JP2772164B2 - Electronic product taping method - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for separating electronic products supplied by a lead frame and taping them on a carrier tape for electronic products such as transistors, diodes, light emitting diodes, semi-fixed resistors, and tantalum capacitors. Taping method.

[0002]

2. Description of the Related Art With respect to the above-mentioned various electronic products, there is a step of individually separating the electronic products from a lead frame to which the electronic products are connected, and taping the separated electronic products on an embossed tape. This taping step is performed using a taping device as shown in FIG. That is, in this apparatus, the electronic product 1 is attached to the lead frame 100 which is moved by an appropriate conveying roller (not shown) at every pitch in the arrow X direction.
01 are attached in series, the individual electronic products are cut off from the lead frame 100, and the embossed tape 110 is moved in parallel with the lead frame 100 in the direction of arrow Y by an appropriate transport roller (not shown). After accommodating (handling) the separated electronic products in the section 111, a taping operation is performed by thermocompression bonding a top tape (not shown) on the embossed tape 110.

[0003] From the lead frame 100 to the electronic product 101
Is separated by a collet 120 having a suction path 121, an upper blade 122, and a lower blade 123, as shown in FIG. The electronic product 101 conveyed along with the lead frame 100 has one lead terminal 101b separated, but the other lead terminal 101a is connected to the lead frame 100. With respect to the electronic product 101, the lower blade 123 rises from below, and while being in contact with and supporting the electronic product 101, the collet 120 descends from above and the upper blade 122 also descends, and the upper blade 122 and the lower blade 123 fall.
Then, the lead terminal 101a is cut to a predetermined length. at the same time,
The electronic product 101 is transferred to the collet 120 through the suction path 121.
Is adsorbed on the end surface 120a.

[0006] The sucked electronic product 101 is stored in the embossed portion 111 of the embossed tape 110 according to the locus of the collet 120 shown in FIG. FIG. 8 shows this state, and the electronic product 101 having both lead terminals 101 a and 101 b is housed in the embossed portion 111. Thereafter, a top tape (not shown) is joined onto the embossed tape 110, thereby completing the taping step of the electronic product.

[0005]

By the way, among the electronic products supplied by the lead frame 100, defective products are selected and cut off in a step before the taping step. A so-called Hankake 130 in which such an electronic product is removed occurs. If the handling is performed as it is, the embossed tape 110 will be disturbed. Therefore, in the taping apparatus as described above, a series of handling of separating the electronic product 101 from the lead frame 100 and transferring the electronic product 101 to the embossed tape 110 may be performed by 1 pcs. With this, the pitch feed of the embossed tape 110 is stopped at the time of the slipping, and the lead frame 100 is rapidly fed by the pitch of the slipping number so that the embossed portion 111 of the embossed tape 110 is continuously filled with the electronic product. I have. However, 1p
In the handling for each cs, the rotation speed of the transport roller cannot be increased so much, and is at most about 100 rpm.
In other words, productivity is poor.

On the other hand, in order to handle a plurality of pcs at a time, for example, a plurality of separated electronic products are temporarily placed in another place, aligned by a linear feeder (not shown), and then handled again to emboss. Tape 11
It is performed to enter the zero embossed portion 111. However, in this case, it is necessary to add another handling which is complicated and easily causes troubles (clogging of electronic products, bending of lead terminals, etc.) to normal handling.

SUMMARY OF THE INVENTION Accordingly, it is an object of the present invention to provide a method of taping an electronic product which can handle electronic products at high speed and with certainty by a plurality of pcs in view of the above problems.

[0008]

In order to achieve the above object, a method of taping an electronic product according to the present invention is characterized in that an electronic product connected to a lead frame at a constant interval is separated from the lead frame, and the electronic product is fixed to a carrier tape at a constant interval. Is a taping method for accommodating the electronic products one by one in an electronic product accommodating section provided with the electronic components, wherein the electronic products are transferred by the lead frame at an upstream side of a handling position where the electronic products are transferred from the lead frame to the carrier tape. The presence / absence of a product is detected for each number of handlings, and among the detection signals, if there is a detection signal at the position closest to the handling position, the pitch corresponding to the number of continuous signals including the presence signal is included. Only after moving the lead frame and carrier tape to the handling position, the electronic product corresponding to the existing signal When separated from the lead frame and stored in the electronic product storage section of the carrier tape, if there is no detection signal at the position closest to the handling position, only the pitch corresponding to the number of consecutive non-signals including the non-detection signal By moving only the lead frame to the handling position, the electronic products are continuously stored in the electronic product storage section of the carrier tape.

In this taping method, first, before the electronic products reach the handling position, the presence or absence of the electronic products to be handled at once is detected. If a considerable number of electronic products are continuously present on the lead frame, the lead frame and the carrier tape are moved to the handling position by the pitch corresponding to the number of detection signals, and a considerable number of electronic products are removed from the lead frame. Separate them individually at a time and place them in the electronic product storage section of the carrier tape.

[0010] When a defective product is cut off in a pre-step of the taping process and a missing occurs in which no electronic product is present in the lead frame, only the lead frame is moved to the handling position by a pitch corresponding to the infinite number of detection signals. And do not move the carrier tape. As described above, by controlling the movement of the lead frame and the carrier tape based on the presence or absence of the detection signal, it is possible to prevent the electronic product from being stored in the electronic product storage portion of the carrier tape. As a result, according to the method of the present invention, a plurality of electronic products can be quickly and reliably taped at a time.

In the method of the present invention, the number of electronic products handled at one time is not particularly limited. In general, if the yield of electronic products is high in the taping process, the larger the number of handling products, the higher the theoretical speed of the taping process. Can be However, in consideration of the pitch size between the lead frame and the carrier tape, the bonding strength of the top tape bonded onto the carrier tape, etc., about 4 pcs is appropriate as described in the following embodiments.

[0012]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, an electronic product taping method according to the present invention will be described based on embodiments. FIG. 1 schematically shows the entire appearance of a taping device for realizing the method. FIG. 2 shows a configuration diagram on the lead frame side, and FIG. 4 shows a configuration diagram on the carrier tape side. 1 and 2,
A lead frame 10 in which electronic products 11 such as transistors and light emitting diodes are arranged at regular intervals is engaged with transport rollers 30 and 31 arranged on the downstream side and the upstream side in the traveling direction. As can be seen from the figure, the conveying rollers 30, 31 are respectively provided with teeth 30a, 31 such as sprockets.
a at regular angular intervals, and each tooth 30a, 3
1 a fits into the hole 10 a of the lead frame 10. The power source of the transport rollers 30 and 31 is a feed motor 32. The feed motor 32 is a numerically controllable stepping motor or the like so that the lead frame 10 can be moved in the arrow X direction at every pitch corresponding to one electronic product, and is connected to the transport roller 31 by a belt 33. In addition, the transport roller 31 can be rotated every pitch. These transport rollers 30, 31 and feed motor 32
Constitute a lead frame transfer means.

A collet 40 that can move in the vertical direction is disposed directly above the lead frame 10, and four electronic product suction portions 40 a are formed in parallel on a surface of the collet 40 facing the lead frame 10. This electronic product suction unit 40
“a” is provided at regular intervals corresponding to the electronic products 11 arranged in the lead frame 10 and has a size that substantially accommodates the electronic products 11. Inside the collet 40, a common flow path 41 is provided.
This common flow path 41 is branched into four individual flow paths 42, and each individual flow path 42 is
Is in communication with Thus, the electronic product 11 can be sucked to the electronic product suction portion 40a by using, for example, a negative pressure.

Further, an upper blade 45 is provided beside the collet 40.
1 (see FIG. 1), and a lower blade 47 (see FIG. 2) is disposed directly below the lead frame 10 facing the collet 40. Both the upper blade 45 and the lower blade 47 can move in the vertical direction. As shown in FIG. 3, in this embodiment, a handling means is constituted by the collet 40, the upper blade 45, and the lower blade 47. In handling the electronic product 11, the collet 40 descends toward the lead frame 10, the upper blade 45 lowers, and the lower blade 47
Goes up. Then, while the electronic product 11 is supported from below by the lower blade 47, the lead terminals 11 a of the electronic product 11 continuous with the lead frame 10 are separated from the lead frame 10 by the upper blade 45 and the lower blade 47. At the same time, the separated electronic product 11 is sucked by the electronic product suction portion 40a of the collet 40 that has descended.

Immediately downstream of the four electronic products arranged at the handling position, four sensors 50 are provided immediately below the lead frame 10 as detecting means for each pitch of the electronic products 11. The sensor 50 is for detecting the presence or absence of the electronic product 11 sent by the lead frame 10, and is in electrical communication with the above-mentioned handling means and the like.

On the other hand, in FIG. 1 and FIG. 4, a carrier tape 20 parallel to the lead frame 10 at a predetermined interval is provided.
Has electronic product storage units 21 at intervals corresponding to the intervals between the electronic products 11, and stores the electronic products carried by the collet 40 in the storage units 21. Carrier tape 2
The transport rollers 60 on the downstream side and the upstream side in the traveling direction of
The carrier tape 20 is engaged with these rollers 60 and 61. The transport rollers 60 and 61 are
As with the transport rollers 30 and 31, each tooth 60
a, 61a, and the teeth 60a, 61a fit into the holes 20a of the carrier tape 20. Also, the transport roller 60,
61 is connected to a feed motor 62 by a belt 63. The feed motor 62 is also the feed motor 32
Similarly to the above, it is a stepping motor or the like that can be numerically controlled, and can move the carrier tape 20 in the arrow Y direction at every pitch. The transport rollers 60 and 61 and the feed motor 62 constitute a carrier tape transfer unit.

In FIG. 4, from the side of the collet 40, after an electronic product is put in the electronic product storage portion 21 of the carrier tape 20, a top tape 70 for thermocompression bonding on the carrier tape 20 is compressed. It is supplied via a roller 71. In the taping device configured as described above, when the electronic products 11 conveyed continuously from the lead frame 10 are continuous, the "present" signal of the electronic products is generated by the sensor 50 disposed immediately before the handling position. Emitted, collet 40 as usual,
The upper blade 45 and the lower blade 47 operate. That is, with respect to the four electronic products sent to the handling position, the collet 40 descends, the upper blade 45 lowers, the lower blade 47 rises, and the lead terminals of the electronic product lead by the upper blade 45 and the lower blade 47. It is separated from the frame 10 (see FIG. 3). At the same time, the four separated electronic products are sucked by the respective electronic product suction portions 40 a of the collet 40. Then, the collet 40 moves right above the carrier tape 20 while drawing a trajectory as indicated by an arrow Z shown in FIG. 1, and stores four electronic products in the respective electronic product storage units 21. This is 1
After the first handling operation, the lead frame 10 and the carrier tape 20 are sequentially fed by four pitches based on the next detection signal of the sensor 50. At the same time, the top tape 70 is thermocompression-bonded to the carrier tape 20 by the pressure roller 71 so as to cover the electronic product storage unit 21.

Here, when a defective product is cut off in a process preceding the taping process and a missing occurs in the lead frame 10 (for example, a defective product usually occurs at a rate of 1 to 2% in a transistor), the following process is performed. Is operated as follows. Referring to FIG. 2, first, if one or several consecutive nuisances occur, and four or more electronic products are continuous before and after the nuisance, the lead is read by a pitch corresponding to the number of the nuisances. The frame 10 is advanced, and the electronic product following the Hanukuke is moved to the electronic product suction part 40 on the upstream side of the collet 40.
a. That is, the lead frame 10 is advanced by an amount corresponding to the slip, and the electronic product is sucked by the electronic product sucking section 40a on the rightmost side of the drawing.
In this way, four electronic products following Hanuke are collet 4
Then, the handling may be performed in the same manner as in the above-described normal state.

Next, when dandruff occurs at intervals and four or more electronic products are not continuous, the lead frame 10 and the carrier tape 20 move by a predetermined pitch in accordance with the presence / absence signal of the sensor 50. In addition, the number of electronic products to be taken into the collet 40 is changed so that the electronic product accommodating portion 20a of the carrier tape 20 does not cause a drop. That is, in this case, the electronic product is the collet 40.
The lead frame 10 moves so as to be sucked from the leftmost electronic product suction portion 40a, and the carrier tape 20 is fed by a pitch corresponding to the number of electronic products to be handled.

This will be described in more detail with reference to the explanatory diagram shown in FIG. 5 correspond to the above components, respectively, and the lead frame 10 and the carrier tape 20 move in the directions of the arrows X and Y, respectively. “Presence” and “absence” described in the lead frame 10 indicate the presence or absence of an electronic product, “presence” of the carrier tape 20 indicates that the electronic product is stored in the electronic product storage unit 21, and “empty”. Indicates that no electronic product is contained in the accommodating section 21. Now, assuming that the electronic products of the lead frame 10 are sent in the order shown in the figure, first, the electronic products arranged in the order of “presence / absence / presence / presence” immediately before the handling position are the sensor 5
0, and only the signal of the sensor 50c is “absent”
become. The detection signal recognizes that an electronic product is present immediately before the handling position, so that the lead frame 10 is fed by one pitch, and the leading electronic product is moved to a position corresponding to the electronic product suction portion 40a of the collet 40. come. At this time, the carrier tape 20 is fed by one pitch corresponding to one electronic product. Then, the leading electronic product is handled and the “empty” electronic product storage unit 21 is handled.
Can be put in.

In the next state, the signal of the sensor 50d is "NO" and the signals of the sensors 50c and 50b are "YES". Sent. Thus, the electronic product comes to the position of the electronic product suction sections 40a and 40b. Concurrently, the carrier tape 20 is fed by two pitches corresponding to the two electronic products, and handles the two electronic products similarly.

Next, since the signals of the sensors 50c and 50d become "absent", the lead frame is advanced by two pitches. Then, since four continuous electronic products are arranged on the four sensors 50, all the signals become “Yes”. At this time, the operation is the same as the normal operation, and the lead frame 10
Is sent four pitches, the carrier tape 20 is also sent four pitches, and four electronic products are handled at a time.

In the above embodiment, the electronic product separated from the lead frame 10 is housed in the electronic product housing portion 21 of the carrier tape 20 without changing its direction as it is, but the direction of the electronic product is changed by 180 degrees. Sometimes taping. In this case, a rotation operation of 180 degrees is added to the handling operation of the collet 40, or the teeth 60a, 61a of the transport rollers 60, 61 of the carrier tape 20 are arranged on the opposite side (the side away from the lead frame 10), What is necessary is just to be able to hang the tape 20 on the conveyance rollers 60 and 61 in the opposite direction.

[0024]

The method of taping an electronic product according to the present invention is as follows.
The configuration described above has the following effects. (1) Since electronic products can be handled at once by a plurality of pcs from the lead frame to the carrier tape without occurrence of a drop on the carrier tape side, high-speed taping becomes possible. For example, for a transistor, the yield is 9
If it is 4 pcs in the case of 8% or more, the number of rotations of the transfer means (transport roller) of the lead frame and the carrier tape is set to 44
It can be increased to about 0 rpm. (2) Since a plurality of electronic products can be separated at a time and the separated electronic products can be handled and taped as they are, compared with the conventional case where the separated electronic products are once placed, aligned, and then handled again. hand,
There are no inconveniences such as bending of lead terminals of electronic products and clogging of electronic products, and taping can be performed reliably.

[Brief description of the drawings]

FIG. 1 is a schematic external view of an entire taping device used in a taping method of the present invention.

FIG. 2 is a schematic configuration diagram showing components related to a lead frame side of the device shown in FIG.

FIG. 3 is a schematic enlarged view showing a handling means of the apparatus shown in FIG.

FIG. 4 is a schematic configuration diagram showing components related to a carrier tape side of the apparatus shown in FIG.

FIG. 5 is an explanatory diagram for explaining the operation (taping method) of the device shown in FIG. 1;

FIG. 6 is a partially omitted plan view of a lead frame and an embossed tape for explaining an outline of a conventional taping device.

FIG. 7 is a schematic enlarged view showing a handling means on the lead frame side shown in FIG. 6;

FIG. 8 is a schematic enlarged view showing a state where electronic products are stored in the embossed tape shown in FIG. 6;

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 10 Lead frame 11 Electronic product 20 Carrier tape 21 Electronic product accommodation part 40 Collet 45 Upper blade 47 Lower blade 50 Sensor (detection means)

Claims (1)

(57) [Claims] 1. A lead frame connected at a fixed interval
Disconnect the electronic product from the lead frame and
1 in the electronic product storage section provided at regular intervals
This is a taping method for accommodating electronic products from a lead frame to a carrier tape.
Lead upstream of the handling position where
Check whether electronic products are transported by the frame.
Detected for each number of drings
If there is a detection signal at the position closest to the ring position,
The number corresponding to the number of consecutive proprietary signals, including
Handle the lead frame and carrier tape only
Product corresponding to a signal that has an existing signal after being moved to the
From the lead frame and separate the carrier tape
The position closest to the handling position, stored in the product storage section
If there is no detection signal, the
No. of lead frame by pitch corresponding to the number of consecutive
The carrier to the handling position.
Continuously store electronic products in the electronic product storage section of ATEP
Taping side of electronic products, characterized in that it was so that
Law .