JP2910738B2 - Solder supply device for FPBGA mounting - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a solder supply device for FPBGA mounting, and more particularly, to an FPBGA (FinePitc)
h Ball Grid Array) relates to a method of supplying solder onto a printed wiring board for mounting.

[0002]

2. Description of the Related Art Conventionally, as a method of supplying solder onto a printed wiring board, a method of supplying solder by solder printing using a metal mask for attaching a mounted component to the printed wiring board, and a method of exchanging the mounted component are used. There is a method of supplying the solder by melting the thread solder by a soldering iron at the time.

In the case of a method of supplying solder by solder printing using a metal mask, a solder paste is supplied on the metal mask at the time of the first component mounting on the printed wiring board.
By tracing the solder paste with a spatula called a squeegee, the solder paste is printed on the printed wiring board through the mask opening of the metal mask, and the solder is supplied to the printed wiring board.

In an apparatus for supplying solder by solder printing using a metal mask, there is a method of automatically supplying a solder paste. As for this automatic supply method, there is a technique disclosed in Japanese Patent Application Laid-Open No. 2-137669.

[0005] In the case of a method of supplying solder by melting the thread solder using a soldering iron, a part to be replaced is repaired at a predetermined place on the printed wiring board when the mounted part is repaired or the mounted part is retrofitted. The solder is supplied to the soldering portion of the component and the soldering pad of the printed wiring board by dissolving the thread solder with a soldering iron, respectively.

[0006]

In the above-mentioned conventional method for supplying solder, in the case where the solder is supplied by melting the thread solder with a soldering iron, the soldering leads or soldering portions of most parts are parts. Solder is supplied using a soldering iron because it is outside the outer shape or is provided on the outer periphery.

On the other hand, in a component in which a soldering portion such as an FPBGA is prepared on the lower surface of the component, the soldering portion is not exposed to the outside when the component is arranged on the printed wiring board. Therefore, solder cannot be supplied after the components are arranged on the printed wiring board when the components are repaired or retrofitted.

[0008] Solder printing is a method in which a metal mask is pressed against a printed wiring board, and the solder paste supplied on the metal mask is scratched with a squeegee to supply the solder to the printed wiring board through the mask opening. is there.

However, in this solder printing, since the solder paste on the metal mask is scraped with a squeegee, it is necessary that the components are not mounted on the printed wiring board, that is, the printed wiring board must be flat. .

[0010] In particular, FPBG requiring fine solder supply
For A, etc., the method of supplying solder by solder printing is effective, but when repairing or retrofitting parts, many parts are already mounted on the printed wiring board, so a large solder printing method using a squeegee etc. is used. Can not supply.

Therefore, an object of the present invention is to solve the above-mentioned problems and to supply solder with the same precision and ease as solder printing before arranging components on a printed wiring board when repairing the FPBGA. It is to provide a solder supply device for mounting.

[0012]

An FPBGA according to the present invention
The mounting solder supply device is an FPBGA mounting solder supply device that supplies a solder paste to the printed wiring board when the mounted component is mounted on the printed wiring board via a solder ball, and is used when the mounted component is replaced. A mask member in which the solder paste is previously filled into opening holes provided corresponding to the positions of the solder balls in the mounting area of the mounting component; and the mounting component of the printed wiring board from the opening hole of the mask member. Applying means for applying air pressure so as to extrude the solder paste onto a mounting position of the mask, and the mask
Placed on a surface of the member facing the solder paste ejection surface.
The solder paste filled in each of the opening holes and
A gas permeable sheet that does not pass through the application means side .

Another FPBGA mounting solder supply device according to the present invention is an FPBGA mounting solder supply device for supplying a solder paste to the printed wiring board when a mounted component is mounted on the printed wiring board via a solder ball. When replacing the mounted component, a mask member in which the solder paste is filled in advance in an opening hole provided in correspondence with the arrangement position of the solder ball in the mounting area of the mounted component, and the mask member are detachably attached. and the extruded solder supply unit the solder paste on scheduled mounting position of the mounting part of the printed circuit board from the opening hole by include nozzle and from the nozzle to eject air into the open hole of the mass
Between the nozzle member and the nozzle and each of the opening holes
Do not pass variously filled solder paste through the nozzle side
And a breathable sheet .

That is, in the solder supply device for mounting an FPBGA of the present invention, a metal mask jig filled with solder paste in a mask opening is mounted on a solder supply device, pressed against a printed wiring board, and filled in the mask opening. The solder paste is extruded using air pressure. Thereby, the SMT (Surface Mount Type)
e) FPBG on printed wiring board on which components are mounted
Solder printing can be easily performed on a soldering pad of a lower surface soldering type component such as A.

More specifically, a gas-permeable sheet that allows air to pass through and does not allow solder paste to pass through; a mask opening that is arranged corresponding to a grid-like solder pad and is filled with solder paste; A mask attached to the inside of the part and attachable to the nozzle part of the solder supplier. Here, the mask opening has an area equivalent to the outer shape of the target component. In addition, the solder supply unit has a nozzle part where the metal mask jig is removable,
It has a function of sending air to the nozzle portion.

As described above, the metal mask jig of the present invention has a mask opening equivalent to the outer shape of the component requiring solder supply, and the solder is supplied to the mask opening by air pressure supplied from a nozzle through a permeable sheet. Since the paste is extruded, solder printing can be performed on the printed wiring board. For this reason, when a component connected to the lower surface such as the FPBGA is replaced for repair, it is possible to easily supply the solder to the printed wiring board even if there is a component around the component to be replaced.

[0017]

Next, an embodiment of the present invention will be described with reference to the drawings. FIG. 1 is a cross-sectional view of a metal mask jig according to one embodiment of the present invention, and FIG. 2 is a cross-sectional view illustrating solder supply according to one embodiment of the present invention.

In these figures, a metal mask jig 1 is shown.
Is a mounting portion 1a for mounting to a nozzle portion 5 of a solder supply device (not shown), and a solder having an area equivalent to the outer shape of a target component (not shown) on the printed wiring board 6 and having a grid shape or the like. A mask opening 2 in which opening holes are arranged corresponding to attachment pads (not shown). The opening of the mask opening 2 is previously filled with a solder paste 3 using a squeegee or the like.

When solder is supplied to the printed wiring board 6 using the metal mask jig 1, the mask opening 2 corresponding to the solder pad is first filled with the solder paste 3.
The metal mask jig 1 is attached to the nozzle part 5 by fitting the mounting part 1a to the tip of the nozzle part 5 of the solder supplier.

Thereafter, the solder supply device and the printed wiring board 6 are moved by a moving mechanism (not shown) so that the position of the mask opening 2 matches the position of the soldering pad of the target component on the printed wiring board 6. And fix it.

Next, the solder supplier lowers the nozzle portion 5 to press the metal mask jig 1 against the printed wiring board and at the same time raises the air pressure inside the solder supplier. The air pressure is transmitted to the mask opening 2 through the air permeable sheet 4, and the solder paste 3 filled in the mask opening 2 is pressed against the soldering pads on the printed wiring board 6.

In this state, the metal mask jig 1 is separated from the printed wiring board 6 by raising the nozzle portion 5 while maintaining the air pressure inside the solder supply device at a somewhat high level, and the metal mask jig 1 is removed from the opening of the mask opening 2. The solder paste 3 extruded by air pressure is printed on the printed wiring board 6. Here, the air permeable sheet 4 is configured to allow air to pass therethrough and not to pass the solder paste 3.

FIG. 3 is a sectional view showing an example of mounting the FPBGA, and FIG. 4 is a diagram showing an example of the arrangement of solder pads in the FPBGA of FIG. Using these figures, FPB is used as an example of a component to be connected by soldering using electrodes on the lower surface of the component.
A description will be given of a mechanism of mounting the GA.

On the lower surface of the FPBGA body 8, solder balls 9 as electrodes are arranged in a grid, and these solder balls 9 and solder pads 11 arranged in a grid on the printed wiring board 6 are soldered. It turns out that it is connected.

These solder balls 9 and soldering pads 1
1 is about 0.5mm, depending on the FPBGA specification
From 0.8 mm, and the diameter of the soldering pad 11 is about 0.2 mm to 0.3 mm.

Although the above-described FPBGA body 8 requires fine solder supply, many SMT components 7 are often already mounted on the printed wiring board 6 at the time of repairing or retrofitting the target component. . Conventionally, if many SMT components 7 are already mounted on the printed wiring board 6, solder cannot be supplied by a large-scale solder printing method using a squeegee or the like. Since the area of the mask opening 2 of the tool 1 has the same area as the outer shape of the target component on the printed wiring board 6, solder printing can be performed at the same density as a conventional metal mask.

As described above, when the target component is replaced, the metal mask jig 1 in which the solder paste 3 is filled in advance in the opening hole provided corresponding to the position of the solder ball 9 in the mounting area of the target component is provided. By applying air pressure from the solder supply device so as to extrude the solder paste 3 from the mask opening 2 onto the position where the target component is to be mounted on the printed wiring board 6, the mask opening 2 is made equivalent to a conventional metal mask. Since it can be formed by a construction method equivalent to the material, it is possible to perform solder printing with a uniform supply amount of the solder paste 3 and a density equivalent to that of a conventional metal mask.

In the case of solder printing using a conventional squeegee or the like, the operating range of the squeegee needs to be considerably wider than the area where the target soldering pad is arranged. Since a range or the like is not required, the area of the mask opening 2 can be as large as the area of the target soldering pad 11. Therefore, the metal mask jig 1 is used to perform solder printing using air pressure.
The contact area between the soldering pad 11 and the printed wiring board 6 can be minimized, and another SMT component 7 is mounted around the soldering pad 11 to be replaced in a component replacement or the like that occurs during repair or the like. Also, the solder can be easily supplied to the soldering pad 11.

[0029]

As described above, according to the present invention, when a mounted component is mounted on a printed wiring board via a solder ball, a solder paste is supplied to the printed wiring board.
In a PBGA mounting solder supply device, when replacing a mounted component, printing is performed from an opening of a mask member in which solder paste is filled in advance in an opening provided corresponding to a solder ball arrangement position in a mounting area of the mounted component. By applying air pressure so as to extrude the solder paste onto the mounting position of the mounting component on the wiring board, the same precision and ease as solder printing can be achieved before disposing the component on the printed wiring board when repairing the FPBGA, etc. There is an effect that solder can be supplied.

[Brief description of the drawings]

FIG. 1 is a sectional view of a metal mask jig according to an embodiment of the present invention.

FIG. 2 is a cross-sectional view illustrating a solder supply according to an embodiment of the present invention.

FIG. 3 is a cross-sectional view illustrating an example of mounting an FPBGA;

FIG. 4 is a diagram showing an example of the arrangement of soldering pads in the FPBGA of FIG. 3;

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Metal mask jig 1a Mounting part 2 Opening part 3 Solder paste 4 Breathable sheet 5 Nozzle part 6 Printed wiring board 7 SMT component 8 FPBGA main body 9 Solder ball 10 Solder 11 Solder pad

Claims (3)

(57) [Claims] An FPBGA mounting solder supply device for supplying a solder paste to a printed wiring board when the mounted component is mounted on the printed wiring board via a solder ball, wherein the mounted component is replaced when the mounted component is replaced. A mask member in which the solder paste is previously filled into opening holes provided corresponding to the arrangement positions of the solder balls in the mounting area,
And applying means for applying a pressure to extrude the solder paste on scheduled mounting position of the mounting part of the printed circuit board from the opening hole of the mask member, the mask member
Placed on a surface opposite to the solder paste ejection surface; and
The solder paste filled in each of the opening holes is applied to the application hand.
An FPBGA mounting solder supply device, comprising: a gas permeable sheet that does not pass through the step side . 2. The method according to claim 1, wherein the mask member is provided with the permeable sheet.
Through the air discharge port of the applying means so as to be freely attached.
Solder supply apparatus for FPBGA mounting according to claim 1, characterized in that form. 3. A printed component is printed via a solder ball.
When mounted on a printed circuit board, solder printed
FPBGA mounting solder supply device
At the time of replacement of the mounted component,
Openings provided corresponding to the positions of the solder balls
A mask member in which holes are filled with the solder paste in advance,
Including a nozzle to make the mask member detachable and the
The nozzle is opened by discharging air from the nozzle into the opening.
The mounting component of the printed wiring board will be mounted from the hole
A solder supply means for extruding the solder paste onto a position;
The nozzle is disposed between the mask member and the nozzle and the nozzle is opened.
The solder paste filled in each of the holes is passed through the nozzle side.
FPB having a breathable sheet that does not
GA mounting solder supply device.