JP2858533B2 - Pressure detector and method of manufacturing the same - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a pressure detector for detecting a fluid pressure, and more particularly to a structure and a manufacturing method thereof.

[0002]

2. Description of the Related Art A conventional pressure detector for detecting the pressure of a fluid is disclosed in Japanese Utility Model Application Laid-Open No. 5-51985.
As shown in the figure, the first step portion 1b and the second step portion
1c and a bottom surface of the second step portion 1c of the main body 1 made of a plastic molded body made of a material such as polyphenylene (PPS). The through hole 4 is formed, and the first step portion 1b is formed.
Is provided with a pressure sensor chip 2 composed of a silicon single crystal thin film diaphragm in a state of receiving a fluid pressure. Then, the first step portion 1b and the second step portion 1c of the main body 1 are formed.
The electrode terminal 3a on the surface of the projection 1d formed between the
An electrode terminal 3a of an arbitrary shape (not shown) is formed on the back surface by a film-shaped electrode member 3 (formed by a resin plating method),
Each of the electrode terminals 3a is electrically connected via a through hole 4, and the electrode terminal 3a of the projection 1d and the pressure sensor chip 2 are wire-bonded by a connection member 5 such as gold.
Further, in order to ensure airtightness, the through hole 4 and the second step portion 1c are sealed with a hard sealing member 6 made of epoxy or the like, and the pressure of the fluid is transmitted to the pressure sensor chip 2, and To isolate from the fluid, the concave portion 1a is sealed with a soft sealing member 7 made of silicone gel or the like, and the pressure detector 8
Is composed.

As a method of manufacturing each of the above-mentioned pressure detectors 8, for example, a plating compatible resin (made of polyplastic, trade name "VECTRA C180") is used to form a place where the through hole 4 and the electrode terminal 3a are formed by a mold. After the primary molding, the molded product is removed from the mold and etched, catalyzed,
Apply electroless plating, put it again in the mold for secondary molding,
The main body 1 is molded using a plating incompatible resin (made of polyplastic, trade name "VECTRA C130"), and then,
Electroplating of a material such as silver, nickel or the like (electroless plating is also possible) provides a film-like electrode member 3 (each electrode terminal 3a) on the inner surface of the through hole 4 and the location where the electrode terminal 3a is formed.
Is formed.

[0004] Next, a plurality of main bodies 1 (the main body 1 on which the film-shaped electrode members 3 are formed) are mounted on a dedicated jig capable of mounting thereon, and electronic components such as an XY robot are mounted. After applying an adhesive (not shown) to the first step portion 1b formed in the concave portion 1a of the main body 1, the device mounts the pressure sensor chip 2 thereon. Next, the electrode terminal 3a of the convex portion 1d of the main body 1 and the pressure sensor chip 2 are wire-bonded by a connecting member 5 such as gold, and the through hole 4 and the second step portion 1c are hardened by epoxy or the like. In order to ensure airtightness by sealing with the sealing member 6 and to transmit the pressure of the fluid to the pressure sensor chip 2 in the final step and to isolate the fluid from the fluid, the concave portion 1a of the main body 1
The pressure detector 8 is manufactured by injecting a soft sealing member 7 made of silicone gel or the like.

[0005]

The pressure detector 8 having such a configuration is provided with an electrode terminal when the pressure sensor chip 2 and the electrode terminal 3a formed on the convex portion 1d of the main body 1 are wire-bonded with the connecting member 5. A sufficient escape space for the capillary for wire bonding is required between the wire bonding portion 3a and the inner wall surface of the concave portion 1a of the main body 1, so that not only the size cannot be reduced, but also a main body configuration for escaping the capillary is required. However, there is a problem that the mold design becomes complicated.

Further, in the manufacturing method, the main body 1 must be mounted on a dedicated jig capable of mounting a plurality of the main bodies 1 vertically and horizontally, so that the operation is very complicated and the airtightness is ensured. The three-hole 4 and the second step portion 1c of the main body 1 must be sealed with the hard sealing member 6 made of epoxy or the like, and the sealing work is complicated, which leads to an increase in man-hour and cost. There was the problem I mentioned. In addition, when a plurality of the main bodies 1 having the above-described shapes are taken by a primary molding and a secondary molding die, not only the die structure becomes complicated, but also die maintenance is required, and the manufacturing method requires man-hours. However, there was a problem that the cost was increased.

[0007]

SUMMARY OF THE INVENTION The present invention has been made in view of the above-mentioned problems, and includes a base member and a pressure sensor chip arranged to receive pressure on a step formed on the surface of the base member. An electrode member formed in the vicinity of the pressure sensor chip and on the back surface of the base member, and electrically connecting the pressure sensor chip and the electrode member to connect the electrode terminals via through holes; A connection member, a cylindrical storage member for forming a flange on the lower end side on the through hole formed in the base member and storing the pressure sensor chip, and a soft seal for sealing the inside of the cylindrical storage member And a stop member.

Further, according to the present invention, as a manufacturing method, an electrode member forming step of forming an electrode member on each base member of a first base substrate having a plurality of base members defined therein, and forming the electrode member. A pressure sensor chip mounting step of mounting a pressure sensor chip on a step portion of each base member of the first base substrate; a wire bonding step of electrically connecting the pressure sensor chip to the electrode member; An adhesive printing step of printing an adhesive on a joint surface between the first base substrate and the second base substrate in which the cylindrical storage member is formed, and the second base on the first base substrate. A bonding step of disposing and bonding a substrate, a soft member sealing step of injecting and sealing a soft member into each of the plurality of cylindrical storage members of the second base substrate; And the first A cutting step of cutting the partition point of the base substrate is intended to include.

[0009]

Since the base member and the cylindrical storage member are separated from each other and the cylindrical storage member is disposed on the through hole formed in the base member, a hard sealing portion for ensuring airtightness is not required, and the cost is reduced. It becomes reduction. Further, since a sufficient space for the capillary to escape at the time of wire bonding is not required, a pressure detector which can be downsized can be obtained.

[0010] Further, an electrode member is formed by electroless plating (electroplating is also possible) on a first base substrate of a base member partitioned and formed for multi-cavity mounting, and a pressure sensor chip is mounted. After wire bonding with the electrode terminal formed by the electrode member, the second base substrate of the cylindrical storage member partitioned and formed for multi-cutting is bonded and fixed, and cut by a dicer (cutting machine). In addition, the manufacturing process is simplified, and an inexpensive pressure detector is obtained.

[0011]

DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, the present invention will be described with reference to the embodiments shown in FIGS. 1 to 4, but the same or corresponding parts in the above-mentioned conventional example will be denoted by the same reference numerals and detailed description thereof will be omitted.

FIGS. 1 and 2 show the structure of a pressure detector 8 for detecting the pressure of a liquid according to an embodiment of the present invention.

Reference numeral 9 denotes a plate-shaped plastic molded body, a base member having a stepped portion 9a at the center, reference numeral 2 denotes a pressure sensor chip, and reference numeral 4 denotes a base member 9 which penetrates from the front surface to the back surface. The through-holes 3 are electrically connected to each other. An electrode terminal 3a formed in an arbitrary shape on the surface of the base member 9 in the vicinity of a step 9a formed in the base member 9, and an electrode terminal having an arbitrary shape (not shown) 3a and form
A film-like electrode member 5 for connecting each of the electrode terminals 3a through the through-hole 4 connects the electrode terminal 3a formed on the surface of the base member 9 to the pressure sensor chip 2 electrically by means such as wire bonding. The connecting member 10 is provided on the through hole 4 formed in the base member 9 with a flange 10a on the lower side.
And a cylindrical storage member 7 for storing the pressure sensor chip 2, and a soft sealing member 7 for sealing the inside of the cylindrical storage member 10.

Next, a method of manufacturing the pressure detector 8 will be described with reference to FIGS.

For example, the formation of the through hole 4 and the electrode terminal 3a as shown in FIG. 2 is primarily formed by using a plating compatible resin, followed by etching, catalyst treatment, and electroless copper plating. To form a first base substrate 11 having a plurality of base members 9 partitioned and formed for multi-cutting. The first base substrate 11 is formed of gold, Electroless plating or electroplating of a material such as silver or nickel forms a film on the inner surface of the through hole 4 of the base member 9 and the electrode terminals 3a (plating compatible resin portion) on the front and back surfaces of the base member 9. Is formed.

Next, in a pressure sensor chip mounting step b, an adhesive (not shown) is applied to the step portion 9a of each base member 9 by an electronic component mounting apparatus such as an XY robot on the first base substrate 11. After the application, the pressure sensor chip 2 is mounted on the step 9a of each base member 9.

Next, in the wire bonding step c, the first
The electrode terminals 3a formed on the surface of the plurality of base members 9 of the base substrate 11 and the plurality of base members 9 of the first base substrate 11
And the pressure sensor chip 2 mounted on the step 9a of
Wire bonding is performed by a connection member 5 such as gold.

Next, in the adhesive printing step d, the first base substrate 12 in which a plurality of cylindrical storage members 10 are formed and partitioned is formed.
An adhesive 13 is formed by printing such as screen printing on the bonding surface with the base substrate 11.

Next, in the bonding step e, the first base member 11
A second base substrate 12 having a cylindrical storage member 10 formed therein is disposed so as to cover the through-hole 4 of each base member 9 formed in a partition, and is bonded.

Next, in a soft member sealing step f, in order to transmit the pressure of the fluid to the pressure sensor chip 2 to each cylindrical storage member 10 of the second base substrate 12 and to isolate the fluid from the fluid,
By injecting and sealing a soft sealing member 7 made of silicone gel or the like, a pressure detector 8 partitioned and formed for multi-cavity is formed.

In the cutting step g, which is the final step, the pressure detector 8 partitioned and formed for multi-cutting is cut by, for example, a cutting machine (dicer) to form a plurality of independent pressure detectors 8. .

In the pressure detector 8, the base member 9 and the cylindrical storage member 10 are separated from each other, and the cylindrical storage member 10 is disposed on the through hole 4 formed in the base member 9.
A pressure sensor that can be miniaturized because a hard sealing member 6 as shown in FIG. 5 for ensuring airtightness is not required and the working process is simplified, and a sufficient space for the capillary to escape during wire bonding is not required. 8 can be obtained.

Further, in the manufacturing method, the first base substrate 11 of the base member 10 partitioned and formed for multi-cavity formation.
Next, the electrode member 3 is formed by electroless plating or electroplating, the pressure sensor chip 2 is mounted, and the pressure sensor chip 2 and the electrode terminal 3a formed by the electrode member 3 are wire-bonded. For this reason, the second base substrate 12 of the cylindrical storage member 10 formed in a partitioned manner can be adhered and the partitioned portion can be cut by a cutting machine.
The productivity can be improved.

Although the present invention has been described with respect to the method of manufacturing the pressure detector 8 using the film-shaped electrode member 3, for example, the present invention is applied to a pressure detector having an electrode lead which is insert-molded integrally with the main body. It goes without saying that a similar effect can be obtained by applying the method.

[0025]

According to the present invention, there is provided a base member, a pressure sensor chip arranged to receive pressure on a step formed on a surface of the base member, a vicinity of the pressure sensor chip and a back surface of the base member. An electrode member for forming an electrode terminal and connecting the electrode terminal through a through hole, a connection member for electrically connecting the pressure sensor chip and the electrode member, and a through hole formed in the base member. It is characterized by comprising a cylindrical storage member that forms a flange on the lower end side and stores the pressure sensor chip, and a soft sealing member that seals the inside of the cylindrical storage member. Since the base member and the cylindrical storage member are separated from each other, and the cylindrical storage member is disposed on the through-hole formed in the base member, a rigid sealing portion for ensuring airtightness is not required. Process It was iodinated, in which the cost can be reduced. In addition, since a sufficient space for the capillary to escape during wire bonding is not required, a pressure detector that can be downsized can be obtained.

Further, as a manufacturing method, an electrode member forming step of forming an electrode member on each base member of a first base substrate on which a plurality of base members are formed, and a step of forming the electrode member on the first base substrate. A pressure sensor chip mounting step of mounting a pressure sensor chip on a step portion of each base member of the base substrate; a wire bonding step of electrically connecting the pressure sensor chip to the electrode member; An adhesive printing step of printing an adhesive on a joint surface of the second base substrate on which the members are formed and the first base substrate, and disposing the second base substrate on the first base substrate A soft member sealing step of injecting and sealing a soft member into each of the plurality of cylindrical storage members of the second base substrate;
And a cutting step of cutting a section of the second base substrate. The electrode member is formed by electroless plating or electroplating on the first base substrate of the base member partitioned and formed for multi-cavity. After forming, mounting the pressure sensor chip, wire bonding the pressure sensor chip and the electrode terminal formed by the electrode member, and then bonding the second base substrate of the cylindrical storage member partitioned and formed for multi-cavity. By fixing and cutting the section with a cutting machine, a plurality of pressure detectors can be obtained, and a complicated manufacturing process is not required, so that productivity is improved and cost reduction is realized. Things.

[Brief description of the drawings]

FIG. 1 is a sectional view of a main part of an embodiment of the present invention.

FIG. 2 is a plan view of the embodiment.

FIG. 3 is a flowchart showing a manufacturing process of the embodiment.

FIG. 4 is an exploded sectional view showing the manufacturing process of the embodiment.

FIG. 5 is a sectional view of a main part of a conventional example.

FIG. 6 is a plan view of the conventional example.

[Explanation of symbols]

 2 pressure sensor chip 3 electrode member 3a electrode terminal 4 through hole 5 connecting member 7 soft sealing member 8 pressure detector 9 base member 9a stepped portion 10 cylindrical storage member 10a flange 11 first base substrate 12 second base Substrate 13 Adhesive a Electrode member forming step b Pressure sensor chip mounting step c Wire bonding step d Adhesive printing step e Bonding step f Soft member sealing step g Cutting step

Claims (2)

(57) [Claims] A pressure sensor chip disposed under pressure on a step formed on a surface of the base member; and electrode terminals in the vicinity of the pressure sensor chip and on the back surface of the base member. An electrode member for connecting the electrode terminals via a through hole, a connection member for electrically connecting the pressure sensor chip and the electrode member, and a lower end side outer side on the through hole formed in the base member. A pressure detector comprising: a cylindrical storage member that forms a flange portion on the base member and stores the pressure sensor chip; and a soft sealing member that seals the inside of the cylindrical storage member. A first base member formed by partitioning a plurality of base members;
Forming an electrode member on each base member of the base substrate, and mounting a pressure sensor chip on a step of each base member of the first base substrate on which the electrode member is formed. A wire bonding step of electrically connecting the pressure sensor chip and the electrode member; and a bonding surface of the second base substrate having the plurality of cylindrical storage members defined therein, the bonding surface being connected to the first base substrate. An adhesive printing step of printing an adhesive on the first base substrate; an adhesion step of arranging and bonding the second base substrate on the first base substrate; and a plurality of the cylindrical housings of the second base substrate. A method for manufacturing a pressure detector, comprising: a soft member sealing step of injecting a soft member into each of the members to seal the member; and a cutting step of cutting a section of the first and second base substrates.