JP2899295B2 - Die ejector device - Google Patents

Description

Description: BACKGROUND OF THE INVENTION The present invention relates to a die ejector device, and can change a lifting stroke and a lifting timing of a pin of a pepper pot for pushing up a chip in response to a change in chip type. It was made.

(Prior art) A chip mounted on a wafer is pushed up by a pin of a pepper pot of a die ejector device arranged below the wafer, and then is sucked by a nozzle of a transfer head,
It is transferred and mounted on a substrate such as a lead frame.

Conventionally, a pin elevating means of such a die ejector device includes a cam driven by a motor to rotate, a cam follower abutting on the cam, and a rod reciprocating in conjunction with the swing of the cam follower. The reciprocating motion is converted into a lifting motion of the pin.

(Problems to be Solved by the Invention) There are various types of chips, and it is desirable to change the manner in which the pins are pushed up by the pins according to the types of chips. That is, for example, in the case of a small chip, the up / down stroke of the pin is reduced to slightly push up the chip, and in the case of a large chip, the bonding area with the wafer sheet is large, and the chip is strongly bonded to the wafer sheet. It is desirable to increase the lifting stroke of the wafer, to push up the chip greatly, and to surely separate the chip from the wafer sheet. Alternatively, it is desirable to change the timing of raising and lowering the pins in accordance with the type of chip. That is, for example, in the case of a small chip, it is preferable that the tip of the nozzle of the transfer head lands on the upper surface of the chip, and then the pin is pushed out to push up the chip. It is desirable to land on the upper surface of the chip.

However, in the conventional die ejector device, the elevating mode of the pins is constant, and even if there is a change in the chip type,
Since the lifting stroke and the lifting timing cannot be changed, there has been a problem that a pickup error due to the nozzle is likely to occur.

Therefore, the present invention responds to the change of chip type,
It is an object of the present invention to provide a die ejector device having a means for changing a lifting mode of a pin.

(Means for Solving the Problems) For this purpose, the present invention provides a chip mounting apparatus provided with one motor that is a common power source for a chip pushing operation and at least one operation required for chip transfer and mounting. A shaft rotated by the motor, a plurality of cams mounted on the shaft and having different cam characteristics, a plurality of cam followers movable to a contact position and a non-contact position with respect to the cam, and And a switching device for switching any one of the cam followers to the contact position, the other cam follower to the non-contact position, and a cam follower connected to the cam follower located at the contact position by the switching device. A swing member that swings integrally, a rod that reciprocates in conjunction with the swing of the swing member, and a tip that is driven by the rod to move the tip from below. It has a pin to push up.

(Operation) According to the above configuration, when a chip type is changed, a cam having a cam characteristic of performing a thrust operation most advantageous for the chip is selected from a plurality of cams, and the switching device is operated. The cam follower of the lever cam is moved to a position where the lever contacts the cam, and the mounting member is connected to the swing member. Next, if you rotate the cam by driving the motor,
The swing member swings in conjunction with the cam follower, the rod reciprocates in conjunction with the swing, the pins protrude and retract from the upper surface of the pepper pot, and move the chips on the wafer to a desired stroke or a desired position. Thrust at the timing of.

Example Next, an example of the present invention will be described with reference to the drawings.

FIG. 1 shows a chip mounting device equipped with a die ejector device according to the present invention. Reference numeral 1 denotes a motor whose rotation is transmitted to a transmission box 4 via a belt 2 and a pulley 3. Reference numeral 5 denotes a gear connected to the transmission box 4, and reference numeral 6 denotes a gear driven by the gear and reciprocatingly rotating. Reference numeral 7 denotes a rotary plate mounted on a rotary shaft of the gear 6, and a roller 8 is mounted on the front surface of the rotary plate. Reference numeral 10 denotes a sliding plate, which is connected to a clamp member 12 for clamping the lead frame LF on the transport path 11 and has a coil spring.
13 urges the lead frame LF in the transport direction (rightward). An engaging plate attached to an end of the sliding plate 10
The roller 8 is driven by the spring force of the coil spring 13.
The sliding plate 10 reciprocates as the rotary plate 7 reciprocates by 180 °, and the lead frame LF clamped by the clamp member 12 is pitch-fed toward the transfer head 15. 16 is a cam device for driving the clamp member 12, and 17 is a syringe for applying a bond to the lead frame LF.

 Next, the die ejector device will be described.

Reference numeral 20 denotes a cam device, which is constituted by mounting two cams 22 and 23 having different cam characteristics on a rotating shaft 21 connected to the pulley 3. As will be described in detail later, these cams 22 and 23 are selectively used to drive the chip push-up pins in response to a change in chip type. A belt 18 transmits rotation to the cam device 16. FIGS. 2 and 3 show the details of the cam device 20. Reference numeral 25 denotes a swinging member.
It is rotatably supported at 26 and disposed. Reference numerals 27 and 28 denote cam followers of the cams 22 and 23, respectively, which are pivotally attached to lower portions of mounting members 29 and 30 which are bent in a key shape. On both sides of the upper portion of the swing member 25, the tip portions 29a, 3 of the mounting members 29, 30 are provided.
Fitting portions 31 and 32 into which 0a is fitted are notched. The back surfaces of the mounting members 29, 30 are attached to rods 33a, 34a of cylinders 33, 34 as switching devices. 35 is the swing member 25
Is a spring member for urging the cam followers 27, 28 in the direction of pressing the cam followers 27, 28 against the cams 22, 23. When the rods 33a, 34a of the cylinders 33, 34 protrude, the mounting member 29 moves forward, and its tip portions 29a, 30a fit into the fitting portions 31, 32, and the mounting members 29, 30
Are connected to the swing member 25 and the cam followers 27 and 2
When the cams 22 and 23 rotate in this state, the swing member 25 swings integrally with the cam followers 27 and 28. That is, the cylinders 33 and 34 move the cam followers 27 and 28 forward and backward to selectively switch between a contact position and a non-contact position with the cams 22 and 23.

FIG. 3 shows that the rod 33a of one cylinder 33 protrudes, the cam follower 27 abuts on the cam 22, and the other cam follower
Reference numeral 28 indicates a state in which the robot has retreated backward and is separated from the cam 23. When the shaft 21 rotates in this state, the cam follower 27 swings based on the cam curve of the cam 22, and the swing member 25 connected to the mounting member 29 also swings. A rod 36 is attached to the lower end of the swinging member 25. In FIG.
Is a lever pivotally mounted on the tip of the rod 36. 38
Is a pepper pot disposed below the wafer 40 and has pins 39 for pushing up chips on the wafer 40. When the swing member 25 swings as described above, the rod 36 reciprocates in the length direction in conjunction with the swing member 25, the lever 37 swings, and the pin 39 projects and retracts from the upper surface of the pepper pot 38. ,
Push up the chips on the wafer 40. 41 is the wafer 40
Are clamped to transport the wafer 40 between the working position (solid line position) and the storage magazine 42, and XY tables 43 and 44 for moving the wafer 40 in the XY direction.

The present apparatus has the above configuration, and the operation will be described next.

First, as shown in FIG. 3, when one cam follower 27 is in contact with the cam 22 and the other cam follower 28 is separated from the cam 23, the cam 1 is driven by the motor 1 and the cam 22 rotates. Swings based on the cam curve of the cam 22. Then the rod 36 reciprocates and the pin 39 is a pepper pot
It protrudes from the upper surface of 38 and pushes up the chips on the wafer 40. At the same time, the nozzle 15a of the transfer head 15 descends, sucks this chip, and transfers it to the lead frame LF.

When the elevating mode of the pin 39 is changed by changing the type of chip, the cam follower 27 is separated from the cam 22 by retreating the rod 33a of the cylinder 33, and the rod 34a of the other cylinder 34 is protruded to mount the cam follower 28. The distal end portion 30a of the member 30 is fitted into the fitting portion 32 of the swing member 25, and the cam follower 28 is brought into contact with the cam 23. Then, the swinging member 25 swings based on the cam curve of the cam 23, and the pins 39 protrude and retract to push up the chips on the wafer 40. In this case, each cam 22,2
As described in the section of (Problems to be Solved by the Invention), assuming that each of the three has a cam curve that is advantageous for the ascending / descending mode of the large chip and the small chip, the type change of the large chip and the small chip Correspondingly, the chip can be pushed up advantageously.

In the above-described embodiment, the case where two sets of cams and cam followers have been described as an example. However, three or more sets of cams and cam followers may be provided for selection and use. The elevating mode of the pin can be changed.

(Effects of the Invention) As described above, the present invention is a chip mounting apparatus provided with one motor that is a common power source for the chip lifting operation and at least one operation necessary for chip transfer and mounting. A shaft rotated by the motor, a plurality of cams mounted on the shaft with different cam characteristics, a plurality of cam followers movable to a contact position and a non-contact position with respect to the cam, and the plurality of cam followers. And a switching device for switching any one of the cam followers to the contact position and the other cam follower to the non-contact position. The switching device connects the cam follower to the cam follower located at the contact position to be integrated with the cam follower. A swinging member that swings in a direction, a rod that reciprocates in conjunction with the swinging of the swinging member, and a tip that is driven by the rod and pushes up a chip from below. In order to cope with a change in chip type, the cam for driving the pin is selected to change the up / down stroke and the up / down timing of the pin, so that the chip can be pushed up advantageously. be able to.

[Brief description of the drawings]

1 shows an embodiment of the present invention. FIG. 1 is an overall perspective view of a chip mounting apparatus, FIG. 2 is a perspective view of a main part, and FIG. 3 is a plan view of the same. 1 Motor 22, 23 Cam 25 Swing member 27, 28 Cam follower 29, 30 Mounting member 33, 34 Switching device 36 Rod 38 Pepper pot 39 Pin 40 …… Wafer

Claims (1)

(57) [Claims] An apparatus for mounting a chip, comprising: a motor serving as a common power source for a push-up operation of the chip and at least one operation required for transferring and mounting the chip, comprising: a shaft rotated by the motor; A plurality of cams mounted on the shaft and having different cam characteristics; a plurality of cam followers movable to a contact position and a non-contact position with respect to the cam; and one of the plurality of cam followers is a cam follower. A switching device that switches another cam follower to the non-contact position at the contact position, and a swing member that is connected to the cam follower located at the contact position by the switching device and swings integrally with the cam follower, A rod that reciprocates in conjunction with the swing of the swing member, and a pin that is driven by the rod and pushes up a chip from below. Chip mounting device.