JP3578347B2

JP3578347B2 - Pressure sensor and method of manufacturing the same

Info

Publication number: JP3578347B2
Application number: JP2002315271A
Authority: JP
Inventors: 昭一近藤; 田辺　　淳
Original assignee: Nippon Seiki Co Ltd
Current assignee: Nippon Seiki Co Ltd
Priority date: 2002-03-29
Filing date: 2002-10-30
Publication date: 2004-10-20
Anticipated expiration: 2022-10-30
Also published as: JP2004003936A

Description

【０００１】
【発明の属する技術分野】
本発明は、液体，気体等の流体の圧力を計測可能とした圧力センサ及びその製造方法に関するものである。
【０００２】
【従来の技術】
近年、シリコンダイアフラム上にゲージ抵抗を形成し、それらをブリッジ状に接続した半導体式の感圧素子を有する圧力センサが広く用いられている。
【０００３】
このような感圧素子を用いた従来の圧力センサは、例えば特開昭６３−２３８５３５号公報に開示され、図８に示すようなものがある。斯かる圧力センサＡは、上述したような感圧素子Ｂと、この感圧素子Ｂを固定保持する凹形状のハウジングＣと、感圧素子Ｂの電気信号を回路基板Ｄに伝えるための複数本のリードＥと、感圧素子Ｂと各リードＥとをそれぞれ接続し、金等の導電性材料からなるワイヤ（接続部材）Ｆと、感圧素子Ｂ，リードＥ，ワイヤＦが圧力媒体に侵されないようにハウジングＣ内に注入されるシリコーンゲル等からなる封止部材Ｇと、によって構成される。また圧力センサＡは、リードＥとハウジングＣとがインサート成形されるものであるが、その製造方法としては、圧力センサとして機能するためのリード端子を複数組備えたリードフレームを金型に配設し、この金型内にハウジングＣとなる樹脂材料を流し込むことで前記リードフレームに複数のハウジングＣが設けられる。そして、各ハウジングＣを前記リードフレームから切断してリードＥがインサート成形によって一体に備えられたハウジングＣが得られる。
【０００４】
【発明が解決しようとする課題】
しかしながら、斯かる圧力センサＡは、回路基板Ｄと電気的に接触するための電極部を形成するためにリードＥをハウジングＣの裏面に沿うように折り曲げる必要があることからリードＥの強度を保つためにある程度の大きさが必要であることや、感圧素子Ｂの電極部とリードＥとを電気的に接続するためのワイヤ（接続部材）を感圧素子ＢがハウジングＣ内に配設されたあとにワイヤボンディングによって形成しなければならないため、ハウジングＣ内にワイヤボンディング装置のボンディングツールが移動可能な程度の空間を設けなければならないこと等によって圧力センサを小型化することが困難であるという問題があった。
【０００５】
また、斯かる圧力センサＡは、製造工程において、前記リードフレームから切断された複数のリードＥをハウジングＣの裏面に沿うように折り曲げて前記電極部を形成するために、前記リードフレームからばらばらに切り離されたリードＥを有する各ハウジングＣを、ピンセット等によって一個ずつリード折り曲げ用のプレス機に載せるなどの煩雑な作業が必要となってしまうといった問題があった。
【０００６】
本発明は前記問題に鑑みてなされたものであり、より小型化が可能であり、また製造工程を簡略化して生産性を向上させることが可能な圧力センサ及びその製造方法を提供することを目的とする。
【０００７】
【課題を解決するための手段】
本発明は、上記課題を解決するために、外部機器と電気的に接続される配線部を備えるとともに開口部が形成される柔軟なシート部材と、前記開口部の形成位置に対応するとともに前記シ−ト部材の下面に配設される取付部材と、前記取付部材の前記シート部材及び前記開口部との対向面を覆うように前記シート部材あるいは前記取付部材に配設され、前記シート部材と前記取付部材とを接着固定するシート状接着剤と、前記取付部材上に前記シート状接着剤及び接着剤を介して配設される半導体式の感圧素子と、前記配線部と前記感圧素子とを電気的に接続する接続部材と、前記シート部材上に前記感圧素子を囲むように配設されるハウジングと、を備えてなることを特徴とする。
【０００９】
また、前記シート部材は、少なくとも１つ以上の標識部を備えてなることを特徴とする。
【００１０】
また、前記標識部は、前記開口部の少なくとも一部にかかるように形成されてなることを特徴とする。
【００１１】
また、前記標識部は、金属材料からなることを特徴とする。
【００１４】
また、前記ハウジングは、内部空間に軟質の封止部材が充填されてなることを特徴とする。
【００１５】
本発明の製造方法は、外部機器と電気的に接続される配線部と開口部とを備える少なくとも１つ以上のシート部材を備える柔軟な第一基板と、枠体から接続部を介して延設される少なくとも１つ以上の取付部材を備える第二基板と、を備え、前記取付部材が前記開口部に位置するように前記第一基板を前記第二基板上に重ね合わせる工程と、前記開口部に対応する取付部材上に接着剤を介して半導体式の感圧素子を配設する工程と、前記配線部と前記感圧素子とを電気的に接続する接続部材を形成する工程と、前記シート部材上に前記感圧素子を囲むようにハウジングを配設する工程と、を含むことを特徴とする。
【００１６】
また、前記感圧素子を配設する工程は、前記第一基板の前記シート部材に形成される少なくとも１つ以上の標識部を画像処理手段を備える画像処理装置にて検出し、この検出結果に基づいて前記感圧素子を配設するための配設装置を制御し、前記感圧素子を前記開口部に対応する前記取付部材上に配設することを特徴とする。
【００１７】
また、前記ハウジングの内部空間に軟質の封止部材を充填する工程を含むことを特徴とする。
【００１８】
また、前記接続部に溝部を形成することを特徴とする。
【００１９】
【発明の実施の形態】
以下、添付図面に基づいて、本発明の第一の実施の形態となる圧力センサについて、ダイブコンピュータやダイバーウォッチ等に搭載されるものを例に挙げて説明する。
【００２０】
図１は、本発明の実施の形態である圧力センサ１を示す図であり、圧力センサ１はハウジング２とシート部材３と取付部材４と感圧素子５と軟質封止部材６とから主に構成される。
【００２１】
ハウジング２は、例えば合成樹脂材からなり、シート部材３上に感圧素子５を囲むように配設され、感圧素子５を収納する収納部（内部空間）２ａには感圧素子５を覆う軟質封止部材６が配設される。また、ハウジング２の外周部には、ダイブコンピュータやダイバーウォッチ等のケース体に配設する際に必要となるＯリング等の弾性シール部材（図示しない）を配設する段差部２ｂが設けられている。
【００２２】
シート部材３は、例えば柔軟に曲がり可能な可塑性基板（ＦＰＣ）であって、感圧素子５と例えばダイバーズウォッチのメイン基板等の外部機器（図示しない）とを電気的に接続するための銅等の導電性材料からなる所定の配線部（図示しない）を備える。また、シート部材３には、感圧素子５を取付部材４上に配設するための略四角形状の開口部３ａが形成される。尚、前記配線部の形成個所は何れか一方の面上であってもよいし、両面であってもよい。また、前記配線部には金等の導電性の良好な導電性材料によってメッキ処理された端子部３ｂが形成される。また、シート部材３は、図２に示すように、前記配線部または端子部３ｂと同様の材料からなる標識部３ｃを備える。標識部３ｃは、開口部３ａによってその一部が切り欠きされることによって開口部３ａの角部にかかるように形成されており、開口部３ａの角部と標識部３ｃとの境界部３ｄが形成されている。尚、標識部３ｃは複数形成される構成であっても良く、複数形成される場合は、開口部３ａの前記角部以外の部分にかかる構成であっても良い。
【００２３】
取付部材４は、紙フェノール，ガラス繊維入り樹脂，セラミックあるいはＳＵＳ等からなり、シート部材３の開口部３ａの形成位置に対応するとともにシ−ト部材３の下面上に配設される。尚、シート部材３と取付部材４とは例えば熱硬化性樹脂からなり取付部材４のシート部材３との対向面を覆うようにあらかじめシート部材４に配設されるシート状接着剤７を介して熱圧着にて接着固定される。この場合、シート状接着剤７は、シート部材３の開口部３ａに対応する取付部材４の個所上にも配設される構成となる。取付部材４の開口部３ａに対応する個所上を避けて接着剤を塗布する場合は、熱圧着の際に前記接着剤が開口部３ａ側にはみ出して余剰接着剤となり、感圧素子５を配設する際の妨げとなる恐れがあるが、取付部材４のシート部材３との対向面を覆うシート状接着剤７にてシート部材３と取付部材４とを接着することで接着剤のはみ出しを防止することが可能となる。
【００２４】
感圧素子５は、例えばシリコンダイアフラム上にゲージ抵抗を形成し、それらをブリッジ状に接続してブリッジ回路を形成するものであり、取付部材４上にシート状接着剤７と例えばシリコーン樹脂からなる接着剤８を介して配設される。また、感圧素子５は所定の電極部５ａを備え、電極部５ａと前記配線部の端子部３ｂとを金等の導電材料からなるワイヤ（接続部材）９を用いてワイヤボンディングすることで、感圧素子５と前記配線部とを電気的に接続する。これによって感圧素子５への電力供給がなされるとともに、感圧素子５からの出力信号を外部に伝達することが可能となる。尚、電極部５ａと端子部３ｂとのワイヤボンディングには、ワイヤボンディング装置が用いられる。
【００２５】
軟質封止部材６は、例えばシリコーンゲルからなり、感圧素子５及びワイヤ９が圧力媒体に侵されないように、ハウジング２の収納部２ａ内を満たしている。
【００２６】
以上の各部によって圧力センサ１が構成される。圧力センサ１は、ハウジング２の収納部２ａに導入される流体の圧力を軟質封止部材６を介して前記シリコンダイアフラムによって受け、前記シリコンダイアフラムの変位に伴う前記ブリッジ回路の出力電圧の変化によって圧力を検出する。
【００２７】
斯かる圧力センサ１は、前記外部機器と電気的に接続される前記配線部を備える柔軟なシート部材３に開口部３ａを形成し、取付部材４を開口部３ａの形成位置に対応するとともにシ−ト部材３の下面上に配設し、取付部材４上に接着剤８を介して感圧素子５を配設することを特徴とするものであり、感圧素子５を取付部材４上に配設することによって感圧素子５と前記配線部とをワイヤ９のみによって電気的に接続することが可能となることから従来のような折り曲げが必要なリードが不要となり、圧力センサを小型化することが可能となる。また、シート部材３に開口部３ａを形成することで感圧素子５の配設個所である取付部材４とシート部材３とに段差を設けることにより、接着剤８が前記配線部上に広がることを防止することができ、ワイヤ９による感圧素子５と前記配線部との電気的接続が接着剤８によって阻害されることを防止することが可能となる。また、接着剤の広がりを考慮する必要が無くなるため、前記配線部の面積を狭めることができ、圧力センサをさらに小型化することが可能となる。また、シート部材３に開口部３ａを形成することで感圧素子５の配設個所である取付部材４とシート部材３とに段差を設けることにより、ワイヤ９の配設個所である電極部５ａと端子部３ｂとの高低差を狭めることができるため、前記ワイヤボンディング装置で用いられる画像処理精度をより向上させることが可能となる。
【００２８】
次に、圧力センサ１の製造方法を説明する。図３は第一基板１１と第二基板１２を示す図、図４は製造過程における圧力センサ１を示す断面図、図５は圧力センサの製造工程の手順を示す図である。
【００２９】
まず、銅等の導電性材料によって所定の前記配線部と標識部３ｃとが形成され、前記配線部の感圧素子５とのワイヤボンディング個所を金等の導電性の良好な導電性材料によってメッキ処理した端子部３ｂを有し、端子部３ｂの近傍に例えば金型プレス加工によって開口部３ａが形成される複数のシート部材３を備える柔軟な第一基板１１（図３（ａ））と、エッチングやプレス等の手段によって枠体１２ａから接続部１２ｂを介して延設される複数の取付部材４を備える第二基板１２（図３（ｂ））と、を形成し、取付部材４が開口部３ａに位置するように第一基板１１をあらかじめ第一基板１１に配設されたシート状接着剤を介して第二基板１２上に重ね合わせ、熱圧着によって前記シート状接着剤を硬化させて第一基板１１と第二基板１２とを固定する（図３（ｃ），基板重ね合わせ工程Ｓ１）。尚、第一基板１１は、図２に示すように、開口部３ａが形成される際に標識部３ｃの一部が切り欠きされ、標識部３ｃと開口部３ａの前記角部との境界部３ｄが形成される。また、境界部３ｄが明確となるように、開口部３ａを形成する際には標識部３ｃが形成される面の反対側の面方向から金型プレス加工することが望ましい。また、基板重ね合わせ工程Ｓ１において、例えば金型プレス加工によって第一基板１１及び前記シート状接着剤の所定個所が切断され、図３（ｃ）に示すように各シート部材３と各取付部材４とが各シート状接着剤７によって接着固定されるとともに接着固定された各シート部材３及び各取付部材４が第二基板１２と接続部１２ｂを介して接続される状態となる。また、図３（ｄ）に示すように第二基板１２の接続部１２ｂには溝部１２ｃが形成される。
【００３０】
次に、開口部３ａに対応する取付部材４上に例えばシリコーン樹脂からなる接着剤８を介して感圧素子５を配設する（図４（ａ），感圧素子配設工程Ｓ２）。感圧素子配設工程Ｓ２においては、画像処理カメラ（画像処理手段）を備えた画像処理装置にて標識部３ｃを検出し、この検出データに基づいて、感圧素子５を配設するための配設装置を制御して感圧素子５を取付部材４の開口部３ａに対応する個所の略中央部に配設する。
【００３１】
次に、第一基板１１及び第二基板１２を前記ワイヤーボンディング装置に配設し、各取付部材４上に配設される各感圧素子５の電極部５ａと、シート部材３の端子部３ｂとをワイヤ９を用いてワイヤボンディングすることで、感圧素子５と前記配線部とを電気的に接続する（図４（ａ），ワイヤボンディング工程Ｓ３）。
【００３２】
次に、合成樹脂材からなり収納部２ａを備える略筒状のハウジング２を、例えばエポキシ系樹脂からなる接着剤（図示しない）を用いて各シート部材３上に各感圧素子５を囲むように配設する（図４（ｂ），ハウジング配設工程Ｓ４）。
【００３３】
次に、各シート部材３上に配設された各ハウジング２の収納部２ａ内に、例えばシリコーンゲルからなる軟質封止部材６を注入し、感圧素子５，ワイヤ９が圧力媒体に侵されないようにする（図４（ｂ），軟質封止部材注入工程Ｓ５）。
【００３４】
そして、接続部１２ｂを介して第二基板１２と接続している状態の各圧力センサ１において、接続部１２部分を手作業またはプレス等によって切断することで、第二基板１２から切り離された個々の圧力センサ１が得られる（図１，接続部切断工程Ｓ６）。
【００３５】
斯かる圧力センサの製造方法は、前記配線部と開口部３ａとを備える少なくとも１つ以上のシート部材３を備える柔軟な第一基板１１と、枠体１２ａから接続部１２ｂを介して延設される少なくとも１つ以上の取付部材４を備える第二基板１２と、を取付部材４が開口部３ａに位置するように第一基板１１を第二基板１２上に重ね合わせる工程と、開口部３ａに対応する取付部材４上に接着剤８を介して感圧素子５を配設する工程と、前記配線部と感圧素子５とを電気的に接続するワイヤ９を形成する工程と、シート部材３上に感圧素子５を囲むようにハウジング２を配設する工程と、を含むことを特徴とするものであり、前記配線部を備えるとともに開口部３ａが形成される柔軟なシート部材３と、開口部３ａの形成位置に対応するとともにシ−ト部材３の下面に配設される取付部材４と、取付部材４上に接着剤８を介して配設される感圧素子５と、前記配線部と前記感圧素子とを電気的に接続するワイヤ９と、シート部材３上に感圧素子５を囲むように配設されるハウジング２と、を備える構成とすることによって、ワイヤボンディングによってワイヤ９を配設した後にハウジング２を配設することができることから、ハウジング２の収納部２ａを最小限の空間にすることができ、圧力センサを小型化することが可能となる。
【００３６】
また、前記配線部と開口部３ａとを備える少なくとも１つ以上のシート部材３を備える柔軟な第一基板１１と、枠体１２ａから接続部１２ｂを介して延設される少なくとも１つ以上の取付部材４を備える第二基板１２と、を取付部材４が開口部３ａに位置するように第一基板１１を第二基板１２上に重ね合わせることにより、１つの工程で複数の取付部材４を複数のシート部材３上に配設することができ、また、この状態で感圧素子５を配設し、その後ワイヤボンディングを連続して行うことが可能なことから、製造工程を簡略化して生産性を向上させることが可能となる。また、第二基板１２の枠体１２ａによって柔軟な第一基板１１を補強することができ、後の工程において感圧素子５，ワイヤ９，ハウジング２をより容易に配設することが可能となる。
【００３７】
また、第一基板１１に標識部３ｃを形成し、前記画像処理装置にて標識部３ｃを検出した前記検出データに基づいて感圧素子５を配設することにより、感圧素子５を開口部３ａに対応する取付部材４上に正確に配設することが可能となる。また、標識部３ｃを、開口部３ｃの少なくとも一部にかかるように形成することにより、開口部３ａの形成位置にばらつきが生じる場合であっても、境界部３ｄは実際に形成された開口部３ａと標識部３Ｃとの境界を示すことから、実際に形成された開口部３ａに対応する取付部材４の所定個所上に感圧素子５を正確に配設することが可能となる。特に、境界部３ｄが標識部３ｃと開口部３ａの前記角部との境界を示す構成においては、１つの標識部にて開口部３ａの異なる２方向の辺部との境界を示すことができ、標識部を複数形成することなく感圧素子５を配設するための前記検出データを得ることが可能となる。
【００３８】
また、特に、接続部１２ｂに溝部１２ｃを形成する場合、製造された各圧力センサ１と第二基板１２とを連結する接続部１２ｂに厚さが薄い個所を形成することで、より容易に各圧力センサ１を第二基板１２から分離することが可能となる。
【００３９】
次に、図６を用いて本発明の第一の参考例について説明する。尚、前述した第一の実施の形態と同一もしくは相当個所には同一符号を付してその詳細な説明を省く。
【００４０】
図６において、本発明の第一の参考例である圧力センサ２０は、ハウジング２とシート部材３と取付部材２１と感圧素子５と軟質封止部材６とから主に構成される。
【００４１】
前述の第一の実施の形態と異なる点は、シ−ト部材３の上面に接着剤（図示しない）を介して取付部材２１を配設し、取付部材２１上に接着剤８を介して感圧素子５を配設する点である。斯かる構成によっても、感圧素子５を取付部材２１上に配設することによって感圧素子５と前記配線部とをワイヤ９のみによって電気的に接続することが可能となることから従来のような折り曲げが必要なリードが不要となり、圧力センサを小型化することが可能となる。
【００４２】
次に、図７を用いて本発明の第二の参考例について説明する。尚、前述した第一の実施の形態と同一もしくは相当個所には同一符号を付してその詳細な説明を省く。
【００４３】
図７において、本発明の第二の参考例である圧力センサ３０は、ハウジング２と硬質基板３１と感圧素子５と軟質封止部材６とから主に構成される。
【００４４】
前述の第一の実施の形態と異なる点は、外部機器と電気的に接続される配線部を備える硬質基板３１に凹部３１ａを形成し、硬質基板３１の凹部３１ａ上に接着剤８を介して感圧素子５を配設する点である。硬質基板３１は、紙フェノール，ガラス繊維入り樹脂あるいはセラミック等からなり、凹部３１ａは、エッチング，プレス加工あるいは切削等の手段によって形成される。斯かる構成によっても、感圧素子５を硬質基板３１の凹部３１ａ上に配設することによって感圧素子５と前記配線部とをワイヤ９のみによって電気的に接続することが可能となることから従来のような折り曲げが必要なリードが不要となり、リードによる寸法の制約がなくなるため圧力センサを小型化することが可能となる。また、硬質基板３１に凹部３１ａを形成することで感圧素子５の配設個所である硬質基板３１に段差を設けることにより、接着剤８が前記配線部上に広がることを防止することができ、ワイヤ９による感圧素子５と前記配線部との電気的接続が接着剤８によって阻害されることを防止することが可能となる。また、接着剤の広がりを考慮する必要が無くなるため、前記配線部の面積を狭めることができ、圧力センサをさらに小型化することが可能となる。また、硬質基板３１に凹部３１ａを形成することで感圧素子５の配設個所である硬質基板３１に段差を設けることにより、ワイヤ９の配設個所である感圧素子５の電極部５ａと前記配線部の端子部との高低差を狭めることができるため、前記ワイヤボンディング装置で用いられる画像処理精度をより向上させることが可能となる。
【００４５】
【発明の効果】
本発明は、液体，気体等の流体の圧力を計測可能とした圧力センサ及びその製造方法に
関するものであり、より小型化が可能であり、また製造工程を簡略化して生産性を向上させることが可能となる。
【図面の簡単な説明】
【図１】本発明の第一の実施の形態である圧力センサを示す図。
【図２】同上のシート部材を示す図。
【図３】同上の製造過程を示す図。
【図４】同上の製造過程を示す断面図。
【図５】同上の製造工程の手順を示す図。
【図６】本発明の第一の参考例である圧力センサを示す断面図。
【図７】本発明の第二の参考例である圧力センサを示す断面図。
【図８】従来の圧力センサの一例を断面で示す図。
【符号の説明】
１，２０，３０圧力センサ
２ハウジング
２ａ収納部（内部空間）
３シート部材
３ａ開口部
３ｃ標識部
３ｄ境界部
４，２１取付部材
５感圧素子
６軟質封止部材
７シート状接着剤
８接着剤
９ワイヤ（接続部材）
１１第一基板
１２第二基板
１２ａ枠体
１２ｂ接続部
１２ｃ溝部
３１硬質基板
３１ａ凹部
Ａ圧力センサ
Ｂ感圧素子
Ｃハウジング
Ｄ回路基板
Ｅリード
Ｆワイヤ（接続部材）
Ｓ１基板重ね合わせ工程
Ｓ２感圧素子配設工程
Ｓ３ワイヤボンディング工程
Ｓ４ハウジング配設工程
Ｓ５軟質封止部材注入工程
Ｓ６接続部切断工程[0001]
TECHNICAL FIELD OF THE INVENTION
The present invention relates to a pressure sensor capable of measuring the pressure of a fluid such as a liquid and a gas, and a method for manufacturing the same.
[0002]
[Prior art]
2. Description of the Related Art In recent years, a pressure sensor having a semiconductor pressure-sensitive element in which a gauge resistor is formed on a silicon diaphragm and connected in a bridge shape has been widely used.
[0003]
A conventional pressure sensor using such a pressure-sensitive element is disclosed in, for example, Japanese Patent Application Laid-Open No. 63-238535, and there is one as shown in FIG. Such a pressure sensor A includes a pressure-sensitive element B as described above, a concave housing C for fixedly holding the pressure-sensitive element B, and a plurality of pressure-sensitive elements for transmitting an electric signal of the pressure-sensitive element B to a circuit board D. Lead E, the pressure-sensitive element B and each lead E are connected to each other, and the wire (connecting member) F made of a conductive material such as gold and the pressure-sensitive element B, the lead E, and the wire F are invaded by the pressure medium. And a sealing member G made of silicone gel or the like injected into the housing C so as not to be sealed. In the pressure sensor A, the lead E and the housing C are insert-molded. The method of manufacturing the pressure sensor A is to dispose a lead frame having a plurality of lead terminals for functioning as a pressure sensor in a mold. Then, a plurality of housings C are provided on the lead frame by pouring a resin material to be the housing C into the mold. Then, each housing C is cut from the lead frame to obtain a housing C in which the leads E are integrally provided by insert molding.
[0004]
[Problems to be solved by the invention]
However, such a pressure sensor A maintains the strength of the lead E because it is necessary to bend the lead E along the back surface of the housing C in order to form an electrode portion for making electrical contact with the circuit board D. Therefore, a wire (connection member) for electrically connecting the electrode portion of the pressure-sensitive element B and the lead E is provided in the housing C. It is said that it is difficult to reduce the size of the pressure sensor because the housing C must be provided with a space in which the bonding tool of the wire bonding apparatus can move, for example, since it must be formed by wire bonding. There was a problem.
[0005]
In the manufacturing process, the pressure sensor A is separated from the lead frame so that the plurality of leads E cut from the lead frame are bent along the back surface of the housing C to form the electrode portion. There is a problem that a complicated operation such as placing each of the housings C having the separated leads E on a lead bending press using tweezers or the like one by one is required.
[0006]
The present invention has been made in view of the above problems, and has as its object to provide a pressure sensor which can be further miniaturized, and which can simplify a manufacturing process and improve productivity, and a manufacturing method thereof. And
[0007]
[Means for Solving the Problems]
In order to solve the above-described problems, the present invention provides a flexible sheet member having a wiring portion electrically connected to an external device and having an opening formed therein, and a flexible sheet member corresponding to a position where the opening is formed, and A mounting member disposed on a lower surface of the seat member, the mounting member being disposed on the sheet member or the mounting member so as to cover a surface of the mounting member facing the sheet member and the opening; A sheet-like adhesive for bonding and fixing an attachment member, a semiconductor-type pressure-sensitive element disposed on the attachment member via the sheet-like adhesive and the adhesive, the wiring section, and the pressure-sensitive element. And a housing disposed on the sheet member so as to surround the pressure-sensitive element.
[0009]
Further, the sheet member is provided with at least one or more sign portions.
[0010]
Further, the marker is formed so as to cover at least a part of the opening.
[0011]
Further, the marking portion is made of a metal material.
[0014]
The housing is characterized in that an internal space is filled with a soft sealing member.
[0015]
The manufacturing method of the present invention includes a flexible first substrate including at least one or more sheet members including a wiring portion and an opening electrically connected to an external device, and extending from the frame via the connection portion. A second substrate provided with at least one or more mounting members, wherein the first substrate is superimposed on the second substrate so that the mounting member is located in the opening, and the opening Disposing a semiconductor-type pressure-sensitive element on a mounting member corresponding to the pressure-sensitive element via an adhesive; forming a connection member for electrically connecting the wiring portion and the pressure-sensitive element; Disposing a housing on the member so as to surround the pressure-sensitive element.
[0016]
Further, the step of disposing the pressure-sensitive element includes detecting at least one or more marker portions formed on the sheet member of the first substrate by an image processing apparatus including image processing means, and An arrangement device for arranging the pressure-sensitive element is controlled on the basis of the pressure-sensitive element, and the pressure-sensitive element is arranged on the mounting member corresponding to the opening.
[0017]
The method may further include a step of filling a soft sealing member into the internal space of the housing.
[0018]
Further, a groove is formed in the connection part.
[0019]
BEST MODE FOR CARRYING OUT THE INVENTION
Hereinafter, with reference to the accompanying drawings, the pressure sensor comprising a first embodiment of the present invention, those to be mounted on the dive computer and Daibauotchi like will be described as an example.
[0020]
FIG. 1 is a diagram showing a pressure sensor 1 according to an embodiment of the present invention. The pressure sensor 1 mainly includes a housing 2, a sheet member 3, a mounting member 4, a pressure-sensitive element 5, and a soft sealing member 6. Be composed.
[0021]
The housing 2 is made of, for example, a synthetic resin material, is disposed on the sheet member 3 so as to surround the pressure-sensitive element 5, and a housing portion (internal space) 2 a for housing the pressure-sensitive element 5 covers the pressure-sensitive element 5. A soft sealing member 6 is provided. In addition, a step portion 2b is provided on the outer peripheral portion of the housing 2 for disposing an elastic seal member (not shown) such as an O-ring which is necessary for disposing the case 2 such as a dive computer or a diver watch. I have.
[0022]
The sheet member 3 is, for example, a flexible bendable plastic substrate (FPC), such as copper for electrically connecting the pressure-sensitive element 5 to an external device (not shown) such as a main substrate of a diver's watch. A predetermined wiring portion (not shown) made of a conductive material of the present invention is provided. The sheet member 3 is formed with a substantially rectangular opening 3a for disposing the pressure-sensitive element 5 on the mounting member 4. The wiring portion may be formed on one of the surfaces or on both surfaces. Further, a terminal portion 3b plated with a conductive material having good conductivity such as gold is formed in the wiring portion. Further, as shown in FIG. 2, the sheet member 3 includes a marker portion 3c made of the same material as the wiring portion or the terminal portion 3b. The marker 3c is formed so that a part of the marker 3c is cut off by the opening 3a so as to cover a corner of the opening 3a, and a boundary 3d between the corner of the opening 3a and the marker 3c is formed. Is formed. Note that a plurality of the sign portions 3c may be formed, and when a plurality of the mark portions 3c are formed, the sign portions 3c may be formed on portions other than the corners of the opening 3a.
[0023]
The attachment member 4 is made of paper phenol, resin containing glass fiber, ceramic, SUS, or the like, and is disposed on the lower surface of the sheet member 3 corresponding to the position where the opening 3a of the sheet member 3 is formed. The sheet member 3 and the mounting member 4 are made of, for example, a thermosetting resin via a sheet-like adhesive 7 which is disposed on the sheet member 4 in advance so as to cover the surface of the mounting member 4 facing the sheet member 3. Adhesively fixed by thermocompression bonding. In this case, the sheet-like adhesive 7 has a configuration in which the sheet-like adhesive 7 is also provided on a portion of the mounting member 4 corresponding to the opening 3a of the sheet member 3. In the case where the adhesive is applied while avoiding the portion corresponding to the opening 3a of the mounting member 4, the adhesive protrudes toward the opening 3a during thermocompression bonding and becomes excess adhesive, and the pressure-sensitive element 5 is disposed. Although there is a possibility that it may hinder the installation, the adhesive is protruded by bonding the sheet member 3 and the mounting member 4 with the sheet-like adhesive 7 covering the surface of the mounting member 4 facing the sheet member 3. It can be prevented.
[0024]
The pressure-sensitive element 5 is for forming a gauge resistor on a silicon diaphragm, for example, and connecting them in a bridge to form a bridge circuit. The pressure-sensitive element 5 is made of a sheet-like adhesive 7 and a silicone resin on the mounting member 4. It is provided via an adhesive 8. The pressure-sensitive element 5 includes a predetermined electrode portion 5a, and is wire-bonded between the electrode portion 5a and the terminal portion 3b of the wiring portion using a wire (connection member) 9 made of a conductive material such as gold. The pressure-sensitive element 5 is electrically connected to the wiring section. Thus, power is supplied to the pressure-sensitive element 5 and an output signal from the pressure-sensitive element 5 can be transmitted to the outside. Note that a wire bonding device is used for wire bonding between the electrode portion 5a and the terminal portion 3b.
[0025]
The soft sealing member 6 is made of, for example, silicone gel, and fills the inside of the housing portion 2a of the housing 2 so that the pressure-sensitive element 5 and the wire 9 are not affected by the pressure medium.
[0026]
The above components constitute the pressure sensor 1. The pressure sensor 1 receives the pressure of the fluid introduced into the storage portion 2a of the housing 2 by the silicon diaphragm through the soft sealing member 6, and changes the pressure by the change in the output voltage of the bridge circuit accompanying the displacement of the silicon diaphragm. Is detected.
[0027]
In such a pressure sensor 1, an opening 3a is formed in a flexible sheet member 3 provided with the wiring section electrically connected to the external device, and a mounting member 4 corresponds to a position where the opening 3a is formed, and a flexible member 3 is provided. The pressure-sensitive element 5 is disposed on the lower surface of the mounting member 4 and the pressure-sensitive element 5 is disposed on the mounting member 4 via the adhesive 8. By arranging, the pressure-sensitive element 5 and the wiring portion can be electrically connected only by the wire 9, so that a lead which needs to be bent as in the related art is not required, and the pressure sensor is downsized. It becomes possible. Also, by forming an opening 3a in the sheet member 3 to provide a step between the mounting member 4 where the pressure-sensitive element 5 is disposed and the sheet member 3, the adhesive 8 spreads over the wiring portion. And the electrical connection between the pressure-sensitive element 5 and the wiring portion by the wire 9 can be prevented from being hindered by the adhesive 8. In addition, since it is not necessary to consider the spread of the adhesive, the area of the wiring portion can be reduced, and the size of the pressure sensor can be further reduced. Also, by forming an opening 3a in the sheet member 3 to provide a step between the mounting member 4 where the pressure-sensitive element 5 is disposed and the sheet member 3, the electrode section 5a where the wire 9 is disposed. The height difference between the terminal and the terminal portion 3b can be reduced, so that the image processing accuracy used in the wire bonding apparatus can be further improved.
[0028]
Next, a method for manufacturing the pressure sensor 1 will be described. FIG. 3 is a diagram showing the first substrate 11 and the second substrate 12, FIG. 4 is a sectional view showing the pressure sensor 1 in a manufacturing process, and FIG. 5 is a diagram showing a procedure of a manufacturing process of the pressure sensor.
[0029]
First, the predetermined wiring portion and the indicator 3c are formed of a conductive material such as copper, and the wire bonding portion of the wiring portion with the pressure-sensitive element 5 is plated with a conductive material having good conductivity such as gold. A flexible first substrate 11 (FIG. 3A) having a plurality of sheet members 3 having the processed terminal portions 3 b and having openings 3 a formed in the vicinity of the terminal portions 3 b by, for example, die pressing; A second substrate 12 (FIG. 3B) including a plurality of mounting members 4 extending from the frame 12a via the connecting portions 12b by means such as etching or pressing, and the mounting members 4 are opened. The first substrate 11 is overlaid on the second substrate 12 via a sheet adhesive previously disposed on the first substrate 11 so as to be located at the portion 3a, and the sheet adhesive is cured by thermocompression bonding. First substrate 11 and second substrate Fixing the 2 (FIG. 3 (c), the process S1 superimposed substrate). As shown in FIG. 2, when the opening 3a is formed, the first substrate 11 is partially cut off when the opening 3a is formed, and the boundary between the marking 3c and the corner of the opening 3a is formed. 3d is formed. Also, when forming the opening 3a, it is desirable to perform die pressing from the surface direction opposite to the surface on which the marker 3c is formed so that the boundary 3d is clear. Further, in the substrate superimposing step S1, predetermined portions of the first substrate 11 and the sheet-like adhesive are cut by, for example, die pressing, and each sheet member 3 and each mounting member 4 are cut as shown in FIG. Are bonded and fixed by the respective sheet-like adhesives 7, and the respective sheet members 3 and the respective mounting members 4 bonded and fixed are connected to the second substrate 12 via the connection portions 12b. Further, as shown in FIG. 3D, a groove 12c is formed in the connection portion 12b of the second substrate 12.
[0030]
Next, the pressure-sensitive element 5 is disposed on the mounting member 4 corresponding to the opening 3a via an adhesive 8 made of, for example, a silicone resin (FIG. 4A, pressure-sensitive element disposing step S2). In the pressure-sensitive element disposing step S2, the marker 3c is detected by an image processing device equipped with an image processing camera (image processing means), and the pressure-sensitive element 5 is disposed based on the detected data. By controlling the disposing device, the pressure-sensitive element 5 is disposed substantially at the center of the portion corresponding to the opening 3 a of the mounting member 4.
[0031]
Next, the first substrate 11 and the second substrate 12 are provided in the wire bonding apparatus, and the electrode portions 5a of the pressure-sensitive elements 5 provided on the mounting members 4 and the terminal portions 3b of the sheet member 3 are provided. Is wire-bonded using a wire 9 to electrically connect the pressure-sensitive element 5 to the wiring portion (FIG. 4A, wire bonding step S3).
[0032]
Next, the substantially cylindrical housing 2 made of a synthetic resin material and provided with the storage portion 2a is placed on each sheet member 3 using, for example, an adhesive (not shown) made of an epoxy resin so as to surround each pressure-sensitive element 5. (FIG. 4B, housing disposing step S4).
[0033]
Next, a soft sealing member 6 made of, for example, silicone gel is injected into the storage portion 2a of each housing 2 provided on each sheet member 3, so that the pressure-sensitive element 5 and the wire 9 are not affected by the pressure medium. (FIG. 4B, soft sealing member injecting step S5).
[0034]
In each of the pressure sensors 1 connected to the second substrate 12 via the connection portion 12b, the connection portion 12 is cut manually or by a press or the like to separate each of the pressure sensors 1 from the second substrate 12. Is obtained (FIG. 1, connection part cutting step S6).
[0035]
The method for manufacturing such a pressure sensor includes a flexible first substrate 11 provided with at least one or more sheet members 3 provided with the wiring portion and the opening 3a, and extending from the frame 12a via the connection portion 12b. A second substrate 12 having at least one or more mounting members 4, a step of superposing the first substrate 11 on the second substrate 12 such that the mounting members 4 are located in the openings 3 a, Disposing a pressure-sensitive element 5 on a corresponding mounting member 4 via an adhesive 8, forming a wire 9 for electrically connecting the wiring portion and the pressure-sensitive element 5, A step of disposing the housing 2 so as to surround the pressure-sensitive element 5 thereon, wherein the flexible sheet member 3 including the wiring portion and the opening 3a is formed; It corresponds to the formation position of the opening 3a The mounting member 4 disposed on the lower surface of the sheet member 3, the pressure-sensitive element 5 disposed on the mounting member 4 via the adhesive 8, and the wiring portion and the pressure-sensitive element are electrically connected. And the housing 2 disposed on the sheet member 3 so as to surround the pressure-sensitive element 5, whereby the housing 2 is disposed after the wires 9 are disposed by wire bonding. Since it can be provided, the storage portion 2a of the housing 2 can be made a minimum space, and the pressure sensor can be downsized.
[0036]
Also, a flexible first substrate 11 including at least one or more sheet members 3 including the wiring portion and the opening 3a, and at least one or more attachments extending from the frame 12a via the connection portion 12b. The second substrate 12 provided with the member 4 is overlapped with the first substrate 11 on the second substrate 12 such that the mounting member 4 is located in the opening 3a. Since the pressure-sensitive element 5 can be disposed in this state and wire bonding can be continuously performed in this state, the manufacturing process can be simplified and the productivity can be improved. Can be improved. Further, the flexible first substrate 11 can be reinforced by the frame 12a of the second substrate 12, and the pressure-sensitive element 5, the wire 9, and the housing 2 can be more easily arranged in a later step. .
[0037]
In addition, by forming the marker 3c on the first substrate 11 and arranging the sensor 5 based on the detection data obtained by detecting the marker 3c by the image processing apparatus, the sensor 5 is opened. It becomes possible to dispose it accurately on the mounting member 4 corresponding to 3a. Further, by forming the marker 3c so as to cover at least a part of the opening 3c, even if the formation position of the opening 3a varies, the boundary 3d is formed in the actually formed opening. Since the boundary between 3a and the marker 3C is shown, it is possible to accurately dispose the pressure-sensitive element 5 at a predetermined position of the mounting member 4 corresponding to the opening 3a actually formed. In particular, in the configuration in which the boundary 3d indicates the boundary between the marker 3c and the corner of the opening 3a, one marker can indicate the boundary between the sides of the opening 3a in two different directions. Thus, the detection data for arranging the pressure-sensitive element 5 can be obtained without forming a plurality of marker portions.
[0038]
In particular, when the groove 12c is formed in the connecting portion 12b, by forming a thin portion at the connecting portion 12b connecting the manufactured pressure sensors 1 and the second substrate 12, each of the grooves 12c can be more easily formed. The pressure sensor 1 can be separated from the second substrate 12.
[0039]
Next, a first reference example of the present invention will be described with reference to FIG. The same or corresponding parts as those in the first embodiment described above are denoted by the same reference numerals, and detailed description thereof will be omitted.
[0040]
6, a pressure sensor 20 according to a first embodiment of the present invention mainly includes a housing 2, a sheet member 3, an attachment member 21, a pressure-sensitive element 5, and a soft sealing member 6.
[0041]
The difference from the first embodiment is that the mounting member 21 is disposed on the upper surface of the sheet member 3 via an adhesive (not shown), and the mounting member 21 is sensed on the mounting member 21 via the adhesive 8. The point is that the pressure element 5 is provided. Even with such a configuration, the pressure-sensitive element 5 and the wiring portion can be electrically connected only by the wire 9 by disposing the pressure-sensitive element 5 on the mounting member 21. A lead that requires a gentle bending is not required, and the pressure sensor can be reduced in size.
[0042]
Next, a second embodiment of the present invention will be described with reference to FIG. The same or corresponding parts as those in the first embodiment described above are denoted by the same reference numerals, and detailed description thereof will be omitted.
[0043]
7, a pressure sensor 30 according to a second embodiment of the present invention mainly includes a housing 2, a hard substrate 31, a pressure-sensitive element 5, and a soft sealing member 6.
[0044]
The difference from the first embodiment is that a recess 31a is formed in a hard substrate 31 having a wiring portion electrically connected to an external device, and an adhesive 8 is formed on the recess 31a of the hard substrate 31. The point is that the pressure-sensitive element 5 is provided. The hard substrate 31 is made of paper phenol, resin containing glass fiber, ceramic, or the like, and the concave portion 31a is formed by means such as etching, pressing, or cutting. Even with such a configuration, by disposing the pressure-sensitive element 5 on the concave portion 31a of the hard substrate 31, the pressure-sensitive element 5 and the wiring portion can be electrically connected only by the wire 9. A lead that requires bending as in the related art is not required, and the size of the lead is not restricted, so that the pressure sensor can be downsized. In addition, by forming the concave portion 31a in the hard substrate 31 and providing a step in the hard substrate 31 where the pressure-sensitive element 5 is disposed, it is possible to prevent the adhesive 8 from spreading on the wiring portion. In addition, it is possible to prevent the electrical connection between the pressure-sensitive element 5 and the wiring portion by the wire 9 from being hindered by the adhesive 8. In addition, since it is not necessary to consider the spread of the adhesive, the area of the wiring portion can be reduced, and the size of the pressure sensor can be further reduced. Also, by forming a recess 31a in the hard substrate 31 to provide a step in the hard substrate 31 where the pressure-sensitive element 5 is disposed, it is possible to connect the electrode portion 5a of the pressure-sensitive element 5 where the wire 9 is disposed. Since the height difference between the wiring portion and the terminal portion can be reduced, it is possible to further improve the image processing accuracy used in the wire bonding apparatus.
[0045]
【The invention's effect】
The present invention relates to a pressure sensor capable of measuring the pressure of a fluid such as a liquid and a gas, and a method for manufacturing the same. It becomes possible.
[Brief description of the drawings]
FIG. 1 is a diagram showing a pressure sensor according to a first embodiment of the present invention.
FIG. 2 is a diagram showing a sheet member according to the first embodiment;
FIG. 3 is a view showing a manufacturing process of the above.
FIG. 4 is a sectional view showing the manufacturing process of the above.
FIG. 5 is a diagram showing a procedure of a manufacturing process of the above.
FIG. 6 is a sectional view showing a pressure sensor as a first reference example of the present invention.
FIG. 7 is a sectional view showing a pressure sensor according to a second reference example of the present invention.
FIG. 8 is a diagram showing an example of a conventional pressure sensor in a cross section.
[Explanation of symbols]
1,20,30 Pressure sensor 2 Housing 2a Housing (internal space)
3 Sheet member 3a Opening 3c Mark 3d Boundary 4, 21 Attaching member 5 Pressure sensitive element 6 Soft sealing member 7 Sheet adhesive 8 Adhesive 9 Wire (connecting member)
11 first substrate 12 second substrate 12a frame 12b connection portion 12c groove 31 hard substrate 31a recess A pressure sensor B pressure-sensitive element C housing D circuit board E lead F wire (connection member)
S1 Substrate superposition step S2 Pressure-sensitive element disposing step S3 Wire bonding step S4 Housing disposing step S5 Soft sealing member injection step S6 Connection part cutting step

Claims

A flexible sheet member including a wiring portion electrically connected to an external device and having an opening formed therein,
A mounting member corresponding to a position where the opening is formed and disposed on a lower surface of the sheet member;
A sheet-like adhesive that is disposed on the sheet member or the attachment member so as to cover a surface of the attachment member facing the sheet member and the opening, and that adheres and fixes the sheet member and the attachment member;
A semiconductor-type pressure-sensitive element disposed on the mounting member via the sheet-like adhesive and the adhesive;
A connection member for electrically connecting the wiring portion and the pressure-sensitive element,
A housing disposed on the sheet member so as to surround the pressure-sensitive element;
A pressure sensor comprising:

The pressure sensor according to claim 1, wherein the sheet member includes at least one or more sign portions.

The pressure sensor according to claim 2 , wherein the marker is formed so as to cover at least a part of the opening.

3. The pressure sensor according to claim 2 , wherein the marker is made of a metal material.

The pressure sensor according to claim 1, wherein the housing has an internal space filled with a soft sealing member.

A flexible first substrate having at least one or more sheet members having a wiring portion and an opening electrically connected to an external device, and at least one or more extending from the frame via the connection portion; A second substrate including an attachment member, comprising: a step of overlapping the first substrate on the second substrate so that the attachment member is located in the opening,
A step of disposing a semiconductor type pressure-sensitive element via an adhesive on a mounting member corresponding to the opening,
Forming a connection member for electrically connecting the wiring portion and the pressure-sensitive element;
Disposing a housing on the sheet member so as to surround the pressure-sensitive element;
A method for manufacturing a pressure sensor, comprising:

The step of arranging the pressure-sensitive element detects at least one or more marker portions formed on the sheet member of the first substrate by an image processing apparatus including an image processing unit, and based on the detection result. 7. The pressure sensor according to claim 6 , further comprising: controlling an arrangement device for disposing the pressure-sensitive element, and disposing the pressure-sensitive element on the mounting member corresponding to the opening. Production method.

7. The method according to claim 6 , further comprising a step of filling a soft sealing member into an inner space of the housing.

7. The method according to claim 6 , wherein a groove is formed in the connection part.