JP2921504B2 - Multilayer printed wiring board and method of manufacturing the same - Google Patents
Multilayer printed wiring board and method of manufacturing the sameInfo
- Publication number
- JP2921504B2 JP2921504B2 JP8222281A JP22228196A JP2921504B2 JP 2921504 B2 JP2921504 B2 JP 2921504B2 JP 8222281 A JP8222281 A JP 8222281A JP 22228196 A JP22228196 A JP 22228196A JP 2921504 B2 JP2921504 B2 JP 2921504B2
- Authority
- JP
- Japan
- Prior art keywords
- layer
- hole
- wiring board
- printed wiring
- insulating resin
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
- B23K26/38—Removing material by boring or cutting
- B23K26/382—Removing material by boring or cutting by boring
- B23K26/389—Removing material by boring or cutting by boring of fluid openings, e.g. nozzles, jets
Landscapes
- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Engineering & Computer Science (AREA)
- Plasma & Fusion (AREA)
- Mechanical Engineering (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
Description
【０００１】[0001]
【発明の属する技術分野】本発明は、非貫通接続孔が形
成された多層プリント配線板およびその製造方法に関す
る。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a multilayer printed wiring board in which non-through connection holes are formed and a method for manufacturing the same.
【０００２】[0002]
【従来の技術】一般に、この種の多層プリント配線板の
製造方法としては、以下の３種類がある。第１の方法は
サブトラクティブ法で形成する方法であって、銅張積層
板にドリルによって穿孔し、電気めっきでスルーホール
銅を形成した後、片面のみをエッチングによって回路形
成して両面板を形成する。次に、この両面板の回路形成
していない銅箔面を最外層として、２枚の両面板の間に
プリプレグと称するガラスクロス樹脂含浸布を挟んで加
熱加圧プレスによって熱圧着する。これによって、両面
板のスルーホール銅が非貫通接続孔を形成し、最後に、
ドリルによって貫通孔を穿孔し、電気めっきによってス
ルーホール銅を形成後、エッチングによって外層回路を
形成するものである。2. Description of the Related Art Generally, there are the following three types of methods for manufacturing this type of multilayer printed wiring board. The first method is a method of forming by a subtractive method, in which a copper-clad laminate is drilled, a through-hole copper is formed by electroplating, and a circuit is formed by etching only one side to form a double-sided board. I do. Next, with the copper foil surface of the double-sided board on which no circuit is formed as the outermost layer, thermocompression bonding is performed by a hot and press press with a glass cloth resin impregnated cloth called prepreg sandwiched between the two double-sided boards. Thereby, the through-hole copper of the double-sided board forms a non-through connection hole, and finally,
A through-hole is formed by a drill, a through-hole copper is formed by electroplating, and an outer layer circuit is formed by etching.
【０００３】第２の方法はアディティブ法で形成する方
法であって、積層プレスあるいはビルドアップ法によっ
て多層板を形成したのちに、ドリルあるいはレーザによ
り非貫通孔を形成し、電気めっきによって非貫通接続孔
および外層回路を形成するものである。また、第３の方
法はフォトビア法で形成する方法であって、感光性の絶
縁樹脂を用いて写真法により非貫通孔を形成するもので
ある。The second method is a method of forming by an additive method. After forming a multilayer board by a lamination press or a build-up method, a non-through hole is formed by a drill or a laser, and a non-through connection is formed by electroplating. A hole and an outer layer circuit are formed. The third method is a method of forming by a photo-via method, in which a non-through hole is formed by a photographic method using a photosensitive insulating resin.
【０００４】[0004]
【発明が解決しようとする課題】一般に、この種の多層
プリント配線板の導通信頼性は、各層間を接続する非貫
通接続穴の信頼性によって大きく左右される。すなわ
ち、多層プリント配線板が搭載された製品の使用時発生
する熱によって多層プリント配線板が膨張収縮を繰り返
し、膨張収縮によって生じた応力が非貫通接続穴に作用
し、非貫通接続穴の上端縁の破壊を引き起こすためであ
る。この破壊は、非貫通穴の上端縁と壁面とのなす角度
が鋭角状に形成されている程、応力の集中によって起こ
り易い。上述した従来の多層プリント配線板の製造方法
における非貫通穴の穿孔方法は、ドリル、レーザ、写真
法によって行っているが、このうち、ドリルによるもの
では、上端縁と壁面とのなす角度がほぼ９０°に形成さ
れるため破壊を引き起こし易く外層回路と非貫通接続穴
との間の導通接続の信頼性が低い。Generally, the reliability of conduction of this kind of multilayer printed wiring board is largely determined by the reliability of non-through connection holes connecting the respective layers. That is, the multilayer printed wiring board repeatedly expands and contracts due to the heat generated when the product on which the multilayer printed wiring board is mounted is used, and the stress generated by the expansion and contraction acts on the non-through connection hole, and the upper edge of the non-through connection hole This is to cause destruction. This destruction is more likely to occur due to the concentration of stress as the angle between the upper edge of the non-through hole and the wall surface is formed at an acute angle. In the above-described conventional method of manufacturing a multilayer printed wiring board, a method of drilling a non-through hole is performed by a drill, a laser, or a photographic method. Since it is formed at 90 °, destruction is likely to occur and the reliability of the conductive connection between the outer layer circuit and the non-through connection hole is low.
【０００５】これに対して、レーザおよび写真法による
穿孔方法では、上端縁と壁面とのなす角度が９０〜１１
０°に形成され、ドリルによる穿孔方法と比較して導通
接続の信頼性が高い。しかも、これらレーザおよび写真
法による穿孔方法では、製造条件を変えることによって
上端縁と壁面とのなす角度をさらに鈍角とし、導通接続
の信頼性を向上させることが可能である。例えば、レー
ザによる穿孔方法では、レーザの照射量を減らすことに
より、上端縁と壁面とのなす角度を鈍角とすることがで
きる。しかしながら、レーザの照射量の不足によって内
層回路上の絶縁層残り（スミア）が起き易くなり、この
スミア残りによる導通接続の信頼性の低下が問題となっ
ていた。また、写真法による穿孔方法では、現像を過多
な条件にすることによって上端縁と壁面とのなす角度を
鈍角とすることができる。しかしながら、現像を過多な
条件とすると、現像液によって非貫通穴の底面の周縁に
おいて絶縁層が内層回路から剥離し、このため内層回路
との密着性や耐熱性が低下するという問題が起きる。こ
のように、従来の方法では、非貫通接続穴と内層回路と
の間の導通接続の信頼性を維持したまま上端縁と壁面の
断面角度を鈍角とすることが困難であった。On the other hand, in the drilling method using a laser and a photographic method, the angle between the upper edge and the wall surface is 90 to 11 degrees.
It is formed at 0 °, and the reliability of the conductive connection is higher than that of the drilling method. In addition, in the perforation method using the laser and the photographic method, the angle between the upper end edge and the wall surface can be further obtuse by changing the manufacturing conditions, and the reliability of the conductive connection can be improved. For example, in the laser drilling method, the angle between the upper edge and the wall surface can be made obtuse by reducing the amount of laser irradiation. However, an insufficient amount of laser irradiation easily causes a residue (smear) of the insulating layer on the inner layer circuit, and there has been a problem that the reliability of the conductive connection is reduced due to the residue of the smear. Further, in the piercing method using a photographic method, the angle between the upper edge and the wall surface can be made obtuse by making the development excessive. However, if the development is performed under excessive conditions, the insulating layer is peeled off from the inner layer circuit at the periphery of the bottom surface of the non-through hole by the developer, which causes a problem that the adhesion to the inner layer circuit and the heat resistance are reduced. As described above, in the conventional method, it is difficult to make the sectional angle between the upper edge and the wall surface obtuse while maintaining the reliability of the conductive connection between the non-through connection hole and the inner layer circuit.
【０００６】したがって、本発明は上記した従来の問題
を解決するためになされたもので、その目的とするとこ
ろは、非貫通接続穴と内層回路との間の導通接続の信頼
性を維持したまま、非貫通接続穴と外層回路との間の導
通接続の信頼性の向上を図った多層プリント配線板およ
びその製造方法を提供することにある。Accordingly, the present invention has been made to solve the above-mentioned conventional problems, and an object of the present invention is to maintain the reliability of the conductive connection between the non-through connection hole and the inner layer circuit. It is another object of the present invention to provide a multilayer printed wiring board and a method for manufacturing the multilayer printed wiring board, which improve the reliability of the conductive connection between the non-through connection hole and the outer layer circuit.
【０００７】[0007]
【課題を解決するための手段】この目的を達成するため
に、本発明に係る多層プリント配線板は、基材上に形成
した内層回路と、この内層回路上に形成した絶縁樹脂層
と、この絶縁樹脂層上に形成した外層回路と、前記絶縁
樹脂層にレーザによって凹設した非貫通穴にめっきを施
し前記内層回路と外層回路とを接続した非貫通接続穴と
を備え、前記絶縁樹脂層を複数の層で形成し、外層回路
側にレーザの切削速度の大きい層を内層回路側にレーザ
の切削速度の小さい層を配置したものである。したがっ
て、内層回路上にスミア残りが発生せずに、非貫通穴の
上端縁と壁面とのなす角度が鈍角に形成される。In order to achieve this object, a multilayer printed wiring board according to the present invention comprises an inner circuit formed on a base material, an insulating resin layer formed on the inner circuit, and an insulating resin layer formed on the inner circuit. An outer layer circuit formed on the insulating resin layer, and a non-through connection hole connecting the inner layer circuit and the outer layer circuit by plating a non-through hole recessed by laser in the insulating resin layer; Are formed in a plurality of layers, and a layer having a high laser cutting speed is arranged on the outer layer circuit side and a layer having a low laser cutting speed is arranged on the inner layer circuit side. Therefore, the angle formed between the upper edge of the non-through hole and the wall surface is formed at an obtuse angle without smear remaining on the inner layer circuit.
【０００８】[0008]
【発明の実施の形態】以下、本発明の実施の形態を図に
基づいて説明する。図１は本発明に係る製造方法を説明
するための多層プリント配線板の断面図、図２は同じく
要部を拡大して示す断面図である。図１（ａ）におい
て、符号２で示すものは、めっき触媒入りガラスエポキ
シ樹脂からなる銅張積層板であって、上下の表面に銅箔
３，４が接着されている。DESCRIPTION OF THE PREFERRED EMBODIMENTS Embodiments of the present invention will be described below with reference to the drawings. FIG. 1 is a cross-sectional view of a multilayer printed wiring board for explaining a manufacturing method according to the present invention, and FIG. In FIG. 1A, reference numeral 2 denotes a copper-clad laminate made of a glass epoxy resin containing a plating catalyst, and copper foils 3 and 4 are adhered to upper and lower surfaces.
【０００９】同図（ｂ）に示すように、エッチングによ
って内層回路３ａ，４ａを形成し、プライマー層５、絶
縁樹脂層６および接着剤層７を形成する。これらプライ
マー層５、絶縁樹脂層６、接着剤層７は、それぞれのレ
ーザの切削速度が３０〜７０μｍ／ショット、５０〜９
０μｍ／ショット、８０〜１２０μｍ／ショットである
材質のものが選択される。As shown in FIG. 1B, inner layer circuits 3a and 4a are formed by etching, and a primer layer 5, an insulating resin layer 6, and an adhesive layer 7 are formed. Each of the primer layer 5, the insulating resin layer 6, and the adhesive layer 7 has a laser cutting speed of 30 to 70 μm / shot and 50 to 9 μm / shot.
A material having a material of 0 μm / shot and 80 to 120 μm / shot is selected.
【００１０】次に、同図（ｃ）に示すように、周波数が
１０ ４ 〜１０ ８ Ｈｚの短パルスＣＯ２レーザを用いて、
レーザビーム光を接着剤層７側から照射して、接着剤層
７、絶縁樹脂層６およびプライマー層５に非貫通穴８を
凹設し、しかるのち、ドリルを用いて貫通穴９を穿孔す
る。レーザによって凹設された非貫通穴８は、プライマ
ー層５、絶縁樹脂層６および接着剤層７のレーザ切削速
度が上述したよう大きさであることにより、接着剤層７
の切削量が一番多く、漸次絶縁樹脂層６、プライマー層
５となる。換言すれば、接着剤層７に穿孔された孔の径
が一番大きく、漸次絶縁樹脂層６、プライマー層５の順
となる。したがって、非貫通穴８の断面形状は、図２に
示すように、すり鉢状に形成され、本実施の形態におい
ては、非貫通穴８の上端縁Ａと壁面Ｂとのなす角度αが
１２０゜の鈍角に形成される。[0010] Next, as shown in FIG. (C), the frequency
Using a short pulse CO 2 laser at 10 4 to 10 8 Hz ,
A non-through hole 8 is formed in the adhesive layer 7, the insulating resin layer 6, and the primer layer 5 by irradiating a laser beam light from the adhesive layer 7 side, and thereafter, the through hole 9 is formed by using a drill. . The non-through hole 8 recessed by the laser causes the adhesive layer 7 due to the laser cutting speed of the primer layer 5, the insulating resin layer 6, and the adhesive layer 7 being as described above.
Is the largest, and becomes the insulating resin layer 6 and the primer layer 5 gradually. In other words, the diameter of the hole pierced in the adhesive layer 7 is the largest, and the insulating resin layer 6 and the primer layer 5 are in order. Therefore, as shown in FIG. 2, the cross-sectional shape of non-through hole 8 is formed in a mortar shape, and in the present embodiment, angle α between upper end edge A of non-through hole 8 and wall surface B is 120 °. Is formed at an obtuse angle.
【００１１】次に、同図（ｄ）に示すように、スミア処
理後、接着剤層７上にエポキシ樹脂からなるめっきレジ
スト１３を塗布するかあるいは感光性ドライフィルムレ
ジストをラミネートし、粗化し、無電解銅めっきによっ
て外層回路１２を形成するとともに、非貫通穴８、貫通
穴９の壁面に銅めっきを析出させて非貫通接続穴１０お
よび貫通接続穴１１を形成する。Next, as shown in FIG. 1D, after smearing, a plating resist 13 made of an epoxy resin is applied on the adhesive layer 7 or a photosensitive dry film resist is laminated and roughened. The outer layer circuit 12 is formed by electroless copper plating, and copper plating is deposited on the wall surfaces of the non-through holes 8 and 9 to form the non-through connection holes 10 and the through connection holes 11.
【００１２】表１は、このように形成された本実施の形
態の多層プリント配線板の非貫通接続穴１０と、図３に
示す非貫通穴２０をドリルによって穿孔し、非貫通孔２
０の上端縁Ａと壁面Ｂとのなす角度βを９０°に形成し
た従来の多層プリント配線板の非貫通接続穴２１との導
通接続の信頼性を測定して比較したものである。この表
から明かなように、本発明の多層プリント配線板におけ
る非貫通接続穴１０の方が導通接続の信頼性が高いこと
がわかる。Table 1 shows that the thus formed non-through connection hole 10 of the multilayer printed wiring board of the present embodiment and the non-through hole 20 shown in FIG.
In this figure, the reliability of the conductive connection with the non-penetrating connection hole 21 of the conventional multilayer printed wiring board in which the angle β formed between the upper end edge A of 0 and the wall surface B is 90 ° is measured and compared. As is clear from this table, the non-penetrating connection hole 10 in the multilayer printed wiring board of the present invention has higher reliability of the conductive connection.
【００１３】[0013]
【表１】 ※１：ＪＩＳ Ｃ５０１２ 付図１．１両面プリント板
用複合テストパターン（表面）、付図１．２同（裏面）
で試料Ｄを１層、２層に形成し多層板を作成。ただし、
ライン幅０．１ｍｍ、ランド径２ｍｍに変更し、非貫通
穴径φ０．１ｍｍ、１層〜２層間距離８０μｍ、めっき
厚さ３０μｍで作成。 ※２：ＪＩＳ Ｃ５０１２ 熱衝撃（高温浸せき）試験
の条件で２００サイクル処理。処理後の導通抵抗値を測
定。ＪＩＳ Ｃ５０１２の規定により、初期値に対する
導通抵抗値変化率が±１０％以下であれば合格となる。[Table 1] * 1: Attached to JIS C5012 Figure 1.1 : Composite test pattern for double-sided printed board ( front side ), Figure 1.2: Attached (back side)
The sample D is formed into one layer and two layers to prepare a multilayer board. However,
The line width was changed to 0.1 mm, the land diameter was changed to 2 mm, and the non-through hole diameter was 0.1 mm, the distance between the first and second layers was 80 μm, and the plating thickness was 30 μm. * 2: 200 cycles treatment under the conditions of JIS C5012 thermal shock (high temperature immersion) test. Measure the conduction resistance after processing. The provisions of JIS C501 2, the conduction resistance value change ratio with respect to the initial value is passed if less 10% ±.
【００１４】[0014]
【実施例】スミア処理は、３８℃の無水クロム酸９５０
ｇ／ｌによって１８分間行う。粗化は、ＮａＦ：１０ｇ
／ｌ，ＣｒＯ3：１５ｇ／ｌ， Ｈ2ＳＯ4：４００ｍｌ／
ｌからなる３６℃の粗化液によって５分間行う。EXAMPLE Smear treatment was performed using chromic anhydride 950 at 38 ° C.
Perform for 18 minutes with g / l. Roughening is 10 g of NaF.
/ L, CrO 3 : 15 g / l, H 2 SO 4 : 400 ml /
1 hour at 36 ° C. for 5 minutes.
【００１５】[0015]
【発明の効果】以上説明したように本発明によれば、内
層回路と外層回路との間に介在する絶縁樹脂層を複数の
層で形成し、外層回路側にレーザの切削速度の大きい層
を、内層回路側にレーザの切削速度の小さい層をそれぞ
れ配置したことにより、内層回路と非貫通接続穴との導
通接続の信頼性を維持したまま、非貫通穴の上端縁と壁
面とのなす角度を鈍角とすることができるので、外層回
路と非貫通接続穴との導通接続の信頼性を向上させるこ
とができる。As described above, according to the present invention, an insulating resin layer interposed between an inner layer circuit and an outer layer circuit is formed of a plurality of layers, and a layer having a high laser cutting speed is formed on the outer layer circuit side. The angle between the top edge of the non-through hole and the wall surface while maintaining the reliability of the conductive connection between the inner layer circuit and the non-through connection hole by arranging each layer with a small laser cutting speed on the inner layer circuit side. Can be made an obtuse angle, so that the reliability of the conductive connection between the outer layer circuit and the non-through connection hole can be improved.
【図１】 本発明に係る製造方法を説明するための多層
プリント配線板の断面図である。FIG. 1 is a cross-sectional view of a multilayer printed wiring board for describing a manufacturing method according to the present invention.
【図２】 本発明の方法によって製造した多層プリント
配線板の要部を拡大して示す断面図である。FIG. 2 is an enlarged sectional view showing a main part of a multilayer printed wiring board manufactured by the method of the present invention.
【図３】 従来の方法で製造した多層プリント配線板の
要部を拡大して示す断面図である。FIG. 3 is an enlarged sectional view showing a main part of a multilayer printed wiring board manufactured by a conventional method.
３ａ…内層回路、５…プライマー層、６…絶縁樹脂層、
７…接着剤層、８…非貫通穴、１０…非貫通接続穴。3a: inner layer circuit, 5: primer layer, 6: insulating resin layer,
7: adhesive layer, 8: non-through hole, 10: non-through connection hole.
───────────────────────────────────────────────────── フロントページの続き (72)発明者 横山 博義 栃木県芳賀郡二宮町大字久下田1065番地 日立エーアイシー株式会社内 (72)発明者 岩崎 康弘 栃木県芳賀郡二宮町大字久下田1065番地 日立エーアイシー株式会社内 (56)参考文献 特開 平２−27795（ＪＰ，Ａ) (58)調査した分野(Int.Cl.6，ＤＢ名) H05K 3/46,3/00 ──────────────────────────────────────────────────続 き Continuing on the front page (72) Inventor Hiroyoshi Yokoyama 1065 Kusita, Ninomiya-cho, Haga-gun, Tochigi Prefecture Inside Hitachi AIC Co., Ltd. (56) References JP-A-2-27795 (JP, A) (58) Fields investigated (Int. Cl. 6 , DB name) H05K 3/46, 3/00
Claims (2)
回路上に形成した絶縁樹脂層と、この絶縁樹脂層上に形
成した外層回路と、前記絶縁樹脂層にレーザによって凹
設した非貫通穴にめっきを施し前記内層回路と外層回路
とを接続した非貫通接続穴とを備えた多層プリント配線
板において、前記絶縁樹脂層を複数の層で形成し、外層
回路側にレーザの切削速度の大きい層を、内層回路側に
レーザの切削速度の小さい層をそれぞれ配置したことを
特徴とする多層プリント配線板。1. An inner layer circuit formed on a base material, an insulating resin layer formed on the inner layer circuit, an outer layer circuit formed on the insulating resin layer, and a non-indented laser formed in the insulating resin layer. In a multilayer printed wiring board having a non-through connection hole formed by plating a through hole and connecting the inner layer circuit and the outer layer circuit, the insulating resin layer is formed of a plurality of layers, and a laser cutting speed is formed on the outer layer circuit side. A multilayer printed wiring board comprising: a layer having a large size; and a layer having a low laser cutting speed disposed on the inner layer circuit side.
に絶縁樹脂層を形成して、絶縁樹脂層にレーザによって
非貫通穴を凹設し、非貫通接続穴を介して内層回路と外
層回路とを接続した多層プリント配線板の製造方法にお
いて、前記絶縁樹脂層を、外層回路側から内層回路側に
向かってレーザーによる切削速度がそれぞれ１２０〜８
０μｍ／ショットの第１の層と、９０〜５０μｍ／ショ
ットの第２の層と、７０〜３０μｍ／ショットの第３の
層とで形成し、周波数が１０ ４ 〜１０ ８ Ｈｚの短パルス
ＣＯ２のレーザによって第１の層側からレーザビーム光
を照射して非貫通穴の上端縁と壁面とのなす角度を９０
゜以上に形成したことを特徴とする多層プリント配線板
の製造方法。2. An inner layer circuit is formed on a base material, an insulating resin layer is formed on the inner layer circuit, a non-through hole is formed in the insulating resin layer by a laser, and the inner layer circuit is formed through the non-through connection hole. In the method of manufacturing a multilayer printed wiring board in which the insulating resin layer is connected to the outer layer circuit from the outer layer side to the inner layer side, the laser cutting speed is 120 to 8 respectively.
A short pulse CO 2 having a first layer of 0 μm / shot, a second layer of 90 to 50 μm / shot, and a third layer of 70 to 30 μm / shot, and having a frequency of 10 4 to 10 8 Hz. Irradiates a laser beam light from the first layer side by the laser of the first type to make the angle between the upper edge of the non-through hole and the wall surface 90 degrees.
(4) A method for producing a multilayer printed wiring board, characterized by being formed as described above.
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8222281A JP2921504B2 (en) | 1996-08-23 | 1996-08-23 | Multilayer printed wiring board and method of manufacturing the same |
| US08/768,426 US5826330A (en) | 1995-12-28 | 1996-12-18 | Method of manufacturing multilayer printed wiring board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8222281A JP2921504B2 (en) | 1996-08-23 | 1996-08-23 | Multilayer printed wiring board and method of manufacturing the same |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH1065344A JPH1065344A (en) | 1998-03-06 |
| JP2921504B2 true JP2921504B2 (en) | 1999-07-19 |
Family
ID=16779919
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP8222281A Expired - Fee Related JP2921504B2 (en) | 1995-12-28 | 1996-08-23 | Multilayer printed wiring board and method of manufacturing the same |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2921504B2 (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3807312B2 (en) * | 2002-01-18 | 2006-08-09 | 富士通株式会社 | Printed circuit board and manufacturing method thereof |
-
1996
- 1996-08-23 JP JP8222281A patent/JP2921504B2/en not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| JPH1065344A (en) | 1998-03-06 |
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