JP2753075B2 - Semiconductor device manufacturing equipment - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION [Object of the Invention] (Industrial application field) The present invention relates to, for example, TAB (Tape Automated Bonding).
The present invention relates to an apparatus for manufacturing a semiconductor device employing a method.

(Prior art) Recently, as a semiconductor device manufacturing apparatus, a TA for transporting semiconductor elements by running a cine-film-shaped film carrier.
Those using the B (Tape Automated Bonding) method are widely used. And among various devices used in each manufacturing process of a semiconductor device, those adopting the TAB method include:
There are an inner lead bonding device, a potting device, an electric test device, an outer lead bonding device, and the like.

FIG. 2 and FIG.
As shown in the figure, the inner lead bonding apparatus 1 supplies a film carrier 3 from a supply reel 2 and intermittently feeds the film carrier 3. Further, as shown in FIG. 3, the portion of the film carrier 3 where the inner leads 4 are formed is stopped below the bonding tool 5, and the inner leads 4 and the semiconductor element mounted on the work stage 6 are stopped. 7 are aligned with the electrodes 8.

Further, the inner lead bonding apparatus 1 lowers the heated bonding tool 5, and presses the inner leads 4... Of the film carrier 3 and the electrodes 8 of the semiconductor elements 7 by the bonding tool 5 to simultaneously connect them. Then, the film carrier 3 is run, and the semiconductor element 7 mounted on the film carrier 3 is transported.
The film carrier 3 is sequentially wound by a take-up reel 9 from a portion where the semiconductor element 7 is mounted.

Here, the numeral 10 in FIG. 2 indicates that the film carrier 3 wound on the take-up reel 9 and the semiconductor element 7 are wrapped around the film carrier 3 in order to prevent direct contact. And a spacer tape for protecting the film carrier 3.

As shown in FIGS. 4 and 5, a potting device 11 used in the resin sealing step supplies the film carrier 3 from the supply reel 12, and intermittently feeds the film carrier 3. Further, as shown in FIG. 5, the semiconductor element 7 mounted on the film carrier 3 is
-Stop below the syringe 13 attached to the Y table.

Further, the potting device 11 discharges the sealing resin 14 put in the syringe 13 from the syringe 13 while moving the syringe 13 and drops the resin onto the semiconductor element 7. Then, the potting device 11 uses the resin 14 to
To coat the surface.

Further, the potting device 11 has a curing furnace 15,
After the semiconductor element 7 is coated with the resin 14, the curing furnace 15
Conveyed inside. Then, the film carrier 3 is caused to travel by guide rollers 16 and the like provided in the curing furnace 15, and the resin 14 is cured while the semiconductor element 7 is conveyed in the curing furnace 15. Then, the film carrier 3 is sequentially wound by the winding reel 17 from the portion where the resin 14 has been cured.

(Problems to be Solved by the Invention) By the way, when shifting from the inner lead bonding step to the potting step, conventionally, it was necessary to wind the film carrier 3 with the inner lead bonding apparatus 1 and then set the film carrier 3 in the potting apparatus 11. The replacement of the wound film carrier 3 with the potting device 11 has been performed, for example, every 30 minutes. For this reason, conventionally, laborious and troublesome work had to be performed, and workability was poor.

Further, since the film carrier 3 is bent when the film carrier 3 travels after the inner lead bonding or when the film carrier 3 is wound by the take-up reel 9, the inner leads 4 are deformed as shown in FIG. was there.
In particular, when the semiconductor element 7 has a large size of 10 mm or more, defects such as the inner leads 4 contacting the corners 7a of the semiconductor element 7 or the inner leads 4 breaking are generated. It was easy.

It is also conceivable to cut the film carrier 3 after the inner lead bonding and store it in a magazine or the like in order to prevent the occurrence of defects such as breakage of the inner leads 4. However, in this way, after cutting,
There is a disadvantage that the semiconductor elements 7... Cannot be transported by the film carrier 3.

An object of the present invention is to provide a semiconductor device manufacturing apparatus which has good workability and can reduce occurrence of defects.

[Structure of the Invention] (Means and Actions for Solving the Problems) In order to achieve the above object, the present invention provides a semiconductor device manufacturing apparatus in which a film carrier for mounting a semiconductor element is run, wherein at least the semiconductor element is formed by a film An inner lead bonding apparatus mounted on a carrier and a potting apparatus for coating a semiconductor element mounted on a film carrier with a sealing resin are connected, and the film carrier travels from the inner lead bonding apparatus to the potting apparatus.

Further, after the inner lead-bonded semiconductor element was coated with a sealing resin by a potting device, the film carrier was caused to run horizontally until the sealing resin coated with the semiconductor element became at least gel-like.

By doing so, the present invention is intended to improve workability and reduce occurrence of defects.

(Embodiment) An embodiment of the present invention will be described below with reference to FIG. Note that the same reference numerals are given to the same components as those described in the section of the related art, and the description thereof will be omitted.

FIG. 1 shows an apparatus for manufacturing a semiconductor device according to the present invention (hereinafter referred to as “the apparatus”).
1 shows an embodiment of a manufacturing apparatus 21). The manufacturing apparatus 21 includes an inner lead bonding apparatus 1 and a potting apparatus 11 connected to each other. Then, the manufacturing apparatus 21 includes the inner lead bonding apparatus 1
In addition, there are provided a bonding tool 5 heated to a temperature sufficient for inner lead bonding, a work stage 6 disposed below the bonding tool 5 and mounting a semiconductor element 7 thereon.

Further, the manufacturing apparatus 21 includes a syringe 13 attached to an XY table or the like for discharging the thermosetting sealing resin fed into the potting apparatus 11 and a heating means (not shown), and a predetermined A curing furnace 15 controlled by a temperature profile is provided. And manufacturing equipment
Numeral 21 moves the file carrier 3 from a supply reel 22 arranged on the inner lead bonding apparatus 1 side to a take-up reel 23 arranged on the curing furnace 15 side of the potting apparatus 11.

Further, the manufacturing apparatus 21 is arranged so that the film carrier 3 passes through a predetermined portion. And the manufacturing apparatus 21
The bonding tool 5 of the inner lead bonding apparatus 1 and the work stage 6 are set in a state in which the film carrier 3 is horizontal with both sides of the film carrier 3 turned up and down.
And below the syringe 13 of the potting device 11. Then, the film carrier 3 is connected to the inner lead bonding device 1, the potting device 11,
And, it passes through the curing furnace 15 in order.

That is, the manufacturing apparatus 21 intermittently feeds the film carrier 3 and causes the circuit pattern formed on the film carrier 3 at a substantially equal pitch along the longitudinal direction to face the semiconductor element 7 placed on the work stage 6. Then, the heated bonding tool 5 is lowered and the inner leads of the circuit pattern and the electrodes of the semiconductor element 7 are simultaneously connected by thermocompression bonding, and the semiconductor element 7 is mounted on the film carrier 3.

In addition, the manufacturing apparatus 21 conveys the semiconductor element 7 that has been internally lead-bonded to the film carrier 3 to the potting apparatus 11 while keeping the film carrier 3 horizontal. Then, the semiconductor element 7 is stopped below the syringe 13, and a sealing resin (not shown) is supplied from the syringe 13.
Is discharged and dropped, and the semiconductor element 7 is coated with the resin.

Further, the manufacturing apparatus 21 transports the semiconductor element 7 coated with the resin into the curing furnace 15. Then, the semiconductor element 7 is conveyed while remaining horizontal in the curing furnace 15 for a while, and is heated and cured until the resin becomes, for example, a gel state, and then brought into contact with the guide roller 16. Then, while intermittently feeding the film carrier 3, the semiconductor element 7
Is further cured.

Here, 1 in the figure indicates the distance that the film carrier 3 travels horizontally after the inner lead bonding until the first contact with the guide roller 16.

The manufacturing apparatus 21 having such a configuration connects the inner lead bonding apparatus 1 and the potting apparatus 11 and continuously runs from the inner lead bonding apparatus 1 to the potting apparatus 11 without cutting the film carrier 3. In addition, there is no need to change the reels when moving from the inner lead bonding process to the potting process. Therefore, the number of operations can be reduced, and the operability can be improved.

Also, a mechanism for winding the film carrier 3 of the inner lead bonding apparatus 1 and a potting apparatus 11 are provided.
However, since a mechanism for supplying the film carrier 3 becomes unnecessary, the cost can be reduced and the installation space can be reduced.

Further, since the semiconductor element 7 to which inner lead bonding is applied is coated with a resin and then the semiconductor element 7 is transported horizontally until the resin becomes a gel state, deformation of the inner leads 4. Inner lead 4 ...
And the corners of the semiconductor element 7 and breakage of the inner leads can be prevented.

Further, since the above-described manufacturing apparatus 21 transports the semiconductor element 7 to the potting apparatus 11 immediately after the inner lead bonding without winding the semiconductor element 7 on a take-up reel, the semiconductor element 7 is coated before being coated with resin. The surface is not damaged and the inner leads 4 are not deformed.
Since the inner leads 4 are not left in the air for a long period of time, even when the tin-plated inner leads are used, whiskers (those that grow like needles on the surface of the tin) and defects caused by the whiskers are eliminated. Will not occur.

In this embodiment, the inner lead bonding apparatus 1 and the potting apparatus 11 are connected. However, the present invention is not limited to this. An electrical test device (for example, a device that applies a contact to the circuit pattern of the film carrier 3 to determine electrical characteristics and the presence or absence of a defect), a cleaning device (for example, a device that removes rubber adhered to the film carrier), and And a lead forming device (for forming an inner lead) may be provided.

[Effects of the Invention] As described above, the present invention relates to a semiconductor device manufacturing apparatus for running a film carrier for mounting a semiconductor element, wherein at least an inner lead bonding apparatus for mounting the semiconductor element on the film carrier, The film carrier was connected to a potting device that coats the mounted semiconductor element with a sealing resin, and the film carrier was continuously run from the inner lead bonding device to the potting device without cutting.

Further, after the inner lead-bonded semiconductor element was coated with a sealing resin by a potting device, the film carrier was caused to run horizontally until the sealing resin coated with the semiconductor element became at least gel-like.

Therefore, the present invention can improve workability,
There is an effect that occurrence of defects can be reduced.

[Brief description of the drawings]

FIG. 1 is a front view showing an embodiment of the present invention, and FIGS.
FIG. 2 shows a conventional example, FIG. 2 is a front view of an inner lead bonding apparatus, FIG. 3 is a cross-sectional view showing an enlarged main part of the inner lead bonding apparatus, and FIG. 4 is a front view showing a potting apparatus. FIG. 5 is a cross-sectional view showing a main part of the potting apparatus in an enlarged manner, and FIG. 6 is a cross-sectional view showing a state in which a defect has occurred in the inner lead. DESCRIPTION OF SYMBOLS 1 ... Inner lead bonding apparatus, 3 ... Film carrier, 7 ... Semiconductor element, 11 ... Potting apparatus, 14 ... Sealing resin, 21 ... Semiconductor device manufacturing apparatus.

Claims (2)

(57) [Claims] An apparatus for manufacturing a semiconductor device in which a film carrier for mounting a semiconductor device is run, at least
An inner lead bonding apparatus for mounting a semiconductor element on the film carrier and a potting apparatus for coating the semiconductor element mounted on the film carrier with a sealing resin are connected to the inner lead bonding apparatus and the potting apparatus. An apparatus for manufacturing a semiconductor device, wherein a film carrier is run continuously. 2. The method according to claim 1, wherein the inner lead-bonded semiconductor element is coated with a sealing resin by the potting device, and then the film carrier is horizontally moved until the sealing resin coated with the semiconductor element becomes at least a gel. Claim (1)
An apparatus for manufacturing a semiconductor device as described in the above.