JP3100738B2 - IC card - Google Patents
IC cardInfo
- Publication number
- JP3100738B2 JP3100738B2 JP04049583A JP4958392A JP3100738B2 JP 3100738 B2 JP3100738 B2 JP 3100738B2 JP 04049583 A JP04049583 A JP 04049583A JP 4958392 A JP4958392 A JP 4958392A JP 3100738 B2 JP3100738 B2 JP 3100738B2
- Authority
- JP
- Japan
- Prior art keywords
- module
- card
- adhesive
- substrate
- adhesive sheet
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Landscapes
- Credit Cards Or The Like (AREA)
Description
【０００１】[0001]
【産業上の利用分野】本発明は、ＩＣモジュールを装着
したＩＣカードに関し、特に、カード基材へのＩＣモジ
ュールの接着時におけるＩＣチップの破損及び接着剤の
外部端子側への滲み出しを確実に防止するようにしたも
のである。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an IC card on which an IC module is mounted, and more particularly, to a method for reliably breaking an IC chip and exuding an adhesive to an external terminal when the IC module is bonded to a card base material. This is to prevent it.
【０００２】[0002]
【従来の技術】従来、この種のＩＣカードにおいては、
例えば特開平２−８０２９９号公報などに開示されてい
るような構成を有するものがある。2. Description of the Related Art Conventionally, in this type of IC card,
For example, there is one having a configuration as disclosed in Japanese Patent Application Laid-Open No. 2-80299.
【０００３】このような従来のＩＣカードにあっては、
カード基材にＩＣモジュールを組み付ける場合、図５に
示すように、カード基材ａに受面ｂを有するモジュール
穴ｃを設け、このモジュール穴ｃにＩＣモジュールｄを
接着することにより固定している。In such a conventional IC card,
When assembling the IC module to the card base, as shown in FIG. 5, a module hole c having a receiving surface b is provided in the card base a, and the IC module d is fixed to the module hole c by bonding. .
【０００４】すなわち、このＩＣモジュールｄは、基板
ｅの裏面にＩＣチップｆを組付け、このＩＣチップｆを
モールド樹脂ｇにて封止してなる構成を有し、このＩＣ
チップｆが封止されたモールド樹脂ｇ部分を前記カード
基材ａのモジュール穴ｃに嵌合させるとともに、このＩ
Ｃモジュールｄの基板ｅの裏面外周部と前記モジュール
穴ｃの受面ｂとの間に接着シートｈを介在して、この接
着シートｈを図示しない超音波振動式あるいは高温式の
加圧ヘッドにて溶融させることにより熱接着している。That is, the IC module d has a configuration in which an IC chip f is mounted on the back surface of a substrate e, and the IC chip f is sealed with a mold resin g.
A portion of the mold resin g in which the chip f is sealed is fitted into the module hole c of the card base material a.
An adhesive sheet h is interposed between the outer peripheral portion of the back surface of the substrate e of the C module d and the receiving surface b of the module hole c, and the adhesive sheet h is applied to an ultrasonic vibration type or high temperature type pressure head (not shown). And heat-bonded.
【０００５】[0005]
【発明が解決しようとする課題】しかしながら、上記し
た従来構造のＩＣカードでは、ＩＣモジュールｄの基板
ｅの裏面外周部をモジュール穴ｃの受面ｂに接着シート
ｈにて熱接着する際、溶融した余剰の接着剤がＩＣモジ
ュールｄの外周部やスルーホールから外部端子側へ滲み
出すために、最適な強度や硬度が得られず、品質等に悪
影響を及ぼしているのが現状である。However, in the IC card having the conventional structure described above, when the outer peripheral portion of the back surface of the substrate e of the IC module d is thermally bonded to the receiving surface b of the module hole c with the adhesive sheet h, the melting is difficult. At the present, the excess adhesive leaks out from the outer peripheral portion and the through hole of the IC module d to the external terminal side, so that optimum strength and hardness cannot be obtained, which adversely affects quality and the like.
【０００６】そこで、このような欠点を補うために、従
来では、図６に示すように、カード基材ａに設けたモジ
ュール穴ｃの受面ｂの外周部に溝ｉを形成し、この溝ｉ
内に溶融した余剰の接着剤を流入させることにより、接
着剤の外部端子側への滲み出しを防止しているものであ
るが、これによって、モジュール穴ｃの受面ｂとＩＣモ
ジュールｄの基板ｅの裏面外周部との接着面積が小さく
なり、強度や硬度が低下するばかりでなく、カード基材
ａの厚きが溝ｉの底部に対応する部位で薄くなるため
に、破壊し易い。しかも、このようにモジュール穴ｃの
受面ｂの外周部に溝ｉを形成するには、径の小さなドリ
ルが必要であるために、加工効率が悪いという問題があ
った。Therefore, in order to compensate for such a drawback, conventionally, as shown in FIG. 6, a groove i is formed on an outer peripheral portion of a receiving surface b of a module hole c provided in a card base material a. i
The adhesive is prevented from seeping out to the external terminal side by flowing excess adhesive melted into the inside. However, the receiving surface b of the module hole c and the substrate of the IC module d are thereby prevented. In addition to the decrease in the adhesive area of e with the outer peripheral portion of the back surface, the strength and hardness are reduced, and the thickness of the card base material a becomes thinner at the portion corresponding to the bottom of the groove i, so that it is easily broken. In addition, in order to form the groove i in the outer peripheral portion of the receiving surface b of the module hole c, a drill having a small diameter is required, so that there is a problem that processing efficiency is poor.
【０００７】本発明は、上記の事情のもとになされたも
ので、その目的とするところは、カード基材のモジュー
ル穴へのＩＣモジュールの熱接着時における溶融した余
剰の接着剤が外部端子側へ滲み出すのを確実に防止し
て、強度及び硬度の向上を図るとともに、モジュール穴
の加工効率を高めることができるようにしたＩＣカード
を提供することにある。The present invention has been made in view of the above circumstances, and it is an object of the present invention to provide a method in which excess adhesive melted during thermal bonding of an IC module to a module hole of a card base material is applied to an external terminal. An object of the present invention is to provide an IC card capable of reliably preventing bleeding to the side, improving strength and hardness, and improving the processing efficiency of module holes.
【０００８】[0008]
【課題を解決するための手段】上述した課題を解決する
ために、この発明は、カード基材にモジュール穴を設
け、このモジュール穴にＩＣモジュールを嵌合させると
ともに、このＩＣモジュールの基板の裏面外周部と前記
モジュール穴の外周に設けられた受面との間の接着面間
に接着シートを介在して、この接着シートにて熱接着し
固定してなるＩＣカードにおいて、前記接着シートによ
る熱接着時に溶融した余剰の接着剤を滞留させるため前
記モジュール穴の受面に外周部分から内側に向かって深
くなるように段差部を有することを特徴とするＩＣカー
ドを提供するものである。In order to solve the above-mentioned problems, the present invention provides a card base with a module hole, fits the IC module into the module hole, and forms a back surface of the IC module substrate. An IC card is formed by interposing an adhesive sheet between an outer peripheral portion and a receiving surface provided on an outer periphery of the module hole, and thermally bonding and fixing the adhesive sheet with the adhesive sheet. In order to retain the excess adhesive melted during bonding, the receiving surface of the module hole has a depth from the outer peripheral portion toward the inner side.
It is an object of the present invention to provide an IC card characterized by having a stepped portion .
【０００９】また、この発明は、カード基材にモジュー
ル穴を設け、ＩＣモジュールの基板の裏面中央部に設け
たれたＩＣチップを前記モジュール穴に嵌合させるとと
もに、前記ＩＣモジュールの基板の裏面外周部と前記モ
ジュール穴の外周面に設けられた受面との間の接着面間
に接着シートを介在して、この接着シートにて熱接着し
固定してなるＩＣカードにおいて、前記ＩＣモジュール
の基板の裏面の最外周に滲み出し防止壁が形成されてお
り、この滲み出し防止壁と前記ＩＣチップとの間に介在
する前記ＩＣモジュール基板の裏面にて形成される凹部
に前記接着シートによる熱接着時に溶融した余剰の接着
剤を滞留させ、この滞留された接着剤の滲み出しを前記
滲み出し防止壁により防止することを特徴とするＩＣカ
ードを提供するものである。According to the present invention, a module hole is provided in a card base material, and the module hole is provided in a central portion of a back surface of a substrate of an IC module.
Causes the sag IC chip fitted to the module hole, an adhesive sheet interposed between the adhesion surface between the abutment provided on the outer peripheral surface of the rear surface outer peripheral portion of the substrate of the IC module and the module holes an IC card formed by thermal bonding were fixed with the adhesive sheet, the IC module
A seepage prevention wall is formed on the outermost periphery of the back surface of the substrate.
Between the wall for preventing oozing and the IC chip.
Recess formed on the back surface of the IC module substrate
The excess adhesive melted at the time of thermal bonding by the adhesive sheet is retained, and the oozing of the retained adhesive is performed.
It is an object of the present invention to provide an IC card which is prevented by a seepage prevention wall .
【００１０】[0010]
【作用】すなわち、この発明は、上記の構成を採用する
ことにより、カード基材に設けたモジュール穴の外周に
設けられた受面とＩＣモジュールの基板の裏面外周部と
の間に、ＩＣチップとの間に介在するＩＣモジュール基
板の裏面にて形成される凹部に接着シートによる熱接着
時に溶融した余剰の接着剤を滞留させ、この滞留された
接着剤の滲み出しを防止する滲み出し防止壁を設けたの
で、熱接着時に溶融した余剰の接着剤が外部端子側へ滲
み出すことを確実に防止できる。In other words, the present invention adopts the above-described structure to provide the outer periphery of the module hole provided in the card base material.
An IC module base interposed between an IC chip and a receiving surface provided and an outer peripheral portion of a back surface of the substrate of the IC module.
The excess adhesive melted during the thermal bonding by the adhesive sheet is retained in the concave portion formed on the back surface of the plate , and this retained
A bleeding prevention wall is provided to prevent bleeding of the adhesive.
Accordingly, it is possible to reliably prevent the excess adhesive melted during the thermal bonding from seeping out to the external terminal side.
【００１１】また、前記モジュール穴の受面とＩＣモジ
ュールの基板の裏面外周部との間の接着剤間に凹部を形
成してなるために、径の大きなドリルにて容易に凹部を
加工・形成できる。Further, since a concave portion is formed between the adhesive between the receiving surface of the module hole and the outer peripheral portion of the back surface of the substrate of the IC module , the concave portion can be easily formed with a large diameter drill.
Ru can be processed and formation.
【００１２】[0012]
【実施例】以下、本発明の実施例を図１から図４に示す
図面を参照しながら詳細に説明すると、図１から図３は
本発明に係るＩＣカードの第１実施例を示すもので、図
中１はカード基材である。このカード基材１には、図１
及び図２に示すように、モジュール穴２が設けられ、こ
のモジュール穴２の受面２ａには、段差部３が段付き形
成されている。また、図中４は前記カード基材１のモジ
ュール穴２に嵌合されて熱接着により固定されたＩＣモ
ジュールである。DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS An embodiment of the present invention will be described below in detail with reference to the drawings shown in FIGS. 1 to 4. FIGS. 1 to 3 show a first embodiment of an IC card according to the present invention. In the figure, reference numeral 1 denotes a card base material. This card base material 1 has the structure shown in FIG.
As shown in FIG. 2 and FIG. 2, a module hole 2 is provided, and a step portion 3 is formed in a stepped manner on a receiving surface 2 a of the module hole 2. Reference numeral 4 in the figure denotes an IC module fitted into the module hole 2 of the card base 1 and fixed by thermal bonding.
【００１３】このＩＣモジュール４は、基板５と、この
基板５の裏面中央部に組付け固定されたＩＣチップ６
と、このＩＣチップ６を外部端子（図示せず）に電気的
に接続する金ワイヤ７と、これらＩＣチップ６及び金ワ
イヤ７を封止するモールド樹脂８とで一体形成してなる
構成を有する。The IC module 4 includes a substrate 5 and an IC chip 6 mounted and fixed at the center of the back surface of the substrate 5.
And a gold wire 7 for electrically connecting the IC chip 6 to an external terminal (not shown), and a molding resin 8 for sealing the IC chip 6 and the gold wire 7. .
【００１４】そして、前記カード基材１にＩＣモジュー
ル４を装着するには、モジュール穴２の受面２ａとＩＣ
モジュール４の基板５の裏面外周部５ａとの間の接着面
間に接着シート９を介在し、この接着シート９を加圧ヘ
ッド１００にて溶融させて熱圧着することにより行なわ
れる。In order to mount the IC module 4 on the card base 1, the receiving surface 2a of the module hole 2 and the IC
This is performed by interposing an adhesive sheet 9 between the adhesive surfaces of the module 4 and the outer peripheral portion 5 a of the back surface of the substrate 5, melting the adhesive sheet 9 by the pressure head 100, and performing thermocompression bonding.
【００１５】このとき、溶融した接着剤は、前記カード
基材１に設けたモジュール穴２の受面２ａとＩＣモジュ
ール４の基板５の裏面外周部５ａとの間の接着面間に形
成された段差部３による空間Ｓ内に滞留し、これによっ
て、接着剤の外部端子側への滲み出しを確実に防止して
いる。また、図３は径の大きなドリル２００を用いて前
記カード基材１へのモジュール穴２の受面２ａに形成さ
れる段差部３の加工状態を示すものである。At this time, the melted adhesive is formed between the adhesive surface between the receiving surface 2a of the module hole 2 provided in the card base 1 and the outer peripheral portion 5a of the back surface of the substrate 5 of the IC module 4. The step portion 3 stays in the space S, thereby reliably preventing the adhesive from seeping out to the external terminals. FIG. 3 shows a processing state of the step portion 3 formed on the receiving surface 2a of the module hole 2 in the card base material 1 by using a drill 200 having a large diameter.
【００１６】また、図４は本発明に係る第２実施例を示
すもので、前記ＩＣモジュール４の基板５の裏面外周部
５ａに段差部５１を形成してなる構成を有するものであ
る。なお、上記の実施例において、カード基材１のモジ
ュール穴２の底部２ｂとＩＣモジュール４のモールド樹
脂８の底面８ａとの間を液状接着剤９１にて接着すれ
ば、更に強度を増加させることが可能になる。FIG. 4 shows a second embodiment according to the present invention, which has a structure in which a step portion 51 is formed on the outer peripheral portion 5a of the back surface of the substrate 5 of the IC module 4. In the above embodiment, if the bottom 2b of the module hole 2 of the card base 1 and the bottom 8a of the molding resin 8 of the IC module 4 are bonded with the liquid adhesive 91, the strength can be further increased. Becomes possible.
【００１７】[0017]
【発明の効果】以上の説明から明らかなように、この発
明は、カード基材に設けたモジュール穴の外周に設けら
れた受面とＩＣモジュールの基板の裏面外周部との間
に、ＩＣチップとの間に介在するＩＣモジュール基板の
裏面にて形成される凹部に接着シートによる熱接着時に
溶融した余剰の接着剤を滞留させ、この滞留された接着
剤の滲み出しを防止する滲み出し防止壁を設けたので、
熱接着時に溶融した余剰の接着剤を凹部に滞留させるこ
とができ、これによって、接着剤が外部端子側へ滲み出
すことを確実に防止できるために、強度及び硬度を向上
させることができ、ＩＣカードの品質を高めることがで
きる。As is apparent from the above description, the present invention is applicable to the case in which
Between the receiving surface and the outer peripheral portion of the back surface of the IC module substrate.
The excess adhesive melted during the thermal bonding by the adhesive sheet is retained in the recess formed on the back surface , and the retained adhesive is
As we established bleeding prevention wall to prevent bleeding of agent ,
Excess adhesive melted at the time of thermal bonding can be retained in the concave portion, and this can reliably prevent the adhesive from seeping out to the external terminal side, so that strength and hardness can be improved, and IC The quality of the card can be improved.
【００１８】また、モジュール穴の受面とＩＣモジュー
ルの基板の裏面外周部との間の接着面間に、凹部を形成
してなるために、径の大きなドリルにて容易に凹部を加
工・形成でき、加工効率を向上させることができる。Further, since a concave portion is formed between the adhesive surface between the receiving surface of the module hole and the outer peripheral portion of the back surface of the substrate of the IC module, the concave portion can be easily formed with a large diameter drill.
It can be processed and formed, and the processing efficiency can be improved.
【図１】本発明に係るＩＣカードの第１実施例を示す要
部拡大断面図。FIG. 1 is an enlarged sectional view of a main part showing a first embodiment of an IC card according to the present invention.
【図２】同じくＩＣカードの平面図。FIG. 2 is a plan view of the IC card.
【図３】同じくカード基材のモジュール穴への段差部の
加工状態を示す概略的説明図。FIG. 3 is a schematic explanatory view showing a processing state of a stepped portion into a module hole of the card base material.
【図４】本発明に係るＩＣカードの第２実施例を概略的
に示す要部拡大断面図。FIG. 4 is an enlarged sectional view of a main part schematically showing a second embodiment of the IC card according to the present invention.
【図５】従来のＩＣカードを概略的に示す要部拡大断面
図。FIG. 5 is an enlarged sectional view of a main part schematically showing a conventional IC card.
【図６】従来のＩＣカードの他の例を概略的に示す要部
拡大断面図。FIG. 6 is an enlarged sectional view of a main part schematically showing another example of a conventional IC card.
１…カード基材、２…モジュール穴、２ａ…受面、３…
段差部、４…ＩＣモジュール、５…基材、５ａ…裏面外
周部、６…ＩＣチップ、７…金ワイヤ、８…モールド樹
脂、９…接着シート。DESCRIPTION OF SYMBOLS 1 ... Card base material, 2 ... Module hole, 2a ... Receiving surface, 3 ...
Step portion, 4 IC module, 5 base material, 5a outer peripheral portion of the back surface, 6 IC chip, 7 gold wire, 8 mold resin, 9 adhesive sheet.
Claims (2)
ジュール穴にＩＣモジュールを嵌合させるとともに、こ
のＩＣモジュールの基板の裏面外周部と前記モジュール
穴の外周に設けられた受面との間の接着面間に接着シー
トを介在して、この接着シートにて熱接着し固定してな
るＩＣカードにおいて、 前記接着シートによる熱接着時に溶融した余剰の接着剤
を滞留させるため前記モジュール穴の受面に外周部分か
ら内側に向かって深くなるように段差部を有することを
特徴とするＩＣカード。An IC module is fitted in a module hole in a card base material, and between an outer peripheral portion of a back surface of a substrate of the IC module and a receiving surface provided in an outer periphery of the module hole. In an IC card having an adhesive sheet interposed between the adhesive surfaces and thermally bonded and fixed with the adhesive sheet, the module hole for retaining excess adhesive melted during the thermal bonding by the adhesive sheet is received. Peripheral part on the surface
An IC card having a stepped portion so as to be deeper toward the inside .
ジュールの基板の裏面中央部に設けたれたＩＣチップを
前記モジュール穴に嵌合させるとともに、前記ＩＣモジ
ュールの基板の裏面外周部と前記モジュール穴の外周面
に設けられた受面との間の接着面間に接着シートを介在
して、この接着シートにて熱接着し固定してなるＩＣカ
ードにおいて、 前記ＩＣモジュールの基板の裏面の最外周に滲み出し防
止壁が形成されており、この滲み出し防止壁と前記ＩＣ
チップとの間に介在する前記ＩＣモジュール基板の裏面
にて形成される凹部に前記接着シートによる熱接着時に
溶融した余剰の接着剤を滞留させ、この滞留された接着
剤の滲み出しを前記滲み出し防止壁により防止すること
を特徴とするＩＣカード。2. A module hole is provided in a card base, and an IC module is provided.
The IC chip provided in the center of the back of the Joule substrate
Together fitted into the module hole, the outer peripheral surface of the module holes and the rear surface peripheral portion of the substrate of the IC module
An IC card interposed between an adhesive surface and a receiving surface provided on the IC card and thermally bonded and fixed with the adhesive sheet; seeping out to the outermost periphery of the back surface of the substrate of the IC module; Prevention
A stop wall is formed, and the bleeding prevention wall and the IC
The back surface of the IC module substrate interposed between the IC module substrate and the chip
The adhesive sheet is retained excess adhesive melted at the time of thermal bonding due to a recess formed in, which is the residence adhesive
An IC card characterized in that bleeding of an agent is prevented by the bleeding prevention wall .
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP04049583A JP3100738B2 (en) | 1992-03-06 | 1992-03-06 | IC card |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP04049583A JP3100738B2 (en) | 1992-03-06 | 1992-03-06 | IC card |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH05246186A JPH05246186A (en) | 1993-09-24 |
| JP3100738B2 true JP3100738B2 (en) | 2000-10-23 |
Family
ID=12835243
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP04049583A Expired - Lifetime JP3100738B2 (en) | 1992-03-06 | 1992-03-06 | IC card |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP3100738B2 (en) |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7086600B2 (en) | 2001-02-02 | 2006-08-08 | Renesas Technology Corporation | Electronic device and method of manufacturing the same |
| JP2008224602A (en) * | 2007-03-15 | 2008-09-25 | Mitsubishi Electric Corp | Watt-hour meter |
| JP5431278B2 (en) * | 2010-09-21 | 2014-03-05 | 日立オートモティブシステムズ株式会社 | Control device for electronic equipment |
| JP6146735B2 (en) * | 2013-03-27 | 2017-06-14 | スタンレー電気株式会社 | Semiconductor light emitting device |
-
1992
- 1992-03-06 JP JP04049583A patent/JP3100738B2/en not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| JPH05246186A (en) | 1993-09-24 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| KR100288385B1 (en) | Semiconductor device and manufacturing method thereof | |
| JP3201353B2 (en) | Semiconductor device and manufacturing method thereof | |
| US5821628A (en) | Semiconductor device and two-layer lead frame for it | |
| JPH0621317A (en) | Manufacture of semiconductor package | |
| JP3100738B2 (en) | IC card | |
| US7838972B2 (en) | Lead frame and method of manufacturing the same, and semiconductor device | |
| EP0711104B1 (en) | Semiconductor device and method for making same | |
| JPS61267363A (en) | Image sensor | |
| JPH08111493A (en) | Semiconductor device | |
| US6333212B1 (en) | Semiconductor device and manufacturing method thereof | |
| JP2947217B2 (en) | Tape carrier type semiconductor device | |
| JPH1154686A (en) | Lead frame and semiconductor package using the same | |
| JPH06232289A (en) | Chip carrier and its manufacturing method | |
| KR100201391B1 (en) | Area array package | |
| JP2592181B2 (en) | Sardip type package for solid-state image sensor | |
| JPH05185786A (en) | Ic card | |
| KR0183649B1 (en) | Leadframe assembly and semiconductor device using it | |
| JP2658353B2 (en) | IC card | |
| JPH04129253A (en) | Semiconductor package | |
| JP2964403B1 (en) | Manufacturing method of package in which semiconductor chip is mounted on lead frame | |
| JP2522165B2 (en) | Semiconductor device | |
| JPH1012797A (en) | Lead frame, resin-sealed semiconductor device using the lead frame and manufacturing method therefor | |
| KR200168180Y1 (en) | Lead frame for semiconductor electrode | |
| JPH02102562A (en) | Semiconductor device | |
| JPH09306946A (en) | Tape carrier and tape carrier semiconductor device using the same |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20070818 Year of fee payment: 7 |
|
| FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20080818 Year of fee payment: 8 |
|
| FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20090818 Year of fee payment: 9 |
|
| FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20090818 Year of fee payment: 9 |
|
| FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20100818 Year of fee payment: 10 |
|
| FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20100818 Year of fee payment: 10 |
|
| FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20110818 Year of fee payment: 11 |
|
| FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20110818 Year of fee payment: 11 |
|
| FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20120818 Year of fee payment: 12 |
|
| EXPY | Cancellation because of completion of term | ||
| FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20120818 Year of fee payment: 12 |