JP2765507B2 - Method for manufacturing resin-encapsulated semiconductor device - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for manufacturing a resin-encapsulated semiconductor device, and more particularly, to a resin encapsulation having a heat-dissipating member such as a heat sink or a heat-conducting plate for promoting heat dissipation and preventing heat storage. The present invention relates to a method for attaching a heat dissipation member in a semiconductor device.

[0002]

2. Description of the Related Art FIG. 5 is a sectional view showing an example of a conventional resin-sealed LSI. Referring to FIG. 5, this LSI is manufactured as follows. First, the chip 1 is mounted on the island 4 of the lead frame using a die bonding material.
Next, bonding and bonding of the chip surface using the wire 2 are performed.
Pads (not shown) and lead terminals 6 on the lead frame side
And bonding. Thereafter, the package is sealed with the resin layer 3 and externally provided by transfer molding using a molding die. Finally, lead cutting and molding are performed to complete the resin-sealed LSI shown in FIG.

The above is a general resin-encapsulated LSI that has been widely used. However, in recent years, the amount of heat generated per unit volume has been increasing in accordance with the increasing functionality and density of the LSI. Along with this, there is a need for a technique for making LSI components and structures suitable for improving thermal conductivity and heat dissipation and preventing heat storage. An LSI shown in FIG. 6 is known as a resin-sealed LSI in which such measures and measures are taken. In the LSI shown in this figure, a chip is mounted on a highly heat-conductive metal block (heat spreader) 10 fixed to the lead terminal 6 by an insulating adhesive 11 or glass fusing to achieve low thermal resistance.

The above-described LSI shown in FIG. 6 can further improve heat dissipation by exposing the heat spreader 10 from the resin layer 3 as shown in FIG.
Such a resin-sealed LSI is disclosed in, for example,
No. 8364.

As a resin-encapsulated LSI having improved heat dissipation, as shown in FIG. 8, an LSI in which a heat sink 5 is attached to the surface of an exterior resin layer 3 with respect to the LSI shown in FIG.
It has been known. Further, as shown in FIG. 9, a heat sink 5 is mounted on the LSI having the heat spreader exposed structure shown in FIG.
LS attached to the exposed surface of the heat spreader 10
There is also I.

Further, a resin-sealed LSI considering thermal design
Other than the above, there is one disclosed in JP-A-2-163954. Resin sealing type L described in this publication
In the SI, a high thermal conductive plate having a large area is disposed as close as possible to the chip mounting island in order to transmit heat generated in the chip to the high thermal conductive plate with low resistance. For this purpose, the suspension pin of the lead frame is provided with a hole for positioning the high thermal conductive plate, while the high thermal conductive plate is provided with a projection which fits into the positioning hole of the suspension pin. To manufacture the LSI described in this publication, first, a chip is fixed to an island, and a bonding pad on the chip and an inner lead of a lead frame are wire-bonded. Next, the above-mentioned protrusion of the high thermal conductive plate is inserted into the positioning hole of the suspension pin from the back surface side of the island (the surface on which the chip is not mounted), and the high thermal conductive plate is positioned and temporarily fixed. Thereafter, similarly to a general resin-sealed LSI, resin sealing, lead cutting, and lead molding are performed to complete the LSI.

[0007]

In any of the above-described resin-sealed LSIs, measures to reduce the heat resistance and increase the heat dissipation have the side effect of increasing the manufacturing cost.
Also, depending on the structure, so-called island shift, in which the island is displaced in the resin sealing process, is likely to occur, and as a result, the chip is exposed on the exterior resin surface, or the wire and the chip come into contact with each other to cause a short circuit. There is. The description is given below.

First, as shown in FIG. 5 and FIG.
In the case of using the island, the island 4 causes an island shift due to the flow and pressure of the molten resin press-fitted into the mold cavity at the time of resin press-fitting, and the wire 2
It is well known in the art that deformation and contact with the chip 1 easily occur.

Next, the LSI shown in FIG. 6, FIG. 7 or FIG.
In the case of an LSI in which the thermal resistance is reduced by using the metal block 10 having high thermal conductivity as described above, a step of fixing the metal block 10 having high thermal conductivity to the inner lead 6 of the lead frame in advance is required. Rise is inevitable.

[0010] Further, as in the case of the LSI shown in FIGS.
After the resin sealing step, a step of attaching the heat sink 5 to the surface of the sealing resin 3 (in the case of FIG. 8) or attaching the heat sink 5 to the exposed surface of the heat spreader 10 (in the case of FIG. 9) is required. Is inevitable.

Further, the LSI described in Japanese Patent Application Laid-Open No. Hei 2-163954 requires a step of providing a positioning hole in a suspension pin of a lead frame and a step of providing a projection on a heat conductive plate, and the processing is expensive. Since precision is required, manufacturing costs increase.

Accordingly, it is an object of the present invention to provide a method of manufacturing a resin-sealed LSI having excellent effects of reducing heat resistance and increasing heat dissipation by using simple components and simple steps. It is.

Still another object of the present invention is to provide a resin-sealed LSI having low heat resistance, good heat dissipation, and an excellent heat storage prevention effect as described above,
Accordingly, it is an object of the present invention to provide a method of manufacturing such that contact between a wire and a chip does not occur.

[0014]

According to the present invention, there is provided a sealing device.
Use a heatsink or heat conductive plate on the exterior resin layer.
Resin-sealed semiconductor with a structure in which a metal heat dissipation member is embedded
In manufacturing the apparatus, in the resin sealing step of pressing the molten resin into the cavity of the molding die to form the resin layer, the heat-dissipating member is disposed in advance at the bottom of the cavity of the lower molding die. Then, the molten resin is press-fitted to mold the resin layer for the sealing exterior, and at the same time, the heat-dissipating member is fixed to the resin layer by using the adhesive force of the molded resin layer.

[0015] The present invention, in the resin sealing step, as the molding lower die, with use of the die alms structure narrowing drilling on the bottom of the cavity, as the heat radiating member, under a said forming A main body part to be fitted during digging of the mold, and a horizontal projection from the main body part,
A flange-shaped part that should be in close contact with the upper surface of the periphery of the lower mold
It is characterized by using a heat dissipating member provided .

Alternatively, in the resin sealing step, a mold having a structure in which a frame-shaped projection is provided at the bottom of a cavity is used as the lower mold for molding, and the molding die is used as the heat dissipation member. It is fitted into the space surrounded by the frame-like protrusion of the lower die
The body part to be extended horizontally from the body part
A flange which should be in close contact with the upper surface of the frame-shaped projection of the lower mold for molding
And a heat dissipating member having a shape-like portion .

Alternatively, in the second manufacturing method,
Instead of providing the protrusion on the lower mold for molding,
In addition to providing the knockout pin for ejecting a molded product on the surface to be abutted against the heat dissipation member, the lower mold for molding and
Then, a mold having an opening at the bottom of the cavity through which the knockout pin with the protrusion penetrates is used .

According to the present invention, in the resin encapsulating step, a heat dissipating member having a structure having a portion directly in contact with the back surface of a chip to be resin-sealed or a chip mounting island of a lead frame is used as the heat dissipating member. It is characterized by using .
Thereby, the thermal resistance can be further reduced.

Furthermore, in the resin sealing step, after applying the high thermal conductivity of the die bonding material previously the chip or on at least one surface of the back surface and the heat radiating member of the island, and characterized in that the resin pressed I do. This allows
The heat radiation effect can be further enhanced.

[0020]

The resin-sealed LSI manufactured according to the present invention
Includes a heat dissipating member such as a heat sink or a heat conducting plate, which is made of a metal block having high thermal conductivity. In the present invention, at the time of resin sealing, the heat dissipating member is set in advance on the bottom of the cavity of the lower molding die, and then the molten resin is press-fitted. Thus, the heat dissipation member is fixed to the exterior resin layer by the adhesive force of the solidified resin at the same time as the molding of the exterior resin layer. Therefore Oite the present invention, after the first forming an outer resin layer, of attaching a heat-radiating member in a separate step from this, a special manufacturing process for a heat-radiating member mounting is not required.

In the present invention, in order to simultaneously and efficiently mount the heat radiating member at the time of molding the exterior resin layer, the shape of the heat radiating member is formed at the bottom of the cavity of the lower molding die. In addition, an escape groove in which the heat radiation member can be set is provided. On the other hand, the heat dissipating member is provided with a portion that enters the inside of the escape groove and a flange portion that protrudes around the escape groove. When the molten resin is injected, the heat dissipating member attempts to cause lateral displacement due to the flow of the resin, but the lateral wall of the escape groove suppresses the lateral displacement. Also, since the heat dissipation member is pressed in the depth direction of the escape groove by the pressure of the injected resin, the escape groove is covered with the flange-shaped portion and the injected resin leaks into the escape groove. There is no. Therefore, the clearance of the clearance groove does not need to be particularly high precision, but may be any value as long as the lateral displacement of the heat radiation member can be absorbed. As described above, in the present invention, the step of fixing and placing the lead frame and the heat radiation member in advance is unnecessary.
In addition, it is not necessary to perform a process requiring high precision, in which a positioning hole is provided in the lead frame and a projection that fits into the positioning hole is provided on the heat radiation member side, and both parts are not required to be processed.

The effect of preventing the heat dissipating member from laterally shifting and the effect of preventing the injected resin from leaking into the escape groove are not obtained only when the structure of the lower mold is an escape groove structure. A similar effect can be obtained by providing a frame-shaped projection on the bottom of the cavity of the lower mold and setting a flanged heat-radiating member in a space surrounded by the frame-shaped projection. Further, the above-mentioned frame-shaped projection may be provided on the knockout pin side for ejecting the molded product after resin sealing.

In the structure of the invention described so far, the structure of the heat radiating member is the same as that of the upper surface of the heat radiating member set in the molding die and the back surface of the chip or the island on which the chip is mounted. In such a structure, the chips and islands are pressed against the heat radiating member by the pressure of the resin during the injection of the molten resin, so that the so-called island shift, that is, displacement of the chips and islands does not occur. Therefore, a short circuit in which the bonding wire and the chip are in contact with each other is eliminated. In addition, since the adhesion between the chip or the island and the heat dissipation member is improved, the thermal resistance is reduced.

In the above configuration, if a die bond material having high thermal conductivity is applied to the back surface of the chip or the island or the upper surface of the heat radiating member in advance, and then the molten resin is press-fitted, the gap between the chip or the island and the heat radiating member is reduced. Is further improved, so that the thermal resistance can be further reduced.

[0025]

Next, a preferred embodiment of the present invention will be described with reference to the drawings. FIG. 1 is a cross-sectional view of a resin-sealed LSI manufactured according to the first embodiment of the present invention in a resin-sealing step. With reference to FIG. 1, in the present embodiment, a lower mold 8 </ b> A of a resin molding mold has a structure in which a relief groove 12 is provided. The clearance groove 12 is provided so that a heat sink 5A made of a metal block having high thermal conductivity can be set. In addition, this escape groove 12
Need only have a rough clearance that can absorb the lateral displacement of the heat sink 5A.

In this embodiment, first, the chip 1 is fixed to the island 4 of the lead frame 15A in advance, and the bonding pad (not shown) on the chip 1 and the inner lead 6 of the lead frame are connected by the bonding wire 2. Leave. Next, separately from this, the clearance groove 12 of the lower mold 8A for sealing is used.
, The heat sink 5A is set. Then, the lead frame 15A on which the above-described chip is mounted is arranged on the lower mold 8A. Then, it is clamped by the sealing upper mold 7 and the melted sealing resin 30 is pressed into the cavity 16. At this time, the heat sink 5A is pressed into the relief groove 12 of the lower mold by the pressure of the injected resin 30. Therefore, the resin 30
The lateral displacement of the heat sink 5 </ b> A caused by the flow of the heat is suppressed by the lateral wall of the escape groove 12. At the same time,
Since the escape groove 12 is covered by the heat sink 5A, the leakage path of the resin 30 to the escape groove 12 is cut off. After the injection of the molten resin and cooling, the molded product with the heat sink is molded using the knockout pins 9 into the molds 7 and 8.
Although the heat sink 5A is taken out, the heat sink 5A remains firmly fixed to the LSI surface while being half embedded in the exterior resin layer due to the adhesive property of the solidified resin.

In this embodiment, by providing the relief groove 12 for attaching the heat sink to the lower mold 8A, the heat sink 5A is dropped into the relief groove 12 during resin sealing. With only one operation, the heat sink 5A can be easily attached with high positional accuracy. That is, unlike the conventional LSI with a heat sink shown in FIGS. 8 and 9, a special process of attaching a heat sink to a molded product after resin sealing is not necessary.

Unlike the LSI shown in FIG. 9, there is no need to use a lead frame 15 to which the heat spreader 10 is attached in advance.

Further, unlike the LSI described in the above-mentioned JP-A-2-163954, a hole for positioning is provided on the lead frame side for mounting the heat conductive plate, and the lead frame is provided on the heat conductive plate side. There is no need to perform a special process of providing a projection that fits into the hole on the side. That is, in this embodiment, the structure of the LSI itself is simple, and therefore, the manufacturing process is also simple. Moreover, in this embodiment, only the relief groove 12 is provided in the lower molding die 8A. However, the clearance groove 12 does not need to be high precision, and may have a clearance large enough to prevent the heat sink 5 from laterally shifting. Good. Manufacture of such a mold is not particularly difficult.

Next, a second embodiment of the present invention will be described. FIG. 2 is a cross-sectional view of a resin-sealed LSI manufactured according to the second embodiment of the present invention in a resin-sealing step. Comparing FIG. 2 with FIG. 1, in the present embodiment, the pedestal 1 is attached to the heat sink 5B so that the heat sink 5B directly contacts and supports the island 4 on the lead frame side.
7 is different from the first embodiment. Also in this embodiment, the heat sink 5B is provided in the escape groove of the lower mold 8A.
Is set, and then the lead frame 1 on which the chip is mounted
After arranging 5A, the molten resin 30 is press-fitted. At that time, the island 4 tends to shift due to the flow of the injected resin 30, but is pressed against the pedestal 17 of the heat sink by the pressure of the resin, and thus remains at the original position.

According to the present embodiment, the resin 30
In addition to preventing island shift due to press fitting,
Since the island 4 and the pedestal 17 can be brought into close contact with each other, the thermal conductivity from the chip 1 to the heat sink 5B can be improved. In addition, the pedestal 17 must be
If a die bond material having good heat conductivity is applied to the front surface or the back surface of the island 4, the above heat conductivity is further improved.

Next, a third embodiment of the present invention will be described. FIG. 3 is a sectional view of a resin-sealed LSI manufactured according to the third embodiment of the present invention in a resin-sealing step. Comparing FIG. 3 and FIG.
This embodiment differs from the previous embodiments in that a protrusion 18 for supporting the heat dissipation plate 10 is provided at the bottom of the cavity 16 of B. The convex portion 18 only needs to have a rough clearance that can absorb the lateral displacement of the heat conductive plate 10. Also in this embodiment, resin sealing is performed according to the same process sequence as in the previous embodiments. That is, a flange-like portion projecting horizontally from the upper portion of the heat conductive plate 10 is placed on the convex portion 18 of the lower mold 8B, and then the lead frames 15A with chips mounted thereon are arranged, and then the molten resin 30 is press-fitted. . At this time, the heat conductive plate 10 is caused to flow by the injected resin 30 and tends to move in the lateral direction. However, since the side wall at the lower part of the flange portion is pressed against the convex portion 18, the lateral displacement remains within the range of the clearance. Further, since the flange portion of the heat conductive plate 10 is pressed against the convex portion 18 of the lower mold by the pressure of the injected resin 30, the resin 30 does not leak into the area surrounded by the convex portion 18. Here, in this embodiment, the protrusion 1
Although the projection 8 is provided on the lower die 8B side, the projection 18 may be modified so as to be provided on the ejection knockout pin 9 side of the molded product. In this case, the projection 18 is provided on the surface of the knockout pin which is to be attached to the bottom surface of the heat conduction plate 10.
Is provided. On the other hand, the lower mold is provided with an opening through which a knockout pin with a projection penetrates while flattening the bottom surface of the cavity.

Next, a fourth embodiment of the present invention will be described. FIG. 4 is a cross-sectional view of a resin-sealed LSI manufactured according to the fourth embodiment of the present invention in a resin-sealing step. Comparing FIG. 4 with FIG. 2, the present embodiment is different from the lead frame connected by wire bonding in that a TAB (Tape Outbound Bond) is used.
ing: The use of a lead frame 15B connected by a tape automated bonding) method
This is different from the previous embodiments. In all of the embodiments described above, the heat generated in the chip is indirectly transmitted to the heat sink (or the heat conductive plate) via the island. In this embodiment, the chip 1 is provided with the heat sink 5B.
Contact directly. Therefore, the thermal resistance from the chip to the heat sink becomes smaller than before. Also in this embodiment, resin sealing is performed according to the same process sequence as in the previous embodiments. That is, first, a lead frame 15B in which the chip 1 is mounted and the wires 2 are connected by the TAB method is prepared in advance. Next, separately from this, after setting the pedestal heat sink 5B in the clearance groove 12 of the lower mold 8A for sealing, the above-described chip-mounted leads 15B are arranged in the lower mold 8A, and clamped by the upper mold 7. I do. Then, the molten sealing resin 30 is press-fitted. At this time, the chip 1 is
However, the resin is pressed against the heat sink 5B by the pressure of the resin, and is supported by the resin. As a result, the displacement of the chip is prevented, and the chip 1 and the heat sink 5B adhere to each other,
Good thermal conductivity is obtained. Further, by applying a die bonding material having good thermal conductivity on the back surface of the chip 1 or the top surface of the heat sink 5B, the thermal resistance from the chip 1 to the heat sink 5B can be further reduced.

In any of the above embodiments, the heat sink and the heat conductive plate are replaced with each other.
It will be clear that the relief groove and the projection can be interchanged. In the present invention, the selection of whether the heat dissipation member is a heat sink or a heat conduction plate and the selection of whether the structure of the lower mold is a relief groove structure or a convex structure are one of the choices. The choice of the other is not necessarily determined uniquely and is independent of each other.

As described above, the resin-sealed LSI manufactured according to the present invention is provided with a heat radiating member made of a metal block having good heat conductivity, such as a heat sink or a heat conductive plate. According to the present invention, the heat dissipating member is set in advance in the bottom of the cavity of the lower mold for molding when the resin is sealed, and then the molten resin is press-fitted. Thus, the heat dissipation member is fixed to the exterior resin layer by the adhesive force of the solidified resin simultaneously with the molding of the exterior resin layer. Therefore Oite the present invention, that first attaching the heat-radiating member after forming the exterior resin layer, a special process for the heat-radiating member mounting is not required.

In the present invention, in order to simultaneously and efficiently mount the heat radiating member at the time of molding the above-mentioned exterior resin layer, the shape of the heat radiating member is formed at the bottom of the cavity of the lower mold for molding. In addition, an escape groove in which the heat radiation member can be set is provided. On the other hand, the heat dissipating member is provided with a portion that enters the inside of the escape groove and a flange portion that protrudes around the escape groove. When the molten resin is injected, the heat dissipating member attempts to cause lateral displacement due to the flow of the resin, but the lateral wall of the escape groove suppresses the lateral displacement. Also, since the heat dissipating member is pressed in the depth direction of the escape groove by the pressure of the injected resin, the flange-shaped portion is covered with the escape groove, and the injected resin leaks into the escape groove. There is no. Therefore, the clearance of the clearance groove does not need to be particularly high precision, but may be any value as long as the lateral displacement of the heat radiation member can be absorbed. As described above, in the present invention, the step of fixing and placing the lead frame and the heat radiation member in advance is unnecessary.
Further, it is not necessary to perform a process requiring high precision, in which a positioning hole is provided in the lead frame and a projection which fits into the positioning hole is provided on the heat radiating member side.

The effect of preventing the heat dissipating member from laterally shifting and the effect of preventing the injected resin from leaking into the escape groove are not obtained only when the structure of the lower mold is an escape groove structure. A similar effect can be obtained by providing a frame-shaped projection on the bottom of the cavity of the lower mold and setting a flanged heat-radiating member in a space surrounded by the frame-shaped projection. Further, the frame-shaped protrusion may be provided on the knockout pin side for ejecting the molded product after resin sealing.

In the structure of the invention described so far, the structure of the heat radiating member is such that the upper surface of the heat radiating member set in the molding die and the chip set thereon or the back surface of the island on which the chip is mounted are mounted. When the molten resin is injected, the chips and islands are pressed against the heat radiating member by the pressure of the resin, so that the so-called island shift, that is, displacement of the chips and islands does not occur. Therefore, there is no defect such as contact between the bonding wire and the chip. In addition, since the adhesion between the chip or the island and the heat dissipation member is improved, the thermal resistance is reduced.

In the above structure, if a high-heat-conductive die-bonding material is previously applied to the back surface of the chip or the island or the upper surface of the heat-dissipating member, and then the molten resin is press-fitted, the gap between the chip or the island and the heat-dissipating member is reduced. Can further increase the adhesion and lower the thermal resistance. Such an effect is due to T
The use of the lead frame bonded by the AB method is particularly effective because the chip directly contacts the heat dissipation member.

According to the present invention, a resin-sealed LSI with a heat dissipation member can be manufactured at low cost.

Further, not only the occurrence of short-circuit failure between the wire and the chip due to the displacement of the chip or the island caused in the resin sealing process can be suppressed, but also the heat dissipation can be further improved.

[Brief description of the drawings]

FIG. 1 is a sectional view showing a state before resin injection in a resin sealing step according to a first embodiment of the present invention.

FIG. 2 is a sectional view showing a state before resin injection in a resin sealing step according to a second embodiment of the present invention.

FIG. 3 is a cross-sectional view showing a state before resin injection in a resin sealing step according to a third embodiment of the present invention.

FIG. 4 is a sectional view showing a state before resin injection in a resin sealing step of a fourth embodiment of the present invention.

FIG. 5 is a sectional view of an example of a conventional resin-sealed LSI.

FIG. 6 shows a conventional resin-sealed LSI with a heat spreader.
It is sectional drawing of an example.

FIG. 7 shows a conventional resin-sealed LSI with a heat spreader.
It is sectional drawing of another example of (a).

FIG. 8 is a cross-sectional view of an example of a conventional resin-sealed LSI with a heat sink.

FIG. 9 is a cross-sectional view of another example of a conventional resin-sealed LSI with a heat sink.

[Explanation of symbols]

 Reference Signs List 1 chip 2 wire 3 exterior resin layer 4 island 5A, 5B heat sink 6 inner lead 7 upper die 8A, 8B lower die 9 knockout pin 10 heat spreader 11 adhesive layer 12 relief groove 13 TAB 14 die bonding material 15A, 15B lead frame 16 cavity 17 pedestal 18 convex part 30 molten resin

Claims (5)

(57) [Claims] 1. A method for manufacturing a resin-encapsulated semiconductor device having a structure in which a metal heat-dissipating member such as a heat sink or a heat-conducting plate is embedded in a resin layer for encapsulation exterior. A resin sealing step of molding the resin layer by press-fitting the molten resin into the cavity. In the resin sealing step, the heat dissipating member is disposed in advance at the bottom of the cavity of the lower molding die, and then the melting is performed. A method of manufacturing a resin-encapsulated semiconductor device, in which a resin is press-fitted to form the resin layer for encapsulation and at the same time, the heat-dissipating member is fixed to the resin layer using the adhesive force of the resin layer after molding. In the resin sealing step, a mold having a structure in which a bottom of a cavity is dug is used as the lower mold for molding, and the lower mold for molding is dug as the heat dissipation member. a body portion to be fitted into the body portion The horizontal direction from the
On the upper surface of the periphery of the engraving of the lower mold for molding
Using a heat dissipating member having a flange-shaped portion to be in close contact with the lower mold for molding,
The flange portion of the heat dissipating member
After supporting it with the peripheral part of the lower mold for engraving,
A method for manufacturing a resin-encapsulated semiconductor device, wherein the molten resin is press-fitted . 2. A method for manufacturing a resin-encapsulated semiconductor device having a structure in which a metal heat-dissipating member such as a heat sink or a heat-conducting plate is embedded in a resin layer for encapsulation exterior. A resin sealing step of molding the resin layer by press-fitting the molten resin into the cavity. In the resin sealing step, the heat dissipating member is disposed in advance at the bottom of the cavity of the lower molding die, and then the melting is performed. A method of manufacturing a resin-encapsulated semiconductor device, in which a resin is press-fitted to form the resin layer for encapsulation and at the same time, the heat-dissipating member is fixed to the resin layer using the adhesive force of the resin layer after molding. In the resin sealing step, a mold having a structure in which a frame-shaped protrusion is provided at the bottom of a cavity is used as the lower mold for molding, and the lower mold for molding is used as the heat dissipation member. It fitted all in a space surrounded by the frame-like protrusion A body portion,
The molding lower metal projecting horizontally from the main body portion
And a flange-shaped portion to be in close contact with the upper surface of the frame-shaped projection of the mold.
Using a heating member, the main body portion of the heat dissipation member is previously
The heat dissipating member is fitted into a space surrounded by a frame-shaped protrusion.
And a frame-shaped projection of the lower mold for molding.
And then press-fitting the molten resin . 3. The method for manufacturing a resin-encapsulated semiconductor device according to claim 2, wherein the projection is provided on the heat-dissipating member of the knockout pin for ejecting a molded product instead of providing the projection on the lower molding die. It is provided on the abutting to become surface attached, as the molding lower die, a mold knockout pin with the projection is provided with an opening through the cavity bottom
A method for manufacturing a resin-encapsulated semiconductor device, comprising: 4. The method for manufacturing a resin-encapsulated semiconductor device according to claim 1 , wherein in the resin-encapsulating step, the heat-dissipating member includes a resin-encapsulated chip or a lead frame. A method of manufacturing a resin-encapsulated semiconductor device, comprising using a heat-dissipating member having a portion having a portion directly in contact with a back surface of a chip mounting island. 5. The method of manufacturing a resin-encapsulated semiconductor device according to claim 4 , wherein in the resin-encapsulating step, at least one of the back surface of the chip or the island and the surface of the heat-dissipating member has high thermal conductivity. A method of manufacturing a resin-encapsulated semiconductor device, comprising applying a die-bonding material and then press-fitting the resin.