JP2833841B2 - Degate method of lead frame and degate device using the same - Google Patents

Description

Description: TECHNICAL FIELD The present invention relates to a lead frame degate method and a degate device using the same.

(Prior Art) FIG. 6 shows a state in which a general matrix frame is sealed with resin. As shown in the figure, in the matrix frame, a plurality of rows of mold parts 12 are arranged on the lead frame 10,
In the case of resin sealing, a runner resin path is provided so as to cross the lead frame 10, and a gate extending from the runner resin path to the cavity is provided in a branched shape to fill the resin. In the figure, 14 is a runner and 16 is a gate.

When the runner is drawn out long on the lead frame and sealed with resin as described above, the runner attachment area on the lead frame becomes large, and a method of removing the runner and the gate without leaving the lead frame on the lead frame becomes a problem. (In the present specification, a degate is used to remove a runner or a gate that has solidified on a lead frame.) The applicant has first described a method of reliably degate a runner or the like from a lead frame by using a plurality of parts at a portion where a runner is attached. A method has been proposed in which a runner is peeled and removed from a lead frame by using a lead frame having a plurality of through holes and pressing the runner in the peeling direction at the position of the through hole after molding (Japanese Patent Application No. 1-323198).

(Problems to be Solved by the Invention) The above-mentioned method allows the runner to be reliably peeled and removed over the entire length of the runner by pressing the runner at a plurality of locations and peeling the runner. A slight bending causes a crack to enter the boundary between the gate and the mold portion, thereby ensuring the gate peeling.

However, since the above method merely presses the runner position with a pi, the force is not necessarily applied to all the gates properly, and a crack is surely formed at the boundary between the gate and the mold portion. However, there is a problem that a gate may be left.

Therefore, the present invention has been made to solve the above problems, and an object of the present invention is to provide a degate method and a degate method that can reliably degate at a boundary position between a gate and a mold portion in a lead frame. The present invention provides a degate device used.

(Means for Solving the Problems) The present invention has the following configuration to achieve the above object.

That is, a lead for extending and removing the runner and the gate from the lead frame molded using a mold provided with a branch extending from the runner resin path on both sides of the runner resin path and a gate connecting to the cavity from both sides of the runner resin path. In the degate method for a frame, at a position where the runner and the gate of the lead frame are attached, the lead frame is pressed from one side where the runner and the gate are not attached to deflect the lead frame, thereby forming a boundary between the gate and the mold portion. Then, the runner is pressed from one side of the lead frame with a push pin at a through-hole position previously provided at the runner attachment position of the lead frame, and the runner is peeled off.

A lead for extending and removing the runner and the gate from the lead frame molded by using a mold provided with a mold in which the runner resin path extends on the lead frame and the gate connecting to the cavity is branched from both sides of the runner resin path. In a frame degate device, one surface of the lead frame to which the runner adheres at the time of degate abuts, and the receiving portion serving as a support portion when the lead frame is bent and the separated runner and gate are dropped and discharged. of,
A frame receiver having a discharge hole which is provided in accordance with the attachment position of the runner and the gate, and a frame receiving member is provided opposite to the frame receiving member with the lead frame interposed therebetween, and the vicinity of the runner attaching position of the lead frame between the frame receiving member and the frame receiving member And a pusher mechanism installed on the back side of the pusher and having a push pin for pressing the runner in the direction of peeling the runner from the lead frame at the position of the through hole provided in the lead frame. .

Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the accompanying drawings.

FIG. 1 is an explanatory view of a degate device according to the present invention as viewed from the front.

After molding, the lead frame is transported to a degate device, where the runner, gate, and the like are peeled and removed.

In FIG. 1, reference numeral 20 denotes a frame receiver for supporting the lead frame from below when degate is performed. In the figure, the left-right direction is the longitudinal direction of the lead frame, and the lead frame cut into a strip shape is placed. A plurality of molded portions are formed in the lead frame in the longitudinal direction. A receiving portion 22 for supporting the lower surface of the lead frame is provided between every two adjacent molded portions on the upper surface of the frame receiver 20. The receiving portion 22 is a portion that supports the lower surface of the lead frame at the time of degate, and is provided so as to slightly protrude from the upper surface of the frame receiver 20 as shown in the figure.

A pair of mold parts connected to one runner is located within the range sandwiched by the receiving parts 20, but the peeled runner and gate are dropped at an intermediate position of the receiving parts 20 of the frame receiving part 20. And a discharge hole 24 for discharging the liquid.

FIG. 2 is a plan view of the frame receiver 20. FIG. As shown in the figure, the discharge holes 24 are provided at predetermined intervals on the frame receiver 20 corresponding to the runner positions. The discharge hole 24 is provided with a gate discharge portion 24a formed to be slightly wider in order to pass the peeled gate portion. At the upper edge of the discharge hole 24, a pusher receiving portion 24b for supporting the lead frame at the runner side edge at the time of degate is provided in a projecting shape. As shown in FIG. 6, the frame receiver 20 of the illustrated embodiment is an apparatus of a type in which two rows of mold parts are provided on one lead frame.
The two discharge holes 24a are provided in the discharge holes 24 of the book.

The degate device of the embodiment is a device for processing with two lead frames facing each other, and two frame receivers 20 are installed facing each other.

Above the frame receiver 20, a pusher mechanism for pressing and degate the lead frame with the frame receiver 20 is provided.

In FIG. 1, reference numeral 26 denotes a frame receiver above the frame receiver 20.
This is a pusher plate to be installed facing 20. A pusher 28 is provided on the pusher plate 26 at a position facing the discharge hole 24. Pusher plate on the back of pusher 28
A pusher 28 is elastically movable up and down with respect to the pusher plate 26.

FIG. 4 shows the pusher plate 26 as viewed from below. The pushers 28 are arranged at predetermined intervals in the longitudinal direction corresponding to the runner positions of the lead frame. Since two lead frames are juxtaposed in the frame receiver 20, two rows of pushers 28 are also provided.

At the lower end of the pusher 28 that contacts the lead frame,
Hold down part 28 that holds the top surface of the lead frame with full width
a is provided. The pressing portions 28a are provided in a narrow-width protruding edge shape, and are provided in parallel with two runners 14 with a width interval therebetween.

Reference numeral 32 denotes a push pin provided at an intermediate position between the holding portions 28a. The push pin 32 is for pressing the runner attached to the lead frame from the attachment surface side to separate the runner. In the embodiment, two pushers 28 are provided. Therefore, the lead frame is provided with a through hole for allowing the push pin 32 to pass therethrough.

As shown in FIG. 1, the push pin 32 is a pusher plate.
The base of the pusher 26 is fixed to the pusher 26, and the tip end for pushing out the runner is formed to have a small diameter, and is inserted into the pusher 26 from the rear side of the pusher 26.

FIG. 3 shows a side view of the pusher plate 26. A pusher 28 and a push pin 32 are arranged corresponding to each of two lead frames to be processed on the pusher plate 26. The pusher plate 26 is moved up and down by a pusher plate elevating unit 34. 36 is a guide for raising and lowering the pusher plate 26, and 38 is a suspension spring for urging the pusher plate 26 upward.

The lead frame conveyed to the degate device is first suspended below the pusher 28. Reference numeral 40 denotes a chuck arm for gripping both sides of the lead frame 10. The chuck arm 40 opens and closes sideways by air. 42 is a chuck support plate that supports the check arm 40, and 44
Denotes a lifting drive unit for moving the chuck support plate 42 up and down. 46 is a lifting drive unit 44, a pusher plate lifting unit 34,
This is a machine frame that supports the guide 36 and the like.

Subsequently, a method of removing the runner and the gate by the degate device of the above embodiment will be described with reference to the explanatory diagram shown in FIG.

In FIG. 3, position A is the position of the lead frame first supported by the chuck arm 40, and position B is the state where the chuck support plate 42 is lowered by the elevation drive unit 44 and the lead frame is set in the frame receiver 20.

FIG. 5A shows a state where the lead frame 10 is set in the frame receiver 20. Since the receiving portion 22 is provided so as to slightly protrude from the frame receiving portion 20, the lead frame 10 is supported so as to be stretched between the receiving portions 22 in a state where the receiving portion 22 is set in the frame receiving portion 20, so that the The lead frame 10 is in a slightly floating state. As described above, the runner 14 and the gate 16 are located above the discharge hole 24 of the frame receiver 20.

The pusher 28 is located above the lead frame 10 in the above-described state, and the push pin 32 is at a position retracted in the pusher 28. When peeling the runner and the gate, FIG. 5 (b)
Lower the pusher plate 26 as shown in
Is pressed against the upper surface of the lead frame 10 to press the lead frame downward.

The lead frame 10 is held until the lower surface of the lead frame 10 comes into contact with the pusher receiving portion 24b by the pressing force of the pusher 28.
Is pushed down, and the lead frame 10 is supported by the pusher receiving portion 24b and the receiving portion 22 to bend as shown in the figure. The pressing action of this pusher 28 causes the lead frame 10
Is turned to the side opposite to the side where the gate 16 is attached.

The boundary between the gate 16 and the mold section 12 is V
It is formed in a notch shape, and the pressing portion 28a of the pusher 28 presses the lead frame 10 at the side edge of the runner 14, so that
The rotation of the lead frame serves to rotate the lead frame 10 while holding down the gate 16, so that a crack can be reliably formed at the boundary between the gate 16 and the mold portion 12.

The pressing action of the pusher 28 is applied to the lead frame 10.
Since the operation is performed simultaneously on the respective upper runner portions 14, the lead frame 10 is pulled and pressed in the longitudinal direction. This suitably functions to bend the lead frame 10 using the receiving portion 22 and the pusher receiving portion 24b as support ends.

The pressing force of the pusher 28 against the lead frame acts through the elastic force of the spring 30, but when the pusher plate 26 is further pressed, the spring 30
The pusher plate 26 descends against the resilience of the pusher plate 26, and the push pin 32 fixed to the pusher plate 26 descends.

FIG. 5C shows a state where the spring 32 is compressed and the pusher plate 26 is lowered to the lowermost position. When the pusher plate 26 is lowered to the lowermost position, the push pin 32 presses and separates the runner 14 that has penetrated the lead frame 10 and adhered to the lead frame 10.

After the crack is formed in the gate 16 as described above, the gate 16 and the runner 14 are separated from the lead frame 10 by the pressing and separating operation of the runner 14 portion by the push pin 32, and the runner 14 and the gate 16 fall from the discharge hole 24. (FIG. 5 (c)).

After the degate, the pusher plate 26 rises again, and the lead frame 10 is chucked by the chuck arm 40 and lifted to a predetermined position. Thus, one cycle of degate is completed.

As described above, according to the degate method of this embodiment, each runner on the lead frame and each gate portion are pressed by the pushers, and the lead frame is positively rotated to crack the gate and further push. Since the runner is depressed by pressing the runner in the peeling direction by the pin, the gate peeling can be reliably performed at the boundary position of the mold portion, and the runner adhering to the lead frame for a considerably long time can be reliably removed.

By applying the above method, it is possible to eliminate the occurrence of product defects due to the automatic degate device, and to prevent the occurrence of troubles in the device.

In the above embodiment, an example in which a matrix frame is used as a lead frame has been described. However, it is needless to say that the present invention can be applied to lead frames other than the matrix frame and various types of lead frames such as a mold position and a size. Although the above embodiment is an apparatus of a type in which two lead frames are juxtaposed, it can be similarly applied to an apparatus for processing one by one or an apparatus for processing two or more sheets at a time.

As described above, the present invention has been described variously with reference to the preferred embodiments. However, the present invention is not limited to these embodiments, and it goes without saying that many modifications can be made without departing from the spirit of the present invention. That is.

(Effect of the Invention) According to the degate method and degate device for a matrix frame according to the present invention, the gate and the runner attached to the lead frame can be reliably peeled off from the lead frame and removed. In addition, cracks can be surely formed at the boundary position between the gate and the molded portion, and the gate can be peeled off, so that a degate without leaving a gate can be performed.

[Brief description of the drawings]

FIG. 1 is an explanatory view of a lead frame degate device according to the present invention as viewed from the front side, FIG. 2 is a plan view of a frame receiver, FIG. 3 is an explanatory view of the pusher plate viewed from the side, FIG. FIG. 5 is a bottom view of the pusher plate, FIG. 5 is an explanatory view showing a degate method according to the method of the present invention, and FIG. 6 is an explanatory view showing a mold state of a matrix frame. 10 ... lead frame, 12 ... mold, 14 ... runner, 16 ... gate, 20 ... frame receiver, 22 ... receiver, 24 ... discharge hole, 24a ... gate discharge, 26 ... Pusher plate, 28 …… Pusher, 30 …… Spring, 32 …… Push pin, 40 …… Chuck arm.

Claims (2)

(57) [Claims] A runner resin path extends on a lead frame, and a runner and a gate are peeled from a lead frame molded by using a mold provided with a gate branching from both sides of the runner resin path to a cavity. In the degate method of a lead frame to be removed, the lead frame is bent by pressing the lead frame from one side where the runner and the gate do not adhere at the position where the runner and the gate of the lead frame adhere. A crack is formed in the boundary portion of the lead frame, and then the runner is peeled by pressing the runner with a push pin from one side of the lead frame at a through hole position previously provided at the runner attachment position of the lead frame. Degate method. 2. A runner resin path extends on a lead frame, and a runner and a gate are peeled from a lead frame molded using a mold provided with a gate branching from both sides of the runner resin path to a cavity. In a degate device for a lead frame to be removed, one surface of the lead frame to which the runner adheres at the time of degate abuts, and the receiving portion serving as a support portion when bending the lead frame and the separated runner and gate are dropped. And a frame receiver having a discharge hole that is provided in accordance with the attachment position of the runner and the gate for discharging, and a lead frame interposed between the frame receiver and the frame receiver. A pusher that clamps the vicinity of the runner attachment position, and is installed on the back side of the pusher and is transparent to the lead frame. Digeto device of the lead frame, characterized by comprising a pusher mechanism having a push pin for pushing in the direction of separating the runner from the lead frame at hole positions.