JPH033009A - Numerical control method and device for working substrate - Google Patents

Abstract

PURPOSE:To always attain working up to a required part in the plate thickness direction by using a value obtained by multiplying the plate thickness found out prior to real working by a previously set required ratio as working depth to execute working on each working position. CONSTITUTION:The upper face position of an X-Y table 2 is previously measured by a position detector 9 and stored in a numerical controller 11. A substrate 13 is set up on the X-Y table 2 and the numerical controller 11 calculates the plate thickness by the upper face position data of the base 21 measured by the position controller 9 and the already stored upper position data of the table 2 and multiplies the calculated value by the previously set required ratio. The numerical controller 11 moves the base 21 on the table 2 in the X and Y axis directions and works a spot facing by using the multiplied value as the working depth while moving a tool 8 in the Z axis direction. Consequently, the generation of defective working due to a change in the plate thickness can be prevented.

Description

Detailed Description of the Invention [Industrial Field of Application] The present invention provides a method to always maintain the thickness of the substrate at a desired position on the substrate surface (or The present invention relates to a numerically controlled substrate processing method and apparatus for processing the substrate at a constant depth from the bottom surface.

[Conventional technology]

For reinforcing a substrate, for example a printed circuit board, as shown in FIG. 2, a glass fiber layer 22 made of glass fibers is placed in the center of the substrate 21 in the thickness direction, and a glass fiber layer 22 made of glass fibers is placed on both sides. An epoxy layer 23.23 is interposed,
Some have copper foil layers 24, 24 deposited on their upper and lower surfaces.

Depending on the IC chip to be attached to such a substrate 21, in order to dissipate heat, copper plating is applied to the entire inner circumferential surface of the counterbore after the counterbore for mounting the IC chip is processed. At this time, since the glass fiber layer 22 is more easily coated with the plating than the epoxy layer 23, there is a demand for counterbore processing up to the center of the glass fiber layer 22 (see section A in the figure).

Conventionally, a numerically controlled board processing device is used to process such a board 2.
A method of counterboring 1 at a constant depth from the top surface is known. This is to constantly detect the position of the upper surface of the substrate 21 and lower the tool (not shown) to a position that is a desired dimension lower than the detected value.

[Problem to be solved by the invention]

However, such conventional methods have the following problems. That is, in manufacturing the substrate 21, copper foil layers 24.
When the substrate 24 is heated and formed, the thickness of the substrate becomes the same as that of the substrate 2.
It may change depending on the position on one surface (usually, the inner side of the substrate 21 is thicker and the peripheral side is thinner. Even in this case, the glass fiber layer 22 is usually located at the center in the thickness direction) . In the conventional method, when performing counterbore processing up to the glass fiber layer 22, which is always located in the center of the substrate 21, when the thicker substrate is used as the reference, the thinner substrate is the glass fiber layer in the center. It went beyond the fiber layer 22 and reached the epoxy layer 23 below it (see section B in the figure), resulting in processing defects. On the other hand, if the thinner board is used as a reference, the thicker board will have the glass fiber layer 22.
W4 foil layer 24 and epoxy N23 above it
This resulted in a machining defect.

In this way, the above-mentioned conventional technology does not take into account the fact that the depth of the counterbore changes as the thickness of the board changes. At processing positions where the material is thicker or thinner than the thickness, there is a problem that the counterbore depth is shallow or too deep, respectively.

SUMMARY OF THE INVENTION An object of the present invention is to provide a numerically controlled board processing method and an apparatus therefor, which are not affected by changes in board thickness and are capable of always processing up to a desired portion in the board thickness direction.

[Means to solve the problem]

The above purpose is to obtain the board thickness at each processing position before actual processing, and then use that board thickness as a reference to determine a preset desired ratio (in the above example, the thickness of the board from the top surface of the board to the glass fiber layer). This is achieved by performing machining (spot boring in the above example) using the value obtained by multiplying the ratio) as the machining depth.

[Effect]

In the above-described example, the glass fiber layer 22 of the substrate 21 is normally positioned at the center in the thickness direction even if the thickness changes. In the present invention, when performing counterbore processing up to the glass fiber layer 22, the board thickness is determined at each processing position, and the counterboring depth is determined by the ratio of the dimension up to the glass fiber layer 22 to this board thickness. Therefore, when performing counterbore processing up to the glass fiber layer 22 located at the center of the board in the thickness direction, if a 50% counterbore depth is specified, the glass fiber layer at the center of the board in the thickness direction will be Countersinking can be performed up to the fiber layer, and processing defects will not occur due to changes in board thickness.

〔Example〕

Hereinafter, the present invention will be described in detail with reference to the drawings. FIG. 1 is a configuration diagram for explaining an embodiment of a numerically controlled board processing method and apparatus according to the present invention. In this figure 1, 1 is Bed, 2 is X, Y is 7',
Reference numeral 3 denotes a cross rail, which is based on the bed 1 and the cross rail 3, and moves along the X axis by moving the X and Y tables 2 back and forth (movement in the direction perpendicular to the plane of illustration).

Also, 4 is the saddle, 5 is the Z-axis motor, 6 is the Y-axis motor, and 7
8 is a spindle, and 8 is a tool. Y-axis movement is performed by moving the saddle 4 to which the spindle 7 is attached to the left and right by the Y-axis motor 6 (moves in the left-right direction in the figure), and the spindle 7 and saddle 4 are moved by the Z-axis motor 5. By moving the tool 8 up and down (in the vertical direction in the figure), the tool 8 is moved along the Z axis.

Positioning and cutting feed are performed by the X- and Y-axis movements as described above, and cutting feed to the counterbore depth is performed by two-axis movement.

Furthermore, 9 is a position detector for detecting the position in the Z-axis direction;
O is a pulse converter that converts the linear movement of the detector of the position detector 9 into a pulse number, 11 is a numerical control device, and 21 is a board similar to that shown in FIG. 2. Here, the numerical control device 11 functions as a general control means as a numerical control device of a numerically controlled board processing apparatus, and also serves as the following means. That is, the top surface position of the X, Y table 2 detected by the position detector 9 and the X, Y table 2
Calculating means that calculates the plate thickness of the substrate 21 from the top surface position of the substrate 21 placed thereon, and multiplies the calculated value by a preset desired ratio, here 50χ, to obtain the machining depth. It also serves as tool control means for lowering the tool 8 to the machining depth determined thereby.

In other words, in the present invention, the position detector 9 detects X in advance.

The upper surface position of the Y table 2 is measured and the value is stored in the numerical control device 11 through the pulse converter 10.

Subsequently, the substrate 13 is set on the X, Y table 2 and processed, and the position detector 9 measures the top surface position of the substrate 21 at each processing position.

The numerical control device 11 determines the substrate thickness at each processing position based on the top surface position data of the substrate 21 measured by the position detector 9 and the top surface position data (constant values) of the X and Y tables 2 that have already been stored. is calculated, and the calculated value is multiplied by a preset desired ratio, in this case 50%. Further, the numerical control device 11 performs spot facing processing by using the X, Y table 2 to move the tool 8 along the Z axis and move the tool 8 along the X and Y axes, using the 50x multiplied value as the processing depth.

In the above-described embodiment, the present invention is applied to counterbore machining, but it goes without saying that it can also be applied to blind hole machining.

〔Effect of the invention〕

According to the present invention, the processing depth, for example, the counterbore depth, is determined by the ratio of the desired processing layer position to the board thickness. This has the effect of preventing processing defects from occurring due to changes.

[Brief explanation of drawings]

FIG. 1 is a block diagram for explaining one embodiment of the method and apparatus of the present invention, and FIG. 2 is a cross-sectional view of a substrate for explaining problems of the prior art. 1...Bed, 2...X, Y table, 3...Cross rail, 4...Saddle, 5...2M motor, 6
... Y-axis motor, 7... Spindle, 8... Tool, 9... Position detector, 10... Pulse converter, 11
... Numerical control device, 21 ... Substrate, 22 ... Glass fiber layer, 23 ... Epoxy layer, 24 ... Copper foil layer.

Claims (2)

[Claims] 1. In a numerically controlled board processing method in which a board is processed using a numerically controlled board processing device, the top surface positions of the X and Y tables of the processing device are measured, and the top surface positions of the X and Y tables are measured for each processing position. The top surface position of the substrate is measured, the board thickness of the substrate is calculated for each processing position, and the calculated value is multiplied by a preset desired ratio, and the obtained value is used as the processing depth. Characteristic numerical control board processing method. 2. position detection means for measuring the top surface positions of the X and Y tables and the top surface positions of the substrates placed on the X and Y tables; and the thickness of the substrate from the respective top surface positions detected by the position detection means. and a calculation means for calculating the machining depth by multiplying the calculated value by a preset desired ratio, and a tool control means for lowering the tool to the machining depth determined by the calculation means. A numerically controlled board processing device characterized by: