JP2828436B2 - Method of setting transfer route of semiconductor manufacturing line - Google Patents

Method of setting transfer route of semiconductor manufacturing line

Info

Publication number
JP2828436B2
JP2828436B2 JP9086696A JP8669697A JP2828436B2 JP 2828436 B2 JP2828436 B2 JP 2828436B2 JP 9086696 A JP9086696 A JP 9086696A JP 8669697 A JP8669697 A JP 8669697A JP 2828436 B2 JP2828436 B2 JP 2828436B2
Authority
JP
Japan
Prior art keywords
route
layer
transport
intra
transfer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP9086696A
Other languages
Japanese (ja)
Other versions
JPH10107123A (en
Inventor
兌 遠 張
範 天 朴
仁 煕 尹
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sansei Denshi Co Ltd
Original Assignee
Sansei Denshi Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sansei Denshi Co Ltd filed Critical Sansei Denshi Co Ltd
Publication of JPH10107123A publication Critical patent/JPH10107123A/en
Application granted granted Critical
Publication of JP2828436B2 publication Critical patent/JP2828436B2/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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Classifications

    • GPHYSICS
    • G05CONTROLLING; REGULATING
    • G05BCONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
    • G05B19/00Programme-control systems
    • G05B19/02Programme-control systems electric
    • G05B19/418Total factory control, i.e. centrally controlling a plurality of machines, e.g. direct or distributed numerical control [DNC], flexible manufacturing systems [FMS], integrated manufacturing systems [IMS] or computer integrated manufacturing [CIM]
    • G05B19/4189Total factory control, i.e. centrally controlling a plurality of machines, e.g. direct or distributed numerical control [DNC], flexible manufacturing systems [FMS], integrated manufacturing systems [IMS] or computer integrated manufacturing [CIM] characterised by the transport system
    • GPHYSICS
    • G05CONTROLLING; REGULATING
    • G05BCONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
    • G05B19/00Programme-control systems
    • G05B19/02Programme-control systems electric
    • G05B19/418Total factory control, i.e. centrally controlling a plurality of machines, e.g. direct or distributed numerical control [DNC], flexible manufacturing systems [FMS], integrated manufacturing systems [IMS] or computer integrated manufacturing [CIM]
    • G05B19/41865Total factory control, i.e. centrally controlling a plurality of machines, e.g. direct or distributed numerical control [DNC], flexible manufacturing systems [FMS], integrated manufacturing systems [IMS] or computer integrated manufacturing [CIM] characterised by job scheduling, process planning, material flow

Landscapes

  • Engineering & Computer Science (AREA)
  • General Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Quality & Reliability (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Automation & Control Theory (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)

Description

【発明の詳細な説明】DETAILED DESCRIPTION OF THE INVENTION

【0001】[0001]

【発明の属する技術分野】本発明は、半導体製造ライン
の搬送システム及び搬送経路の設定方法に関するもの
で、より詳細には、半導体製造ラインの同一層内及び層
間に、複数の搬送経路を形成し、各経路別の負荷量を参
照して、目的地まで最短時間内に移送物の搬送が行われ
るように改善させた半導体製造ラインの搬送システム及
び搬送経路の設定方法に関する。
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a transfer system for a semiconductor manufacturing line and a method for setting a transfer route. More specifically, the present invention relates to a method for forming a plurality of transfer routes within the same layer and between layers of a semiconductor manufacturing line. The present invention also relates to a semiconductor manufacturing line transfer system and a transfer path setting method in which a transfer object is transferred within a shortest time to a destination with reference to a load amount for each path.

【0002】[0002]

【従来の技術】通常、半導体製造装置を製造する製造ラ
インには、工程、計測及び制御等の多様な用途を有する
設備が所定のレイアウトで配置されており、これらの中
で工程設備間、計測設備間及び工程設備と計測設備間に
は、工程を遂行するために、中間製造物であるウェーハ
の搬送が行われる。
2. Description of the Related Art Usually, equipment having various uses such as process, measurement and control is arranged in a predetermined layout on a manufacturing line for manufacturing semiconductor manufacturing equipment. Wafers, which are intermediate products, are transported between equipment and between processing equipment and measurement equipment in order to perform a process.

【0003】ある一の設備から他の設備へのウェーハの
搬送は、通常作業者の手作業によって行われるが、自動
化された工程では自動搬送システムによって行われる。
最近の物流量が多くなるにつれて、自動搬送システムが
工場内部の全体物流のために多く導入されている。
[0003] The transfer of wafers from one facility to another is usually performed manually by an operator, but in an automated process is performed by an automatic transport system.
With the recent increase in mass flow, more and more automatic transport systems have been introduced for overall logistics inside factories.

【0004】従来の半導体製造ラインの自動搬送システ
ムは、おおよそ特定層に限定された開または閉の経路上
に、搬送物を押し出し方式で搬送するように構成されて
いた。
A conventional automatic transfer system of a semiconductor manufacturing line is configured to transfer a conveyed product on an open or closed path limited to a specific layer by an extrusion method.

【0005】従って、経路中間の一地点で負荷量が多く
なるか、または故障が発生されると物流の流れが円滑に
ならなくなり、全体的な搬送が円滑に遂行されなかっ
た。
[0005] Therefore, if the load increases or a failure occurs at one point in the middle of the route, the flow of the physical distribution is not smooth, and the entire transport is not smoothly performed.

【0006】特に、搬送物の搬送が遅延されると中間製
造段階のウェーハが大気に露出される時間が増加され
て、製品の汚染や品質が低下する場合があった。
In particular, if the transport of the transported product is delayed, the time during which the wafer in the intermediate manufacturing stage is exposed to the air is increased, and the contamination and quality of the product may be reduced.

【0007】従って、全体の半導体製造ラインの搬送効
率が低下され、半導体装置の生産性が低下される問題点
があった。
Accordingly, there has been a problem that the transfer efficiency of the entire semiconductor manufacturing line is reduced and the productivity of the semiconductor device is reduced.

【0008】[0008]

【発明が解決しようとする課題】本発明の目的は、層内
と層間とにそれぞれ複数個の経路を形成させて、所望す
る特定地点に移送物を最短時間内に搬送するための半導
体製造ラインの搬送システムを提供することである。
SUMMARY OF THE INVENTION It is an object of the present invention to provide a semiconductor manufacturing line for forming a plurality of paths between layers and between layers to transport a conveyed product to a desired specific point within a minimum time. Is to provide a transport system.

【0009】本発明の他の目的は、層内及び層間の複数
個の経路を通じて移送物を搬送する前に、既に層内経路
と層間経路との負荷量及び状態をチェックして、移送物
を円滑に搬送するための半導体製造ラインの搬送経路の
設定方法を提供することである。
Another object of the present invention is to check the load and state of the intra-layer path and the interlayer path before transporting the transported article through a plurality of paths in the layer and between the layers, and to determine the load. An object of the present invention is to provide a method of setting a transfer route of a semiconductor manufacturing line for transferring a semiconductor device smoothly.

【0010】[0010]

【課題を解決するための手段】前記の目的を達成するた
めに、請求項1記載の第1の発明による半導体製造ライ
ンの搬送経路の設定方法は、上層及び下層に同一層内に
相互に異なる地点間の搬送物の搬送のための層内経路が
それぞれ構成され、当該上層の層内経路と下層の層内経
路との間には複数の搬送地点が設置され、当該搬送物を
層内及び層間に搬送される搬送経路を設定する半導体製
造ラインの搬送経路の設定方法において、前記搬送物が
層間搬送物であると搬送経路が設定されたかを確認し、
当該経路の状況が良好であると設定された経路に層間搬
送経路を決定する第1段階と、前記搬送経路が設定され
なかったり、当該搬送経路が設定されたとしても当該経
路の状況が良好でなければ、全体の層間経路をチェック
して良好で搬送量の余裕がある経路を択一し、層間搬送
経路に決定する第2段階と、前記搬送物が層内の搬送物
であると層内搬送経路が設定されており、当該経路の状
況が良好であると設定された経路に搬送経路を決定する
第3段階と、層内搬送の設定された経路の状況が良好で
なく、当該設定された経路が確定経路であると当該設定
された経路を層内搬送経路に決定する第4段階と、層内
搬送経路が設定されない状態であるか、または層内搬送
の設定された経路が良好でなく、かつ、当該設定された
経路が確定経路でなければ、全体の層内経路をチェック
して搬送量の余裕のある経路の中から択一し、層内搬送
経路に決定する第5段階とを含むことを要旨とする。従
って、搬送物は同一層間の移送のために、最適の多様な
経路が選択され、これを通じて移送される。また、層間
の移送も同様に、多様な経路を通じて均等な負荷量で行
える。また、層内及び層間の搬送時に、搬送される前
に、搬送される経路がチェックされるので、効率的な移
送が行えるように経路が選択できる。
According to a first aspect of the present invention, there is provided a method for setting a transfer route of a semiconductor manufacturing line, wherein an upper layer and a lower layer are different in the same layer. Intra-layer routes for transporting goods between points are respectively configured, and a plurality of transport points are installed between the upper layer intra-layer route and the lower layer intra-layer route, and the transported objects are transported within the layer and In the method of setting a transfer path of the semiconductor manufacturing line to set a transfer path to be transferred between the layers, it is confirmed whether the transfer path is set as the transfer object is an interlayer transfer object,
A first step of determining an interlayer transport route to a route that is set to be favorable, and a status of the route being good even if the transport route is not set or the transport route is set. If not, a second step of checking the entire interlayer path, selecting a path that is good and having a sufficient transport amount, and determining the interlayer transport path, and determining that the transported article is a transported article within the layer, A third step of determining a transport path to a path in which a transport path is set and the state of the path is set to be good, and a state in which the set path of intra-layer transport is not good and the set And the fourth step of determining the set route as the intra-layer transport route if the route that has been set is the determined route, and the intra-layer transport route is not set or the intra-layer transport set route is good. And the set route is a confirmed route Kere If, then alternative among a margin of the transport amount by checking the entire layer path route, and summarized in that and a fifth step of determining the layer the conveying path. Accordingly, a variety of optimal paths are selected for transport between the same layers and transported therethrough. In addition, the transfer between layers can be similarly performed with a uniform load through various routes. In addition, since the route to be transported is checked before and during transport between layers and between layers, the route can be selected so that efficient transport can be performed.

【0011】[0011]

【発明の実施の形態】以下、図面を用いて本発明の実施
の形態を詳細に説明する。
Embodiments of the present invention will be described below in detail with reference to the drawings.

【0012】図1を参照すると、本発明による半導体製
造ラインの搬送システムの実施の形態は、複数層に各層
別及び層間に複数の搬送経路が構成されている。
Referring to FIG. 1, in an embodiment of a semiconductor manufacturing line transfer system according to the present invention, a plurality of transfer paths are formed for each layer in a plurality of layers and between layers.

【0013】すなわち、上層10及び下層12に、同一
層内に相互に異なる地点間の搬送物の搬送のための層内
経路(P21、P22、P11、P12)がそれぞれ構成されており、
上層10の層内経路(P21、P22)と下層12の層内経路(P
11、P12)との間には、搬送物の他層間の搬送のための複
数の層間経路(I1-I4)が連結されている。
That is, the upper layer 10 and the lower layer 12 are respectively provided with intra-layer routes (P21, P22, P11, P12) for transporting the conveyed articles between different points in the same layer,
The intra-layer path (P21, P22) of the upper layer 10 and the intra-layer path (P
11, P12), a plurality of interlayer routes (I1-I4) for transporting the transported product between other layers are connected.

【0014】下層12の層内経路(P11、P12)は、それぞ
れ別途の閉鎖経路で、それぞれ工程設備、計測設備また
は貯蔵部のような設備で搬送物を移送するためのストッ
カーが位置した搬送地点A1、B1、C1及びD1を経
由するようになっている。上層10の層内経路(P21、P2
2)もそれぞれ別途の閉鎖経路で、搬送物の移送のための
ストッカーが位置した、それぞれの搬送地点A2、B
2、C2及びD2を経由するように構成されている。
The intra-layer routes (P11, P12) of the lower layer 12 are separate closed routes, respectively, and are transport points where stockers for transporting the transported products are located by facilities such as process equipment, measuring equipment, or storage units. It passes through A1, B1, C1, and D1. The route in the upper layer 10 (P21, P2
2) is also a separate closed route, each of the transport points A2, B where a stocker for transporting the transported goods was located.
2, C2 and D2.

【0015】ここで、層内経路(P21、P22、P11、P12)は
コンベヤーシステムから形成されることができ、層間経
路(I1-I4) はエレベーターシステムから構成されること
ができる。
Here, the intra-layer paths (P21, P22, P11, P12) can be formed from a conveyor system, and the inter-layer paths (I1-I4) can be formed from an elevator system.

【0016】本発明による実施の形態は図1のように、
二層間に4個の経路が形成されており、各層別に2個の
経路が形成されているが、これは製作者の意図によっ
て、閉鎖経路及び開放経路を含む多層及び多経路に適用
されることができる。
An embodiment according to the present invention is shown in FIG.
Four paths are formed between the two layers, and two paths are formed for each layer. This may be applied to a multilayer and a multi-path including a closed path and an open path according to a manufacturer's intention. Can be.

【0017】上述したとおり、半導体製造ラインの搬送
システムが構成されることによって、特定地点から他地
点にウェーハのような搬送物を搬送するための搬送経路
が多様に選択されることができ、搬送経路の選択は、搬
送経路に付加された負荷量と経路の状態とによって決定
される。
As described above, by configuring the transfer system of the semiconductor manufacturing line, a transfer path for transferring a transfer object such as a wafer from a specific point to another point can be variously selected. The selection of the route is determined by the load applied to the transport route and the status of the route.

【0018】上述した本発明による半導体製造ラインの
搬送システムは、図2に示した搬送経路の設定方法によ
って搬送物が搬送される経路が決定される。このような
搬送物の搬送経路は、各搬送地点であるストッカーが位
置する地点(A1-D1、A2-D2)で決定され、決定された搬送
経路に沿って搬送物が移送されるように、搬送システム
が制御される。そして、搬送物の搬送制御は、ストッカ
ーのコントローラーとメインホストコンピューターとが
インターフェースされながら、図2において決定された
選択された経路によって遂行される。
In the transport system of the semiconductor manufacturing line according to the present invention described above, the route on which the article is transported is determined by the transport route setting method shown in FIG. The transport route of such a transported product is determined at the location where the stocker that is each transport point is located (A1-D1, A2-D2), and the transported product is transported along the determined transport route, The transport system is controlled. Then, the transport control of the transported object is performed by the selected route determined in FIG. 2 while the controller of the stocker and the main host computer are interfaced.

【0019】各地点における搬送物の経路設定に対し
て、図2を参照して具体的に説明する。
The setting of the route of the conveyed article at each point will be specifically described with reference to FIG.

【0020】特定地点で搬送物が発生すると、その搬送
物が搬送される位置が段階S2でまず確認される。搬送
物は、異なる層間または同一層内に搬送される場合に分
類されることができる。層内搬送は特定層に形成された
層内経路の中のいずれか1つが選択及び決定されなけれ
ばならないし、層間搬送は特定層間を連結する層間経路
の中のいずれか1つが選択及び決定されなければならな
い。
When a conveyed object is generated at a specific point, the position where the conveyed object is conveyed is first checked in step S2. Conveyed goods can be classified as being conveyed between different layers or within the same layer. The intra-layer transport must select and determine one of the intra-layer routes formed in the specific layer, and the inter-layer transport must select and determine one of the interlayer routes connecting the specific layers. There must be.

【0021】従って、段階S4で搬送物が層間搬送物で
あれば段階S6を遂行して、層間設定経路が存在するか
をチェックする。ここにおいて層間設定経路は、搬送物
が工程順序を考えて出来るだけ通過しなければならない
層間経路を前以って指定したもので、当該経路に問題点
がなければ層間設定経路を通じて搬送物が移送されるよ
うに搬送が制御される。
Therefore, in step S4, if the conveyed article is an inter-layer conveyed article, step S6 is performed to check whether an inter-layer setting path exists. Here, the interlayer setting route is a route in which the transported product must pass through as much as possible in consideration of the process sequence, and if there is no problem in the route, the transported product is transported through the interlayer setting route. Is controlled so as to be performed.

【0022】従って、搬送物に設定された層間設定経路
があれば、段階S10を遂行して層間設定経路の状況が
チェックされる。チェックされた結果が段階S12で、
当該経路が良好なものと判断されると段階S14を遂行
して、選択された層間経路を最終に決定するかを判断し
て決定する。段階S14で選択経路に決定しなければ、
段階S2に戻り、段階S2から再遂行して、搬送物の移
送経路が決定される。
Therefore, if there is an interlayer setting route set for the conveyed article, step S10 is performed to check the status of the interlayer setting route. The checked result is step S12,
If it is determined that the path is good, step S14 is performed to determine whether to finally determine the selected interlayer path. If the selected route is not determined in step S14,
Returning to step S2, the process is performed again from step S2, and the transfer route of the conveyed object is determined.

【0023】もし、段階S8で判断した結果、搬送物に
特定された層間設定経路が存在しなかったり、段階S1
2で判断した結果、層間設定経路に定められた当該経路
の状態が良好でなければ、段階S18を遂行して、全体
の層間経路(I1-I4) がチェックされる。そして、段階S
20でチェックされた層間経路中で、負荷量に余裕があ
って、経路状態に異常のない層間経路が択一され、段階
S14で択一された経路に層間経路を決定するかを判断
及び決定する。
If it is determined in step S8 that there is no interlayer setting path specified for the conveyed article,
If it is determined in step 2 that the state of the route set in the interlayer setting route is not good, step S18 is performed, and the entire interlayer route (I1-I4) is checked. And stage S
Among the interlayer routes checked in step 20, an interlayer route having a sufficient load amount and having no abnormality in the route state is selected, and it is determined and determined whether to determine the interlayer route as the route selected in step S14. I do.

【0024】上述した段階S6乃至段階S20を通じ
て、搬送物であるウェーハを移送する特定層間経路が決
定される。
Through steps S6 to S20 described above, a specific interlayer path for transferring a wafer as a transfer object is determined.

【0025】そして、搬送物が層内移送物であるか、ま
たは前記の方法によって層間経路が決定されたら、次に
特定層に対する層内経路が決定される。
Then, if the transported object is an intra-layer transported object or an interlayer path is determined by the above-described method, then an intra-layer path for a specific layer is determined.

【0026】すなわち、段階S22を遂行して、搬送物
に特定された層内設定経路が存在するかがチェックされ
る。層内設定経路は、層間設定経路と同様に、搬送物が
工程順序を考えて、できるだけ通過しなければならない
層内経路を前以って指定したもので、当該経路に問題点
がなければ層内設定経路を通じて搬送物が移送されるよ
うに搬送が制御される。
That is, by performing step S22, it is checked whether or not the transported object has the specified intra-layer setting path. The intra-layer setting route, like the inter-layer setting route, specifies in advance the intra-layer route that the conveyed product must pass through as much as possible in consideration of the process order. The transport is controlled so that the transported article is transported through the internal setting path.

【0027】前記搬送物に対する層内設定経路が存在す
ると段階S24を経てS26で、特定された層内設定経
路の状況がチェックされる。層内設定経路の状況が良好
でなければ、段階S30で層内設定経路が確定経路であ
るかを判断する。確定経路は、特定された経路の状況に
関係なく、必ず当該経路を通過しなければならないよう
に設定されたものである。段階S30で特定された経路
が確定経路S30と判断されると段階S32を遂行し
て、搬送物を搬送する経路を確定経路に指定された層内
設定経路に決定するかを判断して、搬送物移送経路が決
定される。また、段階S28で層内設定経路に特定され
た経路の状況が良好なものと判断されると段階32を遂
行して、搬送物を搬送する経路を選択された層内経路に
決定するかを判断して、搬送物移送経路が決定される。
If there is an intra-layer setting path for the conveyed object, the status of the specified intra-layer setting path is checked in step S26 through step S24. If the status of the intra-layer set route is not good, it is determined in step S30 whether the intra-layer set route is a confirmed route. The confirmed route is set so that it must pass through the specified route regardless of the status of the specified route. If it is determined that the route specified in step S30 is the determined route S30, step S32 is performed to determine whether the route for transporting the article is determined to be the intra-layer set route designated as the determined route, and An article transfer route is determined. If it is determined in step S28 that the status of the route specified as the intra-layer setting route is good, the process proceeds to step 32 to determine whether to determine the route for transporting the conveyed product as the selected intra-layer route. Judgment is made, and the transfer route of the transported object is determined.

【0028】もし、段階S24で層内設定経路が存在し
なかったり、段階S30で層内設定経路に特定された経
路の状態が良好でなく、その経路が確定経路でなければ
段階S36を遂行して、層内経路全体がチェックされ
る。そして、チェックされた層内経路の中で、搬送量に
余裕がある経路が段階S38で択一され、段階S32を
遂行して、選択された層内経路に搬送物を移送するかが
決定される。
If the intra-layer set route does not exist in step S24, or the state of the route specified as the intra-layer set route in step S30 is not good, and if the route is not a confirmed route, step S36 is performed. The entire intra-layer path is checked. Then, among the checked intra-layer routes, a route having a sufficient transport amount is selected in step S38, and step S32 is performed to determine whether to transfer the article to the selected intra-layer route. You.

【0029】段階S32で選択された層内経路を決定す
ると当該経路に搬送物が移送され、選択された層内経路
を選択しなければ、段階S2に戻り、段階S2から経路
設定動作が再遂行される。
When the intra-layer route selected in step S32 is determined, the article is transferred to the selected route, and if the selected intra-layer route is not selected, the process returns to step S2, and the route setting operation is performed again from step S2. Is done.

【0030】従って、特定位置から他位置に搬送物を搬
送する最適の搬送経路が、層内及び層間に形成された経
路の中から選択され、選択された経路に搬送物が移送さ
れる。
Therefore, an optimal transport path for transporting the transported article from the specific position to another location is selected from the paths formed in the layers and between the layers, and the transported article is transported to the selected path.

【0031】例えば、図1において、搬送物が下層12
のA1地点から、上層のA2地点に搬送される場合を説
明すると、下記のとおりである。
For example, in FIG.
The case where the sheet is conveyed from the point A1 to the point A2 in the upper layer will be described below.

【0032】搬送物に対して、上層10と下層12との
層内設定経路と確定経路が設定されていない状態であれ
ば、層間及び層内の各経路の負荷量と状態とをチェック
して、最適の経路が選択される。
If the in-layer set route and the fixed route of the upper layer 10 and the lower layer 12 are not set for the transported material, the load amount and state of each route between the layers and in the layer are checked. , The optimal route is selected.

【0033】そして、搬送物に対して、層内経路P11
を通じて、D1を経てからA2へ移送される経路が確定
経路に設定された場合は、必ずこの経路を通じて搬送物
が移送されるように設定され、それによって、搬送物は
当該経路が正常状態の場合は移送が遂行されるが、負荷
量が多い場合や、異常が発生して移送が難しくなった場
合は待機処理される。
Then, the in-layer route P11
When the route to be transferred to A2 after passing through D1 is set as a fixed route, the transported product is always set to be transported through this route, so that the transported product is in a normal state. The transfer is performed, but when the load is large or when the transfer becomes difficult due to an abnormality, a standby process is performed.

【0034】このような過程で、搬送物に対する層間経
路I4に選択され、層内経路が下層12のP11及びD
1が選択されると、搬送物は指定された経路を通じて、
上層10に搬送物が移送される。そして、搬送物に対し
て、上層10の層内経路が更に指定されてA2地点まで
移送される。
In such a process, the interlayer path I4 for the conveyed article is selected, and the intra-layer paths P11 and D11 of the lower layer 12 are selected.
If 1 is selected, the goods will be transported through the designated route
The transported material is transferred to the upper layer 10. Then, the in-layer route of the upper layer 10 is further specified for the transported article, and the transported article is transported to the point A2.

【0035】従って、搬送物は同一層間の移送のため
に、最適の多様な経路が選択されて、これを通じて移送
される。層内経路は各経路別に均等な負荷をもち、そし
て搬送物は、最短距離及び最少時間で、決定された経路
に沿って移送される。更に、層間の移送も同様に、多様
な経路を通じて均等な負荷量で行える。
Therefore, the transported article is transported through the various paths selected for optimal transport between the same layers. The intra-layer path has an equal load on each path, and the conveyed goods are transported along the determined path with the shortest distance and the shortest time. In addition, the transfer between layers can also be performed with a uniform load through various routes.

【0036】また、層内及び層間の搬送時に、搬送され
る前に、搬送される経路がチェックされるので、効率的
な移送が行えるように経路が選択できる。
In addition, since the route to be transported is checked before transport in the layer and between layers, the route can be selected so that efficient transport can be performed.

【0037】以上において本発明は、記載された具体例
に対してのみ詳細に説明したが、本発明の技術思想範囲
内で、多様な変形及び修正が可能であることは、当業者
によって明らかなものであり、このような変形及び修正
が、添付された特許請求範囲に属することは当然なもの
である。
Although the present invention has been described in detail only with respect to the specific examples described, it will be apparent to those skilled in the art that various changes and modifications can be made within the technical idea of the present invention. It is to be understood that such changes and modifications fall within the scope of the appended claims.

【0038】[0038]

【発明の効果】以上説明したように、第1の発明による
半導体製造ラインの搬送経路の設定方法は、搬送物が層
間搬送物であると搬送経路が設定されたかを確認し、当
該経路の状況が良好であると設定された経路に層間搬送
経路を決定する第1段階と、前記搬送経路が設定されな
かったり、当該搬送経路が設定されたとしても当該経路
の状況が良好でなければ、全体の層間経路をチェックし
て良好で搬送量の余裕がある経路を択一し、層間搬送経
路に決定する第2段階と、前記搬送物が層内の搬送物で
あると層内搬送経路が設定されており、当該経路の状況
が良好であると設定された経路に搬送経路を決定する第
3段階と、層内搬送の設定された経路の状況が良好でな
く、当該設定された経路が確定経路であると当該設定さ
れた経路を層内搬送経路に決定する第4段階と、層内搬
送経路が設定されない状態であるか、または層内搬送の
設定された経路が良好でなく、かつ、当該設定された経
路が確定経路でなければ、全体の層内経路をチェックし
て搬送量の余裕のある経路の中から択一し、層内搬送経
路に決定する第5段階とを含むので、搬送物は同一層間
の移送のために、最適の多様な経路が選択され、これを
通じて移送される。また、層間の移送も同様に、多様な
経路を通じて均等な負荷量で行える。また、層内及び層
間の搬送時に、搬送される前に、搬送される経路がチェ
ックされるので、効率的な移送が行えるように経路が選
択できる。
As described above, the method for setting a transfer route of a semiconductor manufacturing line according to the first invention confirms whether a transfer route has been set when a transfer object is an interlayer transfer object, and checks the status of the transfer route. A first step of determining an interlayer transport route to a route set as good, and if the transport route is not set, or if the status of the route is not good even if the transport route is set, the entire The second stage of checking the interlayer route of the vehicle and selecting a route having a good and sufficient transport amount and determining the interlayer transport route, and setting the transport route in the layer when the transported material is a transported material in the layer. And the third stage of determining a transport route to a route that is set to be favorable in the route, and the status of the route set in intra-layer transport is not good and the set route is determined. If the route is set, the set route The fourth step of determining the route, and if the intra-layer transport route is not set or the intra-layer transport set route is not good and the set route is not a fixed route, And the fifth stage of checking the intra-layer route and selecting from the routes having a sufficient transport amount and determining the intra-layer transport route. Various routes are selected and transported through. In addition, the transfer between layers can be similarly performed with a uniform load through various routes. In addition, since the route to be transported is checked before and during transport between layers and between layers, the route can be selected so that efficient transport can be performed.

【図面の簡単な説明】[Brief description of the drawings]

【図1】本発明による半導体製造ラインの搬送システム
の実施の形態を示す模式図である。
FIG. 1 is a schematic diagram showing an embodiment of a semiconductor manufacturing line transfer system according to the present invention.

【図2】本発明による半導体製造ラインの搬送経路設定
方法の実施の形態を示す流れ図である。
FIG. 2 is a flowchart showing an embodiment of a method for setting a transfer route of a semiconductor manufacturing line according to the present invention.

【図3】本発明による半導体製造ラインの搬送経路設定
方法の実施の形態を示す流れ図である。
FIG. 3 is a flowchart showing an embodiment of a method for setting a transfer route of a semiconductor manufacturing line according to the present invention.

【符号の説明】[Explanation of symbols]

10 上層 12 下層 A1〜D2 搬送地点 I1〜I4 層間経路 P11,P12,P21,P22 層内経路 10 Upper layer 12 Lower layer A1 to D2 Transport point I1 to I4 Interlayer route P11, P12, P21, P22 Intralayer route

───────────────────────────────────────────────────── フロントページの続き (56)参考文献 特開 昭60−84819(JP,A) 特開 昭63−62345(JP,A) 特開 昭50−85076(JP,A) 特開 平1−257345(JP,A) ──────────────────────────────────────────────────続 き Continuation of the front page (56) References JP-A-60-84819 (JP, A) JP-A-63-62345 (JP, A) JP-A-50-85076 (JP, A) JP-A-1- 257345 (JP, A)

Claims (1)

(57)【特許請求の範囲】(57) [Claims] 【請求項1】 上層及び下層に同一層内に相互に異なる
地点間の搬送物の搬送のための層内経路がそれぞれ構成
され、当該上層の層内経路と下層の層内経路との間には
複数の搬送地点が設置され、当該搬送物を層内及び層間
に搬送される搬送経路を設定する半導体製造ラインの搬
送経路の設定方法において、 前記搬送物が層間搬送物であると搬送経路が設定された
かを確認し、当該経路の状況が良好であると設定された
経路に層間搬送経路を決定する第1段階と、 前記搬送経路が設定されなかったり、当該搬送経路が設
定されたとしても当該経路の状況が良好でなければ、全
体の層間経路をチェックして良好で搬送量の余裕がある
経路を択一し、層間搬送経路に決定する第2段階と、 前記搬送物が層内の搬送物であると層内搬送経路が設定
されており、当該経路の状況が良好であると設定された
経路に搬送経路を決定する第3段階と、 層内搬送の設定された経路の状況が良好でなく、当該設
定された経路が確定経路であると当該設定された経路を
層内搬送経路に決定する第4段階と、 層内搬送経路が設定されない状態であるか、または層内
搬送の設定された経路が良好でなく、かつ、当該設定さ
れた経路が確定経路でなければ、全体の層内経路をチェ
ックして搬送量の余裕のある経路の中から択一し、層内
搬送経路に決定する第5段階と、 を含むことを特徴とする半導体製造ラインの搬送経路の
設定方法。
An upper layer and a lower layer each have an intra-layer path for transporting a conveyed article between different points in the same layer, and a path between the upper layer and the lower layer in the same layer. A plurality of transfer points are installed, and in the method of setting a transfer path of the semiconductor manufacturing line for setting a transfer path for transferring the transfer object in the layer and between the layers, the transfer path is determined when the transfer object is an interlayer transfer object. A first step of checking whether the route has been set, and determining an interlayer transport route for the route that is set to have a favorable condition for the route; and even if the transport route is not set or the transport route is set. If the status of the route is not good, the entire interlayer route is checked, and a route having a good and sufficient transport amount is selected, and a second stage is determined as the interlayer transport route. The transport route within the layer is set if the And the third stage of determining a transport route to a route that is set to be good in the route, and the status of the route set in the layer is not good and the set route is determined. A fourth step of determining the set route as the intra-layer transport route if the route is a route, and the intra-layer transport route is not set or the intra-layer transport set route is not good, and If the set route is not a fixed route, a fifth step of checking the entire intra-layer route and selecting from routes having a sufficient transport amount and determining the intra-layer transport route is included. A method of setting a transfer route of a semiconductor manufacturing line, characterized by the following.
JP9086696A 1996-09-17 1997-04-04 Method of setting transfer route of semiconductor manufacturing line Expired - Fee Related JP2828436B2 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
KR1996-40443 1996-09-17
KR1019960040443A KR100252208B1 (en) 1996-09-17 1996-09-17 Transfer system in semiconductor manufacturing lines and a method for determining transfer path

Publications (2)

Publication Number Publication Date
JPH10107123A JPH10107123A (en) 1998-04-24
JP2828436B2 true JP2828436B2 (en) 1998-11-25

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Country Status (3)

Country Link
JP (1) JP2828436B2 (en)
KR (1) KR100252208B1 (en)
TW (1) TW366518B (en)

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5458633B2 (en) * 2008-06-20 2014-04-02 株式会社Ihi Processing equipment and transfer control method
CN113023357B (en) * 2021-04-14 2022-06-07 湖南三安半导体有限责任公司 Pasting device

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5337622B2 (en) * 1973-12-05 1978-10-11
JPS6084819A (en) * 1983-10-14 1985-05-14 Mitsubishi Electric Corp Semiconductor manufacturing apparatus
JPS6362345A (en) * 1986-09-03 1988-03-18 Fujitsu Ltd Wafer distributing and conveying mechanism
JPH01257345A (en) * 1988-04-07 1989-10-13 Oki Electric Ind Co Ltd Automatic transfer apparatus for semiconductor wafer
JP3332967B2 (en) * 1992-10-29 2002-10-07 沖電気工業株式会社 Automatic transfer system and automatic transfer method

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KR19980021564A (en) 1998-06-25
TW366518B (en) 1999-08-11
JPH10107123A (en) 1998-04-24
KR100252208B1 (en) 2000-04-15

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