JPS63318013A - Superconductive wiring material - Google Patents
Superconductive wiring materialInfo
- Publication number
- JPS63318013A JPS63318013A JP62151192A JP15119287A JPS63318013A JP S63318013 A JPS63318013 A JP S63318013A JP 62151192 A JP62151192 A JP 62151192A JP 15119287 A JP15119287 A JP 15119287A JP S63318013 A JPS63318013 A JP S63318013A
- Authority
- JP
- Japan
- Prior art keywords
- crystal
- base plate
- wiring
- mono
- terminals
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000463 material Substances 0.000 title claims abstract description 17
- 239000013078 crystal Substances 0.000 claims abstract description 18
- 239000002887 superconductor Substances 0.000 claims abstract description 11
- 239000000758 substrate Substances 0.000 claims description 16
- 239000012212 insulator Substances 0.000 claims description 2
- 239000004020 conductor Substances 0.000 claims 1
- 229910052594 sapphire Inorganic materials 0.000 abstract description 7
- 239000010980 sapphire Substances 0.000 abstract description 7
- 229910052761 rare earth metal Inorganic materials 0.000 abstract description 2
- 150000002910 rare earth metals Chemical class 0.000 abstract description 2
- 230000008020 evaporation Effects 0.000 abstract 1
- 238000001704 evaporation Methods 0.000 abstract 1
- 239000010949 copper Substances 0.000 description 7
- 239000002184 metal Substances 0.000 description 7
- 229910052751 metal Inorganic materials 0.000 description 7
- 239000010408 film Substances 0.000 description 4
- 238000000034 method Methods 0.000 description 3
- 238000004544 sputter deposition Methods 0.000 description 3
- 150000001875 compounds Chemical class 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 239000010409 thin film Substances 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 230000020169 heat generation Effects 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 238000012856 packing Methods 0.000 description 1
- 229920002120 photoresistant polymer Polymers 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 230000008054 signal transmission Effects 0.000 description 1
- 230000007704 transition Effects 0.000 description 1
- 238000007740 vapor deposition Methods 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Classifications
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E40/00—Technologies for an efficient electrical power generation, transmission or distribution
- Y02E40/60—Superconducting electric elements or equipment; Power systems integrating superconducting elements or equipment
Abstract
Description
【発明の詳細な説明】
〔産業上の利用分野〕
本発明は電子計算機等に用いられる高密度配線材料及び
基板であって、特に発熱が無く高密度な素子の実装に適
する超電導配線材料に関する。DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to high-density wiring materials and substrates used in electronic computers and the like, and particularly to superconducting wiring materials that do not generate heat and are suitable for mounting high-density elements.
従来、素子を高密度に配線する方法には、特公昭60−
35825に記載の如<Cu又はAQ等の金属を、ホト
レジスト、PIQ等の樹脂あるいはA Q 203.
S i 02等酸化物によって形成したギャップ内に埋
め込み、この金属によって素子間の電気的導通を得る方
法がある。ところが、この配線法では集積度が増すにつ
れ素子間の配線金属抵抗が累積して増大し、信号伝達速
度低下、及び発熱等の問題が発生する。Conventionally, the method of wiring elements in high density was
As described in 35825, a metal such as Cu or AQ is combined with a photoresist, a resin such as PIQ, or a metal such as AQ 203.
There is a method of embedding the metal in a gap formed by an oxide such as S i 02 and obtaining electrical continuity between elements using this metal. However, with this wiring method, as the degree of integration increases, the wiring metal resistance between elements increases cumulatively, causing problems such as a reduction in signal transmission speed and heat generation.
電気抵抗のない材料としては、従来よりNbaSnを始
めとする金属又は化合物超電導体が公知である。しかし
、これら材料は摂氏−250℃以下という極低温でのみ
超電導となるもので、この様な温度では半導体が動作し
ない。As materials without electrical resistance, metals such as NbaSn or compound superconductors are conventionally known. However, these materials become superconducting only at extremely low temperatures of -250 degrees Celsius or lower, and semiconductors do not operate at such temperatures.
一方、近年になって、ある種の酸化物が超電導を示し、
超電導転移点も従来の金属・化合物超電導体に比べはる
かに高いことが明ろかとなった。On the other hand, in recent years, certain oxides have shown superconductivity,
It has become clear that the superconducting transition point is also much higher than that of conventional metal/compound superconductors.
これら酸化物は、希土類金属をMとした時、M2Cu0
4と表わされるペロブスカイト構造を有するのが特徴で
ある。ペロブスカイト単位胞内の(001)面にCu及
びOより成る面が形成され、この面内で超電導が起こる
ものである。本材料はスパッタリング法により容易に多
結晶の薄膜が形成でき、これを前述した配線材のCu及
びAflの代りに用いることにより配線抵抗による発熱
のない配線材料が容易に得られる。しかしながら、実
・装密度を上げるため配線幅を狭くすると、配線幅と結
晶粒径がほぼ同程度となり、結晶粒間で」二記超電導層
の接触のない部分ができ、配線材として機能しない欠点
があった。These oxides, when the rare earth metal is M, are M2Cu0
It is characterized by having a perovskite structure represented by 4. A plane made of Cu and O is formed on the (001) plane within the perovskite unit cell, and superconductivity occurs within this plane. A polycrystalline thin film can be easily formed using this material by sputtering, and by using this material in place of the aforementioned wiring materials Cu and Afl, a wiring material that does not generate heat due to wiring resistance can be easily obtained. However, the actual
・When the wiring width is narrowed to increase the packing density, the wiring width and the crystal grain size become almost the same, and there is a part where the superconducting layer mentioned above does not contact between the crystal grains, which has the disadvantage that it does not function as a wiring material. .
上記従来技術は、配線抵抗の低下について考慮されてお
らず、また酸化物超電導体を用いた配線材料も配線の微
細化に対応できない難点があった。The above-mentioned conventional technology does not take into account the reduction in wiring resistance, and wiring materials using oxide superconductors also have the disadvantage that they cannot respond to miniaturization of wiring.
本発明の目的は、高密度でかつ配線抵抗のない配線材料
を提供することにある。An object of the present invention is to provide a wiring material with high density and no wiring resistance.
上記目的は、酸化物超電導体を単結晶基板上に作製する
ことにより単結晶とし、かつその結晶面の(OO1)面
を基板面に対し傾けることにより膜面内に超電導状態で
ある方向と電流の流れない方向を生ぜしめ、これを配線
材に適用することにより達成される。The above purpose is to make an oxide superconductor into a single crystal by fabricating it on a single crystal substrate, and by tilting the (OO1) crystal plane with respect to the substrate surface, the direction of the superconducting state and the current flow in the film plane are determined. This is achieved by creating a direction in which no flow occurs and applying this direction to the wiring material.
酸化物超電導体は例えばB a 2 Cu O4の様に
希土類と銅の酸化物である。結晶形はペロブスカイト構
造であり第3図に示すC面内で超電導を示す。Oxide superconductors are oxides of rare earths and copper, such as Ba 2 Cu O4. The crystal form is a perovskite structure and exhibits superconductivity in the C plane shown in FIG.
そこで例えばサファイア(0001)囲碁板上にBa2
CuOaの(011)面を有する単結晶膜を作製すれば
、第1図に示す如く互いに平行で電気的接触のない(0
01)面の組ができる。これを斜視すると第2図に示す
如く超電導状態である方向4と電気的に絶縁体となる方
向5とが同一基板面内に存在することが分る。この面」
二に、Cu等で端子部6,7.8を図の様な関係に蒸着
、スパッタリングまたはめつきにより形成すると、同一
(001)面上にある6及び7は電気抵抗なしで導通が
あり、6と8及び7と8は絶縁状態となる。So, for example, on a sapphire (0001) Go board, Ba2
If a single crystal film of CuOa with a (011) plane is fabricated, the (0
01) A set of surfaces is created. If this is viewed from perspective, it can be seen that the superconducting direction 4 and the electrically insulating direction 5 exist within the same substrate plane, as shown in FIG. This side”
Second, if the terminal parts 6, 7, 8 are formed of Cu or the like by vapor deposition, sputtering, or plating in the relationship shown in the figure, 6 and 7 on the same (001) plane are electrically conductive without electrical resistance. 6 and 8 and 7 and 8 are in an insulated state.
これら端子部の配置を考慮すれば、高密度な素子実装が
可能となる。さらにサファイア(0001)面を基板面
から傾けて切り出して使用すればBa2CuOaの(0
11)方位も傾き(001)面も傾くため超電導層間の
距離も変化させることができる。If the arrangement of these terminal portions is taken into consideration, high-density device mounting becomes possible. Furthermore, if the sapphire (0001) plane is cut out at an angle from the substrate surface, Ba2CuOa's (0
11) Azimuth and inclination Since the (001) plane is also inclined, the distance between superconducting layers can also be changed.
また、さらに複雑な素子間配線が必要とされる場合は、
第1図に示した配線材料上にAQ、zOa等絶縁体単結
晶膜をエピタキシャル成長させ、その上にさらに酸化物
超電導層を形成し、下層とはスルーホール形成後Cu等
により接続する多層配線を用いれば、任意の端子間の接
続が可能となる。In addition, if more complicated inter-element wiring is required,
An insulating single crystal film such as AQ or zOa is epitaxially grown on the wiring material shown in Fig. 1, and an oxide superconducting layer is further formed on top of it, and a multilayer wiring is connected to the lower layer by Cu or the like after forming through holes. If used, connections between arbitrary terminals can be made.
B a 2 Cu O4を直径100w1厚さ5圃の形
状に焼結成形し、これをターゲットとして用いスパッタ
リングした。基板にサファイア基板を用い、高周波投入
電力3ood、Arガス圧2 X I Q−2Torr
。B a 2 Cu O 4 was sintered into a shape with a diameter of 100 w and a thickness of 5 fields, and sputtering was performed using this as a target. A sapphire substrate is used as the substrate, high frequency input power is 3 ood, Ar gas pressure is 2 X I Q-2 Torr.
.
o2ガス圧力0 、2 X 10”−2Torr基板は
水冷した。O2 gas pressure 0, 2 x 10''-2 Torr substrates were water cooled.
基板には高周波バイアスを印加し、平均の直流電位が一
200Vとなるよう調整した。上記条件でサファイア基
板の面方位を次の第1表の様に変えた時、それぞれ特定
面方位のBazCu○4単結晶膜が成長した。厚さは1
μmとした。A high frequency bias was applied to the substrate, and the average DC potential was adjusted to 1200V. When the plane orientation of the sapphire substrate was changed as shown in Table 1 below under the above conditions, BazCu*4 single crystal films with specific plane orientations were grown. Thickness is 1
It was set as μm.
第 1 表
本実施例によれば、サファイア基板上に単結晶酸化物超
電導体が形成できることが分った。Table 1 According to this example, it was found that a single crystal oxide superconductor could be formed on a sapphire substrate.
本発明によれば、特定面方位を持った酸化物超電導体を
基板上に形成でき、高密度化可能で配線抵抗のない配線
材料が形成できる効果がある。According to the present invention, an oxide superconductor having a specific plane orientation can be formed on a substrate, and a wiring material that can be highly densified and has no wiring resistance can be formed.
第1図はサファイア基板」二に形成したBa2Cu04
薄膜の面方位関係を示す断面図、第2図は第1図の斜視
図及び第3図はペロブスカイトの結晶面を示す構造図で
ある。
1・・・基板、2・・・酸化物超電導体、3・・・ペロ
ブスカイト(001)面、4・・・超電導方向、5・・
・絶縁体第 1 口
第 2 図Figure 1 shows Ba2Cu04 formed on a sapphire substrate.
FIG. 2 is a cross-sectional view showing the plane orientation relationship of the thin film, FIG. 2 is a perspective view of FIG. 1, and FIG. 3 is a structural diagram showing the crystal plane of perovskite. DESCRIPTION OF SYMBOLS 1... Substrate, 2... Oxide superconductor, 3... Perovskite (001) plane, 4... Superconducting direction, 5...
・Insulator No. 1 Port No. 2 Diagram
Claims (1)
とより成るものにおいて、基板に単結晶絶縁体を用い導
体を酸化物超電導体単結晶膜とすることを特徴とする超
電導配線材料。1. A superconducting wiring material consisting of a conductive film formed on a substrate and an electrode layer formed thereon, characterized in that the substrate is a single crystal insulator and the conductor is an oxide superconductor single crystal film. .
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP62151192A JPS63318013A (en) | 1987-06-19 | 1987-06-19 | Superconductive wiring material |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP62151192A JPS63318013A (en) | 1987-06-19 | 1987-06-19 | Superconductive wiring material |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS63318013A true JPS63318013A (en) | 1988-12-26 |
Family
ID=15513276
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP62151192A Pending JPS63318013A (en) | 1987-06-19 | 1987-06-19 | Superconductive wiring material |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS63318013A (en) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5084437A (en) * | 1990-02-28 | 1992-01-28 | Westinghouse Electric Corp. | Method for making high-current, ohmic contacts between semiconductors and oxide superconductors |
KR100515124B1 (en) * | 1999-12-14 | 2005-09-16 | 일본국 통상산업성 공업기술원 | Epitaxial compound structure and device comprising same |
-
1987
- 1987-06-19 JP JP62151192A patent/JPS63318013A/en active Pending
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5084437A (en) * | 1990-02-28 | 1992-01-28 | Westinghouse Electric Corp. | Method for making high-current, ohmic contacts between semiconductors and oxide superconductors |
KR100515124B1 (en) * | 1999-12-14 | 2005-09-16 | 일본국 통상산업성 공업기술원 | Epitaxial compound structure and device comprising same |
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