JP2861135B2 - Component mounting method - Google Patents

Description

The present invention relates to a method for mounting an electronic component on a three-dimensional board.

[Conventional technology]

Conventional automatic mounting of electronic components is limited to mounting on a flat board, and there is no proposal for automatic mounting on a three-dimensional board. Although not intended for automatic implementation,
Japanese Patent Publication No. 61-23132 discloses a conventional technique similar to the present invention. This conventional example relates to an apparatus for transferring small components such as transistors from one system to another system having a different pitch using a suction head having suction tweezers.

That is, the suction head having the suction tweezers is set at 45 ° with respect to the horizontal plane, and in this state, the first magazine is set at a position facing the suction head. The second magazine is set horizontally. The suction tweezers are lowered to suck the parts on the first magazine and rise. After that, the suction head rotates 45 ° like shaking the head,
Come on the second magazine. The suction tweezers then lowers and places the part on the second magazine.

In this conventional example, the operation is merely to transfer the parts between magazines having an angle of 45 ° while changing the interval between the parts. When components are mounted on a three-dimensional board, the operation must be more complicated. However, no proposal for such component mounting has been made yet.

[Problems to be solved by the invention]

The example shown in the conventional example is for transferring components, but the present invention is intended to enable components to be mounted on a three-dimensional board.

When component mounting is to be performed on a three-dimensional board, it must be possible to mount components on board walls in various directions and angles.
In the conventional example, it is a fixed relationship because components placed on a certain surface need only be transferred to a different certain surface.
A three-dimensional substrate must be mountable on various substrate surfaces that are not constant.

Also, in the case of component mounting, the direction of the component on the board surface changes in various ways, and the positional accuracy of the component on the board surface is required to be much higher than in the case of simply transporting. The second problem is how to deal with the direction of the component and how to adjust the position with high precision.

It is an object of the present invention to provide a method for solving the above-described problems and to enable components to be mounted on a three-dimensional board.

[Means for solving the problem]

The present invention has the following means in order to solve the problems described above.

In other words, in a method of sucking a component with a suction head having a suction portion communicating with a vacuum pump at the tip and mounting the component on a three-dimensional substrate, a suction head that is bendable and can rotate around a vertical axis is used. Rotating the suction head about the vertical axis in accordance with the direction of the mounting unit wall surface of the three-dimensional substrate, and in the centering unit, rotating the suction head about the vertical axis in accordance with the centering of the component and the mounting direction of the component. Then, in the component mounting part, the suction head is bent in accordance with the inclination of the mounting part wall surface of the three-dimensional substrate, and the component is mounted on the mounting part wall surface of the three-dimensional substrate. It is characterized by doing.

[Action]

In mounting components on a three-dimensional board, they must be mounted on mounting walls of various directions and angles. By adopting a method of bending the suction head according to the inclination of the mounting part wall of the three-dimensional substrate, even for mounting walls of various angles,
If the suction head is bent at an angle equal to the angle θ from the reference plane, components can be mounted on a mounting wall at an arbitrary angle.

Also, by adopting a method in which the suction head is rotated around the vertical axis in accordance with the direction of the mounting unit wall surface of the three-dimensional substrate,
By bending the suction head in a fixed direction, it is possible to mount the suction head on mounting walls in various directions and angles.

In component mounting, it must be possible to handle various component directions. By adopting a method of rotating the component around the vertical axis according to the mounting direction of the component, it is possible to mount components not only in a directional component but also in various directions.

Furthermore, in order to increase the component mounting accuracy, the component is mounted after the component is centered, so that component mounting with high mounting accuracy is possible.

〔Example〕

FIG. 1 shows an outline of an electronic component mounting method according to the present invention. The suction head 11 is provided with a suction nozzle 12 having a suction opening 16 connected to a vacuum pump (not shown). Suction head 11
Can move in any of the X, Y, and Z directions. Also,
A free rotation (R1) around the Z axis (vertical axis) is possible by the head rotation device 18 composed of an electric motor or the like.

In the component supply unit (a) of FIG. 1 and FIG.
The suction head 11 descends, and the suction nozzle 12 suctions a component 15 from a component feeder 13 such as a tape feeder, a stick feeder, a straight-ahead feeder, or a tray feeder. Before or after the suction of the component 15, the suction head 11
Rotation around the Z-axis (R1) according to the direction of the mounting wall 31 is performed. That is, when the suction head 11 moves to the component mounting portion (c) and is bent, the suction head 11 rotates around the Z axis so that the direction becomes the mounting wall surface. Conversely, the suction head 11 may not be rotated, and the three-dimensional substrate 31 may be rotated and mounted. After sucking the component 15, the suction head 11 moves up.

The suction head 11 that has picked up the component 15 moves onto the centering portion (b). Here, the suction head 11 descends and temporarily centers the component 15 on the centering jig 21.
In the centering jig 21, FIGS. 1 and 3 (a),
As shown in FIG. 3 (b), the centering of the component 15 is performed by means of the position regulating pawls 22, 22 and the like (FIG. 3 (a)).
Further, the component 15 is rotated (R2) about the Z axis of the suction head 11 in accordance with the mounting direction of the component 15 (FIG. 3B). Thereafter, the suction head 11 moves up.

The suction head 11 moves onto the component mounting portion (c) and bends from the position shown by the dotted line in the figure to the state shown by the solid line according to the angle of the mounting surface from the horizontal plane as shown in FIG. That is, it is bent from the Z axis by the angle θ. The bending at the angle θ is performed using the shaft 41 as a fulcrum, for example, by raising the bending lever 17. In this state, the suction head 11 descends, moves further, takes the component 15 to the board wall surface, and mounts the component 15 on the board 31. In the component mounting section (c), the three-dimensional board 31 is transported,
It is fixed on a conveyor 32 having positioning means. When the mounting of the component 15 on the three-dimensional substrate 31 is completed, the suction head 11 moves, ascends, moves to the component supply unit (a), and returns to the initial state.

When the component 15 is made of a magnetic material or the like and can be attracted by a magnet, it is also possible to use magnet attraction instead of vacuum attraction as the attraction method.

5 and 6 show an embodiment of the suction head. FIG. 5 is an exploded perspective view, and FIG. 6 is an assembled perspective view thereof. The suction head 10 includes head fixing portions 56, 56 and head enabling portions 51A, 51B, and a bending lever 17 is provided on the head movable portion 51B. A recess provided in the head fixing portion 56 from a passage 52 leading to a vacuum pump (not shown)
53, through an opening 54 provided in the head movable portion 51A, a passage 55 communicating with a suction nozzle (not shown) extends to a suction opening (not shown). Therefore, vacuum suction of a component can be performed by the suction head 10. Also, the suction head is raised around the shaft 41A by raising the bending lever 17, and the bearing 41B,
With 41B as a fulcrum, it can be bent at any angle.

〔The invention's effect〕

The following effects can be obtained by adopting the method of mounting the electronic component on the three-dimensional board as described above.

That is, as described in claim 1, in a method of mounting a component on a three-dimensional board by suctioning a component with a suction head having a suction unit that communicates with a vacuum pump at a tip end,
Using a suction head that is freely bendable and rotatable about a vertical axis, the suction head is rotated about the vertical axis in accordance with the direction of the mounting unit wall surface of the three-dimensional substrate, and at a centering unit, Centering the component and rotating the component about the vertical axis in accordance with the mounting direction of the component, and then in the component mounting section, the suction head of the suction head in accordance with the inclination of the wall surface of the three-dimensional board mounting section. The component mounting method is characterized by bending and mounting the component on the mounting portion wall surface of the three-dimensional substrate, thereby enabling high-precision mounting on the three-dimensional substrate wall in various directions and angles. Become.

[Brief description of the drawings]

FIG. 1 is a schematic view of an embodiment of a component mounting method of the present invention, FIG. 2 is an explanatory view showing an embodiment of a component supply section of the present invention, and FIGS. 3 (a) and 3 (b) are centering sections of the present invention. FIG. 4 is an explanatory view of the operation of the embodiment, FIG. 4 is an explanatory view of the operation in the component mounting section of the embodiment of the component mounting method of the present invention, FIG. 5 is an exploded perspective view of the suction head of the present invention, and FIG. It is an assembly perspective view. 10, 11 ... suction head, 12 ... suction nozzle, 13 ... component supply device, 15 ... component, 16 ... suction opening, 17 ... bending lever, 18 ... head rotating device, 21 ... centering Jig, 22 ... Position control nail, 31 ... Three-dimensional board

Claims (1)

(57) [Claims] 1. A method of mounting a component on a three-dimensional substrate by suctioning a component by a suction head having a suction portion communicating with a vacuum pump at a tip thereof, wherein the suction is capable of being bent and rotatable about a vertical axis. Using a head, the suction head is rotated about the vertical axis in accordance with the direction of the mounting unit wall surface of the three-dimensional substrate, and the centering unit vertically centers the component in accordance with the centering of the component and the mounting direction of the component. The component is rotated about a direction axis, and then, in the component mounting section, the suction head is bent in accordance with the inclination of the mounting section wall surface of the three-dimensional board, and the suction head is bent onto the mounting section wall surface of the three-dimensional board. A component mounting method characterized by mounting components.