JP2938921B2 - Thermal head - Google Patents
Thermal headInfo
- Publication number
- JP2938921B2 JP2938921B2 JP2780990A JP2780990A JP2938921B2 JP 2938921 B2 JP2938921 B2 JP 2938921B2 JP 2780990 A JP2780990 A JP 2780990A JP 2780990 A JP2780990 A JP 2780990A JP 2938921 B2 JP2938921 B2 JP 2938921B2
- Authority
- JP
- Japan
- Prior art keywords
- common electrode
- thermal head
- head substrate
- external connection
- heating elements
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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Description
【発明の詳細な説明】 ［産業上の利用分野］ 本発明は、サーマルヘッドに関し、さらに詳しくは発
熱素子が搭載された回路基板の構造の改良に関するもの
である。Description: BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a thermal head, and more particularly, to an improvement in the structure of a circuit board on which a heating element is mounted.
［従来の技術］ 第14図は典型的な従来例のサーマルヘッド１の構成を
示す平面図であり、第15図は第14図の切断面線XV−XVか
ら見た断面図である。サーマルヘッド１は発熱ライン２
を発熱駆動する複数の駆動回路３が搭載され、セラミッ
クから形成されるヘッド基板４と、ヘッド基板４に接続
され、可撓性合成樹脂材料またはガラスエポキシ樹脂材
料などから成る外部配線基板５とを備える。[Prior Art] FIG. 14 is a plan view showing a configuration of a typical conventional thermal head 1, and FIG. 15 is a cross-sectional view taken along a section line XV-XV in FIG. The thermal head 1 has a heating line 2
A plurality of drive circuits 3 for driving the heat generation are mounted, and a head substrate 4 made of ceramic and an external wiring substrate 5 connected to the head substrate 4 and made of a flexible synthetic resin material or a glass epoxy resin material are connected. Prepare.
ヘッド基板４には各駆動回路３毎に共通接地電極用接
続端子６が設けられ、外部配線基板５にはこれと個別に
接続される複数の共通接地電極用接続端子７が設けら
れ、共通接地電極用接続端子７は共通電極８に共通に接
続される。一方、ヘッド基板４には発熱ライン２の共通
電極９がヘッド基板４の外周に沿って形成され、外部配
線基板５には前記共通電極９の両端部に接続される共通
電極10が設けられる。また外部配線基板５には外部のホ
ストコンピュータなどと接続するためのコネクタ11が設
けられる。前記ヘッド基板４および外部配線基板５は、
たとえばアルミニウムなどのベース12に固定される。The head substrate 4 is provided with a common ground electrode connection terminal 6 for each drive circuit 3, and the external wiring substrate 5 is provided with a plurality of common ground electrode connection terminals 7 individually connected thereto. The electrode connection terminals 7 are commonly connected to a common electrode 8. On the other hand, a common electrode 9 of the heating line 2 is formed on the head substrate 4 along the outer periphery of the head substrate 4, and a common electrode 10 connected to both ends of the common electrode 9 is provided on the external wiring substrate 5. The external wiring board 5 is provided with a connector 11 for connecting to an external host computer or the like. The head substrate 4 and the external wiring substrate 5
For example, it is fixed to a base 12 such as aluminum.
第16図はヘッド基板４の平面図であり、第17図は第16
図の矢符XVIIの拡大平面図であり、第18図は第17図の切
断面線XVIII−XVIIIから見た断面図である。ヘッド基板
４上には蓄熱層13と厚膜電極層14とが形成される。この
上には同一の材料で発熱抵抗体層15と抵抗体層16とが形
成される。さらにその上にはスパッタリングや蒸着によ
る金属導体層17がヘッド基板４の外周に沿って第16図示
のように形成され共通電極９が形成される。また複数の
帯状の個別電極18が形成され、複数の発熱素子19から成
る前記発熱ライン２が得られる。FIG. 16 is a plan view of the head substrate 4, and FIG.
FIG. 18 is an enlarged plan view of an arrow XVII in the figure, and FIG. 18 is a cross-sectional view taken along the line XVIII-XVIII in FIG. On the head substrate 4, a heat storage layer 13 and a thick film electrode layer 14 are formed. On this, a heating resistor layer 15 and a resistor layer 16 are formed of the same material. Further thereon, a metal conductor layer 17 formed by sputtering or vapor deposition is formed along the outer periphery of the head substrate 4 as shown in FIG. 16 to form the common electrode 9. Further, a plurality of strip-shaped individual electrodes 18 are formed, and the heating line 2 including a plurality of heating elements 19 is obtained.
前記抵抗体層16上には、複数本の個別電極18毎に設け
られる複数の前記駆動回路３に共通に接続される共通接
地電極20が形成される。この共通接地電極20には各駆動
回路３毎に前記共通接地電極用接続端子６が一体に形成
される。また駆動回路３に対応する発熱素子19を個別的
に発熱駆動するための信号や駆動電力などを共通する外
部接続端子21が、駆動回路３毎に複数本ずつ設けられ
る。On the resistor layer 16, a common ground electrode 20 commonly connected to the plurality of drive circuits 3 provided for each of the plurality of individual electrodes 18 is formed. The common ground electrode 20 is formed integrally with the common ground electrode connection terminal 6 for each drive circuit 3. In addition, a plurality of external connection terminals 21 are provided for each drive circuit 3 in common with a signal for driving the heating elements 19 corresponding to the drive circuit 3 to individually generate heat, drive power, and the like.
前記共通接地電極用接続端子６や外部接続端子21、ま
たは共通電極９をヘッド基板４の長手方向両端部で外部
配線基板５に接続する共通電極用接続端子22などは、前
記外部配線基板５に前記接地電極用接続端子７やその他
対応する接続端子によりヘッド基板４の第14図の左右方
向全長にわたって接続されている。The common electrode connection terminal 6 and the external connection terminal 21 or the common electrode connection terminal 22 for connecting the common electrode 9 to the external wiring board 5 at both ends in the longitudinal direction of the head substrate 4 are connected to the external wiring board 5. The head substrate 4 is connected over the entire length in the left-right direction of FIG. 14 by the ground electrode connection terminal 7 and other corresponding connection terminals.
［発明が解決しようとする課題］ 上述した従来例のサーマルヘッド１では、ヘッド基板
４と、ヘッド基板４とほぼ同大の外部配線基板５を用い
ているため、構成の小形化が困難であり、またコストも
かさんでいる。前記ヘッド基板４に前述したように外部
配線基板５を接続する必要があるため、このための工数
が増大してしまい製造工程が煩雑になってしまう。[Problem to be Solved by the Invention] In the above-described conventional thermal head 1, since the head substrate 4 and the external wiring substrate 5 having substantially the same size as the head substrate 4 are used, it is difficult to reduce the size of the configuration. , And the cost is also high. Since it is necessary to connect the external wiring board 5 to the head substrate 4 as described above, the number of steps for this is increased and the manufacturing process becomes complicated.
前記ヘッド基板４と外部配線基板５とは相互に半田付
けなどで固定して用いられるが、前述したようにヘッド
基板４と外部配線基板５とは材料が異なり、したがって
熱膨張係数も異なっている。熱膨張係数は、アルミナ系
セラミックでは0.7〜0.8×10-5/℃であり、外部配線基
板５では1.5〜2.0×10-5/℃である。このため使用に伴
い両者の昇温または降温による熱膨張または熱収縮の量
の相違により、両者の接続部において断線または接続位
置がずれる事態が発生する。このような場合、サーマル
ヘッド１の信頼性が甚だしく低下してしまう。またこの
ような事態を防止するために、両者を接着剤を用いて補
強したりまたは使用条件を限定する場合も考えられる
が、前者の場合には工数がさらに増大してしまい、後者
の場合にはサーマルヘッド１の使用性が劣化してしまう
ことになる。The head substrate 4 and the external wiring substrate 5 are used by being fixed to each other by soldering or the like. However, as described above, the head substrate 4 and the external wiring substrate 5 are made of different materials, and therefore have different thermal expansion coefficients. . The coefficient of thermal expansion is 0.7 to 0.8 × 10 −5 / ° C. for the alumina-based ceramic and 1.5 to 2.0 × 10 −5 / ° C. for the external wiring board 5. For this reason, a disconnection or a displacement of the connection position occurs at the connection portion of the two due to a difference in the amount of thermal expansion or contraction due to the temperature rise or fall of the temperature due to the use. In such a case, the reliability of the thermal head 1 is significantly reduced. In order to prevent such a situation, it is conceivable that both are reinforced with an adhesive or the use conditions are limited, but in the former case, the number of steps is further increased, and in the latter case, Means that the usability of the thermal head 1 is deteriorated.
外部配線基板５には前述したようにヘッド基板４との
接続部が設けられ、またコネクタ11が設けられる。この
ためこのような接続個所に塵埃や液体などが侵入しない
ようにするために、第15図に示すように外部配線基板５
の全体とヘッド基板４の駆動回路３までを被覆するヘッ
ドカバー23を設ける必要があり、準備すべき部品点数が
増大してしまうとともに、取付けに伴う工数が増大して
しまう。As described above, the external wiring substrate 5 is provided with a connection portion with the head substrate 4 and the connector 11 is provided. Therefore, in order to prevent dust and liquid from entering such connection points, as shown in FIG.
It is necessary to provide a head cover 23 that covers the entire device and the drive circuit 3 of the head substrate 4, so that the number of components to be prepared increases and the number of steps involved in mounting increases.
本発明の目的は、上述の技術的課題を解消し、構成を
格段に小形化することができるとともに、信頼性を向上
することができるサーマルヘッドを提供することであ
る。SUMMARY OF THE INVENTION An object of the present invention is to provide a thermal head that can solve the above-mentioned technical problems, can significantly reduce the size of the configuration, and can improve the reliability.
［課題を解決するための手段］ 本発明は、配線基板上に配列された複数の発熱素子
と、 発熱素子の配列方向と交差する一方側に形成され、か
つ各発熱素子に共通に接続された第１共通電極と、 発熱素子の他方側に設けられ、かつ各発熱素子と個別
に接続される複数の個別電極と、 複数の個別電極毎に設けられ、かつ対応する複数の発
熱素子をそれぞれ個別的に発熱駆動する複数の駆動回路
と、 各駆動回路の下層側に形成され、かつ各駆動回路に共
通に接続される第２共通電極と、 個別電極の上層側または下層側の少なくともいずれか
一方に駆動回路の配列範囲に亘る長さで形成され、かつ
隣接する駆動回路の間で前記第２共通電極と接続される
とともに、長手方向端部に外部接続端子が形成された第
２共通電極用導電部材とから成ることを特徴とするサー
マルヘッドである。Means for Solving the Problems According to the present invention, a plurality of heating elements arranged on a wiring board are formed on one side intersecting the arrangement direction of the heating elements, and are commonly connected to each heating element. A first common electrode; a plurality of individual electrodes provided on the other side of the heating element and individually connected to each heating element; and a plurality of heating elements provided for each of the plurality of individual electrodes and corresponding to each other. A plurality of drive circuits which are driven to generate heat, a second common electrode formed below the respective drive circuits and commonly connected to the respective drive circuits, and at least one of an upper layer side and a lower layer side of the individual electrodes The second common electrode is formed to have a length covering the arrangement range of the drive circuits, is connected to the second common electrode between adjacent drive circuits, and has an external connection terminal formed at a longitudinal end. Consisting of a conductive member A thermal head is characterized.
また本発明は、前記個別電極の上層側または下層側の
少なくともいずれか一方には第１共通電極の両端部付近
と接続され、かつ長手方向端部に外部接続端子が形成さ
れた第１共通電極用導電部材が形成されていることを特
徴とするサーマルヘッドである。The present invention also provides a first common electrode, wherein at least one of the upper layer side and the lower layer side of the individual electrode is connected to the vicinity of both ends of the first common electrode, and an external connection terminal is formed at a longitudinal end. A thermal head, wherein a conductive member is formed.
さらにまた本発明は、前記複数の発熱素子を被覆する
電気絶縁性耐摩耗層が前記個別電極を被覆する範囲に亘
って形成され、かつ個別電極の配置位置に対応する耐摩
耗層上に前記第２共通電極用導電部材が形成されたこと
を特徴とするサーマルヘッドである。Still further, according to the present invention, the electrically insulating wear-resistant layer covering the plurality of heating elements is formed over a range covering the individual electrode, and the second wear-resistant layer is formed on the wear-resistant layer corresponding to the arrangement position of the individual electrode. (2) A thermal head in which a conductive member for a common electrode is formed.
［作 用］ 本発明に従うサーマルヘッドは、配線基板上に複数の
発熱素子と、発熱素子の配列方向と交差する一方側に設
けられた第１共通電極と、発熱素子の他方側に設けられ
て各発熱素子と個別に接続される複数の個別電極とを備
える。また個別電極は複数の個別電極毎に設けられて、
対応する複数の発熱素子をそれぞれ個別的に発熱駆動
し、前記配線基板上に形成される複数の駆動回路に接続
される。駆動回路の下層側には各駆動回路に共通に接続
される第２共通電極が形成される。また個別電極の上層
側また下層側の少なくともいずれか一方に、駆動回路の
配列範囲にわたる長さで第２共通電極用導電部材が形成
される。この第２共通電極用導電部材は前記第２共通電
極と、隣接する駆動回路の間で接続され、長手方向端部
に外部接続端子が形成されて成る。[Operation] A thermal head according to the present invention includes a plurality of heating elements on a wiring substrate, a first common electrode provided on one side intersecting the arrangement direction of the heating elements, and a heating element provided on the other side of the heating elements. A plurality of individual electrodes individually connected to each heating element are provided. Also, the individual electrodes are provided for each of the plurality of individual electrodes,
A corresponding plurality of heating elements are individually driven to generate heat and are connected to a plurality of driving circuits formed on the wiring board. A second common electrode commonly connected to each drive circuit is formed below the drive circuit. Further, a conductive member for the second common electrode is formed on at least one of the upper layer side and the lower layer side of the individual electrode so as to have a length covering the arrangement range of the drive circuit. The second common electrode conductive member is connected between the second common electrode and an adjacent drive circuit, and has an external connection terminal formed at a longitudinal end.
このため、前記第２共通電極に駆動回路毎に接続端子
を形成して配線基板の前記配列方向の全長にわたって他
の外部配線基板と接続する必要が解消される。このよう
な外部接続手段は、前記第２共通電極用導電部材の接続
端子が形成された付近でのみ配線基板との接続が可能な
大きさであればよい。このためサーマルヘッド全体の構
成を小形化することができる。また前述した外部接続手
段と電気絶縁性基板とは電気絶縁性基板の前記配列方向
に沿う一部分でのみ接続されるので、これらの材料が異
なる場合に昇温および降温に伴う熱膨張または熱収縮の
量に相違があっても、その影響を格段に抑制でき、サー
マルヘッドの信頼性を向上ができる。This eliminates the need to form a connection terminal for each drive circuit on the second common electrode and connect the second common electrode to another external wiring board over the entire length of the wiring board in the arrangement direction. Such an external connection means only needs to be large enough to be connectable to the wiring board only in the vicinity of the second common electrode conductive member where the connection terminal is formed. Therefore, the configuration of the entire thermal head can be reduced in size. Further, since the above-mentioned external connection means and the electrically insulating substrate are connected only at a part along the arrangement direction of the electrically insulating substrate, when these materials are different, the thermal expansion or thermal contraction accompanying the temperature rise and the temperature decrease is caused. Even if the amount is different, the influence can be remarkably suppressed, and the reliability of the thermal head can be improved.
［実施例］ 第１図は本発明の一実施例のサーマルヘッド30の断面
図である。サーマルヘッド30はたとえばアルミナ系セラ
ミックなどの電気絶縁性と剛性とを有する材料から成る
矩形平板状などの配線基板としてのヘッド基板31を有す
る。ヘッド基板31には接着剤層32を介してたとえばアル
ミニウムなどの金属材料から成る放熱板33が固定され
る。前記ヘッド基板31上にはたとえばスクリーン印刷な
どの厚膜技術にて蓄熱層35が形成され、また厚膜共通電
極層45がヘッド基板31の外周に沿って形成される。Embodiment FIG. 1 is a sectional view of a thermal head 30 according to an embodiment of the present invention. The thermal head 30 has a head substrate 31 as a wiring substrate of a rectangular flat plate or the like made of a material having electrical insulation and rigidity such as alumina ceramic. A radiator plate 33 made of a metal material such as aluminum is fixed to the head substrate 31 via an adhesive layer 32. On the head substrate 31, a heat storage layer 35 is formed by a thick film technique such as screen printing, and a thick film common electrode layer 45 is formed along the outer periphery of the head substrate 31.
蓄熱層35上には発熱抵抗体層34、第１共通電極36およ
び複数の個別電極37が形成され、複数の発熱素子38が第
１共通電極36と各個別電極37との間に構成される。発熱
素子38は、たとえばセラミックなどからなる耐摩耗層39
を介して、プラテン40との間で感熱紙41に感熱印字を行
う。またこの発熱素子38は集積回路素子として実現され
る駆動回路42により制御される。駆動回路42には絶縁層
66で被覆された前記個別電極37が接続されると共に、駆
動回路42に発熱素子38を駆動する信号などを入力し、絶
縁層66で被覆された外部接続端子43が接続され、駆動回
路42およびその周辺を被覆して合成樹脂材料などからな
る保護層44が形成される。On the heat storage layer 35, a heating resistor layer 34, a first common electrode 36, and a plurality of individual electrodes 37 are formed, and a plurality of heating elements 38 are formed between the first common electrode 36 and each individual electrode 37. . The heating element 38 includes a wear-resistant layer 39 made of, for example, ceramic.
The thermal printing is performed on the thermal paper 41 with the platen 40 via the. The heating element 38 is controlled by a driving circuit 42 implemented as an integrated circuit element. The drive circuit 42 has an insulating layer
While the individual electrode 37 covered with 66 is connected, a signal for driving the heating element 38 and the like are input to the drive circuit 42, the external connection terminal 43 covered with the insulating layer 66 is connected, and the drive circuit 42 and A protective layer 44 made of a synthetic resin material or the like is formed so as to cover the periphery.
第２図はサーマルヘッド30の平面図であり、第３図は
第２図矢符IIIで示す部分の拡大平面図であり、第４図
は第３図の切断面線IV−IVから見た断面図である。以下
の説明ではこれらの図面を併せて参照する。ヘッド基板
31上に蓄熱層35が形成されたのち、前記厚膜技術にてヘ
ッド基板31の外周に沿って厚膜共通電極層45、および第
１共通電極用導電部材としての第１共通電極接続リード
線（以下、第１接続リード線と略す）46が、ヘッド基板
31の第２図左右方向全長に亘る長さに一体的に形成され
る。第１接続リード線46と間隔をあけて、第２共通電極
用導電部材としての第２共通電極接続リード線（以下、
第２接続リードと略す）47がヘッド基板31の左右方向全
長に亘る長さに略平行に形成される。第１および第２接
続リード請求線46,47を被覆して、絶縁層48形成後、前
記発熱抵抗体層34と同一の材料で同一工程時に一体的に
形成される抵抗体層49,50,51が形成される。FIG. 2 is a plan view of the thermal head 30, FIG. 3 is an enlarged plan view of a portion indicated by an arrow III in FIG. 2, and FIG. 4 is a view taken along a section line IV-IV in FIG. It is sectional drawing. The following description also refers to these drawings. Head substrate
After the heat storage layer 35 is formed on the upper surface 31, the thick film common electrode layer 45 and the first common electrode connection lead wire as the first common electrode conductive member are formed along the outer periphery of the head substrate 31 by the thick film technology. (Hereinafter abbreviated as a first connection lead wire) 46 is a head substrate
31 is formed integrally with the entire length in the left-right direction in FIG. A second common electrode connection lead wire (hereinafter, referred to as a second common electrode conductive member) is spaced apart from the first connection lead wire 46.
A second connection lead 47 is formed substantially parallel to the length of the head substrate 31 over the entire length in the left-right direction. After covering the first and second connection lead request wires 46, 47 and forming the insulating layer 48, the resistor layers 49, 50, 51 are formed.
このようなヘッド基板31上に、厚膜共通電極層45を全
面に亘って被覆し、スパッタリングや蒸着などで金属導
体層からなる第１共通電極36が形成される。この第１共
通電極層36と並行して抵抗体層50上に各駆動回路42の下
層側であって、ヘッド基板31の第２図左右方向全長に亘
って延び、各駆動回路42の共通する接地電極となる第２
共通電極52が形成される。On such a head substrate 31, a thick film common electrode layer 45 is coated over the entire surface, and a first common electrode 36 made of a metal conductor layer is formed by sputtering or vapor deposition. In parallel with the first common electrode layer 36, the resistor extends over the entire length of the head substrate 31 in the left-right direction in FIG. The second to be the ground electrode
The common electrode 52 is formed.
第２共通電極52と第２接続リード線47とは、隣接する
各駆動回路42の間で接続部53によってそれぞれ接続され
る。第２接続リード線47の第２図右方端部は、ヘッド基
板31の第２図下端部に沿って第２図左方端部付近まで延
びリード線外部接続端子57とされる。一方、第２共通電
極52の第２図左方側端部は、ヘッド基板30の第２図下端
部まで引き出されて、第２共通電極外部接続端子（以
下、第２外部接続端子と略す）54とされる。また第１共
通電極36の第２図左方側端部はヘッド基板30の第２図下
方端部まで引き出され、第１共通電極外部接続端子（以
下、第１外部接続端子と略す）55とされる。The second common electrode 52 and the second connection lead wire 47 are connected to each other between the adjacent drive circuits 42 by the connection portions 53. The right end of the second connection lead wire 47 in FIG. 2 extends to the vicinity of the left end in FIG. 2 along the lower end of the head substrate 31 in FIG. On the other hand, an end on the left side in FIG. 2 of the second common electrode 52 is drawn out to the lower end in FIG. 2 of the head substrate 30, and is connected to a second common electrode external connection terminal (hereinafter abbreviated as a second external connection terminal). It is 54. The left end of the first common electrode 36 in FIG. 2 is drawn out to the lower end of the head substrate 30 in FIG. 2 and is connected to a first common electrode external connection terminal (hereinafter abbreviated as a first external connection terminal) 55. Is done.
隣接する駆動回路42の間には各種駆動用の信号などを
相互間で転送するための転送ライン56が形成される。個
別電極37および外部接続端子43上には絶縁層66が形成さ
れる。前記保護層44の高さt1は約1mm程度であり、絶縁
層66のヘッド基板からの高さをこれ以上に形成すれば、
感熱紙41に接触することなく、接続リード46,47を形成
できる。外部接続端子43e,43fにはヘッド基板31上で第
３図右方に延びる配線パターン73,74が形成される。Transfer lines 56 for transferring various driving signals and the like between the adjacent drive circuits 42 are formed. An insulating layer 66 is formed on the individual electrodes 37 and the external connection terminals 43. The height t1 of the protective layer 44 is about 1 mm, and if the height of the insulating layer 66 from the head substrate is more than this,
The connection leads 46, 47 can be formed without contacting the thermal paper 41. Wiring patterns 73, 74 extending rightward in FIG. 3 on the head substrate 31 are formed on the external connection terminals 43e, 43f.
第５図はサーマルヘッド30の電気的構成を説明するブ
ロック図である。ヘッド基板31には前述したように第１
外部接続端子55が設けられ、第１共通電極36と接続され
る。また第２外部接続端子54およびリード線外部接続端
子57が設けられ、第２接続リード線の両端部にそれぞれ
接続される。また外部接続端子43a,43b,43c,43d,43e,43
fには、発熱素子38を発熱駆動するためのシリアルな印
画データＤ、ラッチ信号LT、クロック信号CK、ストロー
ブ信号SB1,SB2,SB3がそれぞれ入力される。FIG. 5 is a block diagram illustrating the electrical configuration of the thermal head 30. The head substrate 31 has the first
An external connection terminal 55 is provided and connected to the first common electrode 36. A second external connection terminal 54 and a lead external connection terminal 57 are provided, and are connected to both ends of the second connection lead. External connection terminals 43a, 43b, 43c, 43d, 43e, 43
To f, serial print data D for driving the heating element 38 to generate heat, a latch signal LT, a clock signal CK, and strobe signals SB1, SB2, and SB3 are respectively input.
駆動回路42はすべて同一の構成を有し、前記印画デー
タＤとクロック信号CKとが入力されるシフトレジスタ58
と、シフトレジスタ58に入力されたデータをラッチ信号
LTでラッチするラッチ回路59と、ラッチ回路59にラッチ
された印画データＤをストローんブ信号SB1が入力され
たタイミングで各発熱素子38に出力するゲート回路60と
を備える。The drive circuits 42 all have the same configuration, and a shift register 58 to which the print data D and the clock signal CK are input.
And latches the data input to the shift register 58
A latch circuit 59 that latches with LT and a gate circuit 60 that outputs the print data D latched by the latch circuit 59 to each heating element 38 at the timing when the strobe signal SB1 is input.
各駆動回路42にはシフトレジスタ58およびラッチ信号
LT、クロック信号CK、ストローブ信号SB1についてバッ
ファ回路61,62,63,64がそれぞれ設けられ、その出力は
隣接する他の駆動回路42のシフトレジスタ58、ラッチ回
路59およびゲート回路60にそれぞれ入力される。Each drive circuit 42 has a shift register 58 and a latch signal
Buffer circuits 61, 62, 63, and 64 are provided for LT, clock signal CK, and strobe signal SB1, and their outputs are input to shift register 58, latch circuit 59, and gate circuit 60 of another adjacent driving circuit 42, respectively. You.
本実施例では複数の駆動回路42はたとえば３つブロッ
クに区分され、印画データＤ、ラッチ信号LT、クロック
信号CKは全駆動回路42に前述のように順次的に転送さ
れ、ストローブ信号SB2,SB3は各ブロックの初段の駆動
回路42に配線パターン73,74を介して入力されて、ブロ
ック内で転送される。In this embodiment, the plurality of drive circuits 42 are divided into, for example, three blocks, and the print data D, the latch signal LT, and the clock signal CK are sequentially transferred to all the drive circuits 42 as described above, and the strobe signals SB2, SB3 Is input to the first-stage drive circuit 42 of each block via the wiring patterns 73 and 74 and is transferred within the block.
以上のように本実施例のサーマルヘッド30ではヘッド
基板31に供給される印画データＤや各種制御信号または
駆動電圧VHや接地電位GNDなどを、従来例のように各駆
動回路毎に接続端子を設けて入力する必要がなくなり、
ヘッド基板31の長手方向左方側端部付近で、たとえばリ
ード線などの外部接続配線65と接続するようにした。As described above, in the thermal head 30 of the present embodiment, the printing data D, various control signals, the driving voltage VH, the ground potential GND, and the like supplied to the head substrate 31 are connected to the connection terminals for each driving circuit as in the conventional example. There is no need to enter and enter
Near the left end of the head substrate 31 in the longitudinal direction, the head substrate 31 is connected to an external connection wiring 65 such as a lead wire.
これにより従来例で説明したヘッド基板と同幅の外部
配線基板が不要となり、全体のサイズを2/3〜1/2に小型
化できる。また部品点数が大幅に削減されると共に、外
部配線基板をヘッド基板31に接続する工程が不要とな
り、製造に関する工数を削減することができる。またこ
れにより得られるサーマルヘッド30のコストを大幅に削
減できる。This eliminates the need for an external wiring substrate having the same width as the head substrate described in the conventional example, and can reduce the overall size to 2/3 to 1/2. In addition, the number of components is significantly reduced, and the step of connecting the external wiring board to the head substrate 31 is not required, so that the number of manufacturing steps can be reduced. Further, the cost of the thermal head 30 obtained thereby can be greatly reduced.
ヘッド基板31と外部接続配線65とは第２図に示される
ような極めて限られた範囲で相互の接続が行われるた
め、従来例で説明した両者の熱膨張係数の相違に伴い、
昇温または降温される際の熱膨張および熱収縮の量の差
に基づいて、両者の接続部の断線やずれの発生が解消さ
れる。これによりサーマルヘッド30の信頼性を向上する
ことができる。Since the head substrate 31 and the external connection wiring 65 are interconnected within a very limited range as shown in FIG. 2, due to the difference in thermal expansion coefficient between the two described in the conventional example,
Based on the difference between the amount of thermal expansion and the amount of thermal shrinkage when the temperature is raised or lowered, the occurrence of disconnection or misalignment at the connection between the two is eliminated. Thereby, the reliability of the thermal head 30 can be improved.
第６図は本発明の他の実施例のサーマルヘッド30aの
断面図である。本実施例は前述の実施例と類似し、対応
する部分には同一の参照部号を付す。本実施例の注目す
べき点は、前記接続リード線46,47を個別電極37の上層
側に設けたことである。接続リード線46,47は金属箔な
どから形成され、電気絶縁性材料からなる被覆体67中に
埋設される。この被覆体67は接着剤層68で絶縁層66上に
固着される。なお絶縁層66上で被覆体67の保護層44側と
発熱素子38側の端部とは、感熱紙41が被覆体67に引つ掛
かる事態を防止するために合成樹脂材料からなる充填層
69が形成される。FIG. 6 is a sectional view of a thermal head 30a according to another embodiment of the present invention. This embodiment is similar to the previous embodiment, and corresponding parts are denoted by the same reference numerals. What is notable in this embodiment is that the connection lead wires 46 and 47 are provided on the upper layer side of the individual electrode 37. The connection lead wires 46 and 47 are formed of metal foil or the like, and are embedded in a cover 67 made of an electrically insulating material. The cover 67 is fixed on the insulating layer 66 with an adhesive layer 68. Note that the protective layer 44 side of the cover 67 and the end on the side of the heating element 38 on the insulating layer 66 are a filling layer made of a synthetic resin material in order to prevent the thermal paper 41 from being caught on the cover 67.
69 is formed.
第７図はヘッド基板31の平面図であり、第８図は第７
図の矢符VIIIの拡大平面図であり、第９図は第８図の切
断面線IX−IXから見た断面図である。本実施例では接続
リード線46,47は個別電極37の上層側に形成されるた
め、第１共通電極36と第１接続リード線46とは接続部70
において半田または導電性接着剤で接続される。FIG. 7 is a plan view of the head substrate 31, and FIG.
FIG. 9 is an enlarged plan view of an arrow VIII in the figure, and FIG. 9 is a cross-sectional view as viewed from a section line IX-IX in FIG. In this embodiment, since the connection lead wires 46 and 47 are formed on the upper layer side of the individual electrode 37, the first common electrode 36 and the first connection lead wire 46 are connected to the connection portion 70.
Are connected by solder or conductive adhesive.
また第２接続リード線47と第２共通電極52とは、各駆
動回路42との間と、第２共通電極52の両端部とで、相互
に近接方向に延びる接続部47a,52aが、各端部が重畳す
るように相互に近接方向に延びて形成され、相互に重畳
する接続部71において接続部53を構成し、接続部70と同
様に接続される。また本実施例では第２外部接続端子54
はヘッド基板31の第８図下端部から第２接続リード線47
に対応する位置まで延びて形成され、接続部72で前記接
続部70と同様に接続される。このような実施例があって
も前述の実施例で述べた効果と同様の効果を達成するこ
とができる。Further, the connection portions 47a and 52a extending in the mutually approaching direction between the respective drive circuits 42 and both end portions of the second common electrode 52 are formed between the second connection lead wire 47 and the second common electrode 52, respectively. The connecting portions 71 are formed so as to extend in the mutually approaching direction so that the end portions overlap each other, and constitute a connecting portion 53 at the connecting portion 71 overlapping each other, and are connected in the same manner as the connecting portion 70. In this embodiment, the second external connection terminal 54 is used.
Is the second connecting lead wire 47 from the lower end of the head substrate 31 in FIG.
And is connected to the connecting portion 72 in the same manner as the connecting portion 70. Even with such an embodiment, it is possible to achieve the same effects as those described in the above embodiment.
第10図は本発明のさらに他の実施例のサーマルヘッド
30bの断面図であり、第11図はサーマルヘッド30bの平面
図であり、第12図は第11図の矢符XIIの拡大平面図であ
り、第13図は第12図の切断面線XIII−XIIIから見た断面
図である。これらの図面を併せて参照して、本実施例に
ついて説明する。本実施例は前述の実施例に類似し、対
応する部分には同一の参照符を付す。本実施例のサーマ
ルヘッド30bは、下記のようにして構成される。FIG. 10 shows a thermal head according to still another embodiment of the present invention.
FIG. 11 is a cross-sectional view of the thermal head 30b, FIG. 12 is an enlarged plan view of an arrow XII of FIG. 11, and FIG. 13 is a cross-sectional line XIII of FIG. It is sectional drawing seen from -XIII. The present embodiment will be described with reference to these drawings. This embodiment is similar to the previous embodiment, and corresponding parts are denoted by the same reference numerals. The thermal head 30b of this embodiment is configured as described below.
ヘッド基板31上に蓄熱層35を形成した後、厚膜共通電
極層45をヘッド基板31の第12図上方側縁部に沿って左右
方向全長に亘り形成する。この左方側端部は、ヘッド基
板31の左方側縁部に沿って延設され、端部を第１外部接
続端子55として構成する。次に発熱抵抗体層34をヘッド
基板31のほぼ全面に亘って形成し、蓄熱層35以外の範囲
では絶縁層49,51として用いられる。この発熱抵抗体層3
4および抵抗体層49上に第１共通電極36、個別電極37、
第２共通電極52転送ライン56および外部接続端子43を形
成する、共通接地電極52の左方端は第12図下方に向けて
延設され、第２外部接続端子54として形成される。また
第２共通電極52には、隣接する駆動回路42の間毎に接続
部52aが第２接線リード線47側に延びて形成される。After the heat storage layer 35 is formed on the head substrate 31, the thick film common electrode layer 45 is formed along the upper side edge of the head substrate 31 in FIG. The left end extends along the left edge of the head substrate 31, and the end serves as a first external connection terminal 55. Next, the heating resistor layer 34 is formed over substantially the entire surface of the head substrate 31, and is used as the insulating layers 49 and 51 in a range other than the heat storage layer 35. This heating resistor layer 3
4 and the first common electrode 36, the individual electrode 37,
The left end of the common ground electrode 52 which forms the second common electrode 52 transfer line 56 and the external connection terminal 43 extends downward in FIG. 12 and is formed as a second external connection terminal 54. In the second common electrode 52, a connection portion 52a is formed to extend toward the second tangential lead wire 47 for each adjacent drive circuit.
このようなヘッド基板31上に第12図に２点鎖線で示す
駆動回路42の配置領域を除いて、たとえばセラミックス
などの硬質材料層をヘッド基板31のほぼ全面に亘って形
成する。この硬質材料層は第１共通電極36および個別電
極37を被覆する範囲では、耐摩耗層39として構成され、
個別電極37を被覆する範囲および外部接続端子43を被覆
する範囲では絶縁層75,76として用いられる。A hard material layer of, for example, ceramics is formed on such a head substrate 31 over almost the entire surface of the head substrate 31 except for a region where the drive circuit 42 is shown by a two-dot chain line in FIG. This hard material layer is configured as a wear-resistant layer 39 to the extent that the first common electrode 36 and the individual electrode 37 are covered,
In a range where the individual electrodes 37 are covered and a range where the external connection terminals 43 are covered, the insulating layers 75 and 76 are used.
絶縁層75上には、第１接続リード線46がヘッド基板31
の左右方向全長に亘って形成され、その左方側端部は第
１外部接続端子55接続され、右方側端部は第１共通電極
36と接続される。また第１接続リード線46と間隔をあけ
て略平行に第２接続リード線47が、ヘッド基板31の左右
方向全長に亘って形成され、その左方端部は第２外部接
続端子54と接続される。On the insulating layer 75, the first connection lead wire 46 is
Is formed over the entire length in the left-right direction, the left end thereof is connected to the first external connection terminal 55, and the right end thereof is the first common electrode.
Connected to 36. A second connection lead wire 47 is formed over the entire length of the head substrate 31 in the left-right direction substantially in parallel with the first connection lead wire 46 at an interval, and the left end thereof is connected to the second external connection terminal 54. Is done.
また第２接続リード線47には、隣接する駆動回路42の
間毎に第８図の説明と同様な接続部47aが形成され、第
２共通電極52の接続部52aと重畳されて、第２接続リー
ド線47と第２共通電極52とを前記隣接する駆動回路42の
間毎に接続する接続部53として用いられる。また第２接
続リード線47の第１図の右方側端部は、前述の実施例と
同様にヘッド基板31の下方縁部に沿って外部接続端子43
近傍にまで延びて延設される。このような第２接続リー
ド線47の外部接続端子43側端付近には、リード線外部接
続端子57が接続される。Further, the second connection lead wire 47 is provided with a connection portion 47a similar to that described in FIG. 8 for each space between the adjacent drive circuits 42, and is overlapped with the connection portion 52a of the second common electrode 52 to form the second connection lead 47. The connecting lead wire 47 and the second common electrode 52 are used as a connecting portion 53 that connects the adjacent driving circuits 42 to each other. The right end of the second connection lead wire 47 in FIG. 1 is connected to the external connection terminal 43 along the lower edge of the head substrate 31 similarly to the above-described embodiment.
It extends to the vicinity. A lead wire external connection terminal 57 is connected near the end of the second connection lead wire 47 on the external connection terminal 43 side.
このような実施例においても前述の各実施例で説明し
た効果と同様な効果を達成できる。さらに本実施例で
は、接続リード線46,47と個別電極37との電気的絶縁お
よび、第２接続リード線47と外部接続端子43との電気的
絶縁を実現するにあたって、耐摩耗層39を形成する工程
を同一工程において、同一の電気絶縁性および硬性を有
する材料を用いて絶縁層75.76を構成するようにした。
これにより耐摩耗層39を製造する工程以外に、前記接続
リード線46,47に関連する電気的絶縁層を形成する工程
を省略することができ、製造工程を簡略化することがで
きる効果を併せ持つものである。In such an embodiment, the same effects as those described in the above embodiments can be achieved. Further, in this embodiment, in order to realize electrical insulation between the connection lead wires 46 and 47 and the individual electrodes 37 and electrical insulation between the second connection lead wire 47 and the external connection terminal 43, a wear-resistant layer 39 is formed. In the same step, the insulating layer 75.76 was formed using the same material having the same electrical insulation and hardness.
Accordingly, in addition to the step of manufacturing the wear-resistant layer 39, the step of forming an electrical insulating layer related to the connection lead wires 46 and 47 can be omitted, and the effect of simplifying the manufacturing step can be obtained. Things.
また前記各実施例では、接続リード線46,47は双方が
個別電極37の下層側また上層側のいずれか一方に形成す
るようにしたが、これらは個別電極37の上層側または下
層側にそれぞれ形成するようにしてもよい。外部接続配
線65は前記いずれの実施例においても、ヘッド基板31と
その第２図および第７図に示す左方端で接続するように
したけれども、接続箇所はヘッド基板31の右方端であっ
てもよく、その位置は限定されるものではない。In each of the above embodiments, the connection lead wires 46 and 47 are both formed on either the lower layer side or the upper layer side of the individual electrode 37, but these are formed on the upper layer side or the lower layer side of the individual electrode 37, respectively. It may be formed. In each of the above embodiments, the external connection wiring 65 is connected to the head substrate 31 at the left end thereof as shown in FIGS. 2 and 7, but the connection point is at the right end of the head substrate 31. And the position is not limited.
［発明の効果］ 以下のように本発明に従えば、前記第２共通電極に駆
動回路毎に接続端子を形成して配線基板の前記配列方向
の全長にわたって他の外部配線基板と接続する必要が解
消される。このような外部接続手段は、前記第２共通電
極用導電部材の接続端子が形成された付近でのみ配線基
板との接続が可能な大きさであればよい。このためサー
マルヘッド全体の構成を小形化することができる。また
前述した外部接続手段と電気絶縁性基板とは電気絶縁性
基板の前記配列方向に沿う一部分でのみ接続されるの
で、これらの材料が異なる場合に昇温および降温に伴う
熱膨張または熱収縮の量に相違があっても、その影響を
格段に抑制でき、サーマルヘッドの信頼性を向上ができ
る。[Effects of the Invention] According to the present invention as described below, it is necessary to form a connection terminal for each drive circuit on the second common electrode and connect it to another external wiring board over the entire length of the wiring board in the arrangement direction. Will be resolved. Such an external connection means only needs to be large enough to be connectable to the wiring board only in the vicinity of the second common electrode conductive member where the connection terminal is formed. Therefore, the configuration of the entire thermal head can be reduced in size. Further, since the above-mentioned external connection means and the electrically insulating substrate are connected only at a part along the arrangement direction of the electrically insulating substrate, when these materials are different, the thermal expansion or thermal contraction accompanying the temperature rise and the temperature decrease is caused. Even if the amount is different, the influence can be remarkably suppressed, and the reliability of the thermal head can be improved.
第１図は本発明の一実施例のサーマルヘッド30の断面
図、第２図はサーマルヘッド30の平面図、第３図は第２
図の矢符III部分の拡大平面図、第４図は第３図の切断
面線IV−IVから見た断面図、第５図はサーマルヘッド30
の電気的構成を説明するブロック図、第６図は本発明の
他の実施例のサーマルヘッド30aの断面図、第７図はサ
ーマルヘッド30aの平面図、第８図は第７図の矢符VIII
部の拡大平面図、第９図は第８図の切断面線IX−IXから
見た断面図、第10図は本発明のさらに他の実施例のサー
マルヘッド30bの断面図、第11図はサーマルヘッド30bの
平面図、第12図は第11図の矢符XIIで示す部分の拡大平
面図、第13図は第12図の切断面線XIII−XIIIから見た断
面図、第14図は典型的な従来例のサーマルヘッド１の平
面図、第15図は第14図の切断面線XV−XVから見た断面
図、第16図はヘッド基板４の平面図、第17図は第16図の
矢符XVIIの拡大平面図、第18図は第17図の切断面線XVII
I−XVIIIから見た断面図である。 30,30a,30b……サーマルヘッド、31……ヘッド基板、34
……発熱抵抗体層、36……第１共通電極、37……個別電
極、38……発熱素子、42……駆動回路、43……外部接続
端子、46……第１接続リード線、47……第２接続リード
線、47a,52a,53……接続部、52……第２共通電極、54…
…第２外部接続端子、55……第１外部接続端子、57……
リード線外部接続端子、65……外部接続配線、70〜72…
…接続部FIG. 1 is a sectional view of a thermal head 30 according to one embodiment of the present invention, FIG. 2 is a plan view of the thermal head 30, and FIG.
FIG. 4 is an enlarged plan view of an arrow III portion in FIG. 4, FIG. 4 is a cross-sectional view taken along a section line IV-IV in FIG. 3, and FIG.
FIG. 6 is a sectional view of a thermal head 30a according to another embodiment of the present invention, FIG. 7 is a plan view of the thermal head 30a, and FIG. 8 is an arrow in FIG. VIII
FIG. 9 is a cross-sectional view taken along section line IX-IX of FIG. 8, FIG. 10 is a cross-sectional view of a thermal head 30b according to still another embodiment of the present invention, and FIG. FIG. 12 is a plan view of the thermal head 30b, FIG. 12 is an enlarged plan view of a portion indicated by an arrow XII in FIG. 11, FIG. 13 is a cross-sectional view taken along a cutting plane line XIII-XIII in FIG. 12, and FIG. FIG. 15 is a plan view of a typical conventional thermal head 1, FIG. 15 is a cross-sectional view taken along section line XV-XV in FIG. 14, FIG. 16 is a plan view of the head substrate 4, and FIG. FIG. 18 is an enlarged plan view of arrow XVII in the figure, and FIG. 18 is a sectional line XVII in FIG. 17.
It is sectional drawing seen from I-XVIII. 30, 30a, 30b ... thermal head, 31 ... head substrate, 34
... heating resistor layer, 36 ... first common electrode, 37 ... individual electrode, 38 ... heating element, 42 ... drive circuit, 43 ... external connection terminal, 46 ... first connection lead wire, 47 ... Second connection lead wire, 47a, 52a, 53... Connection part, 52... Second common electrode, 54.
... 2nd external connection terminal, 55 ... 1st external connection terminal, 57 ...
Lead wire external connection terminal, 65 ... External connection wiring, 70-72 ...
... Connection
───────────────────────────────────────────────────── フロントページの続き (72)発明者 道廣 利昭 鹿児島県姶良郡隼人町内999番地３ 京 セラ株式会社鹿児島隼人工場内 (56)参考文献 特開 昭60−166474（ＪＰ，Ａ) (58)調査した分野(Int.Cl.6，ＤＢ名) B41J 2/345 ──────────────────────────────────────────────────続 き Continuation of the front page (72) Inventor Toshiaki Michihiro 999-3, Hayato-cho, Aira-gun, Kagoshima Pref. ) Surveyed field (Int.Cl. 6 , DB name) B41J 2/345
Claims (3)
と、 発熱素子の配列方向と交差する一方側に形成され、かつ
各発熱素子に共通に接続された第１共通電極と、 発熱素子の他方側に設けられ、かつ各発熱素子と個別に
接続される複数の個別電極と、 複数の個別電極毎に設けられ、かつ対応する複数の発熱
素子をそれぞれ個別的に発熱駆動する複数の駆動回路
と、 各駆動回路の下層側に形成され、かつ各駆動回路に共通
に接続される第２共通電極と、 個別電極の上層側または下層側の少なくともいずれか一
方に駆動回路の配列範囲に亘る長さで形成され、かつ隣
接する駆動回路の間で前記第２共通電極と接続されると
ともに、長手方向端部に外部接続端子が形成された第２
共通電極用導電部材とから成ることを特徴とするサーマ
ルヘッド。1. A plurality of heating elements arranged on a wiring board, a first common electrode formed on one side intersecting the arrangement direction of the heating elements, and commonly connected to each heating element; A plurality of individual electrodes which are provided on the other side and are individually connected to the respective heating elements; and a plurality of drives which are provided for each of the plurality of individual electrodes and individually drive the corresponding plurality of heating elements. A circuit, a second common electrode formed on a lower layer side of each drive circuit and commonly connected to each drive circuit, and at least one of an upper layer side and a lower layer side of the individual electrode over an arrangement range of the drive circuit A second common electrode which is formed with a length and is connected to the second common electrode between adjacent driving circuits and has an external connection terminal formed at an end in a longitudinal direction.
A thermal head comprising a conductive member for a common electrode.
くともいずれか一方には第１共通電極の両端部付近と接
続され、かつ長手方向端部に外部接続端子が形成された
第１共通電極用導電部材が形成されていることを特徴と
する特許請求の範囲第１項記載のサーマルヘッド。2. A first common electrode connected to at least one of an upper layer side and a lower layer side of the individual electrode near both ends of a first common electrode and having external connection terminals formed at longitudinal ends. 2. The thermal head according to claim 1, wherein a conductive member is formed.
耐摩耗層が前記個別電極を被覆する範囲に亘って形成さ
れ、かつ個別電極の配置位置に対応する耐摩耗層上に前
記第２共通電極用導電部材が形成されたことを特徴とす
る特許請求の範囲第１項記載のサーマルヘッド。3. An electrically insulating wear-resistant layer covering said plurality of heating elements is formed over a range covering said individual electrodes, and said second wear-resistant layer is formed on said wear-resistant layer corresponding to a position where said individual electrodes are arranged. 2. The thermal head according to claim 1, wherein a conductive member for a common electrode is formed.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2780990A JP2938921B2 (en) | 1990-02-06 | 1990-02-06 | Thermal head |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2780990A JP2938921B2 (en) | 1990-02-06 | 1990-02-06 | Thermal head |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH03230964A JPH03230964A (en) | 1991-10-14 |
| JP2938921B2 true JP2938921B2 (en) | 1999-08-25 |
Family
ID=12231305
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2780990A Expired - Fee Related JP2938921B2 (en) | 1990-02-06 | 1990-02-06 | Thermal head |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2938921B2 (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR101114760B1 (en) | 2008-03-07 | 2012-02-29 | 세이코 엡슨 가부시키가이샤 | Head substrate, method for mounting driver ic on head substrate, and thermal head substrate |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0787199B2 (en) * | 1991-03-29 | 1995-09-20 | ローム株式会社 | Head drive IC and head substrate |
| JP6075626B2 (en) * | 2013-02-26 | 2017-02-08 | 京セラ株式会社 | Thermal head and thermal printer |
-
1990
- 1990-02-06 JP JP2780990A patent/JP2938921B2/en not_active Expired - Fee Related
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR101114760B1 (en) | 2008-03-07 | 2012-02-29 | 세이코 엡슨 가부시키가이샤 | Head substrate, method for mounting driver ic on head substrate, and thermal head substrate |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH03230964A (en) | 1991-10-14 |
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| Date | Code | Title | Description |
|---|---|---|---|
| LAPS | Cancellation because of no payment of annual fees |