JP2778575B2 - How to connect printed circuit boards - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method of connecting printed boards for connecting a plurality of printed boards to each other, and more particularly to a method for mounting printed boards at high density and reducing the size and weight of the apparatus. The present invention relates to a method of connecting printed circuit boards that can be achieved.

[0002]

2. Description of the Related Art When an electronic device is formed by a plurality of printed boards, conventionally, each printed board is connected to a connector,
They were connected to each other by cables or flat cables. In addition, there has been a method of connecting a plurality of printed circuit boards to each other by connecting pins.

A technique for connecting a plurality of printed circuit boards by connecting pins is disclosed, for example, in Japanese Patent Laid-Open No. 4-1189.
No. 91 and JP-A-4-223070.

The method of connecting printed circuit boards disclosed in Japanese Patent Application Laid-Open No. 4-118991 discloses a method of connecting through holes corresponding to each other when a plurality of printed circuit boards (film boards) to be connected are placed in a state where the printed boards are superposed. At the same time, the plated or ring-shaped solder is supplied to each through hole, and then the I / O pins of the electronic component are inserted into the through holes of the printed circuit boards which are overlapped with each other. By soldering the pins and the through holes, the printed circuit boards in a state of being superimposed on the electronic component are connected.

Japanese Patent Laid-Open No. 223070/1992 discloses a method of connecting a printed circuit board, which comprises providing a first printed circuit board with a pin connector whose front end is resiliently openable and closable, and connecting to the first printed circuit board. A hole is formed in the through hole corresponding to the pin connector, the first printed board and the second printed board are superimposed on each other, and the pin connector is fitted into the through hole to form the second through hole. One printed board and the second printed board were connected.

[0006]

However, in the conventional method of connecting a printed circuit board with a connector, a space for mounting a connector shell having a large volume and an occupied area must be secured, and the printed circuit board is mounted at a high density. It is difficult to reduce the size and size of the apparatus. Note that such a problem becomes more prominent as the number of printed circuit boards to be connected increases.

In the conventional method of connecting a printed circuit board with a cable, a large occupied area is required for a connection portion of the cable, and a space for arranging the cable must be secured in the apparatus. Similarly, it has been difficult to achieve high-density mounting of a printed circuit board and downsizing of the device. Even in the method of connecting a printed circuit board using a flat cable, a space for arranging the cable must be secured in the device, and it has been difficult to reduce the size of the device.

On the other hand, in the method of connecting a printed circuit board disclosed in Japanese Patent Application Laid-Open No. 4-118991, after inserting the I / O pins of the electronic component into the through holes of the printed circuit board, the I / O pins and the through holes are connected. Since the soldering procedure is performed by plating or ring-shaped solder, there is a problem that a poor connection or poor melting of the solder may cause poor connection.

Further, since the through hole has a cylindrical shape with a constant diameter, when the amount of solder is increased in order to prevent a connection failure due to insufficient solder or the like, excess solder is removed from the through hole. There is a problem that the wiring overflows and the wiring is short-circuited.

Further, since the through hole has a cylindrical shape with a constant diameter, the I / O pin cannot be inserted into each through hole when the through hole of each printed circuit board is slightly displaced. There was a problem. For this reason, high precision is required for the through-holes, and when connecting the electronic components to the respective printed circuit boards in a state of being superimposed, a special jig is required, which requires a great deal of labor and labor for soldering. There was a problem that it took time.

The method of connecting printed circuit boards disclosed in Japanese Patent Application Laid-Open No. Hei 4-223070 aims at connecting two printed circuit boards (first and second printed circuit boards), and cannot connect three or more printed circuit boards. There was a problem.
In addition, there is a problem that the cost of the pin connector having a complicated configuration is high, and the printed circuit board cannot be easily connected.

SUMMARY OF THE INVENTION The present invention has been made in view of the above-mentioned problems, and it is possible to easily and surely connect a plurality of printed boards, and to realize high-density mounting of printed boards and reduction in size and weight of an apparatus. Pudding that can be planned
The purpose of the present invention is to provide a connection method for a printed circuit board .

[0013]

In order to achieve the above object, a method of connecting a printed circuit board according to the present invention comprises a plurality of printed circuit boards.
Printed circuit board connection with stacked printed circuit boards
Method, when each printed circuit board is overlapped,
Where the opening on the front side of the board is
A large mortar-shaped through hole is formed, and each through hole is formed.
High thermal conductivity after filling paste-like solder into holes
With the pin contact made of material heated
Melt the paste solder by inserting into the through hole
And connect the printed circuit boards to each other.
You.

[0014] Then, preferably, the pin contacts a heated state, after insertion into serial through-holes are to be forcibly cooled.

The connection method of the printed circuit board of the present invention as described above.
According to the law, only by a simple method using the through-hole of said pin contacts and conical, it is possible to connect a plurality of printed circuit boards. Therefore, the space occupied by the connection member can be extremely reduced, and high-density mounting of the printed circuit board and reduction in size and weight of the device can be achieved.

The through holes are formed in a mortar shape in which the opening on the front surface side of the substrate is larger than the opening on the back surface side of the substrate, so that the pin contacts can be easily inserted. The pin contact can be reliably inserted even if the position is slightly shifted.

Further, by forming the through hole into a mortar shape, a large amount of the paste solder can be stored in the through hole, and the pin contact is inserted into the through hole storing the paste solder. However, the paste solder does not overflow from the through hole.

Here, when the tip of the pin contact is sharpened, the pin contact can be more securely and easily inserted into the mortar-shaped through hole, and the soldering operation in the present connection method can be easily performed. Become.

According to the method of connecting printed boards of the present invention, soldering for connection between boards can be performed while inserting the pin contacts in a heated state into the mortar-shaped through-holes. Even when the printed circuit boards are connected, soldering of the printed circuit board located between the printed circuit boards can be performed reliably and easily.

If the pin contact in a heated state is inserted into the through-hole and then forcibly cooled, the solder can be solidified in a short time, and the operation in the next step is performed. be able to.

[0021]

DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, contact of the printed circuit board of the present invention
An embodiment of a continuation method will be described with reference to the drawings. FIG. 1 is an enlarged view of a main part for describing a method of connecting a printed circuit board according to an embodiment of the present invention. FIG.
(A), (b) is a partial sectional view for explaining the connection structure and connection method of the printed circuit board.

First, the connection of the printed circuit board according to the present embodiment is described.
The structure of the printed circuit board connected by the connection method will be described. In FIG. 1, three mortar-shaped through holes 11, 12, 13 and 21, 22, 23 are formed in printed circuit boards 10 and 20, which are connected to each other. These mortar-shaped through holes 11 to 13 and 21 to 2
Numeral 3 is formed in a position corresponding to each other when the printed board 10 and the printed board 20 are overlapped, and the opening on the front side of the board is larger than the opening on the back side of the board.

As shown in FIG. 2A, paste-like solder 40 is filled in each of the mortar-shaped through holes 11 to 13 and 21 to 23.

Reference numerals 31, 32 and 33 are pin contacts. These pin contacts 31, 32, and 33 are formed of a metal having high thermal conductivity, for example, copper or a copper alloy, and preferably a copper alloy plated with nickel. The diameters of the pin contacts 31, 32, 33 are the same as those of the mortar-shaped through holes 11-13 and 21-2.
3 is smaller than the opening diameter on the back side of the substrate, and the tips of the pin contacts 31, 32, 33 are pointed.

Next, a method of connecting a printed circuit board according to this embodiment will be described with reference to FIGS. 1 and 2 (a) and 2 (b).

First, as shown in FIG. 2A, each of the mortar-shaped through holes 11, 12,
13 and 21, 22, 23, respectively.
Fill with zeros. Next, as shown in FIG. 1, the printed circuit boards 10 and 20 are overlapped, and the mortar-shaped through holes 11 and 21, 12 and 22, and 13 and 23 are aligned with each other.

Thereafter, as shown in FIG. 1 and FIG. 2B, the pin contacts 31, 32 and 33 are brought into contact with a soldering iron on the rear end surfaces thereof, for example.
2, 33 are heated, and each pin contact 3 in a heated state
1, 32 and 33 are inserted into the mortar-shaped through-holes 11 and 21, 12 and 22, and 13 and 23 which match each other.

Then, as shown in FIG. 2B, the pin contacts 31, 32, and 33 melt the paste-like solder 40 while the mortar-shaped through-holes 11, 21, 12, and 2 are formed.
2, 13, and 23.

Thereafter, each of the pin contacts 31, 32, 3
3 is stopped, and the pin contacts 31, 32, 33 are forcibly cooled by a fan or the like (not shown), whereby the pin contacts 31, 32, 33 are cooled.
Are mortar-shaped through holes 11 and 21, and 12 and 2 respectively.
2, 13 and 23 are soldered. Thus, the connection between the printed circuit board 10 and the printed circuit board 20 is completed.

The connection of the printed circuit board according to this embodiment is
According to the structure of the printed circuit board connected by the connecting method , the printed circuit board 10 and the printed circuit board 20 are formed by a simple configuration using only the pin contacts 31, 32, 33 and the mortar-shaped through holes 11 to 13 and 21 to 23. Can be connected. Therefore, the space occupied by the connection members can be extremely reduced, and the printed circuit boards 10 and 2 can be used.
0 high-density mounting and reduction in size and weight of the device.

The openings on the front surface of the substrate are larger than the openings on the rear surface of the substrate.
23, the pin contacts 31, 3
2, 33 can be easily inserted, and each printed circuit board 10, 2
0 and the mortar-shaped through holes 11 and 2
Even if the pins 1, 12 and 22, and 13 and 23 are slightly displaced, the respective pin contacts 31, 32 and 33 can be reliably inserted.

Further, by employing the mortar-shaped through holes 11 to 13 and 21 to 23, a large amount of the paste-like solder 40 can be stored in the through-holes. Even if the pin contacts 31, 32, 33 are inserted, the paste solder 4
0 does not overflow from the through hole (FIG. 2).
(See (a) and (b)).

Further, the pin contacts 31, 32,
When the tip of 33 is sharpened, the pin contact can be more reliably and easily made into a mortar-shaped through hole 11-13 and 2
1 to 23, so that the soldering operation in this connection method can be easily performed.

On the other hand, according to the printed circuit board connection method of the present embodiment, the pin contacts 31 and 3 in the heated state are connected.
2, 33 are mortar-shaped through holes 11 and 21, 12 and 2
Soldering for connection between boards can be performed while being inserted into 2, 13, and 23. Therefore, even when three or more printed boards are connected, soldering of a printed board located between printed boards The attachment can be performed reliably and easily.

Each of the pin contacts 3 in the heated state
After the 1, 32, 33 are inserted into the mortar-shaped through-holes 11, 21, 12, 22, 22, 13 and 23, respectively, they are forcibly cooled, so that the solder paste 40 is solidified in a short time. And the operation of the next step can be performed.

The connection structure and connection method of the printed circuit board according to the present invention are not limited to the above-described embodiment. For example, in the present embodiment, two printed circuit boards 1
The case where 0 and 20 are connected has been described, but with a similar configuration, three or more printed boards can be connected in a state of being overlapped with each other.

[0037]

As described above, the printed circuit board of the present invention
According to the connection method , a plurality of printed boards can be easily and reliably connected, and high-density mounting of the printed boards and reduction in size and weight of the device can be achieved.

[Brief description of the drawings]

FIG. 1 shows a connection of a printed circuit board according to an embodiment of the present invention.
It is a principal part enlarged view for demonstrating a method .

FIGS. 2A and 2B show the connection of the printed circuit board.
It is a fragmentary sectional view for explaining a method .

[Explanation of symbols]

10, 20 Printed circuit board 11, 12, 13, 21, 22, 23 Mortar-shaped through-hole 31, 32, 33 Pin contact 40 Paste solder

Claims (2)

(57) [Claims] 1. A method for connecting a plurality of printed circuit boards in a stacked state.
It is a method of connecting printed circuit boards that are connected to each other when the printed circuit boards are stacked,
Mortar shape with opening on front side of substrate larger than opening on back side of substrate
The hole shape of the through-holes are formed in, then Pinkon a solder paste was filled in each through-hole, then formed by a material having high thermal conductivity
Insert the tact into the through hole while heating it,
By melting the paste solder, each printed circuit board is
A method for connecting printed circuit boards, comprising connecting. 2. The pin contact in a heated state,
Forcibly cool after inserting into the through hole
The method for connecting printed circuit boards according to claim 1.