JP2939494B2 - Metallized film capacitors - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a capacitor using a metallized plastic film having a security mechanism (hereinafter referred to as a metallized film).

[0002]

2. Description of the Related Art A conventional high-voltage capacitor uses a paper or plastic film or a combination thereof as a dielectric, and employs a dielectric element and an aluminum foil electrode alternately stacked and wound to form a capacitor element. It had been. In some fields, those using metallized paper or metallized film are also employed.

[0003]

The dielectric of the capacitor is as thin as several μm to several tens μm and has a large area. For this reason, a dielectric is likely to have a defect in withstand voltage, and a capacitor must be designed in consideration of the defect.

In the conventional design, a method has been adopted in which a plurality of dielectrics are overlapped to cover a defective portion of one dielectric with another dielectric. This method was effective as the number of superposed dielectrics was increased, but when the thickness of the dielectric was increased, the thickness between the electrodes was increased, and partial discharge was generated from the end faces of the electrodes to shorten the life of the capacitor. There is a problem that it is difficult to respond to recent demands for miniaturization and lightening of capacitors due to an increase in the volume of capacitor components due to an increase in the thickness of the dielectric.

As another countermeasure against defects, a method of recovering insulation by vaporizing and scattering an electrode metal around a defective portion of a dielectric by a discharge current at the time of dielectric breakdown by adopting a metal deposition electrode (deposition around an insulating defective portion). The electrode metal evaporates and scatters with the energy due to momentary short-circuit, and is separated from the functional part of the capacitor, and the function of the capacitor is recovered. Due to the difficulty, it has not been put to practical use.

SUMMARY OF THE INVENTION The present invention has been made to solve the above-mentioned conventional problems and disadvantages. It is an object of the present invention to improve a metal deposition electrode of a capacitor having a security mechanism, and to use a fuse effect to prevent dielectric breakdown. In order to improve the insulation recovery characteristics of the deposited film by interrupting the current, minimize the capacity decrease due to the fuse operation, etc. under normal use conditions, and reliably avoid short-circuit mode failure even in the event of abnormalities, It is an object of the present invention to provide a capacitor using a metallized film (hereinafter, referred to as a metallized film capacitor) with significantly improved reliability against destruction.

[0007]

Therefore, the metallized film capacitor according to claim 1 is a pair of two plastic films with metal vapor deposition on one side or a plastic film with metal vapor deposition on both surfaces. Two uncoated plastic films are wound as a pair, and at least one of the paired two-sided vapor deposition surfaces is subdivided into a unit metal vapor deposition electrode by a grid-like first slit having no vapor deposition metal, and the first slit is formed. The unit metal deposition electrode is connected by the first fuse part formed in the above, the deposition area of each subdivided unit metal deposition electrode is 10 to 1000 mm ² , and the size of the first fuse part connecting each unit metal deposition electrode is In the narrowest part, 0.05 mm or more and 1.5 mm or less, and each unit metal deposition electrode is connected as a capacitor by the first fuse part. The deposited metal of the active portion and the deposited metal of the electrode lead portion for obtaining conduction by thermal spraying of the metal are separated by a second slit having no deposited metal extending in the longitudinal direction of the film, and separated by the second slit. The deposited metal of the functional part of the capacitor and the deposited metal of the electrode lead-out part are connected by the second fuse part formed between the second slits, and the narrowest part of the first fuse part and the second fuse part is formed. The dimensional ratio is characterized in that the second fuse portion is in the range of 2 to 20 when the first fuse portion is set to 1.

According to a second aspect of the present invention, there is provided the metallized film capacitor, wherein the deposited metal of the electrode lead portion separated by the second slit has a coating resistance lower than that of the deposited metal of the functional portion of the capacitor. Further, the second fuse portion is characterized in that the second fuse portion is located in a region of the deposited metal having a lower film resistance value than the functional portion of the capacitor.

Further, in the metallized film capacitor according to the third aspect, the charging energy of each unit capacitor formed by each unit metal deposition electrode during charging at the rated voltage is 0.05.
J or less.

[0010] The metallized film capacitor of claim 4 is:
Potential gradient of plastic film for DC application is 1
It is characterized in that the voltage is set at 30 V / μm or more and 350 V / μm or less.

[0011] The metallized film capacitor of claim 5 is:
It is characterized in that the potential gradient of the plastic film in AC applications is set to an effective value of 60 V / μm or more and 120 V / μm or less.

[0012]

In the metallized film capacitor according to the first aspect of the present invention, the metal-deposited electrode is subdivided into a plurality of unit metal-deposited electrodes (hereinafter, referred to as segments) by the first non-evaporated grid-like slits, and each segment is formed into the first metal-deposited electrode. Connected via the first fuse section formed between the slits, the discharge energy at the defective portion of the film is reduced to reduce the destruction part due to the impact force at the time of the discharge, and the short circuit at the time of the dielectric breakdown The current is cut off by the fuse function, and the function of the capacitor is prevented from being lost by separating the segment of the dielectric breakdown,
Even in the case of an abnormality in which the short-circuit current at the time of dielectric breakdown cannot be cut off by the fuse function of the first fuse portion, the second connection between the deposited metal of the functional portion of the capacitor and the deposited metal of the electrode lead portion is made. By separating and opening the functional part of the capacitor in which an abnormality has occurred due to the fuse function of the two fuse part, a short circuit failure due to insulation breakdown is reliably avoided.

Conventionally, for example, Japanese Patent Application Laid-Open No. 4-35941
As disclosed in No. 6, many slits are provided only in one direction of the film width to form a segment. In such a slit, segment segmentation (10 to 10) required for the performance of the capacitor of the present invention is performed.
1000 mm ² ) has many practical problems especially for a film width of 50 mm or more for the following reasons. The first is that the width between the slits is extremely narrow, and there are many restrictions on the processing technology. The second is that the decrease in capacity due to the increase in the number of slits is large. In contrast, the grid-like slits of the present application have fewer of these restrictions and can form arbitrarily segmented segments.

An appropriate dimension of the first fuse portion connecting the segments is 0.05 to 1.5 mm at the narrowest portion. If the thickness is less than 0.05 mm, malfunctions due to normal current are common, and the stability of the capacitance is lacking. If the thickness exceeds 1.5 mm, the sensitivity of the fuse portion is poor, and the dielectric is damaged, resulting in a lack of reliability against dielectric breakdown. That's why.

The dimension of the second fuse section connecting the deposited metal of the functional part of the capacitor and the deposited metal of the electrode lead-out part is a dimension ratio of the narrowest part of the first fuse part. It is appropriate that the second fuse portion is in the range of 2 to 20. If the dimensional ratio of the first fuse portion to the narrowest portion is less than 2, malfunctions due to current concentration from the electrode lead-out portion often occur, the stability of the capacitance is lacked, and if it exceeds 20, the sensitivity of the fuse portion is poor. In the case of an abnormality in which the short-circuit current at the time of insulation breakdown cannot be cut off by the fuse function of the first fuse section, the function section of the capacitor cannot be separated and opened by the second fuse section, and short-circuit failure due to insulation breakdown can be ensured. This is because it cannot be avoided.

The area of the segment is 10 to 10
00 mm ² is appropriate. Is less than 10 mm ^2, and the large capacitance loss of slits, the processing techniques including fuse portion, and do not advisable There are difficulties in the economy, also if it is in excess of 1000 mm ^2, when one of the fuse operation This is because the decreasing capacitance becomes large, and the potential gradient is restricted by the life of the capacitance of the capacitor.

In the metallized film capacitor according to the second aspect, the film resistance of the deposited metal at the electrode lead-out portion separated by the second slit is lower than the film resistance of the deposited metal at the functional portion of the capacitor. An edge structure is provided, and the second fuse portion is within a range of a heavy edge portion having a lower film resistance value than a functional portion of the capacitor separated by the second slit. That is, in the metal deposition structure of the heavy edge structure, if the second fuse portion is outside the range of the heavy edge portion, particularly when the dimensional ratio of the first fuse portion and the second fuse portion is small, the current concentration from the electrode lead portion is reduced. This is not a good idea due to lack of stability of capacitance due to many malfunctions.

According to a third aspect of the present invention, the charging energy of each unit capacitor formed by each unit metal deposition electrode during charging at the rated voltage is 0.05.
Suitably, it is J or less. If the charging energy of the unit capacitor exceeds 0.05 J, it becomes difficult to set an appropriate fuse portion, and damage to the dielectric material occurs, thereby reducing the reliability with respect to dielectric breakdown and increasing the capacitance reduction rate.

As in the case of the metallized film capacitor according to the fourth aspect, in DC applications, it is appropriate to set the potential gradient of the plastic film to 130 to 350 V / μm. If it is less than 130 V / μm, the advantage over the conventional capacitor in the potential gradient decreases. 350V / μ
If it exceeds m, the film will be in the inherent withstand voltage region of the film, the frequency of fuse operation will increase sharply, and the capacitance will be reduced, resulting in a loss of function and a failure in practical use.

As in the case of the metallized film capacitor according to the fifth aspect, in an alternating current application, it is appropriate to set the potential gradient of the plastic film to an effective value of 60 to 120 V / μm. If it is less than 60 V / μm, the advantage over the conventional capacitor in the potential gradient decreases. 120V
If it exceeds / μm, it becomes a region that is thermally destroyed by the heat generated by the loss of the capacitor itself, and the function as the capacitor cannot be maintained.

[0021]

Next, specific embodiments of the metallized film capacitor of the present invention will be described in detail with reference to the drawings. FIG. 1 shows a metallized film capacitor element according to one embodiment of the present invention. FIG. 1 is an exploded perspective view, and FIG. 2 is a cross-sectional view of a pair of metallized films. In the figure, reference numeral 1 denotes a first metallized film, and an electrode coating 3 is formed on the surface of a first dielectric film 2 such as a polypropylene film by metal vapor deposition. 2a is a margin part,
The electrode coating 3 is not formed on this portion. Reference numeral 2b denotes a grid-like first slit.
Is not formed. Reference numerals 3b denote first fuse portions, respectively, which connect the segments 3a, which are unit capacitors obtained by subdividing functional portions. Reference numeral 3c denotes a second fuse portion, which connects the deposited metal of the functional portion separated by the second slit 2c having no electrode coating extending in the longitudinal direction of the film and the deposited metal of the electrode lead portion. Reference numeral 4 denotes a second metallized film, and similarly to the names of the respective parts of the first metallized film, 5 denotes a second dielectric film, 5a denotes a margin portion, 5b denotes a grid-like first slit,
5c is a second slit, 6 is an electrode coating, 6a is a segment portion, 6b is a first fuse portion, and 6c is a second fuse portion. Reference numerals 7 and 8 denote metal spray portions for leading out leads. And taking the first metallized film 1 as an example,
As a pattern for forming the segment portion 3a, FIGS.
Although there is the one shown in FIG. 6, other patterns can also be adopted. In FIGS. 3 to 8, w1 indicates the narrowest portion size of the first fuse portion, w2 indicates the narrowest portion size of the second fuse portion, and w3 and w4 indicate the segment portion sizes.

(Example 1) The specifications of a test capacitor having the present structure (FIG. 3) manufactured for a test are shown below. · Metallized film of zinc deposited polypropylene film coating resistance 5 [Omega / □ · Dimensions 100mm wide margin 3.0mm thickness 12μm segment area 400 mm ² first fuse portion narrowest portion 0.6mm second fuse portion narrowest portion 3.0mm All slit widths are constant. ・ Capacity 30μF ・ Impregnant Impregnated with vegetable oil (rapeseed oil) ・ Exterior Square tin case storage ・ Number of samples 10 (10 conventional products without slits for comparison) This capacitor and comparative capacitor (slit) The test was performed using 10 pieces each of which were not provided with (conventional products). Table 1 shows the test results.

[0023]

[Table 1]

The test method is intended to be referred to as step-up withstanding voltage test, put the capacitor in a hot air circulation type thermostatic chamber set at 80 ℃, 180V / μm 10 ⁵ seconds DC voltage equivalent to (2160V) (27 .8Hrs). After the application, the temperature is set to normal temperature, and various characteristics such as the capacitance of the capacitor are measured. Next, a voltage corresponding to 200 V / μm is applied in the same manner, and application and measurement are sequentially repeated, and the applied voltage is increased and continued until the dielectric breakdown of the capacitor is achieved or the capacitor has almost no capacity.

From the above test results, the following has been found. That is, the conventional capacitor is 220 V / μm (2640
V) Although all the dielectric breakdown occurred before and after, the capacitor of the present embodiment can withstand the dielectric breakdown without the film to the original withstand voltage region, and can be used without a large capacity reduction. Does not cause destruction. Thus, high capacity stability and reliability against dielectric breakdown were confirmed.

(Embodiment 2) Next, in the configuration shown in FIGS. 3 to 6 of Embodiment 1, the first fuse portion is changed by changing the size of the second fuse portion w2 (FIGS. 3C to 6C). Six kinds of zinc-evaporated polypropylene films having a dimensional ratio of 1: 1 to 1:30 for the second fuse portion were manufactured, and test capacitors having the following specifications were manufactured. · Metallized film of zinc deposited polypropylene film coating resistance 5 [Omega / □ · Dimensions 100mm wide margin 3.0mm thickness 12μm segment area 400 mm ² first fuse portion narrowest portion 0.6mm second fuse portion narrowest portion 0.6 , 1.2, 3.0, 6.0, 12.0, 18.0mm Slit width is constant ・ Capacity 25μF ・ Impregnant Impregnated with vegetable oil (rapeseed oil) ・ Exterior Square tin case storage ・ Number of samples 10 each (10 pieces of conventional products without a slit and 10 pieces without a second slit and a second fuse portion as shown in FIGS. 7 and 8). Test results are shown in Table 2.

[0027]

[Table 2]

The test method is referred to as a high-temperature continuous step-up dielectric breakdown test. A test capacitor is placed in a hot-air circulating constant temperature bath set at 80 ° C., and the temperature is saturated. / Sec, in the case of an AC test, the voltage is continuously increased at a speed of about 150 VAc / sec, and the capacitor is insulated and the voltage cannot be increased. In the case of a DC test, the applied voltage is 10 kVDC. In the case of the AC test, the operation is continued until the power supply protection device with an operation current of 30 A operates due to the mismatch between the sample and the power supply side.

From the above test results, all of the conventional capacitors were short-circuited due to dielectric breakdown in both the DC test and the AC test, resulting in a case deformation. On the other hand, the capacitors with slits were short-circuited due to the dielectric breakdown in the DC test. Since no failure and no case deformation occurred, and the deteriorated portion was removed by the test due to good fuse operation, all the films were used up to 10 kVDC, which is higher than the original withstand voltage range of the film. Also, in the AC test, 5/10 units of comparative products (FIGS. 7 and 8) having slits in the functional portion and not having the second slit and the second fuse portion, and the second fuse having a ratio of 30 to the first fuse portion 1 were used. Although a short-circuit failure due to insulation breakdown and case deformation were confirmed in 2/10 units of the comparative product provided with the fuse portion and the second slit, in the capacitor of this embodiment, one short-circuit failure due to insulation breakdown and one case deformation were observed. No failure occurred, and together with good fuse operability, extremely high reliability against short-circuit faults was confirmed.

(Embodiment 3) Next, with the same configuration as that of Embodiment 2, the first fuse portion and the second fuse portion w2 are changed by changing the size of the second fuse portion w2 (FIGS. 3C to 6C). Four kinds of zinc-evaporated polypropylene films having a dimensional ratio of two fuse portions of 1: 1 to 1:20 were manufactured, and test capacitors having the following specifications were manufactured. · Metallized film of zinc deposited polypropylene film coating resistance 5 [Omega / □ · Dimensions 100mm wide margin 3.0mm thickness 12μm segment area 400 mm ² first fuse portion narrowest portion 0.6mm second fuse portion narrowest portion 0.6 , 1.2, 3.0, 12.0mm All slit widths are constant ・ Capacity 25μF ・ Impregnant Impregnated with vegetable oil (rapeseed oil) ・ Exterior Square tin case storage ・ Number of samples 10 each (For comparison, no slit is provided Using 10 capacitors and 10 conventional capacitors without slits for comparison, put the capacitors in a hot-air circulating thermostat set at 80 ° C, and set the film potential gradient to the effective value of the voltage. Voltage of 83V / μm at 1000H
rs was applied. Table 3 shows the results.

[0031]

[Table 3]

In the conventional capacitors, all the dielectric breakdown occurred within 100 Hrs, and all the capacitors in which the slits were provided and the dimensional ratio of the first fuse portion to the second fuse portion was 1: 1 did not cause the dielectric breakdown, but the capacity was reduced. However, it was not large enough for practical use. On the other hand, in the capacitors of the present embodiment, all of them were used without any dielectric breakdown and with almost no decrease in capacity. Even if the type and thickness of the film, the deposited metal and the film resistance, the presence or absence of impregnation, and the like are changed, if the dimensional ratio of the first fuse portion and the second fuse portion is within this range, the same performance may be obtained. confirmed.

In the above embodiment, the grid-like first slits are formed discontinuously in two different directions on the film surface, and adjacent segments are mutually connected by a first fuse portion formed between the first slits. It is connected. Thus, during operation of the first fuse section, each unit capacitor formed in each segment can be cut off individually, and the capacity loss can be minimized. In addition, the grid-like first
The slits may be formed not in two directions but in three or more different directions.

The relationship between the area of the segment and the rated charging voltage is suitably that the charging energy of the unit capacitor formed by one segment is 0.05 J or less. The stored energy W of the unit capacitor is obtained by the following equation. ^{W = CE 2/2 (J} ) C = Sεs / (1.13 × 10 11 × d) (F) W: stored energy (J) C: electrostatic capacitance of the unit capacitor (F) d: dielectric thickness (M) S: area of one segment (m ² ) εs: relative permittivity E: charging voltage (V) If the storage energy W of the unit capacitor exceeds 0.05 J, it is difficult to set an appropriate fuse section, and dielectric Damage occurs, the reliability against dielectric breakdown decreases, and the capacitance reduction rate increases.

The potential gradient of the film, that is, the value obtained by dividing the normal working voltage (rated voltage) by the film thickness, is suitably set to 130 to 350 V / μm in DC applications. If it is less than 130 V / μm, the advantage over the conventional capacitor in the potential gradient decreases. 350V /
If it exceeds μm, it will be the original withstand voltage region of the film,
The frequency of operation of the fuse is rapidly increased, the function is lost due to the decrease in the capacitance of the capacitor, and the capacitor cannot be put to practical use. For AC applications, it is appropriate to set the value obtained by dividing the rated voltage (effective value) by the film thickness to 60 to 120 V / μm.
If it is less than 60 V / μm, the advantage over the conventional capacitor in the potential gradient decreases. If it exceeds 120 V / μm, it becomes a region that is thermally destroyed by the heat generated by the loss of the capacitor itself, and the function as the capacitor cannot be maintained.

Regarding the structure of the metal-deposited electrode, a standard metal having a uniform metal-deposited-film resistance value over the entire electrode surface, or a metal-deposited-film resistance value of an electrode lead-out portion separated by the second slit is used. However, a metal-deposited structure having a heavy edge structure lower than the metal-deposited film resistance value of the functional part of the capacitor may be used. In the case of metal deposition having a heavy edge structure, it is preferable that the second fuse portion is within a range of a heavy edge portion lower than the metal deposition film resistance value of the functional portion of the capacitor separated by the second slit.
If the second fuse portion is out of the range of the heavy edge portion by the metal deposition of the heavy edge structure, a malfunction due to current concentration from the electrode lead portion particularly when the dimensional ratio of the first fuse portion and the second fuse portion is small. This is not advisable due to lack of stability of capacitance.

The capacitors are used for electric power,
In addition to high-voltage capacitors for filters and charge / discharge, it can be applied to medium- and low-voltage capacitors for general equipment.

In the above embodiment, a polypropylene film was used as the dielectric film, but another type of film such as a polyethylene terephthalate film may be used. In the above embodiment, zinc was used as the vapor deposition metal. However, the metal is not limited to zinc, and may be other metals such as aluminum and a zinc / aluminum mixture. This time, it was carried out with a vegetable oil oil immersion capacitor, but the impregnating agent and filler are not limited to this. Also, it can be applied regardless of oil immersion or dry type. In this example, both the one and two vapor deposition surfaces are electrodes subdivided by the grid-like slits. However, any one of ordinary vapor deposition films that are not subdivided may be used.

[0039]

In the metallized film capacitor according to the first aspect of the present invention, a single element capacitor is formed as an aggregate of a large number of unit capacitors, and a fuse portion is provided between each unit capacitor and between the functional portion of the capacitor and the electrode lead portion. In order to secure the function of the capacitor by minimizing the capacity reduction without breaking down the insulation by disconnecting the fuse part at the time of abnormality and to prevent short-circuit current at the time of insulation breakdown by the first fuse part In this case as well, the function part of the capacitor and the electrode lead-out part are separated by the second fuse part, thereby reliably avoiding a short-circuit mode failure and greatly improving the reliability against dielectric breakdown. By adopting the present invention, the reliability with respect to the insulation performance is remarkably improved as compared with the conventional capacitor, and it is possible to provide a small and lightweight capacitor, and the industrial and practical value is great.

In the metallized film capacitor according to the second aspect, the second fuse portion is located within a range of a heavy edge portion lower than a coating resistance value of a deposited metal of a functional portion of the capacitor. If the second fuse portion is outside the range of the heavy edge portion by the metal deposition of the structure, malfunctions due to current concentration from the electrode lead portion often occur, particularly when the dimensional ratio of the first fuse portion and the second fuse portion is small. This is because the stability of capacitance is lacking. Therefore, according to the metallized film capacitor of the second aspect, it is possible to prevent malfunction and stabilize the capacitance.

Further, according to the metallized film capacitor of the third aspect, it is easy to set an appropriate fuse portion, the reliability against dielectric breakdown is improved, and the capacitance can be stabilized.

According to the metallized film capacitor of the fourth aspect, it is possible to reliably prevent a decrease in capacitance due to a sudden increase in the frequency of operation of the fuse.

According to the metalized film capacitor of the fifth aspect, thermal destruction can be reliably prevented, and the life of the capacitor can be improved.

[Brief description of the drawings]

FIG. 1 is a developed perspective view showing an example of the configuration of a capacitor element of the present invention.

FIG. 2 is a cross-sectional view of a pair of metal deposition films.

FIG. 3 (a) is a plan view showing a vapor-deposited metal surface of the embodiment. (B) It is a principal part enlarged view of said (a). (C) It is an enlarged view of the fuse part of the above (a).

FIG. 4 (a) is a plan view showing a second embodiment of the metal deposition surface. (B) It is a principal part enlarged view of said (a). (C) It is an enlarged view of the fuse part of the above (a).

FIG. 5 (a) is a plan view showing a third embodiment of the metal deposition surface. (B) It is a principal part enlarged view of said (a). (C) It is an enlarged view of the fuse part of the above (a).

FIG. 6 (a) is a plan view showing a fourth embodiment of the metal surface to be deposited. (B) It is a principal part enlarged view of said (a). (C) It is an enlarged view of the fuse part of the above (a).

FIG. 7A is a plan view showing an example of a metal deposition surface of a capacitor element without a second slit and a second fuse portion. (B) It is a principal part enlarged view of said (a). (C) It is an enlarged view of the fuse part of the above (a).

FIG. 8A is a plan view showing an example of a vapor-deposited metal surface of a capacitor element without a second slit and a second fuse portion. (B) It is a principal part enlarged view of said (a). (C) It is an enlarged view of the fuse part of the above (a).

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 1st metallized film 2 1st dielectric film 2a Margin part 2b 1st slit 2c 2nd slit 3 Metal electrode coating 3a Segment part 3b 1st fuse part 3c 2nd fuse part 4 2nd metallized film 5 Second dielectric film 5a Margin part 5b First slit 5c Second slit 6 Metal electrode coating 6a Segment part 6b First fuse part 6c Second fuse part 7 Lead lead part 8 Lead lead part w1 First fuse part narrowest part Dimension w2 Dimension of narrowest part of second fuse part w3 Dimension of segment part w4 Dimension of segment part

Claims (5)

(57) [Claims] 1. A pair of two plastic films on which metal deposition is applied on one side, or a pair of two plastic films on which metal deposition is applied and a plastic film on which no metal is applied are wound on both sides. At least one of the two vapor-deposited surfaces is a first lattice-like metal-free metal.
The unit metal deposition electrode is subdivided by the slit, the unit metal deposition electrode is connected by the first fuse portion formed between the first slits, and the deposition area of each subdivided unit metal vapor deposition electrode is 10 to 1000 mm ² , The size of the first fuse part connecting each unit metal deposition electrode is 0.05 m at the narrowest part.
m and 1.5 mm or less, and a deposition metal of a function part as a capacitor in which each unit metal deposition electrode is connected to each other by a first fuse part, and a deposition of an electrode lead part for obtaining conduction by spraying metal or the like. The metal is separated from the metal by a second slit having no deposited metal extending in the longitudinal direction of the film, and the deposited metal of the functional portion of the capacitor and the deposited metal of the electrode lead portion separated by the second slit are interposed between the second slits. And the dimensional ratio of the narrowest portion between the first fuse portion and the second fuse portion is 2 to 20 when the first fuse portion is 1. A metallized film capacitor which is within the range. 2. The deposited metal of the electrode lead-out portion separated by the second slit has a film resistance lower than the film resistance of the deposited metal of the functional portion of the capacitor, and the second fuse portion is connected to the capacitor of the capacitor. 2. The metallized film capacitor of claim 1 wherein the metallized film capacitor is in the region of the deposited metal having a lower coating resistance than the functional portion. 3. The metallized film capacitor according to claim 1, wherein the charging energy of each unit capacitor formed by each unit metal deposition electrode at the time of charging at the rated voltage is 0.05 J or less. 4. The metallized film capacitor according to claim 1, wherein a potential gradient of the plastic film in a direct current application is set at 130 V / μm or more and 350 V / μm or less. 5. An electric potential gradient of a plastic film in an alternating current application of 120 V / μm at an effective value of 60 V / μm or more.
m is set to m or less.
Any of the metallized film capacitors.