JP2840227B2 - Heat sink - Google Patents
Heat sinkInfo
- Publication number
- JP2840227B2 JP2840227B2 JP27090796A JP27090796A JP2840227B2 JP 2840227 B2 JP2840227 B2 JP 2840227B2 JP 27090796 A JP27090796 A JP 27090796A JP 27090796 A JP27090796 A JP 27090796A JP 2840227 B2 JP2840227 B2 JP 2840227B2
- Authority
- JP
- Japan
- Prior art keywords
- heat
- layer
- heating element
- heat radiating
- radiating plate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Landscapes
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Description
【０００１】[0001]
【発明の属する技術分野】本発明は、電子部品等の発熱
体に取り付けられて、該発熱体の放熱を行うために用い
られる放熱板に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a heat radiating plate which is attached to a heating element such as an electronic component and used to radiate heat from the heating element.
【０００２】[0002]
【従来の技術】従来より、この種の放熱板の一つとし
て、例えば、特開平８−１６７６８２号公報に開示され
ているように、熱伝導性の大きい材料をシート状に形成
した熱伝導層の両面に、熱放射性の大きい材料からなる
熱放射層を形成してなる放熱体が知られている。2. Description of the Related Art Conventionally, as one type of heat radiating plate, for example, as disclosed in Japanese Patent Application Laid-Open No. 8-167682, a heat conductive layer formed of a material having high heat conductivity in a sheet shape. A radiator is known in which a heat radiating layer made of a material having a high heat radiating property is formed on both surfaces of the heat radiating layer.
【０００３】この放熱板は、電子部品の上面等に取り付
けて使用するのであるが、この取付作業を効率良く行う
ため、両面テープ等が用いられている。The heat radiating plate is used by being attached to the upper surface of an electronic component or the like, and a double-sided tape or the like is used in order to efficiently perform the attaching work.
【０００４】[0004]
【発明が解決しようとする課題】しかし、このような放
熱板の表面において熱放射層を形成する材料としては、
通常、セラミック等が用いられるが、セラミックは粗い
表面を有しているため、放熱板に取り付けた両面テープ
が剥がれ易いという問題があった。However, as a material for forming a heat radiation layer on the surface of such a radiator plate,
Usually, ceramic or the like is used, but since the ceramic has a rough surface, there is a problem that the double-sided tape attached to the heat sink is easily peeled off.
【０００５】また、このような放熱板では、熱放射層が
発熱体に接触することになるため、発熱体からの熱を効
率よく受け取ることができないという問題もあった。本
発明は、上記問題点を解決するために、発熱体に簡単か
つ確実に接着でき、しかも発熱体の熱を効率よく受け取
ることのできる放熱板を提供することを目的とする。Further, in such a heat radiating plate, since the heat radiation layer comes into contact with the heating element, there is a problem that heat from the heating element cannot be efficiently received. An object of the present invention is to provide a heat radiating plate that can be easily and reliably bonded to a heating element and that can efficiently receive the heat of the heating element in order to solve the above problems.
【０００６】[0006]
【課題を解決するための手段及び発明の効果】上記目的
を達成するためになされた請求項１に記載の発明は、熱
伝導率の大きい材料からなる熱伝導層と、該熱伝導層の
両面に積層され、熱放射率の大きい材料からなる熱放射
層と、を備え、電子部品等の発熱体に取り付けられて、
該発熱体の放熱を行う放熱板において、上記発熱体への
取付部位には、上記熱伝導層が露出されていることを特
徴とする。Means for Solving the Problems and Effects of the Invention The invention according to the first aspect of the present invention, which has been made to achieve the above object, comprises a heat conductive layer made of a material having a high heat conductivity, and both surfaces of the heat conductive layer. And a heat radiation layer made of a material having a high heat emissivity, and attached to a heating element such as an electronic component.
In the heat radiating plate for radiating heat from the heat generating element, the heat conductive layer is exposed at a portion where the heat generating element is attached to the heat generating element.
【０００７】なお、熱伝導層を構成する熱伝導率の大き
い材料（以下、熱伝導性材料という）としては、例え
ば、金属又はその酸化物、若しくは炭素が挙げられる。
一方、熱放射層を構成する熱放射率の大きい材料（以
下、熱放射性材料という）としては、各種セラミック
や、黒鉛，カーボンブラック，炭素繊維等が挙げられ
る。この内、セラミックとしては、例えばアルミナ，ジ
ルコニア，チタニア等を用いることができるが、遠赤外
線の放射率が高いものとして、コージライト（２ＭｇＯ
・２Ａｌ2Ｏ3・５ＳｉＯ2 ），チタン酸アルミニウム
（Ａｌ2Ｏ3・Ｔｉ2Ｏ3），β−スポジューメン（Ｌｉ2
Ｏ・Ａｌ2Ｏ3・４ＳｉＯ2），炭化ケイ素（ＳｉＣ）等
も好適に用いられる。更に、全赤外域で放射率の高いセ
ラミックとして、遷移元素酸化物系のセラミックス（
一例として、ＭｎＯ2：６０％，Ｆｅ2Ｏ3：２０％，Ｃ
ｕＯ：１０％，ＣｏＯ：１０％）を用いることもでき
る。また、上記各性質を有する材料は、夫々所定の基材
に混合された複合材料としても良く、該複合材料が、混
合された各材料の性質を維持していれば良い。[0007] Examples of a material having a high thermal conductivity (hereinafter, referred to as a heat conductive material) constituting the heat conductive layer include a metal or an oxide thereof, or carbon.
On the other hand, as a material having a large heat emissivity (hereinafter, referred to as a heat radiating material) constituting the heat radiating layer, various ceramics, graphite, carbon black, carbon fiber and the like can be mentioned. Among them, as the ceramic, for example, alumina, zirconia, titania and the like can be used, and cordierite (2MgO2) is used as a material having a high far-infrared emissivity.
.2Al 2 O 3 .5SiO 2 ), aluminum titanate (Al 2 O 3 .Ti 2 O 3 ), β-spodumene (Li 2
O.Al 2 O 3 .4SiO 2 ), silicon carbide (SiC) and the like are also preferably used. Furthermore, as ceramics with high emissivity in the all infrared region, transition element oxide ceramics (
As an example, MnO 2 : 60%, Fe 2 O 3 : 20%, C
uO: 10%, CoO: 10%) can also be used. Further, the material having each of the above properties may be a composite material mixed with a predetermined base material, and the composite material may maintain the properties of each of the mixed materials.
【０００８】このように構成された請求項１に記載の放
熱板は、例えば、熱伝導層が露出された取付部位に両面
テープを取り付けて、この両面テープを介して電子部品
等の発熱体の上面等に貼付することで使用される。そし
て、熱伝導層は、発熱体から受け取った熱を放熱板全体
に伝導し、熱放射層が、熱伝導層によって伝導された熱
を、電磁波（主に赤外線や遠赤外線）に変換して外部に
放射する。[0008] In the radiator plate according to the first aspect of the present invention, for example, a double-sided tape is attached to a mounting portion where the heat conductive layer is exposed, and a heat-generating element such as an electronic component is connected via the double-sided tape. It is used by attaching it to the upper surface or the like. The heat conducting layer conducts the heat received from the heating element to the entire radiator plate, and the heat radiating layer converts the heat conducted by the heat conducting layer into electromagnetic waves (mainly infrared rays and far infrared rays) and converts the heat to the outside. To radiate.
【０００９】このように、本発明の放熱板によれば、発
熱体への取付部位に熱伝導層が露出されており、熱伝導
層が、熱放熱層を介することなく、発熱体の熱を直接受
け取るようにされているため、発熱体から受け取った熱
を速やかに放熱板全体に伝導することができ、延いて
は、効率よく放熱を行うことができる。As described above, according to the heat radiating plate of the present invention, the heat conductive layer is exposed at the portion where the heat radiating member is attached to the heat radiating plate. Since the heat is directly received, the heat received from the heating element can be quickly transmitted to the entire heat radiating plate, so that heat can be efficiently dissipated.
【００１０】また、発熱体への取付部位に露出された熱
伝導層を構成する熱伝導性材料は、金属など表面形状の
滑らかな材料からなるため、発熱体との接着に両面テー
プを用いた場合は、これを確実に取り付けることがで
き、延いては、発熱体への取付を両面テープによって簡
単かつ確実に行うことができる。Further, since the heat conductive material constituting the heat conductive layer exposed at the portion to be attached to the heating element is made of a material having a smooth surface such as a metal, a double-sided tape is used for bonding to the heating element. In this case, this can be securely attached, and furthermore, the attachment to the heating element can be easily and reliably performed by the double-sided tape.
【００１１】次に、請求項２に記載の発明は、請求項１
に記載の放熱板において、上記取付部位に、熱伝導性の
粘着層を設けたことを特徴とする。従って、本発明によ
れば、発熱体への取付の際に、別途、両面テープや接着
剤等の接着用の部材を用意する必要がないので、取付作
業をより簡単のものとすることができる。Next, a second aspect of the present invention is the first aspect.
Wherein the heat-sink plate is provided with a heat-conductive adhesive layer at the attachment site. Therefore, according to the present invention, it is not necessary to separately prepare an adhesive member such as a double-sided tape or an adhesive when attaching to the heating element, so that the attaching operation can be simplified. .
【００１２】更に、請求項３に記載の発明は、請求項１
または請求項２に記載の放熱板において、当該放熱板の
縁部に切込みを形成し、該切込みにより切り分けられた
部分が、互いに異なる角度に折曲げられていることを特
徴とする。Further, the invention according to claim 3 is the invention according to claim 1.
Alternatively, in the heat sink according to claim 2, a notch is formed at an edge of the heat sink, and portions cut by the cut are bent at different angles.
【００１３】このように構成された請求項３に記載の放
熱板によれば、切込みにより切り分けられた部分が、よ
り広い範囲の空間に分散して配置されることになるた
め、効率よく放熱を行うことができる。即ち、放熱板で
は、熱を電磁波に変換して放射するだけでなく、放熱板
の表面から、放熱板と外気との温度差によっても放熱を
行っているが、放熱板の表面積が同じである場合、それ
が広い範囲の空間に分散して配置されている方が、放熱
板付近の暖められた空気が効率よく拡散されるため、放
熱の効率が向上するのである。According to the radiator plate according to the third aspect of the present invention, the portions cut by the cuts are distributed and arranged in a wider range of space, so that heat is efficiently radiated. It can be carried out. In other words, the heat radiating plate not only radiates heat by converting it to electromagnetic waves, but also radiates heat from the surface of the heat radiating plate by the temperature difference between the heat radiating plate and the outside air, but the surface area of the heat radiating plate is the same. In this case, when the air is dispersed in a wide area, the warmed air near the heat radiating plate is efficiently diffused, so that the heat radiation efficiency is improved.
【００１４】[0014]
【発明の実施の形態】以下に本発明の実施例を図面と共
に説明する。図１（ａ）は、第１実施例の放熱板の構成
を表す平面図、（ｂ）はその断面図であり、図２は、本
実施例の放熱板１０の使用状態を表す説明図である。Embodiments of the present invention will be described below with reference to the drawings. FIG. 1A is a plan view illustrating a configuration of a heat sink of the first embodiment, FIG. 1B is a cross-sectional view thereof, and FIG. 2 is an explanatory diagram illustrating a use state of the heat sink 10 of the present embodiment. is there.
【００１５】本実施例の放熱板１０は、熱伝導率の大き
いアルミニウムの金属板（厚さ０．２ｍｍ）からなる熱
伝導層１２と、熱放射率の大きいジルコニア系のセラミ
ック（厚さ４０μｍ）からなり、熱伝導層１２の表面を
一部を除いて被覆するように形成された熱放射層１４と
を備え、放熱板１０の一方の面の中央部には、熱放射層
１４を形成せずに熱伝導層１２を露出させたままにして
なる取付面１０ａが設けられている。なお、熱放射層１
４は、熱伝導層１２を構成する金属板に、セラミック材
料を溶射したり、セラミック材料をバインダに混入して
なる塗料を塗布すること等により形成することができ
る。The heat radiating plate 10 of this embodiment has a heat conductive layer 12 made of an aluminum metal plate (thickness: 0.2 mm) having a high thermal conductivity and a zirconia ceramic (thickness: 40 μm) having a high thermal emissivity. And a heat radiation layer 14 formed so as to cover a part of the surface of the heat conduction layer 12 except for a part thereof. The heat radiation layer 14 is formed in the center of one surface of the heat sink 10. Instead, a mounting surface 10a is provided that keeps the heat conductive layer 12 exposed. The heat radiation layer 1
4 can be formed by spraying a ceramic material on a metal plate constituting the heat conductive layer 12, applying a paint obtained by mixing a ceramic material into a binder, or the like.
【００１６】このように構成された放熱板１０は、取付
面１０ａに、例えば両面テープ１６を取り付け、この両
面テープ１６が取り付けられた取付面１０ａを、図２に
示すように、基板Ｂに載置されたＩＣ等の電子部品Ｐの
上面に接着することにより使用される。なお、両面テー
プ１６は、熱伝導率の大きい材料にて構成されたものを
用いることが望ましい。The radiator plate 10 thus configured has, for example, a double-sided tape 16 attached to the mounting surface 10a, and the mounting surface 10a to which the double-sided tape 16 is mounted is mounted on the substrate B as shown in FIG. It is used by bonding it to the upper surface of an electronic component P such as an IC placed. It is desirable that the double-sided tape 16 be made of a material having high thermal conductivity.
【００１７】そして、電子部品Ｐにて発生した熱が、放
熱板１０の取付面１０ａを介して熱伝導層１２に伝えら
れると、熱伝導層１２は、この熱を速やかに熱伝導層１
２全体に伝導して、その表面に形成された熱放射層１４
を加熱し、加熱された熱放射層１４は、外気との温度差
により、その表面から放熱を行うと共に、熱を電磁波
（赤外線）に変換して熱放射層１４の内部からも放熱を
行う。When the heat generated in the electronic component P is transmitted to the heat conductive layer 12 via the mounting surface 10a of the heat sink 10, the heat conductive layer 12 quickly transfers the heat to the heat conductive layer 1.
2, the heat radiation layer 14 formed on the surface
Is heated, and the heated heat radiation layer 14 radiates heat from its surface due to a temperature difference from the outside air, and also radiates heat from the inside of the heat radiation layer 14 by converting the heat into electromagnetic waves (infrared rays).
【００１８】以上、説明したように、本実施例の放熱板
１０によれば、電子部品Ｐと接する取付面１０ａに、熱
伝導層１２が露出されているので、電子部品Ｐに発生し
た熱を速やかに受け取ることができ、しかも、この伝え
られた熱を速やかに放熱板１０全体に行き渡らせること
ができるので、効率よく放熱を行うことができる。As described above, according to the radiator plate 10 of the present embodiment, since the heat conductive layer 12 is exposed on the mounting surface 10a in contact with the electronic component P, the heat generated in the electronic component P Since the heat can be received promptly and the transmitted heat can be quickly spread to the entire heat radiating plate 10, heat can be efficiently radiated.
【００１９】また、本実施例によれば、取付面１０ａに
露出された熱伝導層１２は、滑らかな表面を有するアル
ミニウムの金属板からなるので、粗い表面を有するセラ
ミック等に比べて両面テープを確実に接着させることが
でき、延いては、この両面テープを用いて、当該放熱板
１０を電子部品Ｐに簡単かつ確実に接着することができ
る。Further, according to the present embodiment, since the heat conductive layer 12 exposed on the mounting surface 10a is made of an aluminum metal plate having a smooth surface, a double-sided tape can be used as compared with a ceramic or the like having a rough surface. The heat sink 10 can be easily and reliably bonded to the electronic component P by using the double-sided tape.
【００２０】また、本実施例の放熱板１０は、金属板か
らなる熱伝導層１２の表面に、セラミックからなる熱放
射層１４を薄く（４０μｍ）形成することにより構成さ
れているため、金属板の有する弾性により板バネとして
作用する。つまり、当該放熱板１０は、外力に応じて柔
軟に変形するため、外部の物体が接触しても、当該放熱
板１０が破損してしまったり、接触してきた物体を傷つ
けてしまうことがく、安全性の高い装置を構成できる。Further, since the heat radiating plate 10 of this embodiment is formed by forming the heat radiating layer 14 made of ceramic thinly (40 μm) on the surface of the heat conductive layer 12 made of a metal plate, Acts as a leaf spring due to the elasticity of. That is, since the heat radiating plate 10 is flexibly deformed in response to an external force, the heat radiating plate 10 is not damaged even if it comes in contact with an external object, or the contacted object is not damaged. It is possible to configure a device having high reliability.
【００２１】また、熱伝導層１２を形成する金属板の性
質により、局部的に所定以上の力を加えれば、任意の形
状に変形させることができるので、様々な場所に、しか
も放熱板１０の面積を減少させることなく適用すること
ができる。次に、第２実施例について説明する。Also, depending on the properties of the metal plate forming the heat conducting layer 12, if a force greater than a predetermined value is applied locally, it can be deformed into an arbitrary shape. It can be applied without reducing the area. Next, a second embodiment will be described.
【００２２】図３（ａ）は第２実施例の放熱板２０の平
面図、図３（ｂ）はその断面図である。本実施例の放熱
板２０は、第１実施例と同様に、熱伝導率の大きい材料
からなる熱伝導層２２と、熱放射率の大きい材料からな
る熱放射層２４とを備え、更に、熱伝導層２２が露出さ
れた取付面１０ａには、予め粘着層２６が設けられ、更
にその表面には、剥離紙２８が取り付けられている。FIG. 3A is a plan view of a heat sink 20 of the second embodiment, and FIG. 3B is a sectional view thereof. As in the first embodiment, the heat radiating plate 20 of this embodiment includes a heat conducting layer 22 made of a material having a high heat conductivity and a heat radiating layer 24 made of a material having a high heat emissivity. An adhesive layer 26 is provided in advance on the mounting surface 10a where the conductive layer 22 is exposed, and a release paper 28 is mounted on the surface thereof.
【００２３】なお、本実施例において、熱伝導層２２
は、シリコーンとアルミナを重量比２：１で混合し薄膜
化した後１８０℃で加硫し、厚さが１ｍｍ、熱伝導率が
２．５×１０-3［cal／ｃｍ・℃・sec］のフィルムから
なり、一方、熱放射層２４は、シリコーンと気相生長炭
素繊維とを重量比１：１で混合し薄膜化した後１８０℃
で加硫した厚さが１ｍｍのフィルムからなる。そして、
これらフィルムを熱伝導グリースを用いて接着すること
で、放熱板２０が構成されている。In this embodiment, the heat conductive layer 22
Is obtained by mixing silicone and alumina at a weight ratio of 2: 1 to form a thin film, and then vulcanizing at 180 ° C., having a thickness of 1 mm and a thermal conductivity of 2.5 × 10 −3 [cal / cm · ° C. · sec]. On the other hand, the heat radiation layer 24 is formed by mixing silicone and vapor-grown carbon fiber at a weight ratio of 1: 1 to form a thin film.
Consists of a film having a thickness of 1 mm vulcanized in the above. And
The heat radiating plate 20 is formed by bonding these films using thermal conductive grease.
【００２４】このように構成された放熱板２０では、剥
離紙２８を剥して、粘着層２６が設けられた取付面２０
ａを電子部品Ｐの上面等に接着することで、第１実施例
と全く同様に使用される。このように、本実施例の放熱
板２０によれば、取付面２０ａに熱伝導層２２が露出さ
れているので、第１実施例の放熱板１０と同様に、効率
よく放熱を行うことができる。In the radiator plate 20 thus configured, the release paper 28 is peeled off and the mounting surface 20 on which the adhesive layer 26 is provided is provided.
By bonding a to the upper surface of the electronic component P or the like, it can be used in exactly the same manner as in the first embodiment. As described above, according to the heat radiating plate 20 of the present embodiment, since the heat conductive layer 22 is exposed on the mounting surface 20a, heat can be efficiently radiated similarly to the heat radiating plate 10 of the first embodiment. .
【００２５】しかも、本実施例によれば、取付面２０ａ
に予め粘着層２６が設けられているので、取付面２０ａ
に両面テープを取り付けたり、接着剤を塗布する手間を
省くことができ、取付作業をきわめて簡単なものとする
ことができる。なお、本実施例では、熱伝導層２２と熱
放射層２４とを熱伝導性グリースを用いて接着したが、
圧着により積層してもよい。Moreover, according to this embodiment, the mounting surface 20a
Is provided with the adhesive layer 26 in advance, the mounting surface 20a
This eliminates the need to attach a double-sided tape or apply an adhesive, thereby making the attachment operation extremely simple. In this embodiment, the heat conductive layer 22 and the heat radiating layer 24 are bonded by using a heat conductive grease.
You may laminate | stack by crimping.
【００２６】次に、第３実施例について説明する。図４
は、本実施例の構成を表す説明図である。なお、本実施
例の放熱板３０は、第１実施例と全く同様に構成したも
のの外形を加工しただけであり、この外形の形状の異な
る部分についてのみ説明する。Next, a third embodiment will be described. FIG.
FIG. 3 is an explanatory diagram illustrating a configuration of the present embodiment. The radiator plate 30 of this embodiment has the same configuration as that of the first embodiment, but has only the outer shape processed, and only the portions having different outer shapes will be described.
【００２７】即ち、本実施例の放熱板３０は、図４に示
すように、その長手方向両端部に、長手方向に沿った切
込みを２本ずつ入れることにより形成された端片３０
ａ，３０ｂ，３０ｃを夫々備えており、このうち、短手
方向両端の端片３０ａ，３０ｃは、放熱板３０の面より
上方に向け、まん中の端片３０ｂは、放熱板３０の面よ
り下方に向けて屈曲されている。That is, as shown in FIG. 4, the heat radiating plate 30 of this embodiment is formed by making two cuts along the longitudinal direction at both ends in the longitudinal direction.
a, 30b, and 30c, respectively, of which the end pieces 30a and 30c at both ends in the short direction face upward from the surface of the heat sink 30, and the middle end piece 30b is located below the surface of the heat sink 30. It is bent toward.
【００２８】このように構成された本実施例の放熱板３
０によれば、端片３０ａ〜３０ｃが空間的に分散されて
配置されることになり、端片３０ａ〜３０ｃの周囲の空
気が拡散され易くなるため、放熱の効率を向上させるこ
とができる。なお、端片の数，大きさ，形状や、端片を
屈曲させる角度は、当該放熱板３０が取り付けられる部
品Ｐの周囲の空間的な余裕等に応じて適宜決めればよ
い。The radiator plate 3 of the present embodiment thus constructed
According to 0, the end pieces 30a to 30c are spatially dispersed and arranged, and the air around the end pieces 30a to 30c is easily diffused, so that the heat radiation efficiency can be improved. The number, size, and shape of the end pieces, and the angle at which the end pieces are bent may be appropriately determined according to, for example, a spatial margin around the component P to which the heat sink 30 is attached.
【００２９】以上、本発明のいくつかの実施例について
説明したが、本発明はこれらの実施例に限定されるもの
ではなく様々な態様で実施することができる。例えば、
上記実施例では、熱伝導層１２（２２）の両面に同じ材
料からなる熱放射層１４（２４）を形成したが、熱伝導
層の各面に、異なる材料からなる熱放射層を形成しても
よい。Although several embodiments of the present invention have been described above, the present invention is not limited to these embodiments, but can be implemented in various modes. For example,
In the above embodiment, the heat radiation layers 14 (24) made of the same material are formed on both surfaces of the heat conduction layer 12 (22). However, heat radiation layers made of different materials are formed on each surface of the heat conduction layer. Is also good.
【００３０】なお、上記実施例では、取付面１０ａ（２
０ａ）が熱放熱層１４（２４）を分断するように形成さ
れているが、例えば、熱放熱層１４（２４）を繰り抜く
ように形成する等、被接着面の大きさと形状に応じて形
成すればよい。In the above embodiment, the mounting surface 10a (2
0a) is formed so as to divide the heat radiating layer 14 (24). For example, the heat radiating layer 14 (24) is formed so as to be cut out and formed according to the size and shape of the surface to be bonded. do it.
【図１】 第１実施例の放熱板の構成を表す平面図、及
び断面図である。FIG. 1 is a plan view and a cross-sectional view illustrating a configuration of a heat sink according to a first embodiment.
【図２】 放熱板が電子部品に取り付けられた状態を表
す説明図である。FIG. 2 is an explanatory diagram illustrating a state in which a heat sink is attached to an electronic component.
【図３】 第２実施例の放熱板の構成を表す平面図、及
び断面図である。FIG. 3 is a plan view and a cross-sectional view illustrating a configuration of a heat sink according to a second embodiment.
【図４】 第３実施例の放熱板の構成を表す説明図であ
る。FIG. 4 is an explanatory diagram illustrating a configuration of a heat sink according to a third embodiment.
１０，２０，３０…放熱板 １０ａ，２０ａ…取付面 １２，２２…熱伝導層 １４，２４…熱放射層 １６…両面テープ ２６…粘着層 ２８…剥離紙 ３０ａ，３０ｂ，３０ｃ
…端片10, 20, 30: heat radiating plate 10a, 20a: mounting surface 12, 22: heat conductive layer 14, 24: heat radiating layer 16: double-sided tape 26: adhesive layer 28: release paper 30a, 30b, 30c
… End piece
Claims (3)
と、 該熱伝導層の両面に積層され、熱放射率の大きい材料か
らなる熱放射層と、 を備え、電子部品等の発熱体に取り付けられて、該発熱
体の放熱を行う放熱板において、 上記発熱体への取付部位には、上記熱伝導層が露出され
ていることを特徴とする放熱板。1. A heating element such as an electronic component, comprising: a heat conduction layer made of a material having a large heat conductivity; and a heat radiation layer laminated on both surfaces of the heat conduction layer and made of a material having a high heat emissivity. A heat radiating plate attached to the radiator and configured to radiate heat of the heating element, wherein the heat conductive layer is exposed at a portion where the heating element is attached to the heating element.
けたことを特徴とする請求項１に記載の放熱板。2. The heat radiating plate according to claim 1, wherein a heat conductive adhesive layer is provided on the mounting portion.
切込みにより切り分けられた部分が、互いに異なる角度
に折曲げられていることを特徴とする請求項１または請
求項２に記載の放熱板。3. The heat sink according to claim 1, wherein a notch is formed at an edge of the heat sink, and portions cut by the cut are bent at different angles from each other. Heat sink.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP27090796A JP2840227B2 (en) | 1996-10-14 | 1996-10-14 | Heat sink |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP27090796A JP2840227B2 (en) | 1996-10-14 | 1996-10-14 | Heat sink |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH10116945A JPH10116945A (en) | 1998-05-06 |
| JP2840227B2 true JP2840227B2 (en) | 1998-12-24 |
Family
ID=17492654
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP27090796A Expired - Fee Related JP2840227B2 (en) | 1996-10-14 | 1996-10-14 | Heat sink |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2840227B2 (en) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3902109B2 (en) | 2002-10-02 | 2007-04-04 | 本田技研工業株式会社 | Infrared camera characteristics confirmation jig |
| JP2006250513A (en) * | 2005-03-14 | 2006-09-21 | Noritake Co Ltd | Far infrared radiation cooling device |
| KR101012685B1 (en) * | 2009-03-20 | 2011-02-09 | 주식회사 신한빛 | Led lighter having air channel |
-
1996
- 1996-10-14 JP JP27090796A patent/JP2840227B2/en not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| JPH10116945A (en) | 1998-05-06 |
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