error of the electronic component 8 is found. If the strain gauge 101 detects excessive stress or slight stress, oblique suction or standing suction is performed. Adsorption mistakes such as are clearly evident.

Next, based on the rotation of the ball screw, the suction mechanism 9 moves again in the X and Y directions to position the suction nozzle 94 directly above a predetermined position on the substrate 10, and the suction nozzle 94 stops. It descends again from 90. When the suction nozzle 94 is lowered in this way, the rollers 99 of the plurality of holding claws 98 are in sliding contact with the tapered portion 93 from the enlarged diameter portion 92 on the inner peripheral surface of the case 90 while rotating.
8 open each while compressing the compression ridge 100,
In this state, the electronic component 8 is mounted on the substrate 10. When the electronic component 8 is mounted in this manner, the suction nozzle 94 rises again, and the rollers 99 of the plurality of holding claws 98 are brought into sliding contact with the tapered portion 93 of the case 90 while rotating from the tapered portion 93 to the plurality of holding claws 98. Reference numeral 98 denotes a closing operation at the original position by the restoring action of the compression projection 100, and the above operation is repeated thereafter.

Next, when the mounting of the electronic component 8 is completed, the board stage 11 is shifted from the inside of the component mounting machine to the overhanging table 3, and the board 10 removed from the board stage 11 is turned upside down and set again. After shifting the substrate stage 11 on which the substrate 10 is mounted from the overhanging table 3 of the machine and setting it again, the predetermined operation button of the component mounter may be operated again. Then, the above operation is repeated,
The electronic component 8 is to be mounted on a new reverse surface of the substrate 10.

When the mounting of the board 10 is completed and the electronic component 8 is to be mounted on another board 10 having a different size and thickness, the mounted substrate stage 11 is removed from the inside of the component mounter. The other substrate stage 11 may be shifted out of the overhanging stand 3 and taken out from the overhanging stand 3 of the component mounter, and then set, and then a predetermined operation button of the component mounter may be operated. By doing so, the above operation is repeated, and the electronic component 8 is mounted on another substrate 10 having different dimensions and thickness.

According to the above configuration, the strain gauge 101 detects a predetermined stress acting on the plurality of holding claws 98 and clearly determines whether or not the electronic component 8 is sucked, so that a plurality of expensive detectors are used. There is no need at all. Therefore, it is possible to easily omit the difficult alignment work of the projection and reception of the parallel light linear sensor. Also, during mounting of the substrate 10 on one substrate stage 11, another substrate 10 having a different size and thickness can be easily set on another substrate stage 11, so that the component mounting machine can There is no need for the worker to bend down inside and put his head inside, which can greatly simplify and facilitate the work. In addition, since it is not necessary to stop the component mounter for 30 minutes or 40 minutes during the setup change operation, it is possible to very easily avoid a decrease in the operation rate of the component mounter. Furthermore, it is not always necessary to provide a structure in which a component mounting machine stops when an operator enters a hand during the mounting operation.

In the above embodiment, the suction mechanism 9 is used as a component mounter for taking out the substrates 10 one by one. However, a component mounter of the type in which a large number of substrates 10 are sequentially conveyed and mounted. For example, even when the suction mechanism 9 including the strain gauge 101 is used, the same operation and effect as those of the above-described embodiment can be obtained.

[0043]

As described above, according to the present invention, it is not necessary to use a plurality of expensive detectors, and it is possible to omit the difficult alignment operation of the parallel light linear sensor for light projection and light reception. Further, there is no need for a worker to bend down and put his / her head inside the component mounting machine at the time of the setup change work, so that simplification and simplification of the work can be expected. Further, since it is not necessary to stop the component mounter during the setup change operation, it is possible to avoid a decrease in the operation rate. Furthermore, there is a special effect that it is not always necessary to configure a structure in which the component mounting machine stops when an operator takes a hand during the mounting operation.

[Brief description of the drawings]

FIG. 1 is an explanatory sectional view showing a suction mechanism of a component mounter according to the present invention.

FIG. 2 is an overall perspective view showing one embodiment of a component mounter according to the present invention.

FIG. 3 is a plan view showing a substrate stage of the component mounter according to the present invention.

FIG. 4 is a side view showing a substrate stage of the component mounter according to the present invention.

FIG. 5 is a front view showing a substrate stage of the component mounter according to the present invention.

[Explanation of symbols]

DESCRIPTION OF SYMBOLS 1 ... Body frame, 3 ... Overhang stand, 7 ... Tape feeder, 8 ... Electronic components, 9 ... Suction mechanism, 10 ... Board, 11
... substrate stage, 90 ... case, 93 ... taper part, 9
4 ... suction nozzle, 98 ... holding claw, 100 ... compression generation, 1
01: strain gauge, 114: X axis, 115: Y axis, 11
6: fixed rail, 118: movable rail, 121: fixed reference pin, 123: movable reference pin

Continuation of the front page (56) References JP-A-2-207596 (JP, A) JP-A-4-241498 (JP, A) JP-A-4-338698 (JP, A) JP-A-63-234600 (JP) JP-A-3-287338 (JP, A) JP-A-4-35891 (JP, U) JP-A-60-194432 (JP, U) JP-A-2-15800 (JP, U) Field surveyed (Int.Cl. ⁶ , DB name) H05K 13/04 H05K 13/08

Claims (3)

(57) [Claims] 1. A component supply means disposed inside a main body frame, a board located inside the main body frame, and a component of the component supply means being sucked and held by a holding claw, and the sucked component being held A movable suction mechanism for mounting the mounting claw on a substrate, distortion determining means for determining the quality of component suction based on distortion during holding of the holding claw, and a plurality of types of substrates having different dimensions and the like can be mounted. And a plurality of substrate stages for mounting the substrate, wherein the substrate is mounted on one substrate stage of the plurality of substrate stages, and is arranged from the outside of the main body frame to the inside. A component mounting machine characterized by mounting another substrate having different dimensions and the like on a substrate stage. 2. The suction mechanism according to claim 1, wherein the suction mechanism includes a case having a tapered portion formed near an opening end of the inner peripheral surface, a component which is inserted into the case so as to be able to move up and down, and suctions the component of the component supply means under a negative pressure. A suction nozzle mounted on the substrate for mounting the pressure-sucked component, a plurality of openable / closable holding claws disposed on the suction nozzle for holding the component suctioned negatively due to non-contact with the tapered portion; An elastic body interposed between the nozzle and the holding claw for urging the holding claw in the holding direction, wherein the holding claw determines whether the component is attracted or not based on the strain at the time of holding the holding claw. 2. The component mounting machine according to claim 1, further comprising a determination unit. 3. The substrate stage has a substantially box-shaped main body having an open surface, an X-axis erected between both side surfaces inside the main body and located in front of the main body, and a front-rear surface inside the main body. A plurality of Y-axes that are erected and located on both sides of the inside, a fixed rail that penetrates the plurality of Y-axes and is fixedly provided at the front inside the body, and a fixed rail that penetrates the plurality of Y-axes. A movable rail capable of being displaced in the front-rear direction for detachably holding the substrate between the opposed fixed rail and a fixed reference pin fixedly provided on one side inside the main body through the X-axis; 2. The component mounter according to claim 1, further comprising a movable reference pin that penetrates through the X axis and is disposed on the other side inside the main body.