JP2955941B2 - Processing device and processing method - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

The present invention relates to an apparatus and a method for processing a substrate to be processed such as a semiconductor wafer.

[Prior art]

Oxidation, diffusion, CVD in semiconductor wafer process
A heat treatment apparatus is used for heat treatment such as the above. Before the film forming step, the thermal diffusion step, and the like performed by this heat treatment apparatus, wafer cleaning (wet cleaning) is performed as a pretreatment, almost as a pretreatment. This wafer cleaning is performed for the purpose of removing various contaminants and natural oxide films, and a dedicated wafer cleaning apparatus is generally used. Then, a plurality of wafers, for example, 25 wafers cleaned by the wafer cleaning apparatus are stored in a carrier as a wafer storage tool, and the carrier is transferred to a heat treatment apparatus. In the heat treatment apparatus, in the case of single-wafer processing, each wafer is taken out of a carrier and transferred to a wafer chuck as a holder, and the wafer chuck is processed. For example, a plurality of wafers for a plurality of carriers are transferred to a heat treatment boat or wafer holder as a holder, and heat treatment is performed in a state of being accommodated in the boat or wafer holder.

[Problems to be solved by the invention]

By the way, since the purpose of wafer cleaning is to remove various contaminants and the removal of a natural oxide film, it is desirable to perform the heat treatment step as short as possible after the wafer cleaning is completed. However, as described above, since the cleaning device and the heat treatment device are separate from each other, it is necessary to transfer the wafer by a carrier, and a natural oxide film grows on the wafer during the transfer time. For this reason, conventionally, plasma cleaning of the wafer surface is performed in a heat treatment apparatus, for example, a film forming apparatus, or the processing is performed as it is. However, the plasma cleaning has a drawback that causes damage to the wafer, and if it is processed as it is, there is a drawback that the natural oxide film causes electrical characteristic failure and the like. In view of the above, the present invention has been made to eliminate the above-mentioned drawbacks by adding a cleaning function to a portion for transferring a substrate to and from a holder of a storage tool.

[Means for Solving the Problems]

In the present invention, the substrate to be processed is transferred from a storage device for transfer, to a holder for holding a plurality of the substrates to be processed and performing a predetermined process in a processing chamber, and then holding the substrate to be processed. In a processing apparatus in which the step of carrying the holding tool into the processing chamber and performing the processing is performed consistently in a space surrounded by a wall, a plurality of the substrates to be processed are stored in the storage tool, A chuck means for taking out and holding; a chuck moving means for moving the chuck means between an arrangement position of the storage tool and an arrangement position of the holding tool; and a moving path of the chuck means by the chuck moving means. Cleaning means and drying means provided at a predetermined position, and the chuck moving means,
The plurality of substrates to be processed held by the chucking means are moved from the placement position of the storage tool to the placement position of the holding tool, and the holding tool is moved during the movement of the chucking means. The plurality of substrates to be processed before being transferred to the above are cleaned and dried by the cleaning means and the drying means.

[Action]

The substrate to be processed is cleaned by the cleaning means while the substrate to be processed is transferred from a storage device, for example, a carrier, to a holder, for example, a boat. Then, the substrate to be processed immediately after the cleaning, which has been transferred to the holder, is immediately subjected to processing. Further, for example, when transferring the substrate to be processed, which has been subjected to the ashing process, from the holder to the storage device, cleaning is performed by the cleaning unit, and the processed substrate to be cleaned is stored in the storage device. Therefore, a cleaning device after the ashing process is unnecessary.

【Example】

Hereinafter, an embodiment of a processing apparatus according to the present invention will be described with reference to the drawings, taking a case of a heat treatment apparatus as an example. As shown in FIG. 1, the heat treatment apparatus of this example includes a carrier stocker 1 capable of accommodating a plurality of wafer carriers for accommodating a plurality of substrates to be processed, for example, semiconductor wafers, for example, 25 wafers, the wafer carrier, and the wafer. A transfer mechanism 2 with a washing machine for transferring the wafers to and from a quartz wafer boat for heat treatment capable of mounting a plurality of, for example, 100 to 150, and performing wet cleaning during the transfer, and a multi-stage For example, a transport mechanism 3 that accommodates the boats in four stages and carries the boat into and out of the corresponding heat treatment chamber.
An elevator 4 for transferring the boat between the transfer mechanism 3 and the transfer mechanism 2 with a washing machine;
A furnace body 5 provided with the above-mentioned heat treatment chambers configured in multiple stages, for example, four stages, corresponding to the transfer mechanism 3 having a stage structure and capable of performing desired oxidation, diffusion, CVD processing, etc. And a gas supply source 6 for supplying a predetermined processing gas. Carrier installation plates (not shown) are attached to the carrier stocker 1 in multiple stages, and a plurality of, for example, four carriers can be installed on each carrier installation plate. A carrier holder (not shown) that can move up and down between the carrier setting plates is provided, and a plurality of, for example, four carriers set on the carrier setting plate can be collectively gripped. Can be moved to a desired position. As described later, the transfer mechanism with a washing machine 2 includes a transport unit that slides and transports the carrier from the carrier stocker 1, a push-up mechanism for removing a plurality of wafers from the carrier, and a holding mechanism for the removed wafer. And a transfer unit for transferring the wafer from the holding unit to the boat. FIG. 2 shows an embodiment of the transfer mechanism 2 with a washing machine. On the box-shaped housing 11, carriers 40 ₁ , 40 ₂ ,
40 _3, 40 ₄ boat stage 13 where the carrier stage 12 and the boat 41 is placed is provided so as to be positioned on the same line are placed. An operation panel (not shown) is provided on the side wall of the housing 11 side by side. Further, a path between the carrier stage 12 and the boat stage 13 includes a cleaning tank 14 for performing wet cleaning with a cleaning liquid,
The washing tank 15 and the drying tank 16 are sequentially arranged in-line. In the cleaning tank 14, a plurality of wafers are, for example, NH ₄ OH, H ₂
O ₂ , H ₂ O (or HF, H ₂ O) is used to perform wet cleaning with a chemical solution, and in the washing tank 15, the chemical solution is washed and removed with, for example, clean (ultra) pure water. Dry the washed wafer. A plurality of carriers are transported to the carrier stage 12 by a transport unit (not shown). In addition, the carrier stage 12 has a push-up plate retracting hole 17 of a push-up mechanism, which will be described later, opened corresponding to the carrier to be placed. Within this bore 17 is provided in a plurality corresponding to the third carrier 40 ₁ to be placed on the push-up mechanism 18 is the carrier stage 12 as shown in FIG, 40 _2, 40 _3, 40 _4. In FIG. 3, only one push-up mechanism 18 is shown, and the other is omitted. The push-up mechanism 18 includes a cylinder 20 having a plurality of, for example, 25 pistons 19 that move up and down, and a plurality of push-up plates 21 having an arc-shaped groove. The plurality of push-up plates 21 are respectively attached to the upper ends of the respective pistons 19, and the upper and lower operations of the respective pistons 19 cause the holes of the carrier stage 12 to be moved.
Haunts through 17. Carrier stage 12, boat stage 13 and washing tank 1
4. An elongated hole 22 is formed in the housing 11 on the front side of the washing tank 15 and the drying tank 16. Below this slot 22,
As shown in FIG. 3, two guide shafts 23a and 23b are disposed so as to be parallel to each other. These guide shafts 23
A sliding table 24 is mounted on a and 23b. An engagement plate 25 is provided upright on the slide table 24, and a ball screw 26 arranged in parallel with the guide shafts 23a and 23b is screwed to the engagement plate 25. One end of the ball screw 26 is pivotally supported by the support plate 27, and
The other end is connected to a pulse motor 28. The pulse motor 28 is connected to a motor drive circuit 29, and the motor drive circuit 29 is connected to a control mechanism 30 provided on an operation panel. Therefore, the pulse motor 28 is driven by outputting a predetermined signal from the control mechanism 30 to the motor drive circuit 29,
The ball screw 26 connected to the pulse motor 28 rotates. By the rotation of the ball screw 26, the sliding table 24 engaged with the ball screw 26 via the engagement plate 25 moves along the two guide shafts 23a and 23b. On the slide table 24, a cylinder 32 having a pair of pistons 31a and 31b that move up and down is provided.
At the upper ends of these pistons 31a and 31b, a chuck drive mechanism 3 is provided.
Three are provided. This chuck driving mechanism 33 is
4, four operating shafts 35a to 35d extending horizontally from the main body 34 and capable of being moved forward and backward, and provided at the rear ends of the operating shafts 35a to 35d inserted into the main body 34. Working shaft 35a,
A gear system (not shown) for driving 35b, 35c and 35d in directions opposite to each other, and a motor (not shown) for rotating this gear system are provided. Further, a wafer chuck 36 is attached to the chuck driving mechanism 33. This wafer chuck 36
It has a pair of open / close plates 37a, 37b arranged in parallel and opposed to each other. The one opening / closing plate 37a located on the side closer to the main body 34 is supported by the tips of two (for example, 35a and 35b) operating in the same direction among the four operating shafts 35a to 35d. The other opening / closing plate 37b penetrates one opening / closing plate 37a and is supported by the tips of the remaining two operating shafts 35c and 35d operating in the same direction. Further, holding portions 38a and 38b for holding the wafers are provided on the inner surfaces of the lower ends of the opening and closing plates 37a and 37b, respectively.
A plurality of claws extending from the upper end to the lower end are formed on the inner surfaces of the holding portions 38a and 38b, for example, at a pitch (3/8 inch pitch) that is twice as large as the carrier pitch (3/16 inch pitch). When the motor of the chuck driving mechanism 33 is operated in the chuck driving mechanism 33, the two operating shafts 35a and 35b supporting the opening / closing plate 37a of the wafer chuck 36 on the side closer to the main body 34 are retracted. 2 that supports the open / close plate 37b
The operating shafts 35c and 35d move forward to open the pair of open / close plates 37a and 37b. When the operating shafts 35a, 35b supporting the respective open / close plates 37a, 37b and 35c, 35d are operated in the opposite direction, the pair of open / close plates 37a, 37b is closed. The cylinders 20 and 32 and the chuck driving mechanism 33 operate at a necessary timing together with the pulse motor 28 for rotating the ball screw 26 according to a programming signal from a control mechanism 30 provided on the operation panel. The transfer mechanism 2 is disposed on the front surface of the transport mechanism 3, similarly to the carrier stocker 1. This is because, for example, when the carrier stocker 1 is arranged above a part of the transfer mechanism 2,
It is arranged on the front of. The elevator 4 has an arm that moves up and down and moves back and forth in a horizontal state, and the arm 41 can transport the boat 41. The transport mechanism 3 has a multi-stage structure, for example, a four-stage structure.
In each stage, an independent transport mechanism, for example, a soft landing mechanism is provided. Further, the furnace body 5 is provided with a multi-stage, for example, four-stage heat treatment chamber corresponding to the multi-stage transfer mechanism 3. In this heat treatment chamber, a coil-shaped heater is wound around a reaction tube made of, for example, quartz. A scavenger 7 is provided at a joint between the transfer mechanism 3 and the heat treatment chamber in order to exhaust and heat the inside of the reaction tube.
A supply pipe from a gas supply source 6 is connected to an end of the heat treatment chamber that is different from the scavenger 7 side, so that a desired reaction gas can be supplied into the heat treatment chamber. Further, the gas supply source 6 is provided so as to be capable of controlling the flow rate of the desired reaction gas and carrier gas and the switching of the gas. The heat treatment apparatus is configured as described above. Next, the operation and operation of the above-described heat treatment apparatus will be described. First, a carrier containing a plurality of unprocessed wafers is loaded into the carrier stocker 1 by an automatic transfer robot or manually. Next, a plurality of, for example, four carriers 40 ₁ , 40 ₂ ,
40 _3, 40 ₄ to sorting mechanism 2 with washer, for example, slide transporting. The operation of the transfer mechanism with washing machine 2 will be described below with reference to FIGS. First, as shown in FIG. 2 and FIG.
Carrier stage 12 with 25 wafers 39 stored at standard pitch (3/16 inch pitch)
40 _{1-40 4} directly above the respective push-up mechanism 18 is placed so as to be positioned respectively. Further, a quartz boat 41 in which a plurality of (for example, 100) grooves are cut at a double pitch (3/8 inch pitch) is set on the boat stage 13 of the housing 11 by a transfer device (not shown). Next, a predetermined signal is output from the control mechanism 30 to the drive circuit 29, the pulse motor 28 is rotated for a predetermined time, and the ball screw 26 connected to the pulse motor 28 is rotated. Thereby, the slide table 24 engaged with the ball screw 26 via the engagement plate 25 moves along the guide shafts 23a and 23b, and is supported and fixed to the slide table 24 via the cylinder 32 and the chuck drive mechanism 33. Wafer chuck 36 as the first carrier
Is positioned directly above the 40 ₁ (see FIG. 5). Next, the cylinder 20 of the push-up mechanism 18 is driven to raise the thirteen pistons 19 from the left end, and the push-up plates 21 attached to the tips of the pistons 19 are raised. Thus, the push-up plate 21 passes through the hole 17 of the carrier stage 12, receiving their upper arcuate accommodated in the carrier 40 ₁ in a groove 13 of wafers 39, respectively, each wafer 39 each push-up plate
The wafer is moved upward through the wafer chuck 36 in the open state together with 21 (see FIG. 6). Next, the motor of the chuck drive mechanism 33 is rotated to advance the two operating shafts 35a and 35b that support the open / close plate 37 on the side closer to the chuck drive mechanism 33 in the wafer chuck 36, and support the other open / close plate 37b. The two operating shafts 35c and 35d are retracted, and the pair of open / close plates 37a and 37b are closed (see FIG. 7). Subsequently, the cylinder 20 of the push-up mechanism 18 is driven to lower the left end piston 19, and the push-up plate 21 attached to the tip of the piston 19 is lowered. When the lifting plate 21 descends between the open / close plates 37a and 37b in the closed state of the wafer chuck 36,
The wafer 39 received by the push-up plate 21 includes opening and closing plates 37a and 37b.
Are engaged with the grooves between the left-hand claws formed on the holding portions 38a and 38b (see FIG. 8). Then, the pulse motor 28 rotates a predetermined time the drive circuit 29 from the control mechanism 30 outputs a predetermined signal, by rotating the ball screw 26 connected to the pulse motor 28, the wafer chuck 36 of the carrier 40 ₁ Groove pitch (3/1
(6 inch pitch) and the groove pitch (3/8 inch pitch) between the claws of the wafer chuck 36 were moved by a distance (3/16 inch pitch) corresponding to the difference and received by the second push-up plate 21 from the left. The wafer 39 is aligned with the groove between the second claw from the left end of the wafer chuck 36. continue,
The cylinder 20 of the push-up mechanism 18 is driven to lower the second piston 19 from the left end, and the push-up plate 21 attached to the tip of the piston 19 is moved to the open / close plate 37 in the closed state of the wafer chuck 36.
Then, the wafer 39 received by the push-up plate 21 is engaged with the groove between the second claw from the left end formed on the holding portions 38a, 38b of the opening / closing plates 37a, 37b. Thereafter, the same movement of the wafer chuck 36 to the left by a distance of 3/16 inch pitch is repeated, and the lowering of the third and subsequent push-up plates 21 is repeated.
36 engaged in the grooves between the claws in the carrier 40 ₁ of groove pitch of double-pitch formed. Next, the cylinder 32 on the sliding table 24 is driven,
By raising the pistons 31a and 31b, the wafer chuck 36 is raised to a predetermined position. Subsequently, a predetermined signal is output from the control mechanism 30 to the drive mechanism 29, the pulse motor 28 is rotated for a predetermined time, and the ball screw 26 connected to the motor 28 is rotated.
By rotating the sliding table 24, the guide shaft 23
The wafer chuck 36 is moved along the positions a and b, and the wafer chuck 36 supported and fixed to the slide table 24 via the cylinder 32 and the chuck drive mechanism 33 is positioned right above the cleaning tank 14. Then, the cylinder 32 is driven to lower the pistons 31a and 31b, so that the wafer chuck 36 supported by the chuck driving mechanism 33 is immersed in the cleaning tank 14. In the cleaning tank 14, NH
_Since a chemical solution composed of ₄ OH, H ₂ O ₂ , and H ₂ O (or HF, H ₂ O) is contained, the natural oxide film on the wafer 39 is cleaned and removed. When this cleaning is completed, the cylinder 32 is driven again to raise the pistons 31a and 31b, thereby
6 is lifted and taken out of the washing tank 14. Subsequently, a predetermined signal is output from the control mechanism 30 to the drive mechanism 29, the pulse motor 28 is rotated for a predetermined time, and the ball screw 26 is rotated to move the slide table 24 along the guide shafts 23a and 23b. Then, the wafer chuck 36 is positioned right above the washing tank 15. Then, the cylinder 32 is driven to lower the pistons 31a and 31b, and the wafer chuck 36 is put into the washing tank 15. Then, in the washing tank 15, the chemical solution attached to the wafer is washed away with, for example, distilled water. When the rinsing is completed, the cylinder 32 is driven again to raise the pistons 31a and 31b, and the wafer chuck 3
6. Lift 6 and remove it from washing tank 15. Subsequently, a predetermined signal is output from the control mechanism 30 to the drive mechanism 29, the pulse motor 28 is rotated for a predetermined time, and the ball screw 26 is rotated to move the slide table 24 along the guide shafts 23a and 23b. Then, the wafer chuck 36 is positioned right above the drying tank 16. Then, by driving the cylinder 32, the pistons 31a and 31b are lowered, and the wafer chuck 36 is put into the drying tank 16,
The washed wafer is dried. When the impression is completed, the cylinder 32 is driven again to raise the pistons 31a and 31b, lift the wafer chuck 36, and take it out of the drying tank 15. Subsequently, a predetermined signal is output from the control mechanism 30 to the drive mechanism 29, the pulse motor 28 is rotated for a predetermined time, and the ball screw 26 is rotated to move the slide table 24 along the guide shafts 23a and 23b. ,
The wafer chuck 36 is located immediately above the front side of the quartz boat 41. Then, the cylinder 32 is driven to lower the pistons 31a and 31b to lower the wafer chuck 36 to a position in the quartz boat 41. As a result, the 13 cleaned wafers held by the wafer chuck 36 are engaged with the grooves formed at a double pitch (3/8 inch pitch) of the quartz boat 41 and transferred. After the transfer operation of the thirteen wafers in the _first carrier 401 is completed, the piston 31 of the cylinder 32
a, 31b raises wafer chuck 36, pulse motor 2
Movement of table 24 by rotation of 8, wafer chuck 36
Is moved onto the _first carrier 401, and the wafer chuck 36 is lowered by the pistons 31a and 31b of the cylinder 32, and the 12 wafers 3 remaining in the _first carrier 401 are moved.
Prepare to transfer 9. Subsequently, by the similar process to engage the 12 wafers 39 of the carrier 40 ₁ between nail fold pitch of the wafer chuck 36. After this,
By the same process as above, the lifting of the wafer chuck 36,
After the wafer is horizontally moved and lowered, the twelve wafers held at the double pitch by the wafer chuck 36 are subjected to the wet cleaning operation through the cleaning tank 14, the water cleaning tank 15, and the drying tank 16, and then the quartz boat is moved. The transfer is performed on the left side of the area where the transfer has already been performed in step 41. Next, the wafer 3 stored in the _second carrier 402
By performing the same operation for 9, after cleaning all 50 wafers 39 accommodated in the _two carriers 40 ₁ and 40 ₂ , the double pitch (3/8 Transfer is performed by engaging with the groove machined at (inch pitch). Similarly, the carrier 40 _3, 40 ₄ of the wafer was washed with performing re transferred to a quartz boat 41. By the above transfer, the boat 41 on which a plurality of wafers, for example, 100 wafers are loaded, is transported by the arm of the elevator 4 into the transport mechanism 3 at a desired stage. Then, the boats 41 are inserted into the corresponding heat treatment chambers in the furnace body 5 to perform desired heat treatment. The wafer after the heat treatment is transferred from the boat 41 to an empty carrier and stored in the carrier stocker or transferred to the outside. In the above-described embodiment, the description has been made using the soft landing mechanism as the transport mechanism 3, but the transport mechanism is not limited to this. For example, the transport mechanism can be similarly performed using a boat loader, a cantilever, or the like. Further, the number of processing chambers may be one instead of a plurality of chambers. As described above, according to the illustrated embodiment, the carrier 40
When transferring from _{1-40 4} to the boat 41, while holding the wafer at the wafer chuck 36 performs wet cleaning, just after washing, since the wafer can be mounted on the boat 41, a long time from the cleaning Without going through, a film forming process, a process such as diffusion and oxidation can be performed. In the above example, the wafer before processing is cleaned, but after the ashing processing, for example, as in an etching step, and further, as in the case of performing wet cleaning, the wafer is transferred from the boat to the carrier after the processing. The present invention can be applied to the case of changing. In addition, the substrate to be processed is not limited to a wafer.
Of course, a D substrate or the like may be used.

【The invention's effect】

As described above, the processing apparatus according to the present invention can be used to transfer a substrate to be processed from a storage device (for example, a carrier) for a substrate to be processed to a holding device (for example, a boat), or vice versa. In addition, since the cleaning can be performed, the substrate to be processed can be processed without delaying from the cleaning, and the growth of the natural oxide film can be prevented. Also, since a washing machine is added to the processing equipment itself,
No cleaning process is required as a pre-process or post-process,
There is also an effect that a dedicated cleaning device is not required.

[Brief description of the drawings]

FIG. 1 is a diagram showing an outline of an embodiment of a processing apparatus according to the present invention, FIG. 2 is a diagram showing an outline of a transfer mechanism with a washing machine, and FIG. FIG. 4 is a diagram illustrating an example of a unit, FIG. 4 is a diagram for explaining the operation of a transfer mechanism with a washing machine, and FIGS. 5 to 8 are diagrams for explaining a wafer transfer operation. 1; carrier stocker 2; transfer mechanism with washing machine 3; transport mechanism 4; elevator 5; furnace body 12; carrier stage 13; boat stage 14; washing tank 15; washing tank 16; drying tank 24; sliding table 36; Wafer chuck 40 ₁ to 40 ₄ ; Carrier 41; Boat

──────────────────────────────────────────────────の Continued on the front page (51) Int.Cl. ⁶ Identification code FI H01L 21/324 H01L 21/324 W

Claims (4)

(57) [Claims] 1. A substrate to be processed is transferred from a carrier for transfer to a holder for holding a plurality of substrates to be processed and performing predetermined processing in a processing chamber, and then holding the substrate to be processed. In the processing apparatus, the step of carrying the holding tool into the processing chamber and performing the processing is performed consistently in a space surrounded by a wall. A chuck means for taking out and holding; a chuck moving means for moving the chuck means between an arrangement position of the storage tool and an arrangement position of the holding tool; and a moving path of the chuck means by the chuck moving means. Cleaning means and drying means provided at positions along the axis, wherein the chuck moving means moves the chuck means from the disposition position of the storage tool to the disposition position of the holding tool. The transfer of the plurality of substrates to be processed held by the chucking means is performed, and the plurality of substrates to be processed before being transferred to the holder is transferred to the cleaning means during the movement of the chucking means. And a cleaning apparatus for performing washing and drying by the drying means. 2. A holder holding a plurality of substrates to be processed is carried into a processing chamber for processing. After this processing, the holder is unloaded from the processing chamber and processed from the unloaded holder. The step of transferring the substrate to be processed to the container for transporting the substrate to be processed is performed consistently in a space surrounded by a wall. Chuck means for taking out and holding the processing substrate from the holding tool; chuck moving means for moving the chuck means between the position of the holding tool and the position of the storage tool; and the chuck moving means. Cleaning means and drying means provided at a position along the movement path of the chuck means, and the chuck movement means moves the chuck means upward from the position where the holder is arranged. The plurality of substrates to be processed held by the chuck means are moved to the arrangement position of the storage tool, and the plurality of substrates before transfer to the storage tool are transferred during the movement of the chuck means. The substrate to be processed is cleaned and dried by the cleaning means and the drying means. 3. A process for taking out a plurality of substrates to be processed from a storage container for transporting the substrates to be processed by chuck means, and holding the plurality of substrates to be processed, and the chuck holding the plurality of substrates to be processed. Means for holding a plurality of substrates to be processed and moving to a position of a holder for predetermined processing in a processing chamber, and a transfer step of transferring the plurality of substrates to the holder; In the middle of the transfer step, before the transfer to the holder, a washing and drying step of washing and drying the plurality of substrates to be processed, and the holding to hold a plurality of the washed and dried substrates to be processed. Carrying out the tool into the processing chamber and performing the predetermined process in a space surrounded by a wall. 4. A processing step in which a holder holding a plurality of substrates to be processed is carried into a processing chamber, and processing is performed in a state where the substrate to be processed is held by the holders. Later, an unloading step of unloading the holder holding the object to be processed from the processing chamber, and holding the plurality of processed substrates unloaded in the unloading step by the chucking means. A process of taking out the substrate to be taken out and holding, and moving the chuck means holding the plurality of processed substrates to the position of the storage container for transporting the processed substrate, A transfer step of transferring a plurality of substrates to be transferred to the storage device; and in the middle of the transfer process, cleaning and drying the processed substrates before transfer to the storage device. Washing and drying process A processing method, wherein the steps are performed consistently in a space surrounded by walls.