JP2878118B2 - Copper coating method on titanium surface - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method of coating a surface of titanium or a titanium alloy with copper, and more particularly to a method of manufacturing a titanium window plate applied to a window plate for extracting an electron beam accelerated by a charged particle accelerator. It is.

[0002]

2. Description of the Related Art Conventionally, since titanium has excellent mechanical strength, for example, a thinned titanium plate has been applied as a window plate for extracting an electron beam accelerated by a charged particle accelerator. In this titanium window plate, electrons are lost when the electron beam passes through the window plate, and heat is generated by the loss of electrons. However, titanium has poor heat conduction, cannot quickly dissipate the heat generated by the loss of electrons, and has a problem that the titanium window plate is melted and a hole is formed.

[0003] As a remedy, there has been proposed a titanium window plate in which a titanium plate is coated with a metal having good heat conductivity, for example, copper to improve heat dissipation.

[0004] Generally, titanium is an active metal, the surface of which is covered with an oxide. For this reason, even if a pretreatment such as degreasing or pickling is performed and then electrolytic copper plating is performed thereon, the adhesion is extremely poor and it is not practical. Therefore, FIG.
As shown in (1), the surface of the titanium plate 1 is once subjected to matte nickel plating to cover the base plating film 2, and then electrolytic copper plating is applied to cover the copper film 3 to produce the titanium window plate 4. . The conventional titanium window plate 4 configured as described above
Since the titanium plate 1 is covered with the copper film 3 having good thermal conductivity, the heat radiation effect is improved and holes are prevented from being formed by the electron beam. In addition, base plating film 2
It is necessary that the metal has good adhesion to titanium. For example, chrome plating is used in addition to nickel plating.

[0005]

As described above, the conventional method of coating copper on titanium is as follows.
Is coated on the surface of the titanium plate 1 and then coated with the copper film 3. Therefore, there is a problem that the surface of the titanium plate 1 cannot be directly coated with the copper film 3. Therefore, when the titanium window plate 4 coated with the copper film 3 is used as a window plate for taking out a beam of a charged particle accelerator, the base plating film 2 of nickel, chromium or the like impedes the passage of an electron beam, There was a problem that the conduction was reduced.

SUMMARY OF THE INVENTION The present invention has been made to solve the above-mentioned problems, and has as its object to provide a method of coating copper on a titanium surface by which a copper film can be directly coated on a titanium or titanium alloy surface.

[0007]

According to the present invention, there is provided a method for coating a titanium surface with copper according to the present invention, comprising the steps of: polishing a surface of a material made of titanium or a titanium alloy; A step of cleaning, a step of ultrasonically cleaning the material with pure water and then an overflow cleaning with pure water, a step of drying the material after cleaning in an atmosphere of 100 to 150 ° C., and a step of drying in a vacuum atmosphere Forming a base copper film on the base material in the step of plating, depositing and growing a copper film on the base copper film in a plating bath;
And a step of heating in a vacuum atmosphere at a temperature of ° C.

[0008]

In the present invention, oxides and dirt on the material surface are removed by surface polishing and ultrasonic cleaning using a surfactant, and the material surface is activated. Then, the abrasive, the surfactant, the removed foreign matter, and the like are washed away from the surface of the material by ultrasonic cleaning and overflow cleaning using pure water. Next, an underlying copper film is formed in a vacuum atmosphere, and oxidation of the surface of the material during the film formation process is suppressed, and the adhesion of the underlying copper film to the material is improved. Further, after the copper film is coated on the base copper film, heat treatment is performed in a vacuum atmosphere, whereby heat diffusion occurs at each boundary between the material, the base copper coating and the copper film, and the adhesion is improved. .

[0009]

BRIEF DESCRIPTION OF THE DRAWINGS FIG. FIG. 1 is a perspective view showing a titanium window panel manufactured by a method of coating a titanium surface with copper according to one embodiment of the present invention.
In the figure, the same or corresponding parts as those of the conventional titanium window plate shown in FIG. 4 are denoted by the same reference numerals, and description thereof will be omitted. In the drawing, reference numeral 5 denotes a base copper film coated on the surface of the titanium plate 1, and 6 denotes a base copper film 5 and a copper film 3
Are laminated titanium windows.

Next, a method of manufacturing the titanium window plate 6 according to this embodiment will be described. First, a titanium plate 1 (for example, 0.
The surface of the titanium plate 1 is polished with scotch bright (abrasive) while flowing pure water (conductivity: about 1 μS / cm) over the 030 mm thickness. After the surface polishing, the titanium plate 1 is stored in pure water so as not to be dried until the next step. Next, the titanium plate 1 whose surface has been polished is subjected to overflow cleaning with pure water for 3 minutes or more to wash away abrasives and foreign substances to be removed. Then, pure water and a surfactant such as Semico Clean 56
(From Furuuchi Chemical Co., Ltd.) for 5 minutes or more by ultrasonic cleaning. After that, the titanium plate 1 is overflow-washed with pure water for 3 minutes or more, ultrasonically washed with pure water for 3 minutes or more, and further overflow-washed with pure water for 5 minutes or more to remove a surfactant, a removed foreign substance, and the like. Wash off. Then, nitrogen (N ₂ ) gas is blown onto the washed titanium plate 1 to drain it, and the titanium plate 1 is dried by heating at 120 ° C. for 40 minutes in a vacuum furnace. After drying, the substrate is quickly set in a vacuum chamber, copper ion plating is performed on the surface of the titanium plate 1, and a base copper film 5 having a thickness of 0.00025 to 0.00030 mm is formed on the surface of the titanium plate 1.
Thereafter, a copper coating 3 is deposited and grown to a thickness of 0.02 to 0.03 mm on the base copper coating 5 by electrolytic plating or electroless plating. Furthermore, after plating, 45
Heat treatment at 0 to 600 ° C. for 60 minutes to improve adhesion.

Here, in this embodiment, the surface of the titanium plate 1 is polished and cleaned using pure water without performing a normal pretreatment such as degreasing and pickling, so that it is used for ion plating. The adhesion of the base copper coating 5 to the titanium plate 1 is improved without the adhesion of the chemical due to the decrease in the adhesion to the titanium plate 1 to be performed. Further, since the titanium plate 1 is heated and dried in the vacuum furnace after the cleaning, the oxidation of the surface of the titanium plate 1 can be suppressed. Further, since the base copper film 5 is formed on the titanium plate 1 by ion plating, oxides and the like on the surface of the titanium plate 1 are removed by ion bombardment, and the surface of the titanium plate 1 is cleaned and activated. Further, the evaporated particles of copper are ionized, and the evaporated particles of the ionized copper are accelerated, and the underlying copper film 5 is formed on the surface of the titanium plate 1 with good adhesion. Further, since the copper film 3 is deposited and grown by electrolytic plating or electroless plating on the base copper film 5 formed on the surface of the titanium plate 1 by ion plating, the material to be plated and the plating material are the same. Yes, the copper coating 3 is coated on the base copper coating 5 with good adhesion. Therefore, according to this embodiment, copper can be directly coated on the titanium plate 1 while ensuring adhesion without interposing a metal such as nickel or chromium. further,
Since the heat treatment is performed in a vacuum atmosphere after the plating treatment, thermal diffusion occurs at the respective interfaces of the titanium plate 1, the underlying copper coating 5, and the copper coating 3, and the adhesion can be further improved.

Next, as shown in FIGS. 2 and 3, the titanium window plate 6 manufactured as described above was placed in the opening of the window frame 10 and pressed down from outside by the window holding plate 11. In this state, it is brazed (vacuum sealed) to the window frame 10 with the brazing material 12. In this window frame 10, a cooling water channel 13 is formed so as to surround the titanium window plate 6. The window frame 10 is attached by welding to a vacuum chamber (not shown) of the charged particle accelerator. Then, the electron beam accelerated by the charged particle accelerator is extracted through the titanium window plate 6. At this time, the heat due to the loss of electrons passing through the titanium window plate 6 is quickly transmitted to the window frame 10 by the underlying copper film 5 and the copper film 3 having good heat conduction. Then, the heat transmitted to the window frame 10 is cooled by the cooling water flowing through the cooling water passage 13. Accordingly, the titanium window plate 6 is coated with copper having good thermal conductivity on titanium or a titanium alloy without interposing a metal such as nickel or chromium which impedes passage of electrons or lowers thermal conductivity. Therefore, a hole is not pierced by the electron beam, the passage of electrons is not hindered, and the electron beam can be used as a window plate for extracting a beam of the charged particle accelerator.

In the above embodiment, the underlying copper film 5 is formed by ion plating.
The method of forming the base copper film 5 is not limited to ion plating, and any method may be used as long as the film is formed in a vacuum because titanium is an active metal. At this time, from the viewpoint of adhesion, a film forming method such as ion plating, ion beam evaporation, cluster ion beam evaporation, or sputtering is effective.

Further, when the titanium window plate 6 is brazed to the window frame 10, if the copper has low purity, impurities may cause bubbles or embrittlement. Therefore, it is desirable to use copper bronze having high purity as the copper film 3. On the other hand, since a high-purity copper material is used as a vapor deposition material, the base copper film 5 also has high purity.

In the above embodiment, the surface polishing and the overflow cleaning after the surface polishing are performed using pure water. However, alcohol and acetone may be used instead of pure water. However, in the process after the overflow cleaning after the surface polishing, the use of alcohol or acetone instead of pure water causes a decrease in the adhesion of the film formed by ion plating.

Further, in the above embodiment, the titanium plate 1 after cleaning is used.
Is heated and dried in a vacuum furnace, but when the base copper film 5 is formed by, for example, ion plating, an oxide film on the surface of the titanium plate 1 can be removed by ion bombardment treatment in ion plating. The heating and drying need not necessarily be performed in a vacuum atmosphere. The heating temperature is suitably from 100 to 150 ° C.

Further, in the above-described embodiment, the titanium window plate 6 applied to the beam extraction window plate of the charged particle accelerator is described as being manufactured, but the copper film 3 manufactured as described above is coated. Needless to say, the titanium plate 1 has excellent mechanical strength, is easy to be soldered, and can be used other than a window plate for extracting a beam.

[0018]

As described above, according to the present invention, a step of polishing the surface of a material made of titanium or a titanium alloy, a step of ultrasonically cleaning the surface-polished material using a surfactant, Ultrasonic cleaning using pure water, then overflow cleaning using pure water, and drying the material after cleaning in an atmosphere of 100 to 150 ° C.,
A step of forming a base copper film on the material in a vacuum atmosphere after drying, a step of depositing and growing a copper film on the base copper film in a plating bath, and a step of heating in a vacuum atmosphere at 450 to 600 ° C. Therefore, there is an effect that a method of coating copper on a titanium surface can be obtained in which copper can be directly coated on a material made of titanium or a titanium alloy while ensuring adhesion.

[Brief description of the drawings]

FIG. 1 is a perspective view showing a titanium window panel manufactured by a method of coating a titanium surface with copper according to an embodiment of the present invention.

FIG. 2 is a perspective view showing a beam extraction window of a charged particle accelerator using a titanium window plate manufactured by a method of coating a titanium surface with copper according to one embodiment of the present invention.

FIG. 3 is a sectional perspective view taken along line III-III in FIG. 2;

FIG. 4 is a perspective view showing a conventional titanium window plate used for a beam extraction window of a charged particle accelerator.

[Explanation of symbols]

1 titanium plate (material), 3 copper coating, 5 base copper coating,
6 Titanium window boards.

Claims (1)

(57) [Claims] 1. A step of polishing the surface of a material made of titanium or a titanium alloy, a step of ultrasonically cleaning the surface-polished material using a surfactant, and an ultrasonic cleaning of the material using pure water. Then, a step of performing overflow cleaning using pure water, and after the cleaning,
A step of drying in an atmosphere of ° C., a step of forming a base copper film on the material in a vacuum atmosphere after drying, and a step of depositing and growing a copper film on the base copper film in a plating bath,
A step of heating in a vacuum atmosphere at 450 to 600 ° C.