JPH02139365A - Carrier tape - Google Patents
Carrier tapeInfo
- Publication number
- JPH02139365A JPH02139365A JP63291381A JP29138188A JPH02139365A JP H02139365 A JPH02139365 A JP H02139365A JP 63291381 A JP63291381 A JP 63291381A JP 29138188 A JP29138188 A JP 29138188A JP H02139365 A JPH02139365 A JP H02139365A
- Authority
- JP
- Japan
- Prior art keywords
- adhesive
- tape
- carrier tape
- ultraviolet ray
- circuit
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000000853 adhesive Substances 0.000 claims abstract description 29
- 230000001070 adhesive effect Effects 0.000 claims abstract description 29
- 239000002313 adhesive film Substances 0.000 claims abstract description 10
- 229920001225 polyester resin Polymers 0.000 abstract description 5
- 239000004645 polyester resin Substances 0.000 abstract description 5
- 238000000034 method Methods 0.000 abstract description 3
- 239000004925 Acrylic resin Substances 0.000 abstract description 2
- 229920000178 Acrylic resin Polymers 0.000 abstract description 2
- 230000004888 barrier function Effects 0.000 abstract description 2
- 238000006116 polymerization reaction Methods 0.000 abstract description 2
- 239000012466 permeate Substances 0.000 abstract 2
- 239000002390 adhesive tape Substances 0.000 description 6
- 239000011347 resin Substances 0.000 description 3
- 229920005989 resin Polymers 0.000 description 3
- 239000012050 conventional carrier Substances 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 238000005452 bending Methods 0.000 description 1
- 239000003990 capacitor Substances 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000007613 environmental effect Effects 0.000 description 1
- 230000000149 penetrating effect Effects 0.000 description 1
- 230000002250 progressing effect Effects 0.000 description 1
- 238000004804 winding Methods 0.000 description 1
Landscapes
- Packages (AREA)
- Packaging Frangible Articles (AREA)
Abstract
Description
【発明の詳細な説明】
〔産業上の利用分野〕
本発明は長手方向に電子部品を複数個を接着するキャリ
アテープに関する。DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a carrier tape for adhering a plurality of electronic components in the longitudinal direction.
従来、抵抗、コンデンサ、トランジスタ、及び集積回路
装置等のような小型の回路部品をプリント回路基板に実
装する自動化が進められている。BACKGROUND OF THE INVENTION Automation of the mounting of small circuit components such as resistors, capacitors, transistors, integrated circuit devices, etc. on printed circuit boards has been progressing in the past.
このとき、この回路部品を効率よく迅速に自動実装装置
にいかに供給するかが、回路部品の組立コストを下げる
重要な課題になっている。これらの回路部品は自動実装
装置の部品供給装置に直接単体で供給するこはなく、キ
ャリアテープと呼ばれる紙あるいは樹脂テープに回路部
品を貼り付けてリールに巻き付けた状態で装置に供給す
る方法が採られている。また、このようなリールに取り
付けられたテープ上の回路部品は、部品供給装置によっ
て、回路部品のリード線を曲げることなく容易に取り外
しが出来ることが要求されている。At this time, how to efficiently and quickly supply these circuit components to automatic mounting equipment has become an important issue in reducing assembly costs of circuit components. These circuit components are not directly supplied individually to the component supply device of automatic mounting equipment, but instead are supplied to the equipment after being attached to a paper or resin tape called a carrier tape and wound around a reel. It is being Further, it is required that the circuit components on the tape attached to such a reel can be easily removed by the component supply device without bending the lead wires of the circuit components.
第３図は従来の一例のキャリアテープ上に回路部品が接
着された状態を示すキャリアテープの断面図である。こ
の種のキャリアテープは、同図に示すように、例えば、
ポリエステル樹脂で作られた粘着用テープ１の両側にガ
イドテープ２が熱圧着されている。そのガイドテープ２
には、粘着用テープ１を貫通してスプロケットで送るた
めのスプロケット穴（図示せず）が設けられている。ま
た、ガイドテープ２の中間部の粘着用テープ１上には、
回路部品３が貼り付けられる接着剤膜領域９がある。FIG. 3 is a sectional view of a conventional carrier tape showing a state in which circuit components are adhered to the carrier tape. This type of carrier tape is, for example, as shown in the same figure.
Guide tapes 2 are thermocompression bonded to both sides of an adhesive tape 1 made of polyester resin. The guide tape 2
is provided with a sprocket hole (not shown) for penetrating the adhesive tape 1 and feeding it with a sprocket. Moreover, on the adhesive tape 1 in the middle part of the guide tape 2,
There is an adhesive film area 9 to which the circuit component 3 is pasted.
通常、この粘着用テープ１の接着剤膜−・域９に回路部
品３を一宮間隔を置いて接着し、この回路部品３が多数
接着されたキャリアテープをリール（図示せず）に巻き
取っていた。また、プリント回路基板（図示せず）に回
路部品３を実装するときは、このキャリアテープを巻い
たリールを自動実装装置の部品供給装置に取り付けて実
装していた。Usually, the circuit components 3 are adhered to the adhesive film area 9 of the adhesive tape 1 at intervals of one meter, and the carrier tape to which a large number of circuit components 3 are adhered is wound onto a reel (not shown). Ta. Further, when mounting the circuit component 3 on a printed circuit board (not shown), a reel wrapped with this carrier tape is attached to a component supply device of an automatic mounting device.
上述した従来のキャリアテープでは、この粘着テープが
紙あるいは樹脂で作られているので、テープ自体の吸湿
性の大きいこと及び環境温度変化による変形等により、
テープの接着力をいちじるしく低下する欠点がある。こ
のため、キャリアテープに回路部品を取り作けな後に、
リールに巻きとる際あるいはリールを運搬中に、回路部
品がしばしば脱落したりする問題がある。In the conventional carrier tape mentioned above, the adhesive tape is made of paper or resin, so the tape itself has high hygroscopicity and deformation due to environmental temperature changes, etc.
It has the disadvantage of significantly reducing the adhesive strength of the tape. For this reason, after mounting the circuit components on the carrier tape,
There is a problem in that circuit components often fall off during winding on a reel or during transportation of the reel.
また、この問題を解消するために、より強力な接着剤を
使用すると、自動実装装置で回路部品をこのテープから
取り外すことが出来ないという問題がある。Moreover, if a stronger adhesive is used to solve this problem, there is a problem in that the circuit components cannot be removed from the tape by automatic mounting equipment.
本発明の目的は、リールに巻き取り中あるいは運搬中に
、回路部品が脱落したりすることがないとともに回路部
品をプリント回路基板に実装するときに、容易に取り外
しの出来るキャリアテープを提供することである。An object of the present invention is to provide a carrier tape that prevents circuit components from falling off while being wound onto a reel or during transportation, and that can be easily removed when circuit components are mounted on a printed circuit board. It is.
本発明のキヤ、リアテープは、両側にスプロケット穴及
び中間部に回路部品が接着される接着剤膜領域とを有す
るキャリアテープにおいて、前記接着剤膜領域に紫外線
により硬化脆性される接着剤が塗布されることを備え構
成される。The carrier tape of the present invention has sprocket holes on both sides and an adhesive film region in the middle to which circuit components are bonded, and an adhesive that is hardened and brittle by ultraviolet rays is applied to the adhesive film region. It is configured with the following features.
次に、本発明について図面を参照して説明する。 Next, the present invention will be explained with reference to the drawings.
第１図は本発明の第１の実施例を示すキャリアテープの
断面図である。このキャリアテープは、両側にスプロケ
ット穴が設けられたガイドテープ２の上に、紫外線を透
過する接着剤４、例えば、重合度の低いアクリル樹脂系
の接着剤が塗布されている。ま□た、この接着剤４め上
に二接着剤４のバリヤ層となりかつ紫外線を透過する材
料、例えば、接着材と同質のポリエステル樹脂製の中、
間テープらが貼り付けられてる。更に、こめ中間テープ
ら上、すなわち、接着剤膜領・域１上゛に・紫外線を吸
収す為、例えば、ポリエステル樹脂系の接着剤・６が・
塗布□されている。FIG. 1 is a sectional view of a carrier tape showing a first embodiment of the present invention. In this carrier tape, an adhesive 4 that transmits ultraviolet rays, such as an acrylic resin adhesive with a low degree of polymerization, is applied onto a guide tape 2 having sprocket holes on both sides. In addition, on this adhesive 4, a material that serves as a barrier layer for the second adhesive 4 and transmits ultraviolet rays, such as a polyester resin material of the same quality as the adhesive, is placed.
Intermediate tape is attached. Furthermore, in order to absorb ultraviolet rays, a polyester resin adhesive 6, for example, is applied above the intermediate tape, that is, above the adhesive film area 1.
It is coated □.
第２図□は本実装例のテープを処理する工程を説明する
ためのキャリアテープの断面図である。このように、三
層槽□造に形成され、たキャ□リアテ□−ブの中間テー
プ５に接着剤６により回路部・□品′３を接着し、回路
部品３が接着されたキャリ、アチーブをリールに・巻き
取る。次に、こ□の回路部・品３をプリント回路基板に
実装する場合はり第２図に示すよう辷、紫外線照射装置
により、紫外線８をガイドテープ３の裏面から照射し、
接着剤６を硬化腕、性させる。このことにより、回路部
□・品３と中−間テープ５との接着力が減じて、容易に
中間テープ５より取力外すセとが出来□る。FIG. 2 □ is a sectional view of the carrier tape for explaining the process of processing the tape of this implementation example. In this way, the circuit part □ product '3 is adhered to the intermediate tape 5 of the carrier tube □, which is formed in a three-layered tank □ structure, with the adhesive 6, and the carrier to which the circuit component 3 is adhered, the Achieve. Wind it onto the reel. Next, when mounting this circuit part/product 3 on a printed circuit board, as shown in FIG.
The adhesive 6 is cured and cured. As a result, the adhesive force between the circuit part □/product 3 and the intermediate tape 5 is reduced, and it is possible to easily remove the circuit part □ from the intermediate tape 5.
また、この実施例では二中間テープ５を介して回路部品
を接着しているが、直接ガイドチー１３に接着してもよ
い。この場合は、ガイドテープ３及び接着剤６は、例え
ば、ポリニスチル系樹脂とする。要は、この回路部品と
キャリアテープとを接着す接接着剤に、紫外線で硬化さ
れて脆性化される□接着剤を用いることである。Further, although in this embodiment the circuit components are bonded via the two intermediate tapes 5, they may be bonded directly to the guide chip 13. In this case, the guide tape 3 and adhesive 6 are made of, for example, polynystyl resin. The key is to use a □ adhesive that is cured by ultraviolet light and made brittle as the adhesive for bonding the circuit component and the carrier tape.
更に、紫外線照射装置を自動実装装置に組込んでお□け
ば、実装置前に紫外線′を照射すれば、より有利な自動
実装装置が得られる。Furthermore, if an ultraviolet irradiation device is incorporated into an automatic mounting device, and the ultraviolet rays are irradiated before the actual device, a more advantageous automatic mounting device can be obtained.
以上説明したように本発明のキャリアテープは、回路部
品とガイドテープとの接着□に、紫外線で硬化脆性さｆ
Ｌ番接接着剤使用することにより、ガイドテープに貼り
付けられた回路部品は、キャリアテープをリールに巻き
取り時やあるいは運搬中に、回路部品が剥れることがな
く、かつ、回路部品をプリント回路基板に実装するとき
には、容易に取り外すととが出来るという効果がある。As explained above, the carrier tape of the present invention has ultraviolet curing brittleness f for adhesion □ between circuit components and guide tape.
By using No. L adhesive, the circuit components attached to the guide tape will not peel off when the carrier tape is wound onto a reel or during transportation, and the circuit components will not be printed. When mounted on a circuit board, it has the advantage that it can be easily removed.
第１図は本発明の第１の実施例を示すキャリアテープの
断面図、第２図は本実例のテープを処理する工程を説明
するキャリアテープの断面図、第３図は従来の一例のキ
ャリアテープ上に回路部品が接着された状態を示すキャ
リアテープの断面図である。
１・・・粘着テープ、２・・・ガイドテープ、３・・・
回路部品、４・・・第１の接着剤、５・・・中間テープ
、６・・・第２の接着剤、７・・・紫外線照射装置、８
・・・紫外線、９・・接着剤膜領域。FIG. 1 is a sectional view of a carrier tape showing a first embodiment of the present invention, FIG. 2 is a sectional view of a carrier tape explaining the process of processing the tape of this example, and FIG. 3 is a sectional view of a carrier tape of a conventional example. FIG. 3 is a cross-sectional view of the carrier tape showing a state in which circuit components are adhered onto the tape. 1... Adhesive tape, 2... Guide tape, 3...
Circuit component, 4... First adhesive, 5... Intermediate tape, 6... Second adhesive, 7... Ultraviolet irradiation device, 8
...Ultraviolet light, 9...Adhesive film area.
Claims (1)
れる接着剤膜領域とを有するキャリアテープにおいて、
前記接着剤膜領域に紫外線により硬化脆性される接着剤
が塗布されることを特徴とするキャリアテープ。A carrier tape having sprocket holes on both sides and an adhesive film region in the middle to which circuit components are bonded,
A carrier tape characterized in that an adhesive that is cured and made brittle by ultraviolet light is applied to the adhesive film region.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP63291381A JP2972215B2 (en) | 1988-11-17 | 1988-11-17 | Carrier tape |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP63291381A JP2972215B2 (en) | 1988-11-17 | 1988-11-17 | Carrier tape |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH02139365A true JPH02139365A (en) | 1990-05-29 |
| JP2972215B2 JP2972215B2 (en) | 1999-11-08 |
Family
ID=17768184
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP63291381A Expired - Lifetime JP2972215B2 (en) | 1988-11-17 | 1988-11-17 | Carrier tape |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2972215B2 (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0811929A (en) * | 1994-06-23 | 1996-01-16 | Tokujiro Okui | Carrier tape for storage of electronic component |
| JP2014017384A (en) * | 2012-07-09 | 2014-01-30 | Fujikura Ltd | Laser diode module and cleaning method |
| US20150122419A1 (en) * | 2012-06-29 | 2015-05-07 | Mohammad Kamruzzaman CHOWDHURY | Laser and plasma etch wafer dicing with a double sided uv-curable adhesive film |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS63134964U (en) * | 1987-02-26 | 1988-09-05 | ||
| JPS63175058U (en) * | 1987-04-30 | 1988-11-14 | ||
| JPH0258246A (en) * | 1988-08-23 | 1990-02-27 | Nec Corp | Film carrier tape and manufacture of film carrier semiconductor device |
-
1988
- 1988-11-17 JP JP63291381A patent/JP2972215B2/en not_active Expired - Lifetime
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS63134964U (en) * | 1987-02-26 | 1988-09-05 | ||
| JPS63175058U (en) * | 1987-04-30 | 1988-11-14 | ||
| JPH0258246A (en) * | 1988-08-23 | 1990-02-27 | Nec Corp | Film carrier tape and manufacture of film carrier semiconductor device |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0811929A (en) * | 1994-06-23 | 1996-01-16 | Tokujiro Okui | Carrier tape for storage of electronic component |
| US20150122419A1 (en) * | 2012-06-29 | 2015-05-07 | Mohammad Kamruzzaman CHOWDHURY | Laser and plasma etch wafer dicing with a double sided uv-curable adhesive film |
| JP2014017384A (en) * | 2012-07-09 | 2014-01-30 | Fujikura Ltd | Laser diode module and cleaning method |
Also Published As
| Publication number | Publication date |
|---|---|
| JP2972215B2 (en) | 1999-11-08 |
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