JP2927991B2 - IC transfer device - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an IC transport device in an IC manufacturing apparatus.

[0002]

2. Description of the Related Art Conventionally, a transfer device of this type is an IC product 1 resin-sealed in a lead frame 2 shown in a plan view of FIG.
As shown in the cross-sectional view of FIG. 4, in order to transport the product along the transport rail 3, the transport rod 8 and the transport claw 7 are transport-cycle-operated so that the product is pitch-transported. The transport system has a cam and a drive motor.

Next, the operation will be described. As shown in the perspective view of FIG. 6, the following continuous operation is performed by using a cam that performs the cycle operation 11 for conveying the product. First, using the square hole 9 or the round hole of the lead frame of the product, the transport claw 7 is inserted into the square hole 9 by operating the transport rod 8, and then the product is moved in the horizontal direction 10 by the following operation.
To pitch. The transport rod 8 fed at the pitch is extracted from the square hole 9 by the operation of, and returns to the origin of the transport rod by the operation of. By repeating this series of operations 1 to 3, the product is pitch-conveyed to the processing position A, and some processing such as lead cutting is performed during the conveyance.

[0004]

However, in the conventional transport apparatus, the transport rods are transported in such a cycle as described above, so that only the operations actually required for the pitch transport of the product are performed. However, since the operations of,, and are accompanied, there is a drawback that the wasted time of,, is accumulated every time the product pitch is conveyed, and the index of the apparatus and, consequently, the productivity are reduced. Further, since the transport device uses the transport rod and the transport claws as described above, and the square hole and the round hole of the lead frame, there is a drawback such that it is impossible to flexibly support a product type with the same transport device. .

[0005]

According to the present invention, there is provided an IC transport apparatus comprising: a lead frame of an IC product sealed with a resin in a lead frame;
Mega grip unit that clamps the frame end and this
Drive the mega clip unit to move the product to the origin
Servo motor for continuous pitch transfer to processing position
And an image recognition unit that corrects the origin correction position.
The lead frame edge is
Mega clip unit fixed by the end face of the clip unit
Is characterized by driving in the direction to push out the lead frame
And

[0006]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Next, the present invention will be described in detail with reference to the drawings. FIG. 1 is a sectional view showing a part of one embodiment of the present invention,
2A and 2B are views for explaining one embodiment. FIG. 2A is a sectional view showing a clamped state, FIG. 2B is a sectional view showing a state where a clamp is released, and FIG. FIG. FIG. 1 shows a state in which a resin-encapsulated IC product in a lead frame 2 is present on a transport rail 3. Pitch conveyance is performed. First, in FIG. 2, the end of the lead frame 2 of the product is clamped by the mechanical grip unit 4 from the state of FIG. 2B to the state of FIG. Conductive rubber 1 on clamp surface
2 are provided. Next, in FIG. 3, the product is moved in the horizontal direction 6 to the origin correction position B using the servomotor 13 with the mechanical grip unit 4 and the origin position is corrected by the image recognition unit 5, and the origin position and the IC product at that time are corrected. Based on the information of the distance between the pitches of 1, the product is continuously conveyed to the processing position A by the servo motor 13 and a series of conveying operations including the processing are performed. After the processing of the product is completed, the mechanical grip unit 4 is
As a result, the origin is returned at a high speed in the direction opposite to the horizontal direction 6, and the above-described operation is repeated for the next product in the standby state in advance. The above operations are all controlled by the control unit 14.

By using the transfer device of the above-described embodiment, it is possible to transfer a product at a high speed and to perform processing. In addition, since the transport is performed by clamping the end of the lead frame with the mechanical grip unit, it is possible to flexibly support a product type.

[0008]

As described above, according to the present invention, high-speed transport and processing of a product can be achieved by using a mechanical grip unit, a servomotor, and an image recognition unit for origin position correction on a lead frame of a resin-sealed IC. Since it can be performed, the time can be reduced. As a result, the device index can be improved, high productivity can be exhibited, and there is no need to replace or switch units with respect to products, and flexible product types can be handled.

[Brief description of the drawings]

FIG. 1 is a sectional view showing a part of an embodiment of the present invention.

FIG. 2 is a diagram for explaining an embodiment of the present invention, wherein FIG.
Is a cross-sectional view showing a clamped state, and FIG. 2B is a cross-sectional view showing a state in which the clamp is released.

FIG. 3 is a perspective view showing the operation of one embodiment of the present invention.

FIG. 4 is a cross-sectional view showing a part of a conventional transport device.

FIG. 5 is a plan view showing a part of a product.

FIG. 6 is a perspective view showing the operation of a conventional transport device.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 IC product 2 Lead frame 3 Transport rail 4 Mechanical grip unit 5 Image recognition unit 6 Horizontal direction 7 Transport claw 8 Transport rod 9 Square hole 10 Horizontal direction 11 Cycle operation 12 Conductive rubber 13 Servo motor 14 Control part A Processing position B Origin correction position

Claims (1)

(57) [Claims] 1. A mega grip unit for clamping an end of a lead frame of an IC product resin-sealed to a lead frame, and a servo motor for driving the mega clip unit to convey the product to an origin correction position and a processing position at a continuous pitch. If, and an image recognition unit for correcting the origin compensation position, wherein is the lead frame end during continuous pitch feed the mega clip unit is fixed by the end surface of the mega clip unit in a direction to push the lead frame An IC transport device characterized by being driven.