JP2848402B2 - Superconducting wiring - Google Patents
Superconducting wiringInfo
- Publication number
- JP2848402B2 JP2848402B2 JP1180584A JP18058489A JP2848402B2 JP 2848402 B2 JP2848402 B2 JP 2848402B2 JP 1180584 A JP1180584 A JP 1180584A JP 18058489 A JP18058489 A JP 18058489A JP 2848402 B2 JP2848402 B2 JP 2848402B2
- Authority
- JP
- Japan
- Prior art keywords
- film
- superconductor
- wiring
- current
- superconducting
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 239000002887 superconductor Substances 0.000 claims description 53
- 239000004020 conductor Substances 0.000 claims description 29
- 239000000758 substrate Substances 0.000 claims description 22
- 239000012212 insulator Substances 0.000 claims description 16
- 230000008878 coupling Effects 0.000 claims 1
- 238000010168 coupling process Methods 0.000 claims 1
- 238000005859 coupling reaction Methods 0.000 claims 1
- 239000010408 film Substances 0.000 description 65
- 229910002480 Cu-O Inorganic materials 0.000 description 9
- 229910009203 Y-Ba-Cu-O Inorganic materials 0.000 description 8
- 238000007639 printing Methods 0.000 description 7
- 238000000034 method Methods 0.000 description 6
- 238000001035 drying Methods 0.000 description 4
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 3
- 229910052760 oxygen Inorganic materials 0.000 description 3
- 239000001301 oxygen Substances 0.000 description 3
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 2
- 238000000137 annealing Methods 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 238000005036 potential barrier Methods 0.000 description 2
- 229910015901 Bi-Sr-Ca-Cu-O Inorganic materials 0.000 description 1
- 229910014454 Ca-Cu Inorganic materials 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 230000002500 effect on skin Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 238000010304 firing Methods 0.000 description 1
- 230000004907 flux Effects 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 239000012528 membrane Substances 0.000 description 1
- 238000004544 sputter deposition Methods 0.000 description 1
- 230000000087 stabilizing effect Effects 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 239000010409 thin film Substances 0.000 description 1
- 238000007740 vapor deposition Methods 0.000 description 1
Landscapes
- Parts Printed On Printed Circuit Boards (AREA)
- Superconductor Devices And Manufacturing Methods Thereof (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
Description
【発明の詳細な説明】 〔概 要〕 本発明は、直流および交流に対する電気的特性の優れ
た超伝導配線に関し、 配線の断面積を増加させることなく使用できる電流の
限界を増やし、かつ高周波でのより一層の低損失化がで
きる超伝導配線を提供することを目的とし、 基板上に超伝導体で構成された複数の端子を設け、こ
れらの端子を結ぶ配線であって、電流の方向に沿って各
々連続した複数の超伝導体膜と常伝導体膜とが交互に積
層された交互積層部分を有し、該交互積層部分は上記常
伝導体膜を挟む上記超伝導体膜を電流の方向に沿って結
合する超伝導体膜を更に含むように構成するか、あるい
は、基板上に超伝導体で構成された複数の端子を設け、
これらの端子を結ぶ配線であって、電流の方向に沿って
各々連続した複数の超伝導体膜と絶縁体膜とが交互に積
層された交互積層部分、および超伝導体膜のみの部分を
有し、該交互積層部分は上記絶縁体膜を挟む上記超伝導
体膜を電流の方向に沿って結合する超伝導体膜を更に含
むように構成する。DETAILED DESCRIPTION OF THE INVENTION [Summary] The present invention relates to a superconducting wiring having excellent electrical characteristics with respect to direct current and alternating current. The purpose of the present invention is to provide a superconducting wiring capable of further reducing the loss of the above. A plurality of terminals formed of a superconductor are provided on a substrate, and the wiring connecting these terminals is provided in the direction of the current. A plurality of superconductor films and a normal conductor film, each of which is continuous along each other, having an alternately stacked portion in which the superconductor films sandwiching the normal conductor film have an electric current. It is configured to further include a superconductor film coupled along the direction, or provided with a plurality of terminals formed of a superconductor on a substrate,
It is a wiring connecting these terminals, and has an alternately laminated portion in which a plurality of superconductor films and insulator films each continuous in the direction of the current are alternately laminated, and a portion of only the superconductor film. The alternately laminated portion is configured to further include a superconductor film that couples the superconductor films sandwiching the insulator film in a direction of current.
本発明は、直流および交流に対する電気的特性の優れ
た超伝導配線に関する。The present invention relates to a superconducting wiring having excellent electric characteristics with respect to direct current and alternating current.
超伝導配線は、直流では電気抵抗を零にできるため、
損失なく電流を流すことができ、また、高周波でも、エ
ネルギ損失が極めて少なく電流を流すことができる。こ
のため、超伝導体は、高性能な配線材料として期待され
ている。Superconducting wiring can reduce the electrical resistance to zero at DC,
A current can be passed without loss, and a current can be passed with very little energy loss even at a high frequency. For this reason, superconductors are expected as high-performance wiring materials.
たとえば、セラミック基板にNb,V,Y−Ba−Cu−Ｏ系、
Bi−Sr−Ca−Cu−Ｏ系等の超伝導体を導体物質として配
線パターンを形成するには、基板上に蒸着等を用いて薄
膜を形成し、エッチング技術により配線パターンを形成
する方法、配線導体を主成分としたペーストを印刷技術
により基板上に印刷パターンを作製、焼成し厚膜パター
ンを形成する方法等が挙げられる。For example, Nb, V, Y-Ba-Cu-O based ceramic substrate,
In order to form a wiring pattern using a superconductor such as Bi-Sr-Ca-Cu-O as a conductive material, a method of forming a thin film on a substrate by vapor deposition or the like and forming a wiring pattern by an etching technique, A method of forming a printed pattern on a substrate by printing a paste containing a wiring conductor as a main component on a substrate by a printing technique, and baking the printed pattern to form a thick film pattern may be used.
超伝導配線で使用できる電流の限界はできるだけ大き
い方が望ましく、特に酸化物超伝導体では、臨界電流の
増加が望まれている。また、高周波の使用でも、電子装
置のより一層の高性能化のため超伝導配線のより一層の
低損失化が望まれる。It is desirable that the limit of the current that can be used in the superconducting wiring is as large as possible. Particularly, in the case of an oxide superconductor, an increase in the critical current is desired. Further, even in the use of high frequency, it is desired to further reduce the loss of the superconducting wiring in order to further enhance the performance of the electronic device.
本発明は、配線の断面積を増加させることなく使用で
きる電流の限界を増やし、かつ高周波でのより一層の低
損失化ができる超伝導配線を提供することを目的とす
る。SUMMARY OF THE INVENTION It is an object of the present invention to provide a superconducting wiring that can increase the limit of current that can be used without increasing the cross-sectional area of the wiring and can further reduce the loss at high frequencies.
上記の目的は、本発明によれば、基板上に超伝導体で
構成された複数の端子を設け、これらの端子を結ぶ配線
であって、電流の方向に沿って各々連続した複数の超伝
導体膜と常伝導体膜とが交互に積層された交互積層部分
を有し、該交互積層部分は上記常伝導体膜を挟む上記超
伝導体膜を電流の方向に沿って結合する超伝導体膜を更
に含むことを特徴とする超伝導配線によって達成され
る。According to the present invention, the above object is to provide a plurality of terminals made of a superconductor on a substrate, and to provide a wiring connecting these terminals, the plurality of superconductors being respectively continuous along the direction of current. A superconductor having alternately laminated portions in which a body film and a normal conductor film are alternately laminated, wherein the alternating laminated portion couples the superconductor films sandwiching the normal conductor film in the direction of current. This is achieved by a superconducting interconnect characterized by further comprising a membrane.
上記の目的は、本発明によれば、基板上に超伝導体で
構成された複数の端子を設け、これらの端子を結ぶ配線
であって、電流の方向に沿って各々連続した複数の超伝
導体膜と絶縁体膜とが交互に積層された交互積層部分、
および超伝導体膜のみの部分を有し、該交互積層部分は
上記絶縁体膜を挟む上記超伝導体膜を電流の方向に沿っ
て結合する超伝導体膜を更に含むことを特徴とする超伝
導配線によっても達成される。According to the present invention, the above object is to provide a plurality of terminals made of a superconductor on a substrate, and to provide a wiring connecting these terminals, the plurality of superconductors being respectively continuous along the direction of current. An alternately laminated portion in which a body film and an insulator film are alternately laminated,
And a portion having only a superconductor film, wherein the alternately laminated portion further includes a superconductor film that couples the superconductor film sandwiching the insulator film along a direction of current. It is also achieved by conductive wiring.
基板は、その上に成膜が可能なものであればよく、特
に限定しない。The substrate is not particularly limited as long as it can form a film thereon.
超伝導体は超伝導特性を有する物質であればよく、金
属、合金、酸化物等のいずれでもかまわない。The superconductor may be any substance having superconducting properties, and may be any of a metal, an alloy, an oxide, and the like.
電流の方向に垂直な断面内で上記常伝導体または絶縁
体の膜を挟んで上記超伝導体膜を配置する典型的な配置
を第１図（ａ）および（ｂ）に示す。電流の方向は紙面
に対して垂直である。Typical arrangements of arranging the superconductor film with the normal conductor or insulator film interposed in a section perpendicular to the direction of the current are shown in FIGS. 1 (a) and 1 (b). The direction of the current is perpendicular to the page.
第１図（ａ），（ｂ）ともに、基板１上に超伝導体膜
２と非超伝導体膜３とを交互に積層させ、超伝導膜２同
士が連結した配置である。いずれの場合にも超伝導体膜
２は常伝導体または絶縁体の膜３を挟んで配置される。1 (a) and 1 (b), the superconducting films 2 and the non-superconducting films 3 are alternately laminated on the substrate 1, and the superconducting films 2 are connected to each other. In any case, the superconductor film 2 is disposed with the normal conductor or insulator film 3 interposed therebetween.
第１図（ｃ）は基板の配線面から見た場合の概要図例
である。基板１上に設けられた超伝導端子５間を配線４
が結ぶ。第１図（ｄ）は基板の側面から見た場合の概要
図例であり、第１図（ａ）または（ｂ）のような断面を
持つ場合に対応する。FIG. 1 (c) is an example of a schematic diagram when viewed from the wiring surface of the substrate. Wiring 4 between superconducting terminals 5 provided on substrate 1
Ties. FIG. 1 (d) is an example of a schematic diagram when viewed from the side of the substrate, and corresponds to a case having a cross section as shown in FIG. 1 (a) or (b).
本発明では、超伝導電流が超伝導体の表面付近のみを
流れる点に着目し、電流方向に垂直な配線断面内での超
伝導体稜線（軸郭線）の長さを増加させることによっ
て、配線として流せる電流の大きさを増加させる。すな
わち、直流で使用する電流の限界（臨界電流×断面積）
は、パターンの断面に占める稜線の割合（または配線の
単位長当たりの表面積）によって左右され、断面積当た
りの稜線の割合が多いほど電流密度の限界は増加でき
る。また、導体の表皮効果が大きくなる高周波領域にお
いても、超伝導配線の導体による伝送損失を下げるため
には、断面積当たりの稜線の割合が大きいほど表面イン
ピーダンスが下がって効果があり、エネルギ損失を少な
くできる。In the present invention, focusing on the point that the superconducting current flows only near the surface of the superconductor, and increasing the length of the superconductor ridge line (axial section line) in the wiring cross section perpendicular to the current direction, Increase the magnitude of the current that can flow as wiring. In other words, the limit of the current used in direct current (critical current x cross-sectional area)
Depends on the ratio of the ridge line to the cross section of the pattern (or the surface area per unit length of the wiring), and the limit of the current density can be increased as the ratio of the ridge line per cross section increases. Also, even in a high-frequency region where the skin effect of the conductor is large, in order to reduce the transmission loss due to the conductor of the superconducting wiring, the larger the ratio of the ridge line per cross-sectional area is, the lower the surface impedance is, which is effective. Can be reduced.
超伝導体とは電流キャリアの輸送特性の異なる常伝導
体または絶縁体を挟んで超伝導体を配置することによ
り、超伝導体と常伝導体または絶縁体との界面が稜線と
なり、配線断面に占める超伝導体の稜線の割合を増やせ
る。これは、常伝導体を用いる場合、常伝導体の電流キ
ャリアと超伝導体の電流キャリアに対し、超伝導体−常
伝導体の界面でポテンシャル障壁が作られるためであ
る。The superconductor is placed between normal conductors or insulators that have different current carrier transport characteristics, so that the interface between the superconductor and the normal conductor or insulator becomes a ridgeline, and the wiring cross-section The ratio of the occupied ridge of the superconductor can be increased. This is because when a normal conductor is used, a potential barrier is created at the superconductor-normal conductor interface for the current carrier of the normal conductor and the current carrier of the superconductor.
この際、超伝導体間に挟む常伝導体または絶縁体の厚
さの配線厚さに占める割合を相対的に増す方が、該常伝
導体または絶縁体の層を通して超伝導キャリアの移動が
少なくできるように該ポテンシャル障壁が明確なものと
なり望ましい。At this time, it is better to relatively increase the ratio of the thickness of the normal conductor or the insulator sandwiched between the superconductors to the wiring thickness, so that the movement of the superconducting carrier through the normal conductor or the insulator layer is small. It is desirable that the potential barrier be clear so that it can be performed.
超伝導体間に挟む膜として、絶縁体よりも常伝導体を
用いることが望ましい。その理由は、通常、常伝導体は
絶縁体よりも熱伝導性がはるかに優れているので、冷却
効率を高めて超伝導体の温度を安定させることがより容
易に行なえ、かつ常伝導体を超伝導体と他の常伝導体と
の電気的な接続端子として用いることもできるからであ
る。It is desirable to use a normal conductor rather than an insulator as a film sandwiched between superconductors. The reason is that normal conductors usually have much better thermal conductivity than insulators, so it is easier to increase the cooling efficiency and stabilize the temperature of the superconductor, and This is because it can be used as an electrical connection terminal between the superconductor and another normal conductor.
本発明の超伝導配線では、常伝導体または絶縁体を挟
んで超伝導体を配置して両者の界面を実施的な超伝導体
の表面とすることによって、直流で流せる電流の限界を
増加させ、かつ高周波で表面インピーダンスを下げてエ
ネルギ損失を減少させることができる。In the superconducting wiring of the present invention, the limit of the current that can be flowed by direct current is increased by arranging the superconductor with a normal conductor or an insulator therebetween and making the interface between them a practical superconductor surface. In addition, energy loss can be reduced by lowering surface impedance at high frequency.
本発明の超伝導配線は更に、超伝導体膜間に外部から
の磁束が侵入し難く、超伝導体膜間での電磁気的ノイズ
の発生を抑制できる。それは、交互積層部分の超伝導体
膜が電流の方向に沿って超伝導体膜で結合されているの
で、交互積層部分の超伝導体膜間の電位差の発生が抑制
されるからである。超伝導状態においては電気抵抗率は
ほぼゼロになるため、例えば超伝導体膜間を金属等の常
伝導体で結合した場合に比べても、この効果は極めて顕
著である。Further, the superconducting wiring of the present invention makes it difficult for external magnetic flux to enter between the superconductor films, and can suppress the generation of electromagnetic noise between the superconductor films. This is because the superconductor films of the alternately laminated portions are joined by the superconductor films along the direction of the current, so that the generation of a potential difference between the superconductor films of the alternately laminated portions is suppressed. In the superconducting state, the electric resistivity is almost zero, so that this effect is extremely remarkable even when, for example, the superconductor films are connected with a normal conductor such as a metal.
実施例１ MgO基板の（100）面上にAg膜をスパッタにより、１μ
ｍの厚さに堆積する。真空度は10-7Torr台で基板温度は
室温である。次に、Ｙ−Ba−Cu−Ｏ膜を同じチャンバ内
で同時スパッタで堆積し、減圧酸素下としてアニールと
し、厚さ１μｍのＹ−Ba−Cu−Ｏ膜とする。このAg膜と
Ｙ−Ba−Cu−Ｏ膜の作製工程を交互に５回繰り返して、
試料膜を作製する。使用できる電流の限界および高周波
における抵抗を同じ厚さのＹ−Ba−Cu−Ｏ膜に比べて、
５倍程度改善できる。Example 1 An Ag film was sputtered on a (100) plane of an MgO substrate to a thickness of 1 μm.
m. The degree of vacuum is on the order of 10 -7 Torr, and the substrate temperature is room temperature. Next, a Y-Ba-Cu-O film is deposited by co-sputtering in the same chamber, and annealed under reduced pressure oxygen to form a 1-μm-thick Y-Ba-Cu-O film. This Ag film and the production process of the Y-Ba-Cu-O film were alternately repeated five times,
A sample film is prepared. Compared with the same thickness of the Y-Ba-Cu-O film,
It can be improved about 5 times.
実施例２ アルミナ基板上にAgを主成分とするペーストを印刷、
乾燥した後、焼成する。次に、Ｙ−Ba−Cu−Ｏを主成分
とするペーストを印刷、乾燥した後、焼成、酸素アニー
ルする。これらの工程を２回繰り返して、試料膜を作製
する。使用できる直流電流の限界および高周波における
配線に沿った単位長当りの抵抗を同じ配線厚さ、同じ配
線幅のＹ−Ba−Cu−Ｏ膜に比べて、２倍程度改善でき
る。Example 2 Printing a paste containing Ag as a main component on an alumina substrate,
After drying, bake. Next, after printing and drying a paste containing Y-Ba-Cu-O as a main component, firing and oxygen annealing are performed. These steps are repeated twice to produce a sample film. The limit of the usable DC current and the resistance per unit length along the wiring at a high frequency can be improved about twice as compared with the Y-Ba-Cu-O film having the same wiring thickness and the same wiring width.
実施例３ アルミナ基板上にAgを主成分とするペーストを印刷、
乾燥した後、焼成する。次に、Bi−Pb−Sr−Ca−Cu−Ｏ
を主成分とするペーストを印刷、乾燥した後、焼成、酸
素アニールする。これらの工程を２回繰り返して、試料
膜を作製する。使用できる直流電流の限界および高周波
における配線に沿った単位長当りの抵抗を同じ配線厚
さ、同じ配線幅のＹ−Ba−Cu−Ｏ膜に比べて、２倍程度
改善できる。Example 3 Printing a paste containing Ag as a main component on an alumina substrate,
After drying, bake. Next, Bi-Pb-Sr-Ca-Cu-O
After printing and drying a paste mainly composed of, baking and oxygen annealing are performed. These steps are repeated twice to produce a sample film. The limit of the usable DC current and the resistance per unit length along the wiring at a high frequency can be improved about twice as compared with the Y-Ba-Cu-O film having the same wiring thickness and the same wiring width.
実施例４ 第１図（ａ）に示した横断面を有する超伝導配線を作
製する工程の例を、第２図に示した横断面図を参照して
説明する。Example 4 An example of a process for manufacturing a superconducting wiring having the cross section shown in FIG. 1A will be described with reference to the cross sectional view shown in FIG.
MgO基板１の（100）面上に、Bi−Pb−Sr−Ca−Cu−Ｏ
を主成分とするペーストでパターン６を印刷、乾燥す
る。（第２図（ａ））。次に、この乾燥したパターン６
の両側に接してBi−Pb−Sr−Ca−Cu−Ｏを主成分とする
ペーストを印刷、乾燥した後、焼成して第２図（ｂ）の
ようにBi−Pb−Sr−Ca−Cu−Ｏの超伝導膜７および８を
形成する。次に、超伝導膜７の両側に接して超伝導膜８
の上に、Agを主成分とするペーストを印刷、乾燥した
後、焼成して第２図（ｃ）のようにAgの常伝導膜９を形
成する。次に、超伝導膜７の両側に接して常伝導膜９の
上に、Bi−Pb−Sr−Ca−Cu−Ｏを主成分とするペースト
を印刷、乾燥した後、焼成して第２図（ｄ）のようにBi
−Pb−Sr−Ca−Cu−Ｏの超伝導膜10を形成する。第２図
（ａ）のパターン６の幅とこの両側に印刷する各パター
ンの幅が同じで、各印刷厚さがこれらの幅よりも十分に
薄い場合、使用できる直流電流の限界および高周波にお
ける配線に沿った単位長当りの抵抗を、同じ配線厚さ、
同じ配線幅のBi−Pb−Sr−Ca−Cu−Ｏ膜の配線に比べて
5/3倍程度向上させることができる。Bi-Pb-Sr-Ca-Cu-O is placed on the (100) plane of the MgO substrate 1.
The pattern 6 is printed and dried with a paste containing as a main component. (FIG. 2 (a)). Next, this dried pattern 6
Is printed on a paste containing Bi-Pb-Sr-Ca-Cu-O as a main component in contact with both sides of the substrate, dried, and then baked to obtain Bi-Pb-Sr-Ca-Cu as shown in FIG. 2 (b). The -O superconducting films 7 and 8 are formed. Next, the superconducting film 8 is in contact with both sides of the superconducting film 7.
Then, a paste containing Ag as a main component is printed, dried, and fired to form a normal conductive film 9 of Ag as shown in FIG. 2C. Next, a paste containing Bi-Pb-Sr-Ca-Cu-O as a main component is printed on the normal conductive film 9 in contact with both sides of the superconductive film 7, dried, and fired. Bi as in (d)
A superconducting film 10 of -Pb-Sr-Ca-Cu-O is formed. If the width of the pattern 6 in FIG. 2 (a) and the width of each pattern printed on both sides thereof are the same and each printing thickness is sufficiently smaller than these widths, the limit of the usable DC current and the wiring at a high frequency Resistance per unit length along with the same wiring thickness,
Compared to the wiring of Bi-Pb-Sr-Ca-Cu-O film with the same wiring width
It can be improved about 5/3 times.
本発明によれば、使用できる電流の限界および高周波
における抵抗を同じ厚さの超伝導膜に比べて著しく改善
できる。また、超伝導体間に挟む膜として常伝導体を用
いることにより、常伝導体を超伝導層の温度安定のため
に使えるという利点がある。さらに、常伝導体を超伝導
体と他の常伝導体と電気的に接続するためのインタフェ
ースとして使えるという利点もある。According to the present invention, the limit of usable current and the resistance at high frequencies can be remarkably improved as compared with a superconducting film having the same thickness. Further, by using a normal conductor as the film sandwiched between the superconductors, there is an advantage that the normal conductor can be used for stabilizing the temperature of the superconducting layer. Furthermore, there is an advantage that the normal conductor can be used as an interface for electrically connecting the superconductor to another normal conductor.
第１図は、本発明の超伝導配線の典型的な例を示す断面
図、および 第２図は、第１図（ａ）の超伝導配線を作製する工程の
例を示す断面図である。 １……基板、２……超伝導体膜、 ３……常伝導体膜または絶縁体膜、４……配線、 ５……超伝導端子、 ６……Bi−Pb−Sr−Ca−Cu−Ｏを主成分とするペースト
を印刷、乾燥した膜、 ７……Bi−Pb−Sr−Ca−Cu−Ｏ膜、８……Bi−Pb−Sr−
Ca−Cu−Ｏ膜、 ９……Ag膜、10……Bi−Pb−Sr−Ca−Cu−Ｏ膜。FIG. 1 is a cross-sectional view showing a typical example of the superconducting wiring of the present invention, and FIG. 2 is a cross-sectional view showing an example of a process for manufacturing the superconducting wiring of FIG. 1 (a). DESCRIPTION OF SYMBOLS 1 ... Substrate, 2 ... Superconductor film, 3 ... Normal conductor film or insulator film, 4 ... Wiring, 5 ... Superconducting terminal, 6 ... Bi-Pb-Sr-Ca-Cu- Printed and dried paste containing O as a main component, 7... Bi-Pb-Sr-Ca-Cu-O film, 8... Bi-Pb-Sr-
Ca-Cu-O film, 9 ... Ag film, 10 ... Bi-Pb-Sr-Ca-Cu-O film.
───────────────────────────────────────────────────── フロントページの続き (56)参考文献 特開 平１−164049（ＪＰ，Ａ) 特開 昭64−54612（ＪＰ，Ａ) 特開 平１−154593（ＪＰ，Ａ) 特開 昭64−28844（ＪＰ，Ａ) 特開 平１−289141（ＪＰ，Ａ) 実開 昭63−167778（ＪＰ，Ｕ) (58)調査した分野(Int.Cl.6，ＤＢ名) H05K 1/09,1/16,3/10 - 3/26,3/38 H05K 3/46 H01L 39/00 - 39/24──────────────────────────────────────────────────続 き Continuation of front page (56) References JP-A-1-164049 (JP, A) JP-A-64-54612 (JP, A) JP-A-1-154593 (JP, A) JP-A 64-64 28844 (JP, A) JP-A-1-289141 (JP, A) JP-A-63-167778 (JP, U) (58) Fields investigated (Int. Cl. 6 , DB name) H05K 1/09, 1 / 16,3 / 10-3 / 26,3 / 38 H05K 3/46 H01L 39/00-39/24
Claims (2)
を設け、これらの端子を結ぶ配線であって、電流の方向
に沿って各々連続した複数の超伝導体膜と常伝導体膜と
が交互に積層された交互積層部分を有し、該交互積層部
分は上記常伝導体膜を挟む上記超伝導体膜を電流の方向
に沿って結合する超伝導体膜を更に含むことを特徴とす
る超伝導配線。1. A plurality of superconductor terminals provided on a substrate, a wiring connecting these terminals, and a plurality of superconductor films and a normal conductor, each of which is continuous along the direction of electric current. The film has an alternately laminated portion alternately laminated, and the alternately laminated portion further includes a superconductor film coupling the superconductor film sandwiching the normal conductor film in the direction of current. Features superconducting wiring.
を設け、これらの端子を結ぶ配線であって、電流の方向
に沿って各々連続した複数の超伝導体膜と絶縁体膜とが
交互に積層された交互積層部分、および超伝導体膜のみ
の部分を有し、該交互積層部分は上記絶縁体膜を挟む上
記超伝導体膜を電流の方向に沿って結合する超伝導体膜
を更に含むことを特徴とする超伝導配線。2. A plurality of terminals made of a superconductor are provided on a substrate, and a plurality of superconductor films and an insulator film continuous with each other in the direction of electric current are provided for connecting these terminals. And an alternately laminated portion, and a portion of only the superconductor film, wherein the alternately laminated portion couples the superconductor films sandwiching the insulator film along the direction of current. A superconducting wiring, further comprising a body film.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1180584A JP2848402B2 (en) | 1989-07-14 | 1989-07-14 | Superconducting wiring |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1180584A JP2848402B2 (en) | 1989-07-14 | 1989-07-14 | Superconducting wiring |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH0346299A JPH0346299A (en) | 1991-02-27 |
| JP2848402B2 true JP2848402B2 (en) | 1999-01-20 |
Family
ID=16085822
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1180584A Expired - Fee Related JP2848402B2 (en) | 1989-07-14 | 1989-07-14 | Superconducting wiring |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2848402B2 (en) |
Family Cites Families (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6261649A (en) * | 1985-09-09 | 1987-03-18 | 井関農機株式会社 | Extractor for foreign matter in rice huller |
| JPS63119822A (en) * | 1986-11-07 | 1988-05-24 | Shigeru Masuda | Sludge pressing and dehydrating device |
| JPS6454612A (en) * | 1987-08-24 | 1989-03-02 | Sumitomo Electric Industries | Superconductive structure |
| JPS6428844A (en) * | 1987-07-23 | 1989-01-31 | Sharp Kk | Superconducting wiring |
| JPH01154593A (en) * | 1987-12-11 | 1989-06-16 | Hitachi Ltd | Superconducting high speed fine wiring board |
| JP2504498B2 (en) * | 1987-12-21 | 1996-06-05 | 株式会社東芝 | Semiconductor device |
-
1989
- 1989-07-14 JP JP1180584A patent/JP2848402B2/en not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0346299A (en) | 1991-02-27 |
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