JP2797995B2 - Semiconductor device - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a semiconductor device, and more particularly to a semiconductor device for forming a semiconductor element package.

[0002]

According to a first aspect of the present invention, there is provided a semiconductor device having an opening hole penetrating from a front surface to a back surface.
A wiring board formed of an insulator, a component mounting board on which a semiconductor element is mounted and formed of a second insulator, an adhesive layer connecting the wiring board and the component mounting board, and the opening Sealing means for sealing the hole, and the wiring
A conductor wiring formed on a substrate; and a conductor wiring formed on the conductor wiring.
Possess a protruding electrode that is, the semiconductor device of the second invention,
A multilayer wiring board having an opening hole penetrating from the front surface to the back surface and formed by a first insulator; a component mounting substrate formed by a second insulator on which a semiconductor element is mounted; An adhesive layer for connecting the component mounting board, and a wiring conductor formed on the wiring board,
A semiconductor device according to a third aspect of the present invention has a first opening having a first opening hole penetrating from a front surface to a back surface and formed by a first insulator.
A second wiring board having a second opening larger than the first opening penetrating from the front surface to the back surface and formed by a second insulator; a semiconductor element; and the semiconductor device. A component mounting substrate on which an element is mounted and formed by a second insulator; a first adhesive layer connecting a front surface of the first wiring substrate to a back surface of the second wiring substrate; A second connecting the back surface of the wiring board to the component mounting board;
Adhesive layer, the surface of the second wiring board and the first
A wiring conductor formed on the surface of the wiring board, and a bonding wire connecting the semiconductor element and the wiring conductor.

A package as described in Japanese Patent Application Laid-Open No. 58-159355 has also been proposed. This package is shown in FIG. The package shown in FIG.
An opening hole 31 is formed in the substrate, and a metal plate 36 is formed from the back surface of the substrate.
The semiconductor element 30 is mounted on the metal plate 36 by using the mounting agent 32, and the resin frame 38 and the sealing resin 2 are mounted.
9, a resin packaged in a dual in-line format (DIP format) in which external leads 33 are attached and shaped is formed.

However, in the prior art shown in FIG. 8, it is necessary to form a cavity by counterbore processing in order to reduce the thickness of the package, and the counterbore processing is usually performed by an NC drill device or a router processing device. Since a dedicated processing machine such as the above is required, this is a factor for increasing the cost of the package. Furthermore, since the external electrode is an end face electrode with through holes, it is necessary to form a number of through holes corresponding to the external electrodes, in addition to the through holes provided for connecting the laminated layers This also increases the cost of the package.

In the prior art shown in FIG. 9, when an opening is formed in a substrate and a metal plate is applied, plating of a glass epoxy substrate and plating of a metal plate are performed as a metal plate attaching process. Then, a step of brazing the metal plate and the glass epoxy plate is required, which is a factor of increasing the package cost. In addition, it is necessary to attach external leads, a resin sealing layer is formed on the front surface, and a process of shaping the external leads to be attached is required to apply a metal plate on the back surface to make a surface mount type package. This also increases the cost of the package.

[0005]

According to a first aspect of the present invention, there is provided a semiconductor device having an opening hole penetrating from a front surface to a back surface.
A wiring board formed of an insulator, a component mounting board on which a semiconductor element is mounted and formed of a second insulator, an adhesive layer connecting the wiring board and the component mounting board, and the opening The semiconductor device according to a second aspect of the present invention has a sealing means for sealing the hole, and the semiconductor device has a multilayer wiring board having an opening hole penetrating from the front surface to the back surface and formed by the first insulator. A component mounting board mounted and formed by a second insulator, an adhesive layer connecting the multilayer wiring board and the component mounting board, and a wiring conductor formed on the wiring board; A semiconductor device according to a third aspect of the present invention
A first wiring board formed of a first insulator having a first opening hole penetrating from the front surface to the back surface, and a second opening hole larger than the first opening hole penetrating from the front surface to the back surface A second wiring board formed by a second insulator, a semiconductor element, a component mounting board on which the semiconductor element is mounted and formed by a second insulator, and the first wiring board A first adhesive layer connecting the front surface of the first wiring board to the back surface of the second wiring board; a second adhesive layer connecting the back surface of the first wiring board to the component mounting board; The semiconductor device includes a wiring conductor formed on a surface of the wiring substrate and a surface of the first wiring substrate, and a bonding wire connecting the semiconductor element and the wiring conductor.

[0006]

In the structure of the first aspect of the invention, since the wiring board made of the first insulator and the component mounting board made of the second insulator are bonded by the adhesive layer,
A package with reduced cost can be obtained. Second
In the invention of the first aspect, the first aspect is applied to a multilayer wiring board.
As in the invention of the third aspect, the cost can be reduced and the noise can be reduced. According to the third aspect of the invention, the wiring substrate is constituted by a plurality of substrates, so that a thinner package can be obtained.

[0007]

Next, the present invention will be described with reference to the drawings.

FIG. 1 is a schematic sectional view of a semiconductor device according to a first embodiment of the present invention.

First, as shown in FIG. 2, an adhesive resin 2 is applied in a uniform thickness by a printing method to a semiconductor element mounting area on a component mounting board 1 and an area connected to a glass epoxy resin wiring board 4. . A glass epoxy board or the like having a thickness of about 0.1 to 1.0 mm is used as the component mounting board 1, and an epoxy resin or the like is used as the adhesive resin 2. The thickness of the applied adhesive resin can be adjusted widely depending on the semiconductor element to be mounted.
A thickness range of μm is appropriate.

Next, as shown in FIG. 3, the semiconductor element 3 is mounted on the semiconductor element mounting area of the component mounting board 1, and the wiring board 4 is similarly connected to the connection area of the component mounting board 1. At this time, the protruding electrode 5, the wiring conductor 6, and the protective resin layer 7 for protecting the wiring conductor 6 are formed on the wiring substrate 4 in advance.
Here, a glass epoxy substrate thicker than a semiconductor element is used as the wiring substrate 4. Generally, the thickness of the semiconductor element is 250 to 600 μm, so that the thickness of the wiring board 4 is about 0.5 to 1.5 mm. And
When an epoxy resin is used as the adhesive resin, 150
Cured at a temperature of ~ 200 ° C, the wiring board 4 and the semiconductor element 3
Can be fixed on the component mounting board 1. Further, as shown in FIG. 4, the exposed portion of the wiring conductor 6 which is not covered with the protective resin layer 7 and the bonding pad on the semiconductor element 3 are combined with ultrasonic waves using Au bonding wires 8 of 25 to 30 μm. Thermocompression wire bonding (U
The connection is made by the TC) method. At this time, by using a wiring board thicker than the semiconductor element thickness and controlling the loop of the bonding wire, the Au bonding wire 8 is formed.
The connection is made so that is not exposed from the upper surface of the wiring board 4. This is because the Au bonding wire 8 is
If the wiring wires 4 are exposed from the upper surface, the bonding wires 8 come into contact with the mounting board when the wiring board 4 is mounted. Therefore, the bonding wire is connected from the wiring conductor 6 at the higher position to the bonding pad on the semiconductor element 3 at the lower position. Thus, since the bonding wire is formed by being pulled downward from above, the upper limit of the loop of the bonding wire can be kept low. Finally, as shown in FIG. 5, the mounted semiconductor element 3 and the Au bonding wire 8 are sealed with a sealing resin 9. At this time, the sealing resin 9 is formed such that the resin surface is lower than the protruding electrode 5. This resin sealing can be sealed to a uniform thickness by using a printing method. As the condition, when using an epoxy resin having a viscosity of about 2000 poise at room temperature, by using a screen of 100 to 300 mesh, the resin thickness from the substrate surface is set to 100 μm or less,
The semiconductor element including the bonding wire can be sealed. When a glass epoxy printed wiring board is used as the wiring board 4 as the protruding electrode 5, a Cu plating layer is formed on the wiring board 4, and a Ni / Au layer or a Pb—Sn solder layer is laminated on the wiring board 4.
m or more. In this manner, the step of plating and brazing the wiring board 4 and the component mounting board 1 is eliminated by providing the opening 10 penetrating the wiring board 4 and using glass epoxy resin as the component mounting board 1. And the cost of the semiconductor device can be reduced.

FIG. 6 is a schematic sectional view showing a second embodiment of the present invention.

The structure is basically the same as that of the first embodiment, except that a multilayer wiring board is used as the wiring board 4. By using the multilayer wiring board as the wiring board 4, it is possible to expose a pattern for supplying a ground potential to the back surface of the multilayer wiring board. Furthermore, the component mounting surface of the component mounting board is covered with a conductive pattern, and the connection is performed by using a conductive paste as an adhesive resin between the multilayer wiring board and the component mounting board. As described above, in the multilayer wiring board, the electronic components and circuit patterns mounted inside can be shielded without increasing the number of steps.

FIG. 7 is a schematic sectional view showing a third embodiment of the present invention.

The basic structure is the same as that of the first embodiment. However, in the structure of the first embodiment, the wiring board 4 may not be made sufficiently thin. Is configured by bonding a first wiring board 41 and a second wiring board 42. That is, when the wiring board 4 is formed of one glass epoxy board, the wiring conductors 6 are formed on the wiring board 4, so that the bonding wires 8 are connected to the wiring conductors 6. However, since the bonding wire 8 is bonded from the wiring conductor 6 to the bonding pad on the semiconductor element 3, the bonding wire 8 may inevitably protrude from the wiring board 4.
Therefore, in this embodiment, the wiring board 4 is configured by bonding the first wiring board 41 and the second wiring board 42. Hereinafter, a process of forming a wiring board using the first wiring board 41 and the second wiring board will be described. First, the first
The opening hole 10 is formed in the wiring board 41 of the second wiring board 41, and the opening hole 11 larger than the opening of the first wiring board 41 is formed in the second wiring board 42. Next, the first wiring board 41 and the second wiring board 42 are bonded with an adhesive resin. Thereafter, a wiring conductor is formed on the upper surface of the second wiring substrate 42 and a wiring conductor is formed on the upper surface of the first wiring substrate 41. As described above, by forming the wiring board 4 by the first wiring board 41 and the second wiring board 42, the bonding portion of the wiring conductor 6 is formed at a position lower than the upper surface of the wiring board 4. become. Therefore, the bonding wires 8 do not protrude from the upper surface of the wiring board 4, so that the wiring board 4 can be formed thinner, and the package can be made thinner.

Although each of the above embodiments has been described with reference to the case where one semiconductor element is inserted in a wiring board or a multilayer wiring board, the present invention can also be applied to a case where a plurality of semiconductor elements are inserted. It is possible, and it is also possible to provide a plurality of opening holes. Further, in the third embodiment, the example in which the wiring board 4 is formed by two wiring boards has been described. However, the wiring board 4 may be formed by two or more wiring boards. An appropriate taper may be provided.

[0016]

As described above, the component mounting board on which the semiconductor element is mounted is formed of the same material as the wiring board, and the opening hole penetrating the wiring board is provided, so that the wiring board and the component mounting board are bonded with the adhesive resin. Adhesion can be performed, and the number of steps for forming the package can be reduced. In addition, the use of the protruding electrodes can omit steps such as shaping of external leads and can further reduce the number of steps. Therefore, the cost of the package can be reduced. Further, when the package is reduced in thickness, the thickness can be reduced by forming the wiring board with a plurality of wiring boards. Further, by applying to a multilayer wiring board, a shielded package can be obtained.

[Brief description of the drawings]

FIG. 1 is a sectional view showing a first embodiment of the present invention.

FIG. 2 is a sectional view of a process for obtaining the embodiment of FIG. 1;

FIG. 3 is a sectional view of a process for obtaining the embodiment of FIG. 1;

FIG. 4 is a sectional view of a process for obtaining the embodiment of FIG. 1;

FIG. 5 is a sectional view of a process for obtaining the embodiment of FIG. 1;

FIG. 6 is a sectional view showing a second embodiment of the present invention.

FIG. 7 is a sectional view showing a third embodiment of the present invention.

FIG. 8 is a sectional view showing a first conventional technique.

FIG. 9 is a sectional view showing a second conventional technique.

[Explanation of symbols]

Claims (8)

(57) [Claims] A first hole having an opening penetrating from the front surface to the rear surface;
The wiring board formed by the insulator of the
Component mounting base mounted and formed by second insulator
Connecting the board, the wiring board and the component mounting board
An adhesive layer, sealing means for sealing the opening hole, and the wiring
A conductor wiring formed on a substrate; and a conductor wiring formed on the conductor wiring.
Semiconductor device, comprising:
Place. 2. The semiconductor device according to claim 1, wherein said first insulator and said second insulator are resin. Wherein the adhesive layer is a semiconductor device according to claim 1 or 2, wherein it is configured by a resin. 4. A connection between the conductor wiring and the semiconductor element.
And a bonding wire.
2. The semiconductor device according to 1. 5. An apparatus according to claim 1 , further comprising an opening hole penetrating from the front surface to the back surface.
Multi-layer wiring board made of insulator
Mounting of a component on which a component is mounted and formed by a second insulator
Board, the multilayer wiring board and the component mounting board
An adhesive layer to be connected, and a wiring conductor formed on the wiring board.
A semiconductor device having a body. 6. A projection electrode is formed on said wiring board.
6. The semiconductor device according to claim 5, wherein: 7. The method according to claim 1, wherein the adhesive layer is formed by a conductive adhesive.
The semiconductor device according to claim 5, wherein 8. A first opening hole penetrating from the front surface to the back surface.
A first wiring board formed of a first insulator;
Larger than the first opening hole penetrating from the front surface to the back surface
A second opening formed by a second insulator having a second opening;
2, a wiring board, a semiconductor element, and the semiconductor element are mounted.
Component mounting substrate formed by the second insulator
And a front surface of the first wiring substrate and a back surface of the second wiring substrate
A first adhesive layer connecting the first wiring board and a back of the first wiring board;
A second adhesive layer connecting a surface and the component mounting board;
Surface and said first wiring board of the second wiring board
A wiring conductor formed on a surface, the semiconductor element and the wiring conductor;
Having a bonding wire for connecting to a wire conductor
A semiconductor device characterized by the above-mentioned.