JPH02130851A - Die ejector - Google Patents

Abstract

PURPOSE:To alter the vertically moving state of a pin in response to the alteration of the type of a chip by composing of cams having different characteristics, a switching unit for switching the position of a cam follower, and the pin for plunging up from below a rocking member for rocking in cooperation with a mounting member at a contact position and the chip on a wafer. CONSTITUTION:When the vertically moving state of a pin is altered by altering the type of a chip, the rod 33a of a cylinder 33 is retreated to disconnect a cam follower 27 from a cam 22, while the rod of a cylinder 34 is projected to engage the end 30a of the mounting member 30 of a cam follower 28 with the engaging part 32 of a rocking member 25, thereby bringing the follower 28 into contact with a cam 23. Thus, the member 25 is rocked on the basis of the cam curve of the cam 23, and the pin is extended to plung up the chip on the wafer. In this case, if the cams 22, 23 have cam curves advantageous for the vertically moving state of large, small chips, the chip can be advantageously plunged up in response to the alteration of the type of the large or small chip.

Description

[Detailed Description of the Invention] (Industrial Application Field) The present invention relates to a die ejector device, and is capable of changing the lifting stroke and lifting timing of the pepper pot pin that pushes up the chip in response to changes in the chip type. This is what I did.

(Conventional technology) Chips mounted on a wafer are pushed up by the pins of the Pepperbot, a die ejector installed below the wafer, and then adsorbed by the nozzle of a transfer head and transferred to a substrate such as a lead frame. It will be installed.

Conventionally, the means for raising and lowering the pins of such a die ejector device is
A cam that is driven by a motor to rotate, a cam follower that contacts the cam, and a rod that reciprocates in conjunction with the rocking of the cam follower are provided, and the reciprocating motion of the rod is converted into the vertical movement of the pin. ing.

(Problem to be Solved by the Invention) There are various types of chips, and it is desirable to change the manner in which the pin pushes up the chip depending on the type of chip. For example, in the case of a small chip, the pin In the case of large chips, the bonding area with the wafer sheet is large and the pins are strongly bonded to the wafer sheet, so the lifting stroke of the pins can be increased to push the chip up slightly. It is desirable to push it up to ensure that it is peeled off from the wafer sheet. Alternatively, it is desirable to change the timing of raising and lowering the pins in accordance with the type of chip. In other words, for example, in the case of a small chip, it is desirable to push the chip up by protruding a pin after the lower end of the nozzle of the transfer head lands on the top surface of the chip, and in the case of a large chip, after pushing it up with the pin, it is desirable to push the chip up. It is desirable to land on the top surface of the chip.

However, in conventional die ejector devices, the manner in which the pin moves up and down is constant, and even if the type of chip changes, the up/down stroke and timing cannot be changed.This has the problem of easily causing pick-up mistakes by the nozzle. there were.

Therefore, an object of the present invention is to provide a die ejector device that is equipped with means that can change the manner in which the pins are raised and lowered in response to changes in the type of chip.

(Means for Solving the Problems) For this purpose, the present invention provides a plurality of cams driven by a motor and having different cam characteristics, cam followers of these cams, mounting members for these cam followers, and A switching device that selectively switches the position of the cam follower between a contact position and a non-contact position with the cam, a swinging member that swings in conjunction with the mounting member in the contact position, and swinging of the swinging member. The die ejector device consists of a rod that reciprocates in conjunction with the wafer, and a pin that is driven by the rod to protrude from the top of the Pepperbot and push up the chips on the wafer from below.

(Operation) According to the above configuration, when the type of chip is changed,
Among the plurality of cams, a cam having a cam characteristic that provides the most advantageous push-up operation for the chip is selected, and the switching device is operated to move the cam follower of this cam to a position where it comes into contact with this cam. A mounting member is coupled to the swinging member. Next, when the motor is driven to rotate the cam, the swinging member swings in conjunction with this cam follower, the rod moves back and forth in conjunction with this swing, and the pin protrudes from the top of the pepper pot. Then, the chips on the wafer are pushed up with a desired stroke or at a desired timing.

(Example) Next, the present invention will be described in detail with reference to the drawings.

FIG. 1 shows a chip mounting apparatus equipped with a die ejector device according to the present invention.

1 is a motor, the rotation of which is transmitted to a transmission box 4 via a belt 2 and a pulley 3.

5 is a gear connected to the transmission box 4, and 6 is a gear driven by this gear to reciprocate.

Reference numeral 7 denotes a rotary plate attached to the rotating shaft of the gear 6, and a roller 8 is rotatably attached to the front surface of the rotary plate.

A sliding plate 10 is connected to a clamp member 12 that clamps the lead frame L'F on the conveyance path 11, and is biased by a coil spring 13 in the conveyance direction (rightward) of the lead frame LF. There is. The engagement plate 14 attached to the end of the sliding plate 10 is pressed against the roller 8 by the spring force of the coil spring 13, and as the rotary plate 7 reciprocates 180', the sliding plate 10 reciprocates. The lead frame LF, which is moved and clamped by the clamp member 12, is pitch-fed toward the transfer head 15. 16 is a cam device for driving the clamp member 12, and 17 is a syringe for applying a pound to the lead frame LF.

Next, the die ejector device will be explained.

Reference numeral 20 denotes a cam device, in which two cams 22.2 having different cam characteristics are mounted on a rotating shaft 21 connected to the pulley 3.
It is configured by installing 3. As will be described in detail later, these cams 22 and 23 are selectively used to drive the chip push-up pin in response to changes in chip type. 18
is a belt that transmits rotation to the cam device 16. 2 and 3 show details of the cam device 20, 25 is a swinging member, and the upper end thereof is rotatably attached to a shaft support 26 between the cams 22 and 23. It is supported and arranged.

27 and 28 are cam followers of each cam 22 and 23, which are each pivoted to the lower part of a hook-shaped mounting member 29 and 30. Insertion portions 31 and 32 are formed in both upper sides of the swinging member 25, into which the tip portions 29a and 30a of the mounting members 29 and 30 are inserted. Attachment member 29.
The rear side of 30 is attached to the lofts 33a, 34a of cylinders 33, 34 as switching devices. Reference numeral 35 denotes a spring member that urges the swinging member 25 forward, that is, in a direction that presses the cam followers 27.28 against the cams 22.23.

When the rods 33a, 34a of the cylinders 33.degree.
a is fitted into the fitting part 31.32, and the mounting member 29.30 is connected to the swinging member 25 and the cam follower 27.
．． 28 comes into contact with the cams 22 and 23, and in that state the cams 22
．． 23 rotates, the swinging member 25 moves to the cam follower 27
．． ．． It swings in conjunction with 28. That is, the cylinders 33 and 34 move the cam followers 27 and 28 forward and backward to selectively switch them between a contact position and a non-contact position with the cams 22 and 23.

FIG. 3 shows a state in which the rod 33a of one cylinder 33 protrudes and the cam follower 27 contacts the cam 22, and the other cam follower 28 retreats rearward and is away from the cam 23.

When the shaft 21 rotates in this state, the cam follower 27 swings based on the cam curve of the cam 22, and the swing member 25 connected to the mounting member 29 also swings. Reference numeral 36 designates a rod that is pivotally attached to the lower end of the swinging member 25, and in FIG. 1, 37 is a lever that is pivotally attached to the tip of this rod 36. A pepperbot 38 is disposed below the wafer 40 and has pins 39 that push up chips on the wafer 40. When the swinging member 25 swings as described above, the rod 36 reciprocates in its length direction in conjunction with this, the lever 37 swings, and the pin 39 protrudes and sinks from the top surface of the pepperbot 38. The chips on the wafer 40 are pushed up. 41 holds the wafer 40 between the work position (solid line position) and the storage magazine 42.
43.44 is the wafer 40
There is an XY child table for moving in the XY force direction.

This device has the above-mentioned configuration, and its operation will be explained next.

First, as shown in FIG. 3, when one cam follower 27 is in contact with the cam 22 and the other cam follower 28 is separated from the cam 23, the motor 1 drives the cam 22.
When the cam 22 rotates, the swinging member 25 swings based on the cam curve of the cam 22. Then, the rod 36 moves back and forth, and the pin 3
9 protrudes from the top surface of the pepperbot 38, and the wafer 40
Push up the top tip. At the same time, transfer head 1
The nozzle 15a of No. 5 descends, picks up this chip, and transfers and mounts it on the lead frame LF.

When changing the vertical movement of the pin 39 due to a change in the type of chip, the rod 33a of the cylinder 33 is removed to separate the cam follower 27 from the cam 22, the rod 34a of the other cylinder 34 is protruded, and the cam follower 28 is removed.
The distal end portion 30a of the mounting member 30 is fitted into the fitting portion 32 of the swinging member 25, and the cam follower 28 is brought into contact with the cam 23. Then, the swinging member 25 swings based on the cam curve of the cam 23, and the pins 39 protrude and retract to push up the chips on the wafer 40. In this case, if each of the cams 22 and 23 has a cam curve that is advantageous for raising and lowering the large chip and the small chip, as described in the section (Problems to be Solved by the Invention), then the large chip In response to changes in the type of small chips, the chips can be pushed up advantageously.

The above embodiment has been explained using two sets of cams and cam followers as an example, but three or more sets of these may be provided and selectively used. The way the pin moves up and down can be changed.

(Effects of the Invention) As described above, the present invention provides a plurality of cams that are driven by a motor and have different cam characteristics, cam followers of these cams, mounting members for these cam followers,
A switching device that selectively switches the position of these cam followers between a contact position and a non-contact position with the cam, a swinging member that swings in conjunction with the mounting member in the contact position, and a swinging member of the swinging member. The die ejector device consists of a rod that reciprocates in conjunction with the rocking motion, and a pin that is driven by this rod to protrude from the top surface of the pepper pot and push up the chips on the wafer from below. By selecting the cam that drives the pin in accordance with the change, it is possible to change the lifting stroke, lifting timing, etc. of the pin to advantageously push up the chip.

[Brief explanation of drawings]

The drawings show an embodiment of the present invention, in which FIG. 1 is an overall perspective view of a chip mounting apparatus, FIG. 2 is a perspective view of a main part, and FIG. 3 is a plan view of the same. 1... Motor 22.23... Cam 25... Swinging member 27.28... Cam follower 29.30... Mounting member 33.34... Switching device 36... Rod 38...・Pepperbot 39...Pin 40...Wafer

Claims (1)

[Claims] A plurality of cams that are driven by a motor and have different cam characteristics, cam followers of these cams, mounting members for these cam followers, and positions of these cam followers in a contact position and a non-contact position with the cam. a switching device that selectively switches; a swinging member that swings in conjunction with the mounting member at the contact position; a rod that reciprocates in conjunction with the swinging of the swinging member; A die ejector device comprising a pin that protrudes from the top surface of a pepper pot and pushes up chips on a wafer from below.