JP2788909B2 - Parts supply device - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an apparatus for supplying electronic components such as an LSI on a ceramic substrate or a printed circuit board used for a computer or the like.

[0002]

2. Description of the Related Art A printed circuit board assembly line used for a computer or the like is characterized by a very large variety of printed circuit boards and electronic components (LSI). In consideration of such features, there has been proposed a printed circuit board assembling system that supplies a component according to a board by previously disposing a kit on a work pallet or the like for each board on which electronic components are to be mounted (Japanese Patent Application Laid-Open No. HEI 9-103572). 3-24795
Reference).

[0003]

However, according to the above-mentioned prior art, when a printed circuit board and an LSI are put into a production line, there is no shortage in the input lot, and there is no LSI failure during the process. A prerequisite was that it not occur.

By the way, the mounting technology of large computers has been further advanced, and the printed circuit boards constituting the electronic circuits are also shifting to ceramic substrates which can be mounted at higher density. Along with this, the connection method using solder bumps has been adopted for the LSI mounted on the ceramic substrate from the conventional lead pin type in order to secure more connection points.

Therefore, the process of mounting an electronic component such as an LSI on a ceramic substrate becomes very complicated.
In the step of processing a solder ball for connecting to a substrate with respect to the LSI, the LSI at the time of arrival is removed from the baby board, and a chip of about 10 mm square is 500 to 80 mm.
It is necessary to arrange the 0 solder balls regularly. Since such fine processing is performed, a processing defect occurs in the LSI, and there is a problem that even if the LSI for the lot operation is prepared at the time of receiving, the LSI will be out of stock during the process. On the other hand, there are cases where the substrate and the LSI cannot be received in a predetermined delivery date due to the difficulty of the manufacturing technology of ceramic processing and the like.

As described above, the conventional board assembling method described above is based on the premise that at the time of commencement of construction, a board and an LSI for one lot work for assembling one or more computers are prepared, and the process is performed within the process. Is required so that LSI deficiency does not occur.

For this reason, when the above-described conventional method is applied to a ceramic substrate assembly production system, the number of processes in process increases due to the shortage of LSIs, and irregular processing for dealing with the lots in which the shortage has occurred has been required. Therefore, it is expected that a huge amount of manual work will occur and the process will be confused.

The ceramic substrate and the LSI
Since these are very expensive parts, reduction of work in process and support for production systems with short delivery times are very important in reducing product costs.

Further, as described above, after the LSI is put into the process, it is necessary to form a solder ball on the surface of the LSI. There is a process problem that soldering failure occurs due to factors such as oxidation. Therefore, how to achieve synchronous management of the ceramic substrate and the LSI and supply components in a timely manner is important in terms of production management and quality control.

It is an object of the present invention to provide a component supply apparatus which synchronizes the supply of a ceramic substrate with the supply of components while minimizing the in-process in-process even if production fluctuation factors occur. To provide.

[0011]

According to the first aspect of the present invention, there is provided a component supply apparatus for supplying a component to be mounted in a system for performing assembly by mounting an electronic component on a ceramic substrate. A means for disposing a kit of electronic components on a work pallet corresponding to a ceramic substrate to be mounted, a means for mounting an electronic component on a ceramic substrate, and a work provided between the kit disposing means and the mounting means. Means for temporarily storing a pallet, means for reading a management number given to a ceramic substrate, means for extracting a work pallet provided with a kit corresponding to the number from the storage means, and supplying the work pallet in real time to the mounting means It is characterized by having.

In the invention according to the second aspect, the kit serving means receives kit serving data corresponding to the input work lot number from a higher-level device, and serves to serve an empty pallet at a predetermined address by referring to the data. Means to
Means for reading the pallet number of the empty pallet, managing the ceramic substrate product name corresponding to the number, means for taking out the electronic component and reading the component name, and referring to the data based on the component name, Means for distributing the electronic components to the empty pallet to be prepared, and means for taking out the pallet for which the dispensing is completed and transporting the pallet to the storage means.

According to a third aspect of the present invention, the pallets to be served include pallets to serve surplus electronic components.

[0014] In the invention according to claim 4, the means for receiving the serving data from the higher-level device leaves the pallet data in process in the previous lot operation in the serving area, and then processes the pallet data in an empty serving area and then processes the pallet data. It is characterized by writing the catering data of the lot work to be done.

According to a fifth aspect of the present invention, the kit distributing means manages component names that are insufficient for each pallet and the number of components, and changes the distribution priority in ascending order of the number of components. .

[0016] The invention according to claim 6 is characterized in that tracking management of components is performed by combining a production lot number read at the time of serving electronic components and a serial number of a ceramic substrate on which the components are mounted. .

[0017]

According to the present invention, a host computer for real-time online supply of NC data corresponding to each ceramic substrate to a dynamic control and kit dispensing device in a process, and an NC device in another process, Check the arrival of electronic components and ceramic substrate 1 lot,
Means for reporting an excess or deficiency to a host computer, means for reporting information on the name and quantity of the LSI which has become defective during the process to the host computer,
A means for optimizing the serving data for the kit serving device based on the arrival information at the time of loading and the failure information, and a kit serving for serving the LSI loaded in a lot on a work pallet corresponding to one ceramic substrate based on the serving data. The device is located between the device, the kit serving device and the LSI mounting device, and manages a management number previously assigned to the work pallet and information on a ceramic substrate product name associated with the control number. A pallet stocker having a function of supplying a work pallet in real time.

Further, the kit dispensing device is provided with a pallet distributing area capable of distributing a plurality of work pallets for distributing an LSI corresponding to one ceramic substrate as a kit, and a pallet distributing area designated by a control device. Means for distributing the work pallets to the designated address, means for reading the individual number assigned to the work pallet, and means for managing the address and ceramic substrate product name using the number as a key, and one or more computers A mechanism for loading the LSIs necessary to assemble the components, a mechanism for taking out the loaded LSIs one by one, reading the product name and arranging them at the address specified by the control device, and taking out the work pallets for which the kit has been delivered and transporting them to the stocker. The mechanism and the work work lot number input allow the host computer to Means for receiving a serving data, and is configured with means for achieving a data re-editing of the work-in-process work lot data and the lot data, by a control device for controlling the respective mechanisms based on 該再 edited data.

Even if ceramic substrates for one lot are simultaneously loaded, the timing of arrival at the mounting process varies due to various effects of the process. If the LSI serving is performed ignoring this difference in arrival, the kit serving is finished but there is no board, or the reverse case may occur, resulting in an increase in the number of processes.

Therefore, according to the present invention, the process is managed,
For the host computer that creates the NC data required for each process, the progress information such as the serial number of the ceramic substrate collected from the progress reporting device installed in the process and the time required for each process are also stored. By providing means for estimating the timing at which component supply is required and means for prioritizing the serving order of serving data based on the information, component supply synchronized with the progress of the ceramic substrate is realized. You.

Further, since the LSI for one lot covers a very wide variety of parts, the parts are not prepared in the delivery date and cannot be put in. It is expected that the production schedule will be confused due to lack of synchronization management.

Therefore, according to the present invention, when ceramic substrates and LSIs are received, it is detected whether or not the number of members corresponding to the lots is complete.
Means for reporting excess or deficiency, means for reporting information on a host computer in the event of a failure in the middle of the process in real time, and prioritizing the order of serving of the serving data based on the information By providing means,
Even if LSI loss occurs at the time of introduction or during the process, smoothness and work in process can be minimized.

In the case where all the parts for one lot are put in a state where they are not completely arranged, even if the above means can minimize the work pallet in process of waiting for the missing parts, the work pallet is not placed on the pallet table. In-process pallets for the lot remain.

Therefore, according to the present invention, there are provided means for collecting information remaining in process in the previous lot operation to the host computer, and means for preparing serving data for the next lot operation based on the in-process information of the previous lot. In this way, even if the in-process pallet for the previous lot operation remains in the serving area, it is possible to input the next lot operation,
Production stagnation and confusion due to shortages can be minimized.

Further, if there is a surplus part in the parts put in the lot, it is not possible to search the serving destination of the LSI in the serving data, so the equipment is temporarily stopped and the LSI is manually operated. Actions such as removal are required.

Therefore, according to the present invention, means for recognizing that there is a surplus component by searching for serving data, means for defining a part of the serving area as a surplus component pallet, Means for indicating the serving position on the pallet, means for detecting that the surplus parts pallet is full, means for discharging the full pallet for surplus parts, and parts for surviving empty pallets By providing means for supplying to the position defined as a pallet for
Even if the surplus parts are mixed in the lot input parts, continuous operation can be performed without stopping each time.

Electronic parts such as LSIs are provided with a production lot number along with a product name indicating the function. However, due to the structure of the ceramic substrate, after the LSI is mounted, the CAP is determined.
In order to perform tracking management of the LSI because it is sealed, it is necessary to read the LSI lot number at the time of serving, and to manage the LSI lot number in combination with the serial number of the corresponding ceramic substrate.

Therefore, according to the present invention, means for reading the lot number hit on the LSI at the time of serving the LSI, and using the pallet number as a key for each pallet provided with the kit,
Tracking management on the host computer is possible based on the means for reporting the LSI lot number to the host computer and the means for reporting the correspondence information between the ceramic substrate serial number and the pallet number used for mounting on it to the host computer can do.

[0029]

DESCRIPTION OF THE PREFERRED EMBODIMENTS One embodiment of the present invention will be specifically described below with reference to the drawings. The ceramic substrate and the LSI used for the large-sized computer have the shapes shown in FIGS. 14 and 16 in FIG. 1, and each computer includes several tens of ceramic substrates and about 1,000 LSIs. Also, regarding the LSI type,
Since most of them are not used cyclically, as in the method described in the above-mentioned publication, the method of supplying the LSI to the LSI mounting apparatus that mounts the LSI on the substrate is the same as that for the ceramic substrate in advance. A method of distributing kits on a pallet in the order of mounting LSIs is particularly effective.

Further, after the pre-processing is completed for both the ceramic substrate and the LSI, until the LSI is mounted and reflowed,
For ceramic substrates, solder paste paste,
LSI has a process time limit due to problems such as oxidation of solder balls. For this reason, how to supply the LSI parts in synchronization with the progress of the ceramic substrate is very important in terms of product reliability.

FIG. 1 is a diagram showing a system configuration of the present invention. In FIG. 1, a host computer 1 is connected to another department via a network 2 and exchanges data with another section, and also performs management operations for NC data creation and supply, progress management, and other general processes. The workstation 3 is located between the host computer 1 and each of the production facilities. On the basis of a request from each of the production facilities, the workstation 3 performs online transfer of NC data and system control for each of the facilities. It performs reading, loader control, start / stop management, and the like.

An information control device is configured by connecting the host computer 1 and a group of workstations 3 via the network 2, and the information control device configured in this way can provide information on missing or partially missing LSI, It functions to collect progress information, work-in-progress information, and individual schedule information of the ceramic substrate in real time and feed it back to the process.

The LSI product name matching device 4 checks whether or not there is an excess or deficiency of the LSI per input lot and whether or not there is a surplus component at the time of inputting the LSI based on a command from the information control device. To LSI
14 is removed, and a new solder ball for connection to the ceramic substrate is supplied to the connection surface to form a bump. The bump inspection device 6 inspects the LSI which has become defective, and
The SI product name is reported to the host computer 1 via the workstation 3 connected to the bump inspection device 6.

The LSI kit dispensing device 7 disposes the LSI on the work pallet corresponding to the ceramic substrate 16 to be mounted in accordance with a command from the information control device, and the pallet stocker 8 disposes the work pallet on which the kit dispensing is completed. The work pallet is temporarily stored, and the corresponding work pallet is taken out according to a request from the LSI mounting device 11 described later.

The laser printing device 9 includes a ceramic substrate 16
Then, the serial number as the individual management number is laser-printed based on a command from the information control device. Pretreatment device 1
No. 0 performs cleaning and solder paste application before mounting the LSI, and the LSI mounting apparatus 11 responds to a command from the information control apparatus to the LSI board corresponding to the ceramic substrate 16.
Takes out the work pallet provided with the kit from the pallet stocker 8 and mounts the LSI on the ceramic substrate. This work pallet is transported by the conveyor 12. The product name reading device 13 reads the serial number of the ceramic substrate 16 previously printed.

The operation of the production process of the present embodiment configured as described above will be described below. In accordance with an instruction from the information control device, an LSI for one lot is loaded, and the product name collating device 4 checks whether there is an excess or deficiency in the product name and the number of components constituting the one lot and whether there is a surplus component. After that, the bump forming apparatus 5 causes each LSI to
, And a solder ball is supplied to the connection surface to newly connect to the ceramic substrate to form a bump. In this step, 50 mm
Since 0 to 800 bumps are formed, some LSIs may be redone or defective due to manufacturing defects. The missing LSI product name is inspected by the bump inspection device 6 and reported to the host computer 1 via the workstation 3.

The LSI on which the bumps are formed has an LSI of 4
After randomly setting the work pallets on two work pallets, the work pallets are stored in a magazine case capable of storing 10 work pallets and supplied to the component supply unit loader of the LSI kit serving apparatus 7. LS for one lot, depending on the lot type
Since the number of I is about 1,000, the number of magazines is 2-3
The magazine will be supplied. Further, for the convenience of the bump forming process, it is impossible to process the input lot separately from other lots.
, The other lots are partially mixed and input.

In the LSI kit serving apparatus 7, a series of kit serving operations is started by inputting a lot number to be worked into the information control apparatus. That is, in accordance with an instruction from the host computer 1, an empty work pallet for distributing the LSI is arranged, and the LSI is automatically arranged on the work pallet (details of the LSI kit dispensing apparatus will be described later).

The pallets for which kit distribution has been completed are moved to the pallet stocker 8 and stored. At this time, a serial number (hereinafter referred to as a pallet number) of a bar code label uniquely printed on the work pallet is read by a bar code reader (not shown), and the number is sent from the LSI kit serving device 7 via a network. Inventory management is performed based on the pallet number and the correspondence information of the lot number of the arranged ceramic substrate and the product name, and the information is sent to the host computer 1.

The host computer 1 stores the small schedule information already scheduled and the L of the pallet stocker 8.
Based on the LSI inventory information of the SI kit serving completion and the ceramic substrate progress information, a mounting instruction to the ceramic substrate on which the LSI can be mounted is output.

The name of the ceramic substrate and the serial number already uniquely assigned in the manufacturing process are printed on the ceramic substrate by the laser printer 9 in accordance with an instruction from the host computer 1. Note that the serial number printed here is automatically read in an LSI mounting process, a repair wiring process, and the like, and is used for automation of data supply and management of progress and history.

Although the ceramic substrate shrinks during sintering, the shrinkage varies from individual to individual. Therefore, the amount of shrinkage is measured for each serial number, the design data is corrected, and the ceramic substrate of the same product name is corrected. The board is also processed so as to supply proper proper NC data for each serial number.

After printing the serial number, the ceramic substrate 16 is supplied to the LSI mounting apparatus 11 after preprocessing for mounting the LSI, that is, specifically, after cleaning and applying a solder paste. In the LSI mounting device 11, after reading the serial number of the loaded ceramic substrate 16,
The data is requested to the host computer 1 by the number, and the pallet stocker 8 is requested via the network to retrieve the work pallet in which the corresponding LSI is provided as a kit. As described above, according to the present embodiment, synchronization between the ceramic substrate and the LSI component serving is realized.

FIG. 2 is a block diagram of the LSI kit serving apparatus 7 of this embodiment. In FIG. 2, reference numeral 21 denotes a workstation for controlling the entire apparatus; 22, an LSI loading section for loading an LSI for distributing kits stored in a magazine; and 23, an LSI from a work pallet supplied from the LSI loading section 22. An LSI take-out unit 24 for sequentially taking out and setting the product on a turning table, which is a position for reading the product name, reads a product name of the LSI in accordance with an instruction from the workstation 21 and reports the information to the workstation 21. .

Reference numeral 25 denotes an empty pallet supply unit, reference numeral 26 denotes a pallet number reading unit, reference numeral 29 denotes a revolving unit for moving from a product name reading position to a transfer position to the LSI serving unit 27, and reference numeral Empty pallet serving for kit serving, LS
A serving unit 28 composed of a robot that picks up a pallet for serving I and a kit, and a pallet serving table that can serve 100 pallets, is a pallet picking unit. 4A shows a 10 × 10 pallet serving table, and FIG. 4B is an enlarged view of one pallet.

The operation of the LSI kit serving apparatus 7 will be described. When the work lot number is input to the workstation 21, the work station 21 sends the serving data shown in FIG. 3 corresponding to the lot number to the host computer 1.
Receive from

FIG. 3 shows the serving data corresponding to the lot number, which is the data received from the host computer 1, the LSI product name, the board product name, the pallet serving table address, the address in the pallet, and the data to be written in the workstation 21. Pallet number. FIG. 3A shows the serving data of lot number 1.

If the work pallet of the previous work lot (for example, lot number 1) remains in process in the serving data due to, for example, waiting for LSI shortage, the following processing is performed. That is, for example, when the LSI in the pallet at the coordinate A0 in FIG. 4A is a missing item and is in process, the other pallets without the missing item enter the pallet stocker 8 as described above. The in-process pallet remains at the coordinate A0. Then, as shown in FIG. 3B, only the pallet data A0 of the in-process lot number 1 is left as the serving data, and the pallet data for which other processing has been completed is deleted. Serving data (A0, A1, A) for the next work lot (lot number 2)
2,. . ) Is received from the host computer 1 and the next address position (A) of the in-process pallet data is received.
1, A2, A3,. . . ) And pallet data is sequentially written. That is, the pallet address of the host data is relocated to a free address.

Next, a start key is input from the workstation 21. The workstation 21 extracts a table address for arranging pallets with reference to the distribution data, and outputs a distribution instruction of an empty pallet to the address to the distribution unit 27. According to this instruction, the serving section 27
Takes out an empty pallet from the empty pallet supply unit 25,
Set to the designated location.

At this time, the pallet number reading unit 26
The pallet number indicated by the bar code label attached to the pallet in advance is read and reported to the workstation 21. The workstation 21 writes the received pallet number in a record of the serving data as shown in FIG.

The distribution of the required number of pallets is completed. Finally, another pallet is distributed to the table address defined as the reject LSI pallet, and the LS is set.
Processing shifts to serving I.

When the workstation 21 instructs the LSI supply unit 22 and the LSI take-out unit 23,
I is taken out and set at the article name reading position. The LSI product name reading device 24 includes the set LS
The product name of I is read and reported to the workstation 21. The workstation 21 is provided with the turning unit 2
Then, a turn instruction is issued to the server 9, and based on the item name information, a corresponding serving address is searched from the serving data, the serving coordinates are output to the robot of the serving section 7, and the serving of the LSI is executed.

The serving data is, as shown in FIG.
Corresponding to the product name, it is composed of table coordinates of the pallet corresponding to the ceramic substrate to be mounted and coordinates in the pallet. The coordinates in the pallet are in the order in which the ceramic substrates are mounted, so that the LSI mounting apparatus can perform work without reading the LSI product name when mounting. In addition, since the revolving unit 29 is mechanically provided, the reading of the second and subsequent product names and the LSI serving processing can be performed in parallel.

The serving section 27 manages, for each pallet, the LSI product names that are missing at the time of serving and the number thereof, and changes and controls the priority of the serving in ascending order of the missing number. FIG.
Shows an example of changing and controlling the priority of serving.

As described above, in LSI preprocessing, it is practically impossible to supply an input lot without being mixed with other lots at all, and even if this is possible, it would be enormous. Requires manpower and man-hours. For this reason, in this embodiment, it is not possible to search the serving coordinates other than the lot, that is, the serving coordinates in the serving data.
Even if SIs are mixed, the problem is dealt with by serving food on a pallet defined as a reject pallet.

The pallet can store 42 LSIs like other pallets, but when the pallet becomes full, the workstation 21 temporarily suspends the LSI serving, discharges the reject pallet, and reloads the empty pallet. Then, the process proceeds to an LSI serving operation. As a result, in this embodiment, the serving of the LSI is performed without manual intervention. As described above, a part of the serving table is defined as a reject pallet, and the surplus components are served there, so that a special mechanism is not provided, and L is continuously provided.
It is possible to realize the SI serving operation.

Since the pallet for loading the LSI and the pallet for distributing the kit have the same shape, the pallet which has been filled up with the reject LSI and discharged does not need to be loaded into the LSI loading loader at the time of the next lot operation. Can be supplied from

In the LSI serving process, the timing at which the kit serving is completed is different for each pallet. Therefore, in order to realize real-time production in which the in-process is suppressed, the pallets are sequentially taken out from the completed pallet and the LSI mounting device 11 is mounted.
It is necessary to send to

However, if pallet removal processing is performed each time one pallet is completed, a loss time occurs. In this embodiment, the workstation 21 sends the host computer 1 to the host computer 1 each time one pallet is completed. This report reports the completion of LSI kit serving for ceramic substrates. Then, only in the case of the express processing, the pallet is taken out each time one pallet is completed in accordance with the information on whether or not the processing is the express processing from the host computer 1; Alternatively, the LSI serving is stopped halfway by the stop key of the workstation 21 and the pallet in which the kit serving is completed at that time is taken out by the finished product pallet discharging key.

In this embodiment, for this purpose, a pallet stocker 8 serving as a buffer is provided between the LSI kit serving device 7 and the LSI mounting device 11, and real-time supply of the LSI to the LSI mounting device 11 is realized.

The pallet stocker 8 is provided with a bar code reader at the entrance of the pallet. After reading the contents of the bar code label of the pallet taken out of the LSI kit serving apparatus 7, the pallet stocker 8 stores it on an empty shelf. . The workstation that controls the pallet stocker 8 refers to the serving data via the network based on the pallet number input by the bar code, obtains the work lot number and the corresponding ceramic substrate product name, and stores the information and the information. Write the address and pallet number to the inventory table. The workstation sends the information to the host computer 1 and displays on the display the name of the ceramic substrate that can be mounted and the work lot number.

The LSI mounting device 11 reads the laser-printed serial number on the loaded ceramic substrate, requests NC data to the host computer 1, and supplies the LSI to the pallet stocker 8 in a kit. Request the delivery of the corresponding pallet. Note that the pallet stocker 8 is requested to leave the work lot number minus the work lot number.
The information is obtained by using the ceramic substrate product name, and this information can be obtained by reporting the serial number to the host computer 1.

Although the LSI production lot number is put on the cap surface of the LSI together with the product name indicating its function, the structure of the ceramic substrate causes
CAP sealing. Therefore, in performing the tracking management of the LSI, it is necessary to read the lot number of the LSI at the time of serving the LSI, and to manage the combination with the serial number of the corresponding ceramic substrate.

That is, the LSI reads the lot number stamped on the LSI at the time of serving the LSI, reports the LSI lot number to the host computer 1 using the pallet number as a key for each pallet provided with the kit, and transmits the ceramic board serial number and the The host computer reports information corresponding to the pallet number used for mounting the pallet to the host computer, and based on this information, can manage the tracking on the host computer, that is, manage the LSI lot number information for each ceramic substrate.

[0065]

As described above, according to the first and second aspects of the present invention, a work pallet is supplied in real time from a stocker in accordance with a request from an LSI mounting device. , The production in the process can be minimized, the production can be performed with high accuracy in a short schedule, and the synchronous management between a plurality of different processes can be accurately performed. Furthermore, L
The LSI can be supplied to the SI mounting device in a minimum space and in real time.

According to the third aspect of the present invention, even if there is a surplus part among the parts put in the lot, a pallet for serving the parts is prepared, so that the apparatus can be continuously operated without stopping. It becomes possible to work.

According to the fourth aspect of the present invention, even if the in-process pallet in the previous lot operation remains in the serving area, the next lot operation can be input, and production stagnation due to a shortage of parts is suppressed as much as possible. be able to.

According to the fifth aspect of the present invention, the prioritization of the serving order of the serving data is performed, so that even if an LSI defect occurs at the time of lot input or during the process, the work in process is minimized. be able to.

According to the sixth aspect of the present invention, it is possible to perform tracking management of an LSI of which lot number is mounted and where it is mounted on each ceramic substrate managed by a serial number. Even when a defect occurs, it is possible to quickly take measures such as LSI replacement.

[Brief description of the drawings]

FIG. 1 is a diagram showing a system configuration of the present invention.

FIG. 2 is a block diagram of an LSI kit serving device of the present invention.

FIGS. 3A and 3B show serving data corresponding to a lot number.

FIG. 4 (a) shows a pallet serving table,
FIG. 2B is an enlarged view of one pallet.

FIG. 5 shows an example of changing and controlling the priority of serving.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Host computer 2 Network 3 Work station 4 LSI product name collating device 5 Bump forming device 6 Bump inspection device 7 LSI kit serving device 8 Pallet stocker 9 Laser printing device 10 Preprocessing device 11 LSI mounting device 12 Conveyor 13 Product name reader 14 LSI 15 Baby board 16 Ceramic substrate

Continued on the front page (72) Inventor Yoichi Fukuoka 1st Horiyamashita, Hadano-shi, Kanagawa Prefecture Hitachi, Ltd. General-Purpose Computer Division (72) Inventor Yoichi Fujiwara 1st Horiyamashita, Hadano-shi, Kanagawa Hitachi Computer Computer Engineering Co., Ltd. (72) Inventor Junji Narita 1 Horiyamashita, Hadano City, Kanagawa Prefecture Inside Hitachi Computer Engineering Co., Ltd. (72) Inventor Terumi Saito 1st Horiyamashita, Hadano City, Kanagawa Prefecture Inside Hitachi Computer Engineering Co., Ltd. (72) Inventor Inoue Hiroo 1 Horiyamashita, Hadano City, Kanagawa Prefecture General Computer Division, Hitachi, Ltd. (58) Field surveyed (Int. Cl. ⁶ , DB name) H05K 13/02

Claims (6)

(57) [Claims] 1. A component supply apparatus for supplying a component to be mounted in a system for assembling an electronic component by mounting the electronic component on a ceramic substrate, wherein the electronic component is set on a work pallet corresponding to the ceramic substrate to be mounted. Means for mounting electronic components on a ceramic substrate, means for temporarily storing a work pallet provided between the kit serving means and the mounting means, and reading a management number assigned to the ceramic substrate And a means for taking out a work pallet provided with a kit corresponding to the number from the storage means and supplying the work pallet to the mounting means in real time. 2. The kit serving means includes means for receiving kit serving data corresponding to the input work lot number from a higher-level device, means for serving an empty pallet at a predetermined address by referring to the data, and Means for reading the pallet number of the pallet and managing the ceramic substrate product name corresponding to the number; means for taking out the electronic component and reading the component name; and referring to the data based on the component name, 2. The component supply device according to claim 1, further comprising: means for distributing the electronic components on an empty pallet, and means for taking out the pallet for which the disposition has been completed and transporting the pallet to the storage means. 3. The component supply device according to claim 2, wherein the pallets to be served include pallets to serve surplus electronic components. 4. A means for receiving the serving data from a higher-level device, wherein the pallet data on which a work-in-progress has occurred in the previous lot operation is left in the serving area,
3. The component supply device according to claim 2, wherein the distribution data of the lot operation to be processed next is written. 5. The component according to claim 2, wherein said kit serving means manages the component names missing for each pallet and the number thereof, and changes the serving priority in ascending order of the number of missing components. Feeding device. 6. The component according to claim 1, wherein component tracking management is performed by combining a production lot number read at the time of serving electronic components and a serial number of a ceramic substrate on which the component is mounted. Feeding device.