JPH10107123A - Transfer system for semiconductor production line and method for setting transfer route - Google Patents

Transfer system for semiconductor production line and method for setting transfer route

Info

Publication number
JPH10107123A
JPH10107123A JP9086696A JP8669697A JPH10107123A JP H10107123 A JPH10107123 A JP H10107123A JP 9086696 A JP9086696 A JP 9086696A JP 8669697 A JP8669697 A JP 8669697A JP H10107123 A JPH10107123 A JP H10107123A
Authority
JP
Japan
Prior art keywords
route
layer
transport
intra
transported
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP9086696A
Other languages
Japanese (ja)
Other versions
JP2828436B2 (en
Inventor
Daen Cho
兌 遠 張
Hanten Boku
範 天 朴
Jinki In
仁 煕 尹
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Samsung Electronics Co Ltd
Original Assignee
Samsung Electronics Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Samsung Electronics Co Ltd filed Critical Samsung Electronics Co Ltd
Publication of JPH10107123A publication Critical patent/JPH10107123A/en
Application granted granted Critical
Publication of JP2828436B2 publication Critical patent/JP2828436B2/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • GPHYSICS
    • G05CONTROLLING; REGULATING
    • G05BCONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
    • G05B19/00Programme-control systems
    • G05B19/02Programme-control systems electric
    • G05B19/418Total factory control, i.e. centrally controlling a plurality of machines, e.g. direct or distributed numerical control [DNC], flexible manufacturing systems [FMS], integrated manufacturing systems [IMS], computer integrated manufacturing [CIM]
    • G05B19/4189Total factory control, i.e. centrally controlling a plurality of machines, e.g. direct or distributed numerical control [DNC], flexible manufacturing systems [FMS], integrated manufacturing systems [IMS], computer integrated manufacturing [CIM] characterised by the transport system
    • GPHYSICS
    • G05CONTROLLING; REGULATING
    • G05BCONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
    • G05B19/00Programme-control systems
    • G05B19/02Programme-control systems electric
    • G05B19/418Total factory control, i.e. centrally controlling a plurality of machines, e.g. direct or distributed numerical control [DNC], flexible manufacturing systems [FMS], integrated manufacturing systems [IMS], computer integrated manufacturing [CIM]
    • G05B19/41865Total factory control, i.e. centrally controlling a plurality of machines, e.g. direct or distributed numerical control [DNC], flexible manufacturing systems [FMS], integrated manufacturing systems [IMS], computer integrated manufacturing [CIM] characterised by job scheduling, process planning, material flow

Abstract

PROBLEM TO BE SOLVED: To transfer an object to be transferred in the shortest time to the destination by forming a plurality of transfer routes in the same layer and between the layers in a semiconductor production line and referring the quantity of load by respective transfer route. SOLUTION: A transfer system for semiconductor production line to transfer an object to be transferred to the specified point, is provided with at least one or more interlayer routes 11, 12, 13, and 14 by which at least one or more intra-layer routes P11, P12, P21, and P22 passing through a plurality of transfer points in the same layer and the specific transfer positions in the intra-layer routes of layers different from each other are connected with each other. Thus, the obejct can be transferred in the layer and between the layers through the routes P11, P12, P21, and P22 and the routes I1, I2, I3, and I4.

Description

【発明の詳細な説明】DETAILED DESCRIPTION OF THE INVENTION

【0001】[0001]

【発明の属する技術分野】本発明は、半導体製造ライン
の搬送システム及び搬送経路の設定方法に関するもの
で、より詳細には、半導体製造ラインの同一層内及び層
間に、複数の搬送経路を形成し、各経路別の負荷量を参
照して、目的地まで最短時間内に移送物の搬送が行われ
るように改善させた半導体製造ラインの搬送システム及
び搬送経路の設定方法に関する。
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a transfer system for a semiconductor manufacturing line and a method for setting a transfer route. More specifically, the present invention relates to a method for forming a plurality of transfer routes within the same layer and between layers of a semiconductor manufacturing line. The present invention also relates to a semiconductor manufacturing line transfer system and a transfer path setting method in which a transfer object is transferred within a shortest time to a destination with reference to a load amount for each path.

【0002】[0002]

【従来の技術】通常、半導体製造装置を製造する製造ラ
インには、工程、計測及び制御等の多様な用途を有する
設備が所定のレイアウトで配置されており、これらの中
で工程設備間、計測設備間及び工程設備と計測設備間に
は、工程を遂行するために、中間製造物であるウェーハ
の搬送が行われる。
2. Description of the Related Art Usually, equipment having various uses such as process, measurement and control is arranged in a predetermined layout on a manufacturing line for manufacturing semiconductor manufacturing equipment. Wafers, which are intermediate products, are transported between equipment and between processing equipment and measurement equipment in order to perform a process.

【0003】ある一の設備から他の設備へのウェーハの
搬送は、通常作業者の手作業によって行われるが、自動
化された工程では自動搬送システムによって行われる。
最近の物流量が多くなるにつれて、自動搬送システムが
工場内部の全体物流のために多く導入されている。
[0003] The transfer of wafers from one facility to another is usually performed manually by an operator, but in an automated process is performed by an automatic transport system.
With the recent increase in mass flow, more and more automatic transport systems have been introduced for overall logistics inside factories.

【0004】従来の半導体製造ラインの自動搬送システ
ムは、おおよそ特定層に限定された開または閉の経路上
に、搬送物を押し出し方式で搬送するように構成されて
いた。
A conventional automatic transfer system of a semiconductor manufacturing line is configured to transfer a conveyed product on an open or closed path limited to a specific layer by an extrusion method.

【0005】従って、経路中間の一地点で負荷量が多く
なるか、または故障が発生されると物流の流れが円滑に
ならなくなり、全体的な搬送が円滑に遂行されなかっ
た。
[0005] Therefore, if the load increases or a failure occurs at one point in the middle of the route, the flow of the physical distribution is not smooth, and the entire transport is not smoothly performed.

【0006】特に、搬送物の搬送が遅延されると中間製
造段階のウェーハが大気に露出される時間が増加され
て、製品の汚染や品質が低下する場合があった。
In particular, if the transport of the transported product is delayed, the time during which the wafer in the intermediate manufacturing stage is exposed to the air is increased, and the contamination and quality of the product may be reduced.

【0007】従って、全体の半導体製造ラインの搬送効
率が低下され、半導体装置の生産性が低下される問題点
があった。
Accordingly, there has been a problem that the transfer efficiency of the entire semiconductor manufacturing line is reduced and the productivity of the semiconductor device is reduced.

【0008】[0008]

【発明が解決しようとする課題】本発明の目的は、層内
と層間とにそれぞれ複数個の経路を形成させて、所望す
る特定地点に移送物を最短時間内に搬送するための半導
体製造ラインの搬送システムを提供することである。
SUMMARY OF THE INVENTION It is an object of the present invention to provide a semiconductor manufacturing line for forming a plurality of paths between layers and between layers to transport a conveyed product to a desired specific point within a minimum time. Is to provide a transport system.

【0009】本発明の他の目的は、層内及び層間の複数
個の経路を通じて移送物を搬送する前に、既に層内経路
と層間経路との負荷量及び状態をチェックして、移送物
を円滑に搬送するための半導体製造ラインの搬送経路の
設定方法を提供することである。
Another object of the present invention is to check the load and state of the intra-layer path and the interlayer path before transporting the transported article through a plurality of paths in the layer and between the layers, and to determine the load. An object of the present invention is to provide a method of setting a transfer route of a semiconductor manufacturing line for transferring a semiconductor device smoothly.

【0010】[0010]

【課題を解決するための手段】前記の目的を達成するた
めに、請求項1記載の第1の発明による半導体製造ライ
ンの搬送システムは、所定の搬送地点に搬送物を搬送さ
せるための半導体製造ラインの搬送システムにおいて、
同一層内に位置した複数の搬送地点を経由する、少なく
とも1つ以上の層内経路及び相互に異なる層の層内経路
の特定搬送位置の間を連結する、少なくとも1つ以上の
層間経路を備えることによって、前記層内経路及び層間
経路を通じて、搬送物が層内及び層間搬送されるように
構成されることを要旨とする。従って、層内と層間とに
それぞれ複数個の経路を形成させて、所望する特定地点
に移送物を最短時間内に搬送できる。
According to a first aspect of the present invention, there is provided a semiconductor manufacturing line transfer system for transferring a transferred object to a predetermined transfer point. In the line transport system,
It has at least one or more interlayer paths connecting at least one or more intra-layer paths and specific transport positions of intra-layer paths of different layers via a plurality of transport points located in the same layer. In this case, the object is to be configured so that the conveyed article is conveyed in the layer and between layers through the intra-layer path and the inter-layer path. Therefore, a plurality of paths are formed between the layers and between the layers, and the transported object can be transported to a desired specific point within the shortest time.

【0011】請求項2記載の第2の発明は、層内及び層
間に複数個の搬送経路が形成された半導体製造ラインの
搬送経路設定方法において、搬送物が層間搬送物である
と層間設定経路の可否および全体の層間経路状況を参照
して、前記搬送物の搬送経路に搬送する余裕のある層間
経路を決定する第1段階と、前記搬送物が層内の搬送物
であると層内の設定経路の可否および全体の層内経路状
況を参照して、前記搬送物の搬送経路に搬送する余裕の
ある層内経路を設定し、前記搬送物の確定経路が存在す
ると前記確定経路に層内経路を決定する第2段階とを含
むことを要旨とする。従って、層内及び層間の複数個の
経路を通じて移送物を搬送する前に、既に層内経路と層
間経路との負荷量及び状態をチェックして、移送物を円
滑に搬送できる。
According to a second aspect of the present invention, there is provided a method for setting a transfer route of a semiconductor manufacturing line in which a plurality of transfer routes are formed within a layer and between layers. A first step of determining an interlayer route that has room to be transported to the transport route of the transported product with reference to the availability of the transport route and the overall interlayer route status; With reference to the availability of the set route and the entire intra-layer route status, an intra-layer route is set that has room to convey to the conveyance route of the conveyed product. And a second step of determining a route. Therefore, before the transported object is transported through the plurality of paths in the layer and between the layers, the load and the state of the intra-layer path and the interlayer path are already checked, and the transported article can be transported smoothly.

【0012】請求項3記載の第3の発明は、前記第1段
階は、搬送物が層間搬送物であると搬送経路が設定され
たかを確認し、当該経路の状況が良好であると設定され
た経路に層間搬送経路を決定する第3段階と、搬送経路
が設定されなかったり、搬送経路が設定されたとしても
当該経路の状況が良好でなければ、全体の層間経路をチ
ェックして良好で搬送量の余裕がある経路を択一し、層
間搬送経路に決定する第4段階とを含むことを要旨とす
る。従って、搬送物は同一層間の移送のために、最適の
多様な経路が選択され、これを通じて移送される。ま
た、層間の移送も同様に、多様な経路を通じて均等な負
荷量で行える。また、層内及び層間の搬送時に、搬送さ
れる前に、搬送される経路がチェックされるので、効率
的な移送が行えるように経路が選択できる。
According to a third aspect of the present invention, in the first step, it is determined whether or not the transport route is set if the transported product is an interlayer transported product, and the status of the route is determined to be good. The third step of determining the interlayer transport route for the route that has been set, and if the transport route is not set, or if the status of the route is not good even if the transport route is set, the entire interlayer route is checked and determined to be good. The gist of the present invention includes a fourth step of selecting a route having a sufficient transport amount and determining the route as an interlayer transport route. Accordingly, a variety of optimal paths are selected for transport between the same layers and transported therethrough. In addition, the transfer between layers can be similarly performed with a uniform load through various routes. In addition, since the route to be transported is checked before and during transport between layers and between layers, the route can be selected so that efficient transport can be performed.

【0013】請求項4記載の第4の発明は、前記第2段
階は、層内搬送経路が設定されており、当該経路の状況
が良好であると設定された経路に搬送経路を決定する第
5段階と、層内搬送が設定された経路の状況が良好でな
く、前記搬送経路が確定経路であると前記設定経路を層
内搬送経路に決定する第6段階と、層内搬送経路が設定
されない状態であるか、または層内搬送が設定された経
路が確定経路に定めていない状態で当該設定経路の状態
が良好でなければ、全体の層内経路をチェックして、搬
送量の余裕のある経路の中から択一し、層内搬送経路に
決定する第7段階とを含むことを要旨とする。従って、
層内経路は各経路別に均等な負荷をもち、そして搬送物
は、最短距離及び最少時間で、決定された経路に沿って
移送される。また、層内及び層間の搬送時に、搬送され
る前に、搬送される経路がチェックされるので、効率的
な移送が行えるように経路が選択できる。
According to a fourth aspect of the present invention, in the second step, the intra-layer transport route is set, and the transport route is determined to be the route set to be in good condition. 5th step, a 6th step of determining the set path as the intra-layer transport path when the state of the path on which the intra-layer transport is set is not good and the transport path is a confirmed path, and setting the intra-layer transport path If the state of the set route is not good or the route for which intra-layer transport is set is not defined as a confirmed route and the status of the set route is not good, the entire intra-layer route is checked and the transport amount has a margin. A seventh step of selecting from a certain route and determining the intra-layer transport route. Therefore,
The intra-layer path has an equal load on each path, and the conveyed goods are transported along the determined path with the shortest distance and the shortest time. In addition, since the route to be transported is checked before and during transport between layers and between layers, the route can be selected so that efficient transport can be performed.

【0014】[0014]

【発明の実施の形態】以下、図面を用いて本発明の実施
の形態を詳細に説明する。
Embodiments of the present invention will be described below in detail with reference to the drawings.

【0015】図1を参照すると、本発明による半導体製
造ラインの搬送システムの実施の形態は、複数層に各層
別及び層間に複数の搬送経路が構成されている。
Referring to FIG. 1, in an embodiment of a semiconductor manufacturing line transfer system according to the present invention, a plurality of transfer paths are formed for each layer in a plurality of layers and between layers.

【0016】すなわち、上層10及び下層12に、同一
層内に相互に異なる地点間の搬送物の搬送のための層内
経路(P21、P22、P11、P12)がそれぞれ構成されており、
上層10の層内経路(P21、P22)と下層12の層内経路(P
11、P12)との間には、搬送物の他層間の搬送のための複
数の層間経路(I1-I4)が連結されている。
That is, the upper layer 10 and the lower layer 12 are respectively provided with intra-layer routes (P21, P22, P11, P12) for transporting a conveyed article between different points in the same layer,
The intra-layer path (P21, P22) of the upper layer 10 and the intra-layer path (P
11, P12), a plurality of interlayer routes (I1-I4) for transporting the transported product between other layers are connected.

【0017】下層12の層内経路(P11、P12)は、それぞ
れ別途の閉鎖経路で、それぞれ工程設備、計測設備また
は貯蔵部のような設備で搬送物を移送するためのストッ
カーが位置した搬送地点A1、B1、C1及びD1を経
由するようになっている。上層10の層内経路(P21、P2
2)もそれぞれ別途の閉鎖経路で、搬送物の移送のための
ストッカーが位置した、それぞれの搬送地点A2、B
2、C2及びD2を経由するように構成されている。
The intra-layer paths (P11, P12) of the lower layer 12 are separate closed paths, respectively, and are transport points where stockers for transporting the articles are transported by equipment such as process equipment, measuring equipment, or storage units. It passes through A1, B1, C1, and D1. The route in the upper layer 10 (P21, P2
2) is also a separate closed route, each of the transport points A2, B where a stocker for transporting the transported goods was located.
2, C2 and D2.

【0018】ここで、層内経路(P21、P22、P11、P12)は
コンベヤーシステムから形成されることができ、層間経
路(I1-I4) はエレベーターシステムから構成されること
ができる。
Here, the intra-layer paths (P21, P22, P11, P12) can be formed from a conveyor system, and the inter-layer paths (I1-I4) can be formed from an elevator system.

【0019】本発明による実施の形態は図1のように、
二層間に4個の経路が形成されており、各層別に2個の
経路が形成されているが、これは製作者の意図によっ
て、閉鎖経路及び開放経路を含む多層及び多経路に適用
されることができる。
An embodiment according to the present invention is shown in FIG.
Four paths are formed between the two layers, and two paths are formed for each layer. This may be applied to a multilayer and a multi-path including a closed path and an open path according to a manufacturer's intention. Can be.

【0020】上述したとおり、半導体製造ラインの搬送
システムが構成されることによって、特定地点から他地
点にウェーハのような搬送物を搬送するための搬送経路
が多様に選択されることができ、搬送経路の選択は、搬
送経路に付加された負荷量と経路の状態とによって決定
される。
As described above, by configuring the transfer system of the semiconductor manufacturing line, a transfer path for transferring a transfer object such as a wafer from a specific point to another point can be variously selected. The selection of the route is determined by the load applied to the transport route and the status of the route.

【0021】上述した本発明による半導体製造ラインの
搬送システムは、図2に示した搬送経路の設定方法によ
って搬送物が搬送される経路が決定される。このような
搬送物の搬送経路は、各搬送地点であるストッカーが位
置する地点(A1-D1、A2-D2)で決定され、決定された搬送
経路に沿って搬送物が移送されるように、搬送システム
が制御される。そして、搬送物の搬送制御は、ストッカ
ーのコントローラーとメインホストコンピューターとが
インターフェースされながら、図2において決定された
選択された経路によって遂行される。
In the above-described transport system for a semiconductor manufacturing line according to the present invention, the route on which the article is transported is determined by the transport route setting method shown in FIG. The transport route of such a transported product is determined at the location where the stocker that is each transport point is located (A1-D1, A2-D2), and the transported product is transported along the determined transport route, The transport system is controlled. Then, the transport control of the transported object is performed by the selected route determined in FIG. 2 while the controller of the stocker and the main host computer are interfaced.

【0022】各地点における搬送物の経路設定に対し
て、図2を参照して具体的に説明する。
The setting of the route of the conveyed article at each point will be specifically described with reference to FIG.

【0023】特定地点で搬送物が発生すると、その搬送
物が搬送される位置が段階S2でまず確認される。搬送
物は、異なる層間または同一層内に搬送される場合に分
類されることができる。層内搬送は特定層に形成された
層内経路の中のいずれか1つが選択及び決定されなけれ
ばならないし、層間搬送は特定層間を連結する層間経路
の中のいずれか1つが選択及び決定されなければならな
い。
When a conveyed object is generated at a specific point, the position where the conveyed object is conveyed is first checked in step S2. Conveyed goods can be classified as being conveyed between different layers or within the same layer. The intra-layer transport must select and determine one of the intra-layer routes formed in the specific layer, and the inter-layer transport must select and determine one of the interlayer routes connecting the specific layers. There must be.

【0024】従って、段階S4で搬送物が層間搬送物で
あれば段階S6を遂行して、層間設定経路が存在するか
をチェックする。ここにおいて層間設定経路は、搬送物
が工程順序を考えて出来るだけ通過しなければならない
層間経路を前以って指定したもので、当該経路に問題点
がなければ層間設定経路を通じて搬送物が移送されるよ
うに搬送が制御される。
Therefore, if the transported article is an interlayer transported article in step S4, step S6 is performed to check whether an interlayer setting path exists. Here, the interlayer setting route is a route in which the transported product must pass through as much as possible in consideration of the process sequence, and if there is no problem in the route, the transported product is transported through the interlayer setting route. Is controlled so as to be performed.

【0025】従って、搬送物に設定された層間設定経路
があれば、段階S10を遂行して層間設定経路の状況が
チェックされる。チェックされた結果が段階S12で、
当該経路が良好なものと判断されると段階S14を遂行
して、選択された層間経路を最終に決定するかを判断し
て決定する。段階S14で選択経路に決定しなければ、
段階S2に戻り、段階S2から再遂行して、搬送物の移
送経路が決定される。
Therefore, if there is an interlayer setting route set for the conveyed article, step S10 is performed to check the status of the interlayer setting route. The checked result is step S12,
If it is determined that the path is good, step S14 is performed to determine whether to finally determine the selected interlayer path. If the selected route is not determined in step S14,
Returning to step S2, the process is performed again from step S2, and the transfer route of the conveyed object is determined.

【0026】もし、段階S8で判断した結果、搬送物に
特定された層間設定経路が存在しなかったり、段階S1
2で判断した結果、層間設定経路に定められた当該経路
の状態が良好でなければ、段階S18を遂行して、全体
の層間経路(I1-I4) がチェックされる。そして、段階S
20でチェックされた層間経路中で、負荷量に余裕があ
って、経路状態に異常のない層間経路が択一され、段階
S14で択一された経路に層間経路を決定するかを判断
及び決定する。
If it is determined in step S8 that there is no interlayer setting path specified for the conveyed article,
If it is determined in step 2 that the state of the route set in the interlayer setting route is not good, step S18 is performed, and the entire interlayer route (I1-I4) is checked. And stage S
Among the interlayer routes checked in step 20, an interlayer route having a sufficient load amount and having no abnormality in the route state is selected, and it is determined and determined whether to determine the interlayer route as the route selected in step S14. I do.

【0027】上述した段階S6乃至段階S20を通じ
て、搬送物であるウェーハを移送する特定層間経路が決
定される。
Through the above-described steps S6 to S20, a specific interlayer path for transferring a wafer as a transfer object is determined.

【0028】そして、搬送物が層内移送物であるか、ま
たは前記の方法によって層間経路が決定されたら、次に
特定層に対する層内経路が決定される。
Then, if the transported object is an intra-layer transported object, or if an interlayer route is determined by the above-described method, then an intra-layer route for a specific layer is determined.

【0029】すなわち、段階S22を遂行して、搬送物
に特定された層内設定経路が存在するかがチェックされ
る。層内設定経路は、層間設定経路と同様に、搬送物が
工程順序を考えて、できるだけ通過しなければならない
層内経路を前以って指定したもので、当該経路に問題点
がなければ層内設定経路を通じて搬送物が移送されるよ
うに搬送が制御される。
That is, by performing step S22, it is checked whether or not the transported object has the specified intra-layer setting path. The intra-layer setting route, like the inter-layer setting route, specifies in advance the intra-layer route that the conveyed product must pass through as much as possible in consideration of the process order. The transport is controlled so that the transported article is transported through the internal setting path.

【0030】前記搬送物に対する層内設定経路が存在す
ると段階S24を経てS26で、特定された層内設定経
路の状況がチェックされる。層内設定経路の状況が良好
でなければ、段階S30で層内設定経路が確定経路であ
るかを判断する。確定経路は、特定された経路の状況に
関係なく、必ず当該経路を通過しなければならないよう
に設定されたものである。段階S30で特定された経路
が確定経路S30と判断されると段階S32を遂行し
て、搬送物を搬送する経路を確定経路に指定された層内
設定経路に決定するかを判断して、搬送物移送経路が決
定される。また、段階S28で層内設定経路に特定され
た経路の状況が良好なものと判断されると段階32を遂
行して、搬送物を搬送する経路を選択された層内経路に
決定するかを判断して、搬送物移送経路が決定される。
If there is an intra-layer setting path for the conveyed object, the status of the specified intra-layer setting path is checked in step S26 through step S24. If the status of the intra-layer set route is not good, it is determined in step S30 whether the intra-layer set route is a confirmed route. The confirmed route is set so that it must pass through the specified route regardless of the status of the specified route. If it is determined that the route specified in step S30 is the determined route S30, step S32 is performed to determine whether the route for transporting the article is determined to be the intra-layer set route designated as the determined route, and An article transfer route is determined. If it is determined in step S28 that the status of the route specified as the intra-layer setting route is good, the process proceeds to step 32 to determine whether to determine the route for transporting the conveyed product as the selected intra-layer route. Judgment is made, and the transfer route of the transported object is determined.

【0031】もし、段階S24で層内設定経路が存在し
なかったり、段階S30で層内設定経路に特定された経
路の状態が良好でなく、その経路が確定経路でなければ
段階S36を遂行して、層内経路全体がチェックされ
る。そして、チェックされた層内経路の中で、搬送量に
余裕がある経路が段階S38で択一され、段階S32を
遂行して、選択された層内経路に搬送物を移送するかが
決定される。
If the intra-layer set route does not exist in step S24 or the state of the route specified as the intra-layer set route in step S30 is not good, and if the route is not a confirmed route, step S36 is performed. The entire intra-layer path is checked. Then, among the checked intra-layer routes, a route having a sufficient transport amount is selected in step S38, and step S32 is performed to determine whether to transfer the article to the selected intra-layer route. You.

【0032】段階S32で選択された層内経路を決定す
ると当該経路に搬送物が移送され、選択された層内経路
を選択しなければ、段階S2に戻り、段階S2から経路
設定動作が再遂行される。
When the intra-layer route selected in step S32 is determined, the article is transferred to the route. If the selected intra-layer route is not selected, the process returns to step S2, and the route setting operation is performed again from step S2. Is done.

【0033】従って、特定位置から他位置に搬送物を搬
送する最適の搬送経路が、層内及び層間に形成された経
路の中から選択され、選択された経路に搬送物が移送さ
れる。
Therefore, an optimum transport path for transporting the transported article from the specific position to another location is selected from the paths formed within the layers and between the layers, and the transported article is transported to the selected path.

【0034】例えば、図1において、搬送物が下層12
のA1地点から、上層のA2地点に搬送される場合を説
明すると、下記のとおりである。
For example, in FIG.
The case where the sheet is conveyed from the point A1 to the point A2 in the upper layer will be described below.

【0035】搬送物に対して、上層10と下層12との
層内設定経路と確定経路が設定されていない状態であれ
ば、層間及び層内の各経路の負荷量と状態とをチェック
して、最適の経路が選択される。
If the in-layer set route and the fixed route of the upper layer 10 and the lower layer 12 are not set for the transported material, the load amount and the state of each route between the layers and in the layer are checked. , The optimal route is selected.

【0036】そして、搬送物に対して、層内経路P11
を通じて、D1を経てからA2へ移送される経路が確定
経路に設定された場合は、必ずこの経路を通じて搬送物
が移送されるように設定され、それによって、搬送物は
当該経路が正常状態の場合は移送が遂行されるが、負荷
量が多い場合や、異常が発生して移送が難しくなった場
合は待機処理される。
Then, the in-layer route P11
When the route to be transferred to A2 after passing through D1 is set as a fixed route, the transported product is always set to be transported through this route, so that the transported product is in a normal state. The transfer is performed, but when the load is large or when the transfer becomes difficult due to an abnormality, a standby process is performed.

【0037】このような過程で、搬送物に対する層間経
路I4に選択され、層内経路が下層12のP11及びD
1が選択されると、搬送物は指定された経路を通じて、
上層10に搬送物が移送される。そして、搬送物に対し
て、上層10の層内経路が更に指定されてA2地点まで
移送される。
In this process, the inter-layer route I4 for the conveyed object is selected, and the intra-layer routes are defined as P11 and D11 of the lower layer 12.
If 1 is selected, the goods will be transported through the designated route
The transported material is transferred to the upper layer 10. Then, the in-layer route of the upper layer 10 is further specified for the transported article, and the transported article is transported to the point A2.

【0038】従って、搬送物は同一層間の移送のため
に、最適の多様な経路が選択されて、これを通じて移送
される。層内経路は各経路別に均等な負荷をもち、そし
て搬送物は、最短距離及び最少時間で、決定された経路
に沿って移送される。更に、層間の移送も同様に、多様
な経路を通じて均等な負荷量で行える。
Therefore, the transported object is transported through a variety of paths that are optimally selected for transport between the same layers. The intra-layer path has an equal load on each path, and the conveyed goods are transported along the determined path with the shortest distance and the shortest time. In addition, the transfer between layers can also be performed with a uniform load through various routes.

【0039】また、層内及び層間の搬送時に、搬送され
る前に、搬送される経路がチェックされるので、効率的
な移送が行えるように経路が選択できる。
In addition, since the route to be transported is checked before being transported in the layer and between layers, the route can be selected so that efficient transport can be performed.

【0040】以上において本発明は、記載された具体例
に対してのみ詳細に説明したが、本発明の技術思想範囲
内で、多様な変形及び修正が可能であることは、当業者
によって明らかなものであり、このような変形及び修正
が、添付された特許請求範囲に属することは当然なもの
である。
Although the present invention has been described in detail only with respect to the specific examples described above, it will be apparent to those skilled in the art that various changes and modifications can be made within the technical idea of the present invention. It is to be understood that such changes and modifications fall within the scope of the appended claims.

【0041】[0041]

【発明の効果】以上説明したように、第1の発明による
半導体製造ラインの搬送システムは、同一層内に位置し
た複数の搬送地点を経由する、少なくとも1つ以上の層
内経路及び相互に異なる層の層内経路の特定搬送位置の
間を連結する、少なくとも1つ以上の層間経路を備える
ことによって、前記層内経路及び層間経路を通じて、搬
送物が層内及び層間搬送されるように構成されるので、
搬送物を移送するための多様な経路が確保され、それに
よって、最適状態の経路が選択及び決定されることによ
って、半導体製造ラインにおける搬送が、最短距離及び
最少時間で効率的に行われる効果がある。
As described above, the transfer system of the semiconductor manufacturing line according to the first invention has at least one or more intra-layer paths and different paths through a plurality of transfer points located in the same layer. By providing at least one or more interlayer paths connecting between specific transport positions of the intra-layer path of the layer, it is configured such that a transported object is transported in the layer and between layers through the intra-layer path and the interlayer path. So
Various routes for transferring the conveyed goods are secured, whereby the optimum route is selected and determined, so that the conveyance in the semiconductor manufacturing line can be efficiently performed in the shortest distance and the shortest time. is there.

【0042】第2の発明は、搬送物が層間搬送物である
と層間設定経路の可否および全体の層間経路状況を参照
して、前記搬送物の搬送経路に搬送する余裕のある層間
経路を決定する第1段階と、前記搬送物が層内の搬送物
であると層内の設定経路の可否および全体の層内経路状
況を参照して、前記搬送物の搬送経路に搬送する余裕の
ある層内経路を設定し、前記搬送物の確定経路が存在す
ると前記確定経路に層内経路を決定する第2段階とを含
むので、層内及び層間の複数個の経路を通じて移送物を
搬送する前に、既に層内経路と層間経路との負荷量及び
状態をチェックして、移送物を円滑に搬送できる。
According to a second aspect of the present invention, when the article is an inter-layer article, an inter-layer path having a margin to be conveyed to the article conveying path is determined by referring to the availability of an inter-layer set path and the entire inter-layer path state. A first step to determine whether or not the conveyed article is a conveyed article in a layer, referring to the availability of a set path in the layer and the entire intra-layer path state, and referring to a layer that has room to convey to the conveyed path of the conveyed article. Setting an inner route, and determining the intra-layer route in the confirmed route when the confirmed route of the conveyed product exists, so that the transported product is transported through a plurality of routes in the layer and between the layers. The load and the state of the intra-layer path and the inter-layer path have already been checked, and the transported object can be smoothly transported.

【0043】第3の発明は、前記第1段階は、搬送物が
層間搬送物であると搬送経路が設定されたかを確認し、
当該経路の状況が良好であると設定された経路に層間搬
送経路を決定する第3段階と、搬送経路が設定されなか
ったり、搬送経路が設定されたとしても当該経路の状況
が良好でなければ、全体の層間経路をチェックして、良
好で搬送量の余裕がある経路を択一して、層間搬送経路
に決定する第4段階とを含むので、搬送物は同一層間の
移送のために、最適の多様な経路が選択され、これを通
じて移送される。また、層間の移送も同様に、多様な経
路を通じて均等な負荷量で行える。更に、層内及び層間
の搬送時に、搬送される前に、搬送される経路がチェッ
クされるので、効率的な移送が行えるように経路が選択
できる。
According to a third aspect of the present invention, in the first step, it is determined whether or not a transport route is set as the transported product is an interlayer transported product.
A third step of determining an interlayer transport route to a route that is set to be favorable in the route, and if the transport route is not set or the transport route is set and the route status is not good, , Checking the entire interlayer route, selecting a route that is good and has a sufficient transport amount, and determining the interlayer transport route, so that the transported material is transported between the same layers. An optimal variety of routes are selected and transported through. In addition, the transfer between layers can be similarly performed with a uniform load through various routes. In addition, since the route to be transported is checked before and during transport between layers and between layers, the route can be selected so that efficient transport can be performed.

【0044】第4の発明は、前記第2段階は、層内搬送
経路が設定されており、当該経路の状況が良好であれ
ば、設定された経路に搬送経路を決定する第5段階と、
層内搬送が設定された経路の状況が良好でなく、前記搬
送経路が確定経路であると前記設定経路を層内搬送経路
に決定する第6段階と、層内搬送経路が設定されない状
態であるか、または層内搬送が設定された経路が確定経
路に定めていない状態で当該設定経路の状態が良好でな
ければ、全体の層内経路をチェックして、搬送量の余裕
のある経路の中から択一し、層内搬送経路に決定する第
7段階とを含むので、層内経路は各経路別に均等な負荷
をもち、搬送物は最短距離及び最少時間で、決定された
経路に沿って移送される。また、層内及び層間の搬送時
に、搬送される前に、搬送される経路がチェックされる
ので、効率的な移送が行えるように経路が選択できる。
According to a fourth aspect of the present invention, in the second step, the intra-layer transport route is set, and if the status of the route is good, the fifth stage of determining the transport route to the set route is included;
The sixth stage of determining the set route to be the intra-layer transport route when the status of the route in which intra-layer transport is set is not good and the transport route is a confirmed route, and the state in which the intra-layer transport route is not set. Otherwise, if the route for which intra-layer transport has been set is not defined as a confirmed route and the status of the set route is not good, the entire intra-layer route is checked and a route with a sufficient transport amount is checked. And the seventh step of determining the intra-layer transport path, the intra-layer path has an equal load for each path, and the conveyed object follows the determined path with the shortest distance and the shortest time. Be transported. In addition, since the route to be transported is checked before and during transport between layers and between layers, the route can be selected so that efficient transport can be performed.

【図面の簡単な説明】[Brief description of the drawings]

【図1】本発明による半導体製造ラインの搬送システム
の実施の形態を示す模式図である。
FIG. 1 is a schematic diagram showing an embodiment of a semiconductor manufacturing line transfer system according to the present invention.

【図2】本発明による半導体製造ラインの搬送経路設定
方法の実施の形態を示す流れ図である。
FIG. 2 is a flowchart showing an embodiment of a method for setting a transfer route of a semiconductor manufacturing line according to the present invention.

【図3】本発明による半導体製造ラインの搬送経路設定
方法の実施の形態を示す流れ図である。
FIG. 3 is a flowchart showing an embodiment of a method for setting a transfer route of a semiconductor manufacturing line according to the present invention.

【符号の説明】[Explanation of symbols]

10 上層 12 下層 A1〜D2 搬送地点 I1〜I4 層間経路 P11,P12,P21,P22 層内経路 10 Upper layer 12 Lower layer A1 to D2 Transport point I1 to I4 Interlayer route P11, P12, P21, P22 Intralayer route

Claims (4)

【特許請求の範囲】[Claims] 【請求項1】 所定の搬送地点に搬送物を搬送させるた
めの半導体製造ラインの搬送システムにおいて、 同一層内に位置した複数の搬送地点を経由する、少なく
とも1つ以上の層内経路及び相互に異なる層の層内経路
の特定搬送位置の間を連結する、少なくとも1つ以上の
層間経路を備えることによって、前記層内経路及び層間
経路を通じて、搬送物が層内及び層間搬送されるように
構成されることを特徴とする半導体製造ラインの搬送シ
ステム。
1. A transport system for a semiconductor manufacturing line for transporting a transported article to a predetermined transport point, wherein at least one or more intra-layer routes and a plurality of routes through a plurality of transport points located in the same layer. Providing at least one or more interlayer paths for connecting between specific transport positions of the intra-layer paths of different layers, so that a transported object is transported in the layer and between the layers through the intra-layer path and the interlayer path. A transfer system for a semiconductor manufacturing line.
【請求項2】 層内及び層間に複数個の搬送経路が形成
された半導体製造ラインの搬送経路の設定方法におい
て、 搬送物が層間搬送物であると層間設定経路の可否および
全体の層間経路状況を参照して、前記搬送物の搬送経路
に搬送する余裕のある層間経路を決定する第1段階と、 前記搬送物が層内の搬送物であると層内の設定経路の可
否および全体の層内経路状況を参照して、前記搬送物の
搬送経路に搬送する余裕のある層内経路を設定し、前記
搬送物の確定経路が存在すると前記確定経路に層内経路
を決定する第2段階と、 を含むことを特徴とする半導体製造ラインの搬送経路の
設定方法。
2. A method for setting a transfer route of a semiconductor manufacturing line in which a plurality of transfer routes are formed in a layer and between layers. A first step of determining an interlayer route having room to be transported to the transport route of the transported product, and determining whether or not a set route in the layer can be determined if the transported product is a transported product in the layer and the entire layer. A second step of setting an intra-layer route having a margin to be conveyed to the conveyance route of the conveyed object, and determining an intra-layer route as the definite route when there is a confirmed route for the conveyed product, with reference to the inner route status; A method for setting a transfer route of a semiconductor manufacturing line, comprising:
【請求項3】 前記第1段階は、 搬送物が層間搬送物であると搬送経路が設定されたかを
確認し、当該経路の状況が良好であると設定された経路
に層間搬送経路を決定する第3段階と、 搬送経路が設定されなかったり、搬送経路が設定された
としても当該経路の状況が良好でなければ、全体の層間
経路をチェックして良好で搬送量の余裕がある経路を択
一し、層間搬送経路に決定する第4段階と、 を含むことを特徴とする請求項2記載の半導体製造ライ
ンの搬送経路の設定方法。
3. The first step is to check whether a transport route has been set when the transported product is an interlayer transported product, and to determine an interlayer transport route as a route that has been set to have a favorable condition for the route. In the third stage, if the transport route is not set, or if the status of the route is not good even if the transport route is set, the entire interlayer route is checked and a route that is good and has a sufficient transport amount is selected. The method according to claim 2, further comprising: a fourth step of determining an inter-layer transfer path.
【請求項4】 前記第2段階は、 層内搬送経路が設定されており、当該経路の状況が良好
であると設定された経路に搬送経路を決定する第5段階
と、 層内搬送が設定された経路の状況が良好でなく、前記搬
送経路が確定経路であると前記設定経路を層内搬送経路
に決定する第6段階と、 層内搬送経路が設定されない状態であるか、または層内
搬送が設定された経路が確定経路に定めていない状態で
当該設定経路の状態が良好でなければ、全体の層内経路
をチェックして搬送量の余裕のある経路の中から択一
し、層内搬送経路に決定する第7段階と、 を含むことを特徴とする請求項2記載の半導体製造ライ
ンの搬送経路の設定方法。
4. The second step is a step in which an intra-layer transport route is set, and a fifth stage in which a transport route is determined to be a route set to be in good condition, and the intra-layer transport is set. A sixth step of determining that the set route is an intra-layer transport route if the status of the set route is not good and the transport route is a definite route; or the intra-layer transport route is not set, or If the route for which the transport is set is not defined as the fixed route and the status of the set route is not good, the entire intra-layer route is checked, and a route having a sufficient transport amount is selected, and the route is selected. 7. The method according to claim 2, further comprising: determining an internal transport path.
JP9086696A 1996-09-17 1997-04-04 Method of setting transfer route of semiconductor manufacturing line Expired - Fee Related JP2828436B2 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
KR1019960040443A KR100252208B1 (en) 1996-09-17 1996-09-17 Transfer system in semiconductor manufacturing lines and a method for determining transfer path
KR1996-40443 1996-09-17

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JPH10107123A true JPH10107123A (en) 1998-04-24
JP2828436B2 JP2828436B2 (en) 1998-11-25

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JP2010028090A (en) * 2008-06-20 2010-02-04 Ihi Corp Processing equipment, conveyance control device, and conveyance control method
CN113023357A (en) * 2021-04-14 2021-06-25 湖南三安半导体有限责任公司 Pasting device

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JPS6362345A (en) * 1986-09-03 1988-03-18 Fujitsu Ltd Wafer distributing and conveying mechanism
JPH01257345A (en) * 1988-04-07 1989-10-13 Oki Electric Ind Co Ltd Automatic transfer apparatus for semiconductor wafer

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JP3332967B2 (en) * 1992-10-29 2002-10-07 沖電気工業株式会社 Automatic transfer system and automatic transfer method

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JPS5085076A (en) * 1973-12-05 1975-07-09
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JPS6362345A (en) * 1986-09-03 1988-03-18 Fujitsu Ltd Wafer distributing and conveying mechanism
JPH01257345A (en) * 1988-04-07 1989-10-13 Oki Electric Ind Co Ltd Automatic transfer apparatus for semiconductor wafer

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Publication number Priority date Publication date Assignee Title
JP2010028090A (en) * 2008-06-20 2010-02-04 Ihi Corp Processing equipment, conveyance control device, and conveyance control method
CN113023357A (en) * 2021-04-14 2021-06-25 湖南三安半导体有限责任公司 Pasting device
CN113023357B (en) * 2021-04-14 2022-06-07 湖南三安半导体有限责任公司 Pasting device

Also Published As

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KR100252208B1 (en) 2000-04-15
KR19980021564A (en) 1998-06-25
JP2828436B2 (en) 1998-11-25
TW366518B (en) 1999-08-11

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