JP2910719B2 - 部品実装プリント基板からの部品の分離方法及び分離装置 - Google Patents

部品実装プリント基板からの部品の分離方法及び分離装置

Info

Publication number
JP2910719B2
JP2910719B2 JP9048945A JP4894597A JP2910719B2 JP 2910719 B2 JP2910719 B2 JP 2910719B2 JP 9048945 A JP9048945 A JP 9048945A JP 4894597 A JP4894597 A JP 4894597A JP 2910719 B2 JP2910719 B2 JP 2910719B2
Authority
JP
Japan
Prior art keywords
printed circuit
circuit board
component
separating
components
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP9048945A
Other languages
English (en)
Japanese (ja)
Other versions
JPH10247779A (ja
Inventor
貞彦 横山
正年 位地
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
Nippon Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nippon Electric Co Ltd filed Critical Nippon Electric Co Ltd
Priority to JP9048945A priority Critical patent/JP2910719B2/ja
Priority to DE19808728A priority patent/DE19808728A1/de
Priority to TW87103087A priority patent/TW379520B/zh
Priority to KR1019980006878A priority patent/KR100286727B1/ko
Publication of JPH10247779A publication Critical patent/JPH10247779A/ja
Application granted granted Critical
Publication of JP2910719B2 publication Critical patent/JP2910719B2/ja
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/04—Mounting of components, e.g. of leadless components
    • H05K13/0486—Replacement and removal of components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/04—Mounting of components, e.g. of leadless components
    • H05K13/0417—Feeding with belts or tapes

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Processing Of Solid Wastes (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Supply And Installment Of Electrical Components (AREA)
JP9048945A 1997-03-04 1997-03-04 部品実装プリント基板からの部品の分離方法及び分離装置 Expired - Fee Related JP2910719B2 (ja)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP9048945A JP2910719B2 (ja) 1997-03-04 1997-03-04 部品実装プリント基板からの部品の分離方法及び分離装置
DE19808728A DE19808728A1 (de) 1997-03-04 1998-03-02 Gerät zum Abtrennen von Teilen von einer Karte und Abtrennverfahren
TW87103087A TW379520B (en) 1997-03-04 1998-03-03 Detaching apparatus and detaching method for components of printed circuit boards
KR1019980006878A KR100286727B1 (ko) 1997-03-04 1998-03-03 인쇄배선기판으로부터부품을분리하는장치및그분리방법

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP9048945A JP2910719B2 (ja) 1997-03-04 1997-03-04 部品実装プリント基板からの部品の分離方法及び分離装置

Publications (2)

Publication Number Publication Date
JPH10247779A JPH10247779A (ja) 1998-09-14
JP2910719B2 true JP2910719B2 (ja) 1999-06-23

Family

ID=12817423

Family Applications (1)

Application Number Title Priority Date Filing Date
JP9048945A Expired - Fee Related JP2910719B2 (ja) 1997-03-04 1997-03-04 部品実装プリント基板からの部品の分離方法及び分離装置

Country Status (4)

Country Link
JP (1) JP2910719B2 (ko)
KR (1) KR100286727B1 (ko)
DE (1) DE19808728A1 (ko)
TW (1) TW379520B (ko)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4374639B2 (ja) * 1998-02-17 2009-12-02 パナソニック株式会社 回路用基板の処理方法とその装置
US6571359B1 (en) * 1999-12-13 2003-05-27 Intel Corporation Systems and methods for testing processors
CA2259043A1 (en) * 1999-01-18 2000-07-18 Ibm Canada Limited-Ibm Canada Limitee Apparatus and method for non-destructive, low stress removal of soldered electronic components
KR100737812B1 (ko) 2006-03-02 2007-07-12 김도환 피씨비 재처리 장치 및 재처리 방법
KR101367307B1 (ko) * 2012-06-20 2014-03-03 한양대학교 산학협력단 인쇄회로기판의 부품분리장치
KR102001065B1 (ko) 2017-01-13 2019-07-17 주식회사 이알메탈 인쇄회로기판의 부품분리장치
JP7398674B2 (ja) * 2020-09-17 2023-12-15 株式会社アステック入江 基板剥離装置および基板剥離システム

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR960009582U (ko) * 1994-08-30 1996-03-16 인쇄회로기판 동분 제거장치
JP2601225B2 (ja) * 1994-11-08 1997-04-16 日本電気株式会社 部品を搭載したプリント基板からの部品の解体方法
JP2755225B2 (ja) * 1995-02-10 1998-05-20 日本電気株式会社 部品搭載プリント配線板の分離解体装置

Also Published As

Publication number Publication date
KR19980079819A (ko) 1998-11-25
KR100286727B1 (ko) 2001-11-02
TW379520B (en) 2000-01-11
DE19808728A1 (de) 1998-09-10
JPH10247779A (ja) 1998-09-14

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