JP2935843B1 - Wrapping carrier - Google Patents

Abstract

An object of the present invention is to increase the permeation area of an abrasive while suppressing a decrease in mechanical strength, and to prevent waving deformation during polishing of an object to be polished by a lapping device. A wrapping carrier includes a gear 21 meshing with a sun gear 12 provided at the center of a surface plate 11 and an internal gear 13 provided on a peripheral surface of the surface plate 11 concentrically with the sun gear 12. Formed on the outer peripheral surface of the main body 22,
The carrier body 22 is formed with a support hole 23 through which an object to be polished can be inserted and a hole through which an abrasive can pass.
The thickness is 20 to 1000 μm. The remaining portion of the carrier main body 22 other than the gear 21 and its peripheral edge, the support hole 23 and its peripheral edge is formed in the mesh 26, and the holes are mesh holes 27. The distance between the mesh eyes 27 is 0.3 to 1.5.
mm, and the shape of the eye 27 is square or circular,
The size of the mesh eyes 27 is 0.5 to 4 mm.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a carrier used in a lapping apparatus for polishing a surface of a hard brittle material such as quartz, glass, ceramics and the like. More specifically,
The present invention relates to a wrapping carrier having a thickness of 20 to 1000 μm in which a gear is formed on an outer peripheral surface and a support hole into which a workpiece can be inserted is formed.

[0002]

2. Description of the Related Art A lapping device is known as a device for polishing the surface of a hard brittle material such as quartz, glass, ceramics, etc. In a lapping device for simultaneously polishing the upper and lower surfaces of an object to be polished, a pair of upper and lower platens are provided. Can be A sun gear, which is an external gear, is provided at the center of the lower surface plate, and an internal gear, which is an internal gear, is provided concentrically with the sun gear on the peripheral surface of the lower surface plate. As shown in FIG. 3, a lapping carrier 1 is disposed on the lower surface plate, and a gear 2 meshing with both a sun gear and an internal gear is formed on an outer peripheral surface of the lapping carrier 1. Is inserted into a support hole 3 formed in the carrier 1. Although not shown, the upper surface plate of the lapping device is configured to apply a predetermined pressure to the object to be polished by sandwiching the object to be polished inserted into the support hole 3 of the carrier 1 with the lower surface plate. When the platen and the sun gear are concentrically rotated while the abrasive is supplied between the lower surface plate and the upper surface plate with the object to be polished interposed therebetween, the carrier 1 and the sun gear are rotated together with the object to be polished. Revolving around the periphery while rotating, each platen is designed to simultaneously grind the upper and lower surfaces of the object to be polished.

[0003]

However, the object to be polished inserted into the support hole 3 of the carrier 1 is polished while an abrasive is supplied between the lower platen and the upper platen. The agent may remain between the surface of the carrier 1 excluding the support holes 3 and the surface plate, and a part of the pressure applied to the workpiece by the surface plate is supported by the abrasive remaining on the surface of the carrier 1,
There is a problem that a uniform pressure is not applied to the object to be polished. In order to solve this problem, a hole 4 through which a conventional abrasive is allowed to pass is used.
Is formed in a portion excluding the support hole 3. However, in a wrapping carrier having a relatively small thickness of 1000 μm or less, if the hole 4 is made larger, the mechanical strength of the carrier 1 is reduced. However, if the hole 4 is made small in order to prevent a decrease in mechanical strength, there is a problem that the abrasive cannot be sufficiently penetrated and the object to be polished cannot be uniformly polished.

[0004] In this manner, in the relatively thin wrapping carrier thickness, when the carrier rotates and revolves around the sun gear with the object to be polished, between the surface and the surface plate of the workpiece sliding resistance occurs and there is also a problem that the portion excluding the support hole carrier itself is deformed to support the object to be polished is deformed to hit the waves. When the carrier is wavy deformed, the thickness of the carrier itself exceeds the thickness of the object to be polished, and the carrier itself comes into contact with the upper and lower platens, so that even pressure is not applied to the object to be polished. There is a problem that the object to be polished cannot be evenly polished. SUMMARY OF THE INVENTION An object of the present invention is to provide a lapping carrier capable of increasing an area for transmitting an abrasive while suppressing a decrease in mechanical strength.
Another object of the present invention is to provide a lapping carrier which does not cause wavy deformation when polishing an object to be polished by a lapping device.

[0005]

The invention according to claim 1 is
As shown in FIGS. 1 and 2, a gear 21 meshing with a sun gear 12 provided at the center of the surface plate 11 and an internal gear 13 provided on the peripheral surface of the surface plate 11 concentrically with the sun gear 12. Are formed on the outer peripheral surface of the carrier main body 22, and have a thickness of 20 to 1000 in which a support hole 23 through which an object to be polished can be inserted and a hole through which an abrasive is permeable are formed.
It is an improvement of the μm wrapping carrier. The characteristic configuration is that the gear 21 and its peripheral edge, the support hole 23 and the rest of the carrier main body 22 other than the peripheral edge are formed in the mesh 26, and the holes are mesh holes 27. According to the first aspect of the invention, since the mesh holes 27 form the holes, the permeation of the abrasive is larger than that of the conventional product shown in FIG. 3 in which one or more holes are formed larger than the mesh holes. The area can be enlarged. On the other hand, since the holes are the mesh holes 27, a decrease in the mechanical strength of the wrapping carrier itself can be suppressed as compared with the case where a large hole corresponding to the area of the mesh is formed.

The invention according to claim 2 is the invention according to claim 1, wherein the interval t between the meshes 27 is 0.3 to 1.
5 mm, the shape of the mesh eyes 27 is square or circular, and the size d of the mesh eyes 27 is 0.5 to 4.0.
mm wrapping carrier. In the invention according to claim 2, the sliding resistance generated when the lapping carrier rotates and revolves together with the object to be polished to polish the surface of the object to be polished is reduced by the elastic deformation of the mesh 26 formed on the carrier body 22. This prevents the portion excluding the support hole 23 from being deformed in a wavy manner.

[0007] The mesh spacing in the present specification refers to the dimension of the carrier body remaining between meshes as shown by t in the enlarged view of FIG. If less than 3 mm, the mechanical strength of the carrier itself
When the thickness exceeds 1.5 mm, the ability to transmit the abrasive is low.
Reduce. Preferably it is 0.5 to 1.2 mm. Also,
Examples of the shape of the mesh 27 of the square mesh include a shape formed of a quadrilateral, a pentagon, and a hexagon, and a mesh that forms a honeycomb shape is used as the shape of the hexagonal mesh. On the other hand, the shape of the eye 27 of the circular mesh includes both a perfect circle and an ellipse. Furthermore, the size of the mesh eyes 27 is
If the shape of the mesh eyes 27 is circular, it means its diameter, if it is elliptical, it means the major axis, and if the shape of the mesh eyes 27 is square, it means the length of one side. A more preferable value of the size of the mesh 27 is 1 to 3 mm.

[0008]

Embodiments of the present invention will now be described in detail with reference to the drawings. As shown in FIG. 2, the wrapping carrier 20 of the present invention is used for the wrapping device 10. The wrapping device 10 is made of quartz, glass,
A lapping device 10 for polishing the surface of a hard brittle material such as ceramics, and for simultaneously polishing the upper and lower surfaces of an object to be polished is provided with a pair of upper and lower platens 11 (only the lower platen is shown in the figure). . A sun gear 12 as an external gear is provided at the center of the lower surface plate 11, and an internal gear 13 as an internal gear is provided on the peripheral surface of the lower surface plate 11 concentrically with the sun gear 12. A plurality of concave grooves 11a for effectively discharging the abrasive are formed in a lattice shape on the lower surface plate 11, and the lower surface plate 11 and the sun gear 12 can be concentrically rotated with respect to the base 14, respectively. It is composed of An upper surface plate (not shown) is provided above the lower surface plate 11 so as to be vertically movable,
The upper platen is lowered so that the object to be polished is moved to the lower platen 1.
1 and a predetermined pressure is applied to the object to be polished.

As shown in FIG. 1, wrapping carrier 2
Reference numeral 0 denotes a carrier main body 22 having a gear 21 meshing with the sun gear 12 and the internal gear 13 formed on the outer peripheral surface, and a support hole 23 formed in the carrier main body 22 into which an object to be polished can be inserted. This wrapping carrier 20 is S
It is made by etching a plate material made of martensitic stainless steel such as US420J2, SUS431, SUS440C or the like or a SK material or a copper material and having a thickness of 20 to 1000 μm. The support holes 23 are formed in accordance with the outer diameter shape of the object to be polished, and in this embodiment, there are three support holes 23 for the object to be polished, which are square plate materials having rounded corners. It is formed. The carrier body 22 excluding the periphery of the gear 21 and the periphery of the support hole 23 is formed in a mesh 26. As shown in the enlarged view of FIG. 1, the mesh 26 in this embodiment is formed by simultaneously forming a plurality of circular holes 27 having a diameter d of 1 mm at the time of etching so that the interval t between the holes is 1.0 mm. Can be The circular holes 27, which are the eyes of the mesh 26, function as conventional holes that allow the abrasive to pass therethrough and prevent the abrasive from remaining on the surface of the carrier body 22.

In order to grind an object to be polished by a lapping apparatus using the lapping carrier having such a configuration, first, the gear 21 is meshed with both the sun gear 12 and the internal gear 13 and the lower platen is engaged. The lapping carrier 20 is arranged on the upper surface plate 11 without inserting the object to be polished into the support holes 23.
0 together with the lower surface plate 11, and in this state, the lower surface plate 1
1 and the sun gear 12 are rotated for a predetermined time. Due to this rotation, the wrapping carrier 20 revolves while rotating around the sun gear 12, and the wrapping carrier 20 having warpage or distortion is deformed by stress concentrated on the contact portion with the surface plate. After the rotation for a predetermined time, the upper platen is raised to visually check the deformation of the wrapping carrier 20, and the deformed wrapping carrier 20 is removed by this check. As a result, the smoothness of the wrapping carrier 20 can be checked in advance, and the supporting holes 2 of the wrapping carrier 20 that do not deform are formed.
3 is polished.

After the object to be polished is inserted into the support hole 23, the upper platen (not shown) is lowered again to sandwich the object to be polished together with the lapping carrier 20 between the upper platen and the lower platen 11. To a predetermined pressure. In this state, while the abrasive is supplied between the lower surface plate 11 and the upper surface plate by the abrasive supply means (not shown), the lower surface plate 11 and the sun gear 1
2 are respectively rotated. The rotation of the sun gear 12 causes the lapping carrier 20 to move together with the object to be polished into the sun gear 12.
The upper surface and the lower surface of the object to be polished come into contact with the upper surface plate and the lower surface plate 11 and are polished.
At this time, the abrasive supplied between the lower surface plate 11 and the upper surface plate penetrates between the upper surface or the lower surface of the object to be polished and the upper surface plate or the lower surface plate 11 to remove the object to be polished. After being polished, they enter a circular hole 27 which is an eye of the mesh 26, and the abrasive which has entered the circular hole 27 is discharged after entering a concave groove 11a formed in the lower platen 11. For this reason, the abrasive does not remain between the surface of the carrier main body 22 excluding the support holes 23 and the respective surface plates 11, and a uniform pressure can always be applied to the workpiece.

When the carrier rotates and revolves around the sun gear 12 together with the object to be polished, the surface of the object to be polished is
Even if a sliding resistance is generated between the carrier and the surface plate 11, the stress is caused by the mesh 26 formed in the carrier body 22, that is, in the present embodiment, the plurality of circular holes 27 themselves are elastically deformed into an elliptical shape. This prevents the portion other than the support hole 23 from being deformed so as to make a wave.

[0013]

As described above, according to the present invention, the carrier body excluding the periphery of the gear and the periphery of the support hole is formed in a mesh, and the mesh mesh is made to function as a conventional hole. As compared with a conventional product in which one or a plurality of holes are formed which are larger than the mesh, the permeation area of the abrasive can be increased. On the other hand, since the holes are mesh eyes, a decrease in the mechanical strength of the wrapping carrier itself can be suppressed as compared with a case where a large hole corresponding to the area of the mesh is formed. As a result, it is possible to increase the permeation area of the abrasive while suppressing a decrease in mechanical strength as compared with the conventional lapping carrier.
In addition, since the mesh is formed on the carrier body, the sliding resistance that occurs when polishing the surface of the object to be polished is absorbed by the elastic deformation of the mesh eyes, and the portion of the lapping carrier except for the support holes absorbs waves. It is possible to prevent deformation such as hitting. As a result, the surface of the object to be polished inserted into the support hole can be uniformly polished.

[Brief description of the drawings]

FIG. 1 is a plan view showing a wrapping carrier of the present invention.

FIG. 2 is a partial perspective view of the wrapping device showing a use state of the wrapping carrier.

FIG. 3 is a plan view corresponding to FIG. 1 showing a conventional wrapping carrier.

[Explanation of symbols]

 Reference Signs List 11 surface plate 12 sun gear 13 internal gear 20 lapping carrier 21 gear 22 carrier body 23 support hole 26 mesh 27 circular hole (mesh eyes) t mesh mesh distance d mesh mesh size

Claims (2)

(57) [Claims] 1. A sun gear (1) provided at the center of a surface plate (11).
A gear (21) meshing with 2) and an internal gear (13) provided concentrically with the sun gear (12) on the peripheral surface of the surface plate (11).
Are formed on the outer peripheral surface of the carrier main body (22), and the carrier main body (22) has a support hole (23) capable of inserting an object to be polished and a through hole through which an abrasive is permeable, and has a thickness of 20 to 20. 1000
In the case of a wrapping carrier of μm, the mesh (26) is formed with the gear (21) and its periphery, the support hole (23), and the rest of the carrier body (22) other than the periphery thereof formed in the mesh (26). (27) A wrapping carrier characterized in that: 2. An interval (t) between mesh eyes (27) is 0.3 to
2. The mesh according to claim 1, wherein the mesh has a square or circular shape, and the mesh has a size of 0.5 to 4.0 mm. 3. Wrapping carrier.