JP2758791B2 - Pin polishing equipment - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a pin polisher, and more particularly to a pin polisher for removing resin adhered to a reference pin used in molding a multilayer printed wiring board.

[0002]

2. Description of the Related Art A conventional pin polishing method is to coat a reference pin surface with a releasable resin such as a fluororesin to prevent the resin from adhering, or to brush a reference pin after use with a brush or a file. It was a general method to grind the resin portions which were fixed one by one manually.

[0003]

In the conventional method described above, when the resin is coated with a releasable resin, the coating falls off when the resin coated on the outer periphery of the reference pin passes through a hole wall in which the resin is fitted. Lack of durability. In addition, when the resin fixed to the reference pin is manually polished, there is a problem that a large number of steps are required for the operation.

An object of the present invention is to provide a pin polishing apparatus for automatically and reliably removing resin adhered to a reference pin surface.

[0005]

SUMMARY OF THE INVENTION The present invention relates to a pin polishing apparatus for removing a resin adhered to a reference pin used for positioning of a multilayer printed wiring board at the time of pressure molding, and has a disk-like shape having a horizontally rotating shaft. A buff, a motor for rotating and driving the disk-shaped buff, two free rollers horizontally arranged below the disk-shaped buff and having an axis parallel to a rotation axis of the disk-shaped buff; And a pusher that presses and penetrates the reference pin into the gap formed by the free-form roller and the free roller.

[0006]

Embodiments of the present invention will be described below with reference to the drawings.

FIG. 1 is a front view showing an embodiment of the present invention, and FIG. 2 is a side view of FIG.

As shown in FIGS. 1 and 2, the pin polishing apparatus includes a disk-shaped buff (hereinafter, referred to as buff) 1 having a rotation axis in a horizontal direction, and a buff 1 rotated via a timing belt 2 and the like. A motor 3 to be driven and a reference pin 4 which is provided horizontally below the buff 1 and has an axis parallel to the rotation axis of the buff 1
Two free rollers 5 (a) and 5 (b), and a gap formed by the buff 1 and the free rollers 5 (a) and 5 (b) along the free rollers 5 (a) and 5 (b). A pusher 7 for pressing the reference pin 4 by an air cylinder 6 or the like and penetrating the same, and a shooter 8 for supplying the reference pin 4 between the buff 1 on the free rollers 5 (a) and (b) and the pusher 7. Have been.

Next, the operation of the pin polishing apparatus will be described.

First, a reference pin 4 to which resin is fixed is supplied through a shooter 8 onto two free rollers 5 (a) and 5 (b) on the opposite end side to the buff 1 being rotated by a motor 3, and
The free rollers 5 (a) and 5 (b) are brought into sliding contact with the valley formed by the books. After the supply, the reference pin 4 is pressed by the pusher 7 into the gap formed by the lowermost point of the rotating buff 1 and the free rollers 5 (a) and 5 (b). The pressed reference pins 4 are free rollers 5 (a), (b)
It slides on top and is rotated by the buff 1. The polishing surface of the buff 1 is deformed in accordance with the surface of the reference pin 4 to which the resin is fixed, and the resin portion is removed.

Although the pin polishing apparatus described above is not shown, the buff 1 is slid up and down and the free roller 5 is moved.
A mechanism for changing the gap between (a) and (b) to adjust the polishing pressure and a mechanism for collecting the polished reference pin 4 in one place are also provided.

[0012]

As described above, according to the present invention, the resin fixed on the surface of the reference pin is automatically polished by the buffing device using a pin polishing device, so that the coating of the resin having releasability on the reference pin can be achieved. Since the unnecessary resin and the resin stuck to the reference pin are reliably removed, the reference pin having a stable surface can be supplied, and the number of work steps required for the pin polishing operation can be reduced.

[Brief description of the drawings]

FIG. 1 is a front view showing one embodiment of the present invention.

FIG. 2 is a side view of FIG.

[Explanation of symbols]

 1 Buff 2 Timing Belt 3 Motor 4 Reference Pin 5 Free Roller 6 Air Cylinder 7 Pusher 8 Shooter

Continuation of the front page (58) Field surveyed (Int.Cl. ⁶ , DB name) B24B 5/18 B24B 5/307 B24B 29/00 B24B 29/08

Claims (1)

(57) [Claims] 1. A pin polishing apparatus for removing a resin adhered to a reference pin used for positioning of a multilayer printed wiring board at the time of pressure molding, comprising: a disk-shaped buff having a rotation axis in a horizontal direction; A motor to be driven to rotate, two free rollers horizontally arranged below the disk-shaped buff and having an axis parallel to the rotation axis of the disk-shaped buff, and formed by the disk-shaped buff and the free roller And a pusher that presses and penetrates the reference pin into a gap to be formed.