JP2806479B2 - Numerical control substrate processing method and apparatus - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION [Industrial Application Field] The present invention relates to a substrate in which the thickness of a substrate changes depending on the position on the substrate surface, and the upper surface of the substrate (or at any desired position on the substrate surface) The present invention relates to a numerical control substrate processing method and a device for processing at a constant depth from the lower surface.

[Conventional technology]

In the case of a substrate, for example, a printed circuit board, as shown in FIG. 2, a glass fiber layer 22 in which glass fibers are woven in a cross shape is positioned at the center of the substrate 21 in the thickness direction, as shown in FIG. There is one in which epoxy layers 23, 23 are interposed and copper foil layers 24, 24 are formed on the upper and lower surfaces thereof.

Then, depending on the IC chip mounted on such a substrate 21, for the heat dissipation, after counterboring for mounting the IC chip, copper plating is performed on the entire inner peripheral surface of the counterbored portion. At this time, since the glass fiber layer 22 has a better ride on the plating than the epoxy layer 23, there is a demand for counterbore processing (see A in the figure) up to the center portion of the glass fiber layer 22.

Conventionally, using a numerically controlled substrate processing device,
There is a known method of spot-facing 21 at a certain depth from its upper surface. This means that the position of the upper surface of the substrate 21 is always detected,
The tool (not shown) is lowered to a position lower by a desired dimension from the detected value.

[Problems to be solved by the invention]

However, such a conventional method has the following problems. That is, in the manufacture of the substrate 21, when the copper foil layers 24, 24 are formed on the upper and lower surfaces of the inner layer portions (layers 22, 23, 23) by heating, the thickness of the substrate depends on the position on the substrate 21 surface. (In general, the inner side of the substrate 21 is thicker and the peripheral side is thinner.
Is usually located at the center in the thickness direction). In the conventional method, when counterbore processing is performed up to the glass fiber layer 22 which is always located at the center of the substrate 21, when the substrate thickness is larger, the thinner substrate thickness is the glass at the center. The resin reached the epoxy layer 23 below the fiber layer 22 (see the portion B in the figure), resulting in processing failure. Conversely, based on the thinner board thickness, the thicker board thickness does not reach the glass fiber layer 22 but only the copper foil layer 24 and epoxy layer 23 above it, resulting in processing failure. Was.

As described above, the prior art does not consider changing the spot facing depth in accordance with a change in the board thickness. At a processing position that is thicker or thinner than the thickness, there is a problem that the spot facing depth is shallow or too deep, respectively.

An object of the present invention is to provide a numerical control substrate processing method and apparatus capable of always processing a desired portion in the thickness direction without being affected by a change in the substrate thickness.

[Means for solving the problem]

The above object is to obtain the substrate thickness at each processing position before the actual processing, and to set a desired ratio (based on the substrate thickness from the upper surface of the substrate to the glass fiber layer in the above example) based on the thickness. This is achieved by performing machining (counterbore machining in the above example) with the value obtained by multiplying by the ratio) as the machining depth.

[Action]

In the above-described example, as described above, the glass fiber layer 22 of the substrate 21 is usually positioned at the center in the thickness direction even if the thickness changes. In the present invention, this glass fiber layer
When counterbore processing is performed up to 22, the plate thickness is determined at each processing position, and the spot facing depth is determined by the ratio of the dimension up to the glass fiber layer 22 to the plate thickness. For this reason, when performing spot facing up to the glass fiber layer 22 arranged at the center in the thickness direction,
If a counterbore depth of 50% is indicated, the counterbore processing can be performed up to the glass fiber layer at the center in the plate thickness direction regardless of the change in the plate thickness. .

〔Example〕

Hereinafter, embodiments of the present invention will be described with reference to the drawings. FIG. 1 is a configuration diagram for explaining one embodiment of a numerical control substrate processing method and apparatus according to the present invention. This first
In the figure, 1 is a bed, 2 is an X and Y table, 3 is a cross rail, and the bed 1 and the cross rail 3 are used as a base, and the X and Y tables 2 are moved back and forth (movement in a direction perpendicular to the plane of the drawing). To move the X axis.

4 is a saddle, 5 is a Z-axis motor, 6 is a Y-axis motor,
Reference numeral 7 denotes a spindle, and 8 denotes a tool. The saddle 4 on which the spindle 7 is mounted is moved left and right by the Y-axis motor 6 (moves in the left-right direction in the figure), and the spindle 7 and the saddle 4 are moved by the Z-axis The tool 8 is moved up and down (moves in the vertical direction in the figure) by 5 to move the Z axis of the tool 8.

The positioning and cutting feed are performed by the X and Y axis movements as described above, and the cutting feed to the counterbore depth is performed by the Z axis movement.

Further, 9 is a position detector for detecting a position in the Z-axis direction,
10 is a pulse converter for converting the linear movement of the detector of the position detector 9 into a pulse number, 11 is a numerical controller, and 21 is the same substrate as in FIG. Here, the numerical control device 11 functions as a general control means as a numerical control device of the numerical control substrate processing apparatus, and is also used as the following means. That is, the thickness of the substrate 21 is calculated from the upper surface position of the X, Y table 2 detected by the position detector 9 and the upper surface position of the substrate 21 placed on the X, Y table 2, and the calculation is performed. Value to the desired ratio that is set in advance, here 50
The calculation means for calculating the machining depth by multiplying by% and the tool control means for lowering the tool 8 to the machining depth thus obtained are also used.

That is, in the present invention, the position of the upper surface of the X, Y table 2 is measured by the position detector 9 in advance, and the value is stored in the numerical controller 11 through the pulse converter 10. Then, the substrate 13
It is set on the X, Y table 2 and processing is performed. At each processing position, the position detector 9 measures the upper surface position of the substrate 21.

At each processing position, the numerical controller 11 calculates the substrate thickness based on the upper surface position data of the substrate 21 measured by the position detector 9 and the already stored upper surface position data (constant value) of the X, Y table 2. Is calculated, and the calculated value is multiplied by a preset desired ratio, here, 50%. Further, the numerical control device 11 feeds the tool 8 in the Z-axis direction while feeding the tool 8 in the Z-axis direction with the 50% multiplied value as the processing depth, and performs the spot facing operation by feeding the X and Y axes in the X and Y table 2.

In the above embodiment, the case where the present invention is applied to spot facing is described, but it is needless to say that the present invention can also be applied to blind hole drilling.

〔The invention's effect〕

According to the present invention, the processing depth, for example, the spot facing depth is determined by the ratio of the desired processing layer position to the substrate plate thickness,
When processing at a desired position, such as the center layer in the thickness direction,
There is an effect that it is possible to prevent the occurrence of processing defects due to a change in the plate thickness.

BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 is a block diagram for explaining an embodiment of the method and apparatus of the present invention, and FIG. 2 is a cross-sectional view of a substrate for explaining problems of the prior art. 1 ... bed, 2 ... X, Y table, 3 ... cross rail, 4 ... saddle, 5 ... Z axis motor, 6 ... Y axis motor, 7 ... spindle, 8 ... tool, 9 ... ... Position detector, 10 ... Pulse converter, 11 ... Numeric control device, 21 ...
Substrate, 22 ... glass fiber layer, 23 ... epoxy layer, 24 ...
Copper foil layer.

──────────────────────────────────────────────────続 き Continuation of the front page (56) References JP-A-63-237838 (JP, A) JP-A-63-232484 (JP, A) JP-A-61-90851 (JP, A) (58) Field (Int.Cl. ⁶ , DB name) B23Q 15/00 H05K 3/00 G05B 19/403

Claims (2)

(57) [Claims] 1. A numerically controlled substrate processing method for processing a substrate using a numerically controlled substrate processing apparatus, comprising:
Measure the upper surface position of the Y table, measure the upper surface position of the substrate placed on the X, Y table for each processing position, calculate the thickness of the substrate for each processing position, and calculate the calculated value. On the other hand, a numerical control board processing method, wherein a value obtained by multiplying a predetermined desired ratio is processed as a processing depth. 2. A position detecting means for measuring an upper surface position of an X, Y table and an upper surface position of a substrate placed on the X, Y table, respectively, and A calculating means for calculating the thickness of the substrate, multiplying the calculated value by a desired ratio set in advance to obtain a processing depth, and a tool for lowering the tool to the processing depth obtained by the calculating means A numerically controlled substrate processing apparatus, comprising: a control unit.