JP2887243B2 - Manufacturing method of electronic component storage container - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for manufacturing an electronic component housing container for housing electronic components such as a piezoelectric vibrator and a surface acoustic wave filter.

[0002]

2. Description of the Related Art Conventionally, a container for accommodating an electronic component, for example, a piezoelectric vibrator for obtaining a predetermined vibration frequency, is generally made of an electrically insulating material such as alumina ceramics, and is disposed on the upper surface via a side surface. An insulating base having a metallized wiring layer made of a refractory metal powder such as tungsten, molybdenum, or manganese, which is led out to the lower surface, and a metallized wiring layer on the upper surface of the insulating base, which is attached via a conductive adhesive to the piezoelectric vibrator. A holding member for holding and connecting an electrode of the piezoelectric vibrator to an external electric circuit; and a bowl-shaped lid also made of an electrically insulating material. And the electrodes of the piezoelectric vibrator are electrically connected to holding metal fittings. They are joined by a sealing material comprising a lid on the upper surface of the substrate from the solder or the like, a piezoelectric vibrating element as a final product by accommodating the piezoelectric vibrator hermetically inside a container made of the insulating base and the lid.

[0003] In this conventional electronic component housing, usually, metal projections made of Kovar metal or 42 alloy are previously brazed to a metallized wiring layer led out to the lower surface of an insulating base, and the metal projections are used for the piezoelectricity. When the vibration element is mounted on an external wiring board, it is possible to wash and remove unnecessary objects interposed between the piezoelectric vibration element and the wiring board, and it is possible to inspect and confirm the connection state between the piezoelectric vibration element and the wiring board. And so on.

[0004] Such a conventional electronic component storage container is usually manufactured by the following method in consideration of mass production of the insulating base.

[0005] (1) First, a wide area ceramic green sheet is prepared.

(2) Next, the ceramic green sheet is divided into a plurality of sections corresponding to the shape of the insulating base by imaginary lines, and through holes are provided on the imaginary lines of each section.

(3) Next, a metallized ink is applied by printing from the upper surface of each section of the ceramic green sheet to the lower surface through the through hole, and a snap groove is formed along a virtual line of the ceramic green sheet.

(4) Then, the ceramic green sheet is fired to obtain a fired ceramic body in which a metallized wiring layer extending from the upper surface to the lower surface through the through hole is applied to each of the sections, and the metallized wiring of each section is obtained. A metal projection is brazed to a portion of the layer that is led to the lower surface.

(5) Finally, the ceramic fired body is divided along the snap grooves, thereby forming individual insulating substrates having metallized wiring layers and metal projections.

[0010]

However, in this conventional method of manufacturing a container for storing electronic components, when a metal projection is brazed to a metallized wiring layer provided in each section of a ceramic fired body, the brazing material is used. A part of the ceramic fired body is inserted into the through hole to join the metallized wiring layers of the adjacent sections, and as a result, the ceramic fired body is divided into the respective sections along the snap grooves, and the individual pieces having the metallized wiring layers and the metal projections are formed. However, when forming an insulating substrate, the division was not successful, and the insulating substrate was damaged, so that an insulating substrate having a desired shape could not be obtained.

[0011]

SUMMARY OF THE INVENTION The present invention has been made in view of the above-mentioned drawbacks, and has as its object to have a metallized wiring layer extending from the upper surface to the lower surface via the side surfaces, and to have metal projections on a part of the metallized wiring layer firmly. Multiple brazed insulating substrates at once,
An object of the present invention is to provide a method for manufacturing a container for storing electronic components that can be formed.

[0012]

According to the present invention, there is provided an electronic component storage container comprising an insulating base having a metallized wiring layer and metal protrusions, and a bowl-shaped lid body, and having a space for housing electronic components therein. Wherein the insulating substrate has the following (1) to
It is characterized by being formed by the step (5).

(1) a step of dividing the ceramic green sheet into a plurality of sections corresponding to the shape of the insulating base by imaginary lines, and providing a through hole on the imaginary line of each section; and (2) a step of forming each section of the ceramic green sheet. A step of coating the metallized ink over the lower surface via the through hole from the upper surface of the ceramic green sheet and coating the peripheral portion of the through hole with the ceramic paste in the metallized ink printed and applied on the lower surface of the ceramic green sheet, and (3) the ceramic green sheet And (4) firing the ceramic green sheet to obtain a ceramic fired body on which a metallized wiring layer derived from the upper surface to the lower surface via the through hole is applied to each section. And a step of brazing a metal projection to a portion of the metallized wiring layer of each section led out to the lower surface. And (5) a step of dividing the fired ceramic body along a snap groove to form individual insulating substrates having metallized wiring layers and metal projections.

[0014]

BRIEF DESCRIPTION OF THE DRAWINGS FIG.

FIG. 1 shows an embodiment of a container for accommodating a piezoelectric vibrator manufactured by the manufacturing method of the present invention, wherein 1 is an insulating base and 2 is a lid. A container 3 accommodating a piezoelectric vibrator 4 as an electronic component inside the insulating base 1 and the lid 2.
Is configured.

The insulating substrate 1 is made of an electrically insulating material such as an aluminum oxide sintered body, a mullite sintered body, an aluminum nitride sintered body, a silicon carbide sintered body, and the like.
4 acts as a substrate for holding and containing.

The insulating substrate 1 has a pair of metallized wiring layers 5 made of a high melting point metal powder such as tungsten, molybdenum, manganese or the like from the upper surface to the lower surface via the side surfaces.
A holding member 6 for holding a piezoelectric vibrator 4 is attached to the upper surface of each of the pair of metallized wiring layers 5 on the upper surface of the insulating substrate 1 via a conductive adhesive. 1 is connected to a wiring conductor of an external electric circuit board via a brazing material such as solder.

A holding member 6 attached to each of a pair of metallized wiring layers 5 attached to the upper surface of the insulating base 1 holds the piezoelectric vibrator 4 and connects the electrodes of the piezoelectric vibrator 4 to the metallized wiring layer 5. The piezoelectric vibrator 4 is bonded to the holding member 6 via a conductive adhesive such as conductive polyimide so that the electrodes of the piezoelectric vibrator 4 are electrically connected to the holding member 6. Is done.

The holding member 6 is made of nickel silver (Cu-Zn-Ni alloy), Kovar metal (Fe-Ni-Co alloy), 42 alloy (Fe-Ni-Co alloy).
(Alloy) is formed of a metal material having elasticity, such as, for example,
A Kovar metal ingot is formed into a predetermined shape by employing a conventionally known rolling method or punching method.

A metal protrusion 7 having a thickness of about 0.2 mm is brazed to the metallized wiring layer 5 led out on the lower surface of the insulating base 1, and the metal protrusion 7 is led out to the lower surface of the insulating base 1. When connecting the metallized wiring layer 5 to the wiring conductor of the external electric circuit board, a gap of an appropriate size is formed between the insulating base 1 and the external electric circuit board, and the metallized wiring layer is formed.
5 and the wiring conductor of the external electric circuit board so that the connection state between the insulating base 1 and the external electric circuit board can be easily cleaned and removed. .

The metal projections 7 are made of a metal material such as Kovar metal or 42 alloy, and are brazed to the metallized wiring layer 5 on the lower surface of the insulating base 1 via a brazing material such as silver brazing.

Thus, according to this electronic component storage container, the piezoelectric vibrator 4 is adhered to the holding member 6 attached to the insulating base 1 with a conductive adhesive, and the piezoelectric vibrator 4 is attached to the holding member 6.
After that, the lower surface of the lid 2 is joined to the insulating base 1 via a sealing material such as resin, low melting point glass, brazing material, etc. The vibrator 4 is hermetically sealed to provide a piezoelectric vibrating element as a product.

Next, a method of manufacturing the insulating base of the electronic component storage container will be described with reference to FIGS.

First, as shown in FIGS. 2 (a) and 2 (b), a ceramic green sheet 10 having a large area is prepared, and the ceramic green sheet 10 is divided into a plurality of sections X corresponding to the shape of the insulating substrate by a virtual line A. Virtual line of each section X
A through hole 11 is formed on A.

The ceramic green sheet 10 may be made of alumina (Al ₂ O ₃ ), silica (SiO ₂ ), calcia
(CaO), magnesia (MgO), etc., an appropriate organic solvent and a solvent are added to a ceramic raw material powder to form a slurry by mixing and adding a solvent to the powder. It is manufactured by molding.

The through holes 11 formed in the ceramic green sheet 10 are formed in a predetermined shape on the imaginary line A of each section X by subjecting the ceramic green sheet 10 to a well-known drilling method.

Next, the ceramic green sheet 10 is shown in FIG.
As shown in FIG. 3, the metallized ink extends from the upper surface of each section X defined by the virtual line A to the lower surface through the through hole 11.
Print and apply 12 and ceramic green sheet 10
Of the metallized ink 12 printed and coated on the lower surface of the through hole 11 is covered with a ceramic paste 13.

The metallized ink 12 is tungsten,
A suitable organic solvent and a solvent are added to and mixed with a high melting point metal powder such as molybdenum and manganese, and a through hole 11 is formed from the upper surface of each section X of the ceramic green sheet 10 by employing a conventionally known screen printing method. It is printed and applied in a predetermined pattern over the lower surface.

The ceramic paste 13 covering the periphery of the through-hole 11 of the metallized ink 12 is made of a ceramic material such as alumina (Al ₂ O ₃ ), silica (SiO ₂ ), calcia (CaO), magnesia (MgO) or the like. A suitable organic solvent is added to the powder, and a solvent is formed by adding and mixing the solvent to form a paste.Around the through hole 11 of the metallized ink 12 printed and applied to the ceramic green sheet 10 by employing a conventionally known screen printing method. Be deposited.

Next, the ceramic green sheet 10 on which the metallized ink 12 and the ceramic paste 13 are applied
Then, as shown in FIG. 4, a snap groove 14 is formed along the imaginary line A.

The snap groove 14 is formed by firing a ceramic green sheet 10 described later.
When dividing the ceramic green sheet 10 into a plurality of insulating substrates, the ceramic green sheet 10 is formed by cutting the ceramic green sheet 10 by using, for example, a circular cutter blade.

The snap grooves 14 are formed on both the upper and lower surfaces of the ceramic green sheet 10, and when the depth of each is set to 30% of the thickness of the ceramic green sheet 10, the ceramic fired body 15 is divided and insulated. When forming a base,
The work of the division can be made extremely easy.

Next, the ceramic green sheet
10 is fired, and as shown in FIG. 5, a metallized wiring layer extending from the upper surface to the lower surface via the through hole 11 for each section X as shown in FIG.
5 and a metal protrusion 7 is brazed to a portion of the metallized wiring layer 5 of each section X which is led out to the lower surface.

The firing of the ceramic green sheet 10 is performed at a temperature of about 1600 ° C. in a reducing atmosphere or an inert atmosphere in order to prevent the metallized paste 12 printed and coated on the ceramic green sheet 10 from being oxidized. Done in

The brazing of the metal projections 7 to the metallized wiring layer 5 attached to the ceramic sintered body 20 is performed by sequentially placing a brazing material made of silver brazing or the like and the metal projections 7 on the metallized wiring layer 5. This is carried out by heating it to a temperature of about 850 ° C. and then heating and melting the brazing material.

When the metal projections 7 are brazed to the metallized wiring layer 5 attached to the ceramic sintered body 15,
Since the ceramic paste 13 is baked around the through hole 11 of the metallized wiring layer 5, a part of the brazing material enters the through hole 11 and the metallized wiring layer 5 in the adjacent section is formed.
There is no bonding between them. As a result, when the ceramic fired body 15 is divided along the snap grooves 14 to form a plurality of insulating substrates, the division becomes extremely easy, and the insulating substrate is damaged. You can do nothing at all.

The metallized wiring layer 5 has metal projections 7
When brazing, a metal having excellent corrosion resistance, such as nickel and gold, and a good wettability with the brazing material is deposited on the surface of the metallized wiring layer 5 to a thickness of 1.0 to 20.0 μm by plating or the like. In addition, oxidation corrosion of the metallized wiring layer 5 can be effectively prevented, and the brazing strength between the metallized wiring layer 5 and the metal projection 7 can be made extremely strong. Therefore, it is preferable that a metal having excellent corrosion resistance, such as nickel and gold, and a good wettability with a brazing material is applied to the surface of the metallized wiring layer 5 to a thickness of 1.0 to 20.0 μm by plating or the like. .

Finally, the ceramic fired body 15 is divided along the snap grooves 14, whereby a plurality of insulating substrates 1 having the metallized wiring layer 5 and the metal projections 7 shown in FIG. 1 are manufactured at a time.

It should be noted that the present invention is not limited to the above-described embodiment, and various modifications can be made without departing from the gist of the present invention.

[0040]

According to the method of manufacturing an electronic component storage container of the present invention, the peripheral portion of the through hole of the metallized ink printed and applied from the upper surface of each section of the ceramic green sheet to the lower surface through the through hole is formed of ceramic paste. After the ceramic green sheet was fired to form a ceramic fired body because the metal green wiring was provided in each section of the fired ceramic green body, when the metal projections were brazed, a part of the brazing material formed through holes. When the ceramic fired body is divided into a plurality of insulating bases as a result, the division is extremely easy, and the division is extremely easy. Damage and the like can be completely eliminated.

[Brief description of the drawings]

FIG. 1 is a sectional view showing an embodiment of an electronic component storage container manufactured by a manufacturing method of the present invention.

2 (a) and 2 (b) are views for explaining the manufacturing method of the present invention, wherein (a) is a perspective view and (b) is a cross-sectional view thereof.

FIG. 3 is a cross-sectional view for explaining the manufacturing method of the present invention.

FIG. 4 is a cross-sectional view for explaining the manufacturing method of the present invention.

FIG. 5 is a cross-sectional view for explaining the manufacturing method of the present invention.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 ... Insulating base 2 ... Lid 3 ... Container 4 ... Piezoelectric vibrator 5 ... Metallized wiring layer 6 ... Holding member 7 ... Metal projection 10 Ceramic ceramic sheet 11 Through hole 12 Metallized ink 13 Ceramic paste 14 Snap groove 15 Ceramic fired body A Virtual Line X ... section

Claims (1)

(57) [Claims] An electronic component storage container, comprising: an insulating base having a metallized wiring layer and a metal protrusion; and a bowl-shaped lid, and having a space for housing an electronic component therein.
A method for manufacturing an electronic component housing container, wherein the insulating base is formed by the following steps (1) to (5). (1) a step of dividing the ceramic green sheet into a plurality of sections corresponding to the shape of the insulating base with imaginary lines and providing a through-hole on the imaginary line of each section; and (2) from the top of each section of the ceramic green sheet. A step of printing and applying the metallized ink over the lower surface through the through hole and covering the peripheral portion of the through hole with the ceramic paste in the metallized ink printed and applied on the lower surface of the ceramic green sheet; and (3) a virtual line of the ceramic green sheet. And (4) firing the ceramic green sheet to obtain a ceramic fired body on which a metallized wiring layer extending from the upper surface to the lower surface through the through hole is applied to each of the sections, and each of the sections is fired. (5) a step of brazing a metal projection to a portion of the metallized wiring layer of The ceramic fired body was divided along the snap groove, step formed between the individual insulating base having a metallized wiring layer and the metal protrusions.