JPH0699345A - Pin polishing device - Google Patents

Abstract

PURPOSE:To automatically and surely remove resin secured to surfaces of a reference pin, used for positioning at the time of pressure-molding a multilayer printed wiring board, by a buff. CONSTITUTION:A device has a disk-shaped buff 1 having a rotary shaft in a horizontal direction, motor 3 for driving the buff 1 rotated, two free rollers 5 horizontally juxtaposed by providing axes parallelly to the rotary shaft of the buff 1 and a pusher 7 for pressing reference pins 4 along the free rollers 5 inserted through a clearance formed by the buff 1 and the free rollers 5.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a pin polishing device, and more particularly to a pin polishing device for removing resin adhered to a reference pin used in molding a multilayer printed wiring board.

[0002]

2. Description of the Related Art In the conventional pin polishing method, the surface of a reference pin is coated with a resin having releasability such as fluorine resin to prevent the resin from adhering, or the reference pin after use is brushed or sanded. It has been a general method to manually grind the resin portions that are fixed one by one.

[0003]

According to the above-mentioned conventional method, when the resin having the releasability is coated, the coating is dropped when the resin coated on the outer periphery of the reference pin passes through the hole wall into which the resin is fitted. Lack of durability. Further, when the resin fixed to the reference pin is manually abraded, there is a problem that a great number of man-hours are required for the operation.

It is an object of the present invention to provide a pin polishing apparatus that automatically and surely removes resin adhered to the surface of a reference pin.

[0005]

SUMMARY OF THE INVENTION The present invention is a pin polishing apparatus for removing resin adhered to a reference pin used for positioning during pressure molding of a multilayer printed wiring board. A buff, a motor for rotationally driving the disc-shaped buff, two free rollers horizontally provided with an axis parallel to the rotation axis of the disc-shaped buff below the disc-shaped buff, and the disc. The buff and the pusher that pushes the reference pin through the gap formed by the free roller to penetrate the reference pin.

[0006]

Embodiments of the present invention will be described below with reference to the drawings.

FIG. 1 is a front view showing an embodiment of the present invention, and FIG. 2 is a side view of FIG.

As shown in FIGS. 1 and 2, the pin polishing apparatus includes a disk-shaped buff (hereinafter referred to as a buff) 1 having a horizontal rotation axis, and the buff 1 rotated through a timing belt 2 or the like. The motor 3 to be driven and the reference pin 4 are provided horizontally below the buff 1 and have an axis parallel to the rotation axis of the buff 1.
Along the two free rollers 5 (a), (b), which are longer than the two free rollers 5 (a), (b), and in the gap formed by the buff 1 and the free rollers 5 (a), (b). It has a pusher 7 that pushes the reference pin 4 with an air cylinder 6 or the like to penetrate it, and a shooter 8 that supplies the reference pin 4 between the buff 1 and the pusher 7 on the free rollers 5 (a) and (b). Has been done.

Next, the operation of the pin polishing device will be described.

First, the motor 3 feeds the reference pin 4 to which the resin is fixed onto the two free rollers 5 (a) and (b) on the side opposite to the rotating buff 1 through the shooter 8 and 2
The book is brought into sliding contact with the valley portion formed by the free rollers 5 (a) and (b). After the supply, the reference pin 4 is pushed through the gap formed by the lowest point of the rotating buff 1 and the free rollers 5 (a) and (b) by the pusher 7 so that the reference pin 4 is penetrated. The pressed reference pin 4 has free rollers 5 (a) and (b).
It slides on and is subject to rotation by buff 1. The buff 1 has elasticity and the polishing surface is deformed in accordance with the surface of the reference pin 4 to which the resin is fixed, and the resin portion is removed.

Although not shown in the drawings, the pin polishing apparatus described above slides the buff 1 up and down to move the free roller 5.
A mechanism for adjusting the polishing pressure by changing the gap between (a) and (b) and a mechanism for collecting the polished reference pin 4 in one place are also provided.

[0012]

As described above, according to the present invention, the resin adhered to the surface of the reference pin is automatically buffed by the pin polishing device so that the reference pin can be coated with the resin having releasability. There is an effect that the reference pin having a stable surface can be supplied to surely remove the resin which is unnecessary and adhered to the reference pin, and the man-hours required for pin polishing work can be reduced.

[Brief description of drawings]

FIG. 1 is a front view showing an embodiment of the present invention.

FIG. 2 is a side view of FIG.

[Explanation of symbols]

 1 Buff 2 Timing Belt 3 Motor 4 Reference Pin 5 Free Roller 6 Air Cylinder 7 Pusher 8 Shooter

Claims (1)

[Claims] 1. A pin-polishing device for removing resin adhered to a reference pin used for positioning during pressure molding of a multilayer printed wiring board, wherein a disc-shaped buff having a rotation axis in the horizontal direction and the disc-shaped buff are provided. Formed by a motor for rotating and driving, two free rollers horizontally provided with an axis parallel to the rotation axis of the disc-shaped buff below the disc-shaped buff, and the disc-shaped buff and the free roller. And a pusher that pushes the reference pin through the gap.